ES360612A1 - A semiconductor device. (Machine-translation by Google Translate, not legally binding) - Google Patents

A semiconductor device. (Machine-translation by Google Translate, not legally binding)

Info

Publication number
ES360612A1
ES360612A1 ES360612A ES360612A ES360612A1 ES 360612 A1 ES360612 A1 ES 360612A1 ES 360612 A ES360612 A ES 360612A ES 360612 A ES360612 A ES 360612A ES 360612 A1 ES360612 A1 ES 360612A1
Authority
ES
Spain
Prior art keywords
wires
translation
machine
semiconductor device
legally binding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES360612A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Priority to ES360612A priority Critical patent/ES360612A1/en
Publication of ES360612A1 publication Critical patent/ES360612A1/en
Expired legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

A semiconductor device consisting of a plurality of conductive wires, generally parallel, the end of at least one of the conductor wires being crushed, a semiconductor wafer attached to the crushed end of one of the conductor wires, a wire attached to the end of the conductor. Each of the other conducting wires and a contact on the semiconductor wafer, and a thermosetting plastic body encapsulating the ends of the conducting wires, the semiconductor wafer, and the wires interconnecting the wafer and the ends of the conducting wires, terminating the ends of the conducting wires inside the body. (Machine-translation by Google Translate, not legally binding)
ES360612A 1968-11-25 1968-11-25 A semiconductor device. (Machine-translation by Google Translate, not legally binding) Expired ES360612A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ES360612A ES360612A1 (en) 1968-11-25 1968-11-25 A semiconductor device. (Machine-translation by Google Translate, not legally binding)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES360612A ES360612A1 (en) 1968-11-25 1968-11-25 A semiconductor device. (Machine-translation by Google Translate, not legally binding)

Publications (1)

Publication Number Publication Date
ES360612A1 true ES360612A1 (en) 1970-11-16

Family

ID=8451069

Family Applications (1)

Application Number Title Priority Date Filing Date
ES360612A Expired ES360612A1 (en) 1968-11-25 1968-11-25 A semiconductor device. (Machine-translation by Google Translate, not legally binding)

Country Status (1)

Country Link
ES (1) ES360612A1 (en)

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