ES378720A1 - Method of and solution for accelerating activation of plastic substrates in electroless metal plating system - Google Patents

Method of and solution for accelerating activation of plastic substrates in electroless metal plating system

Info

Publication number
ES378720A1
ES378720A1 ES378720A ES378720A ES378720A1 ES 378720 A1 ES378720 A1 ES 378720A1 ES 378720 A ES378720 A ES 378720A ES 378720 A ES378720 A ES 378720A ES 378720 A1 ES378720 A1 ES 378720A1
Authority
ES
Spain
Prior art keywords
solution
palladium
accelerator
substrate
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES378720A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Inc filed Critical MacDermid Inc
Publication of ES378720A1 publication Critical patent/ES378720A1/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/26—Roughening, e.g. by etching using organic liquids

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Improvements in chemical coating procedures, particularly for depositing a continuous and adherent metallic film on the surface of a polymeric plastic substrate, characterized in that the process includes the steps of etching the surface of the substrate in a bath containing chromic acid, activating the surface of the substrate by immersion in a palladium acid hydrosol, accelerate the activated surface to reduce excess stannous ions co-deposited with palladium during the activation stage, and then immerse the surface in a chemical coating solution of the metal that has if deposited, a dilute acid solution of palladium chloride is used in said accelerator stage and a regenerating or rejuvenating aqueous solution consisting essentially of a dilute source of stannous ions in soluble form in insufficient quantity is periodically added to said accelerator solution to effect a substantial formation of particulate palladium but sufficient to control the maximum contamination of hexavalent chromium ion, introduced into said accelerator solution from the etching stage, at a level not exceeding approximately one part per million of hexavalent chromium and one hundred forty-four five parts per million paladin ion. (Machine-translation by Google Translate, not legally binding)
ES378720A 1969-04-07 1970-04-06 Method of and solution for accelerating activation of plastic substrates in electroless metal plating system Expired ES378720A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US81418069A 1969-04-07 1969-04-07

Publications (1)

Publication Number Publication Date
ES378720A1 true ES378720A1 (en) 1972-06-16

Family

ID=25214373

Family Applications (1)

Application Number Title Priority Date Filing Date
ES378720A Expired ES378720A1 (en) 1969-04-07 1970-04-06 Method of and solution for accelerating activation of plastic substrates in electroless metal plating system

Country Status (8)

Country Link
US (1) US3622370A (en)
JP (1) JPS502860B1 (en)
BE (1) BE748540A (en)
DE (1) DE2016397A1 (en)
ES (1) ES378720A1 (en)
FR (1) FR2042997A5 (en)
GB (1) GB1276034A (en)
NL (1) NL7004348A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4204013A (en) * 1978-10-20 1980-05-20 Oxy Metal Industries Corporation Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine
US4246320A (en) * 1979-03-15 1981-01-20 Stauffer Chemical Company Plated acrylate/styrene/acrylonitrile article
US4450191A (en) * 1982-09-02 1984-05-22 Omi International Corporation Ammonium ions used as electroless copper plating rate controller
JPH0159038U (en) * 1987-10-09 1989-04-13
US5962073A (en) * 1997-06-02 1999-10-05 Lacks Industries, Inc. Method for electroplating elastomer-modified polyphthalamide articles
CN103009708A (en) * 2011-09-21 2013-04-03 深圳富泰宏精密工业有限公司 Film plating member and manufacturing method thereof
CN113151812B (en) * 2021-04-20 2022-10-11 广东工业大学 Tin activating solution, preparation method thereof and chemical nickel plating method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3011920A (en) * 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
GB1063092A (en) * 1964-05-07 1967-03-30 Sperry Gyroscope Co Ltd Improvements in metal plating processes
US3479160A (en) * 1965-10-11 1969-11-18 Borg Warner Metal plating of plastic materials
US3432338A (en) * 1967-04-17 1969-03-11 Diamond Shamrock Corp Electroless nickel,cobalt and nickel-cobalt alloy plating from fluoborates sources
US3507681A (en) * 1967-06-02 1970-04-21 Mine Safety Appliances Co Metal plating of plastics

Also Published As

Publication number Publication date
FR2042997A5 (en) 1971-02-12
JPS502860B1 (en) 1975-01-29
GB1276034A (en) 1972-06-01
BE748540A (en) 1970-09-16
DE2016397A1 (en) 1970-10-08
US3622370A (en) 1971-11-23
NL7004348A (en) 1970-10-09

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