ES390975A1 - Electroless nickel solution - Google Patents

Electroless nickel solution

Info

Publication number
ES390975A1
ES390975A1 ES71390975A ES390975A ES390975A1 ES 390975 A1 ES390975 A1 ES 390975A1 ES 71390975 A ES71390975 A ES 71390975A ES 390975 A ES390975 A ES 390975A ES 390975 A1 ES390975 A1 ES 390975A1
Authority
ES
Spain
Prior art keywords
ions
solution
nickel
copper
sulfide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES71390975A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
Shipley Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Inc filed Critical Shipley Co Inc
Publication of ES390975A1 publication Critical patent/ES390975A1/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

An improved procedure for preparing an aqueous electroless nickel plating solution comprising mixing a source of nickel ions, hypophosphite as a reducing agent for said nickel ions, a pH adjuster to provide the required solution pH, and a complexing agent for said nickel ions, characterized in that it further comprises mixing a small, but effective, amount of copper ions in solution, preferably cuprous ions, capable of providing a uniform, non-electrolytic nickel-copper-phosphorous deposit, of similar appearance that of a mirror and of improved corrosion resistance, and which has a coherent, non-powdery structure, said cuprous ions being in solution in an amount capable of providing up to 12% by weight of copper in the deposit, said solution having a pH of at least 4.0 and being substantially free of sulfur compounds that hydrolyze to provide one or both s of the sulfide and hydrogen-sulfide ions. (Machine-translation by Google Translate, not legally binding)
ES71390975A 1970-06-03 1971-05-08 Electroless nickel solution Expired ES390975A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US4324270A 1970-06-03 1970-06-03

Publications (1)

Publication Number Publication Date
ES390975A1 true ES390975A1 (en) 1974-08-01

Family

ID=21926207

Family Applications (2)

Application Number Title Priority Date Filing Date
ES71390975A Expired ES390975A1 (en) 1970-06-03 1971-05-08 Electroless nickel solution
ES399606A Expired ES399606A1 (en) 1970-06-03 1972-02-09 Electroless nickel solution

Family Applications After (1)

Application Number Title Priority Date Filing Date
ES399606A Expired ES399606A1 (en) 1970-06-03 1972-02-09 Electroless nickel solution

Country Status (11)

Country Link
JP (1) JPS5317534B1 (en)
BE (1) BE767985A (en)
BR (1) BR7103261D0 (en)
CA (1) CA936305A (en)
DE (2) DE2166059A1 (en)
ES (2) ES390975A1 (en)
FR (1) FR2094006B1 (en)
GB (1) GB1322081A (en)
NL (1) NL7107368A (en)
SE (2) SE383643B (en)
ZA (1) ZA712751B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54160417U (en) * 1978-04-28 1979-11-09
FR2726205B1 (en) * 1994-10-28 1997-09-26 Motorola Inc METHOD FOR REDUCING THE START-UP TIME IN A AUTOCATALYTIC BATH
CN112207276B (en) * 2020-10-16 2023-02-03 西安工程大学 Preparation method of micron nickel-plated aluminum powder

Also Published As

Publication number Publication date
SE383643B (en) 1976-03-22
DE2166059A1 (en) 1972-12-21
FR2094006B1 (en) 1975-02-21
ES399606A1 (en) 1975-06-16
CA936305A (en) 1973-11-06
DE2166060A1 (en) 1972-12-28
NL7107368A (en) 1971-12-07
DE2122455A1 (en) 1972-01-27
SE7410415L (en) 1974-08-15
FR2094006A1 (en) 1972-02-04
DE2122455B2 (en) 1976-03-04
BE767985A (en) 1971-12-02
GB1322081A (en) 1973-07-04
ZA712751B (en) 1972-04-26
JPS5317534B1 (en) 1978-06-09
BR7103261D0 (en) 1973-05-17
SE400094B (en) 1978-03-13

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