ES449149A1 - Improvements in electrical components. (Machine-translation by Google Translate, not legally binding) - Google Patents

Improvements in electrical components. (Machine-translation by Google Translate, not legally binding)

Info

Publication number
ES449149A1
ES449149A1 ES449149A ES449149A ES449149A1 ES 449149 A1 ES449149 A1 ES 449149A1 ES 449149 A ES449149 A ES 449149A ES 449149 A ES449149 A ES 449149A ES 449149 A1 ES449149 A1 ES 449149A1
Authority
ES
Spain
Prior art keywords
translation
machine
legally binding
*** translate
electrical components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES449149A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Blaupunkt Werke GmbH
Original Assignee
Blaupunkt Werke GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Blaupunkt Werke GmbH filed Critical Blaupunkt Werke GmbH
Publication of ES449149A1 publication Critical patent/ES449149A1/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/145Indicating the presence of current or voltage
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49171Fan-out arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Glass Compositions (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Led Devices (AREA)

Abstract

Perfections in electrical components, characterized, because each electrical component consists of an integrated circuit and a light element which serves as an indicator for the function of the integrated circuit. (Machine-translation by Google Translate, not legally binding)
ES449149A 1975-06-23 1976-06-23 Improvements in electrical components. (Machine-translation by Google Translate, not legally binding) Expired ES449149A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752527858 DE2527858A1 (en) 1975-06-23 1975-06-23 ELECTRICAL COMPONENT

Publications (1)

Publication Number Publication Date
ES449149A1 true ES449149A1 (en) 1977-08-01

Family

ID=5949718

Family Applications (1)

Application Number Title Priority Date Filing Date
ES449149A Expired ES449149A1 (en) 1975-06-23 1976-06-23 Improvements in electrical components. (Machine-translation by Google Translate, not legally binding)

Country Status (5)

Country Link
BR (1) BR7604044A (en)
DE (1) DE2527858A1 (en)
ES (1) ES449149A1 (en)
FR (1) FR2315700A1 (en)
ZA (1) ZA763718B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2097581A (en) * 1981-04-24 1982-11-03 Hitachi Ltd Shielding semiconductor integrated circuit devices from light
DE102015121577B4 (en) * 2015-12-11 2023-06-29 Infineon Technologies Ag METHOD OF DETECTING AN IMINGENT FAILURE OF A SEMICONDUCTOR CHIP OF A SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE ARRANGEMENT

Also Published As

Publication number Publication date
FR2315700B3 (en) 1979-03-09
ZA763718B (en) 1977-05-25
DE2527858A1 (en) 1977-01-13
FR2315700A1 (en) 1977-01-21
BR7604044A (en) 1977-07-05

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