ES486834A0 - Mejoras introducidas en un metodo de electrodeposicion de - plata metalica. - Google Patents

Mejoras introducidas en un metodo de electrodeposicion de - plata metalica.

Info

Publication number
ES486834A0
ES486834A0 ES486834A ES486834A ES486834A0 ES 486834 A0 ES486834 A0 ES 486834A0 ES 486834 A ES486834 A ES 486834A ES 486834 A ES486834 A ES 486834A ES 486834 A0 ES486834 A0 ES 486834A0
Authority
ES
Spain
Prior art keywords
improvements introduced
silver metallic
electrical deposit
deposit
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES486834A
Other languages
English (en)
Other versions
ES8101657A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oxy Metal Industries Corp
Original Assignee
Oxy Metal Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oxy Metal Industries Corp filed Critical Oxy Metal Industries Corp
Publication of ES8101657A1 publication Critical patent/ES8101657A1/es
Publication of ES486834A0 publication Critical patent/ES486834A0/es
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/46Electroplating: Baths therefor from solutions of silver

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
ES486834A 1979-07-13 1979-12-12 Mejoras introducidas en un metodo de electrodeposicion de - plata metalica. Granted ES486834A0 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/057,471 US4265715A (en) 1979-07-13 1979-07-13 Silver electrodeposition process

Publications (2)

Publication Number Publication Date
ES8101657A1 ES8101657A1 (es) 1980-12-16
ES486834A0 true ES486834A0 (es) 1980-12-16

Family

ID=22010752

Family Applications (1)

Application Number Title Priority Date Filing Date
ES486834A Granted ES486834A0 (es) 1979-07-13 1979-12-12 Mejoras introducidas en un metodo de electrodeposicion de - plata metalica.

Country Status (12)

Country Link
US (1) US4265715A (es)
JP (1) JPS6056236B2 (es)
BE (1) BE879681A (es)
BR (1) BR8000086A (es)
CA (1) CA1149324A (es)
CH (1) CH643004A5 (es)
DE (1) DE2943395A1 (es)
ES (1) ES486834A0 (es)
FR (1) FR2461024A1 (es)
GB (1) GB2053280B (es)
HK (1) HK66386A (es)
NL (1) NL7907967A (es)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4428804A (en) 1980-11-10 1984-01-31 Omi International Corporation High speed bright silver electroplating bath and process
US4478691A (en) * 1981-10-13 1984-10-23 At&T Bell Laboratories Silver plating procedure
US4775949A (en) * 1986-06-27 1988-10-04 K-Tron International, Inc. Weigh feeding system with stochastic control
GB9425031D0 (en) * 1994-12-09 1995-02-08 Alpha Metals Ltd Printed circuit board manufacture
GB9425030D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Silver plating
US6905587B2 (en) 1996-03-22 2005-06-14 Ronald Redline Method for enhancing the solderability of a surface
US6544397B2 (en) 1996-03-22 2003-04-08 Ronald Redline Method for enhancing the solderability of a surface
USRE45842E1 (en) 1999-02-17 2016-01-12 Ronald Redline Method for enhancing the solderability of a surface
KR101074744B1 (ko) * 2002-11-28 2011-10-19 신꼬오덴기 고교 가부시키가이샤 전해 은도금액
US20130023166A1 (en) * 2011-07-20 2013-01-24 Tyco Electronics Corporation Silver plated electrical contact

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2097630A (en) * 1935-10-17 1937-11-02 Du Pont Plating of cadmium
BE791401A (fr) * 1971-11-15 1973-05-14 Monsanto Co Compositions et procedes electrochimiques
NL7306732A (es) * 1972-05-17 1973-11-20
US3914162A (en) * 1973-06-25 1975-10-21 Monsanto Co Compositions and process for the electrodeposition of metals
GB1419613A (en) * 1974-06-13 1975-12-31 Lea Ronal Inc Cyanidefree electroplating baths

Also Published As

Publication number Publication date
GB2053280A (en) 1981-02-04
FR2461024A1 (fr) 1981-01-30
JPS6056236B2 (ja) 1985-12-09
DE2943395A1 (de) 1981-02-12
BR8000086A (pt) 1981-03-24
HK66386A (en) 1986-09-18
FR2461024B1 (es) 1985-04-12
ES8101657A1 (es) 1980-12-16
GB2053280B (en) 1984-06-27
CA1149324A (en) 1983-07-05
US4265715A (en) 1981-05-05
BE879681A (fr) 1980-04-28
NL7907967A (nl) 1981-01-15
CH643004A5 (de) 1984-05-15
JPS5613491A (en) 1981-02-09

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