ES2666234T3 - Fuente de deposición por arco con campo eléctrico definido - Google Patents

Fuente de deposición por arco con campo eléctrico definido Download PDF

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Publication number
ES2666234T3
ES2666234T3 ES11727116.3T ES11727116T ES2666234T3 ES 2666234 T3 ES2666234 T3 ES 2666234T3 ES 11727116 T ES11727116 T ES 11727116T ES 2666234 T3 ES2666234 T3 ES 2666234T3
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ES
Spain
Prior art keywords
cathode
anode
magnetic field
electric field
deposition source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES11727116.3T
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English (en)
Inventor
Siegfried Krassnitzer
Juerg Hagmann
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Oerlikon Surface Solutions AG Pfaeffikon
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Oerlikon Surface Solutions AG Pfaeffikon
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Publication of ES2666234T3 publication Critical patent/ES2666234T3/es
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0089—Reactive sputtering in metallic mode
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5873—Removal of material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055—Arc discharge

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Plasma Technology (AREA)

Abstract

Dispositivo de evaporación por arco que comprende - un cátodo (309) que contiene una superficie con aquel material, que va a evaporarse - medios magnéticos (305) que llevan a un campo magnético a lo largo de la superficie del cátodo (309) - un ánodo (303) para la absorción de los electrones, que se extraen del cátodo (309) durante el proceso de evaporación - una fuente de tensión, que permite colocar en potencial positivo al menos durante cierto tiempo el ánodo (303) frente al cátodo (309) caracterizado por que el ánodo (303) está dispuesto en la proximidad inmediata del cátodo (309) y en combinación con el campo magnético generado por los medios magnéticos (305) de tal manera que las líneas del campo magnético se guían, con una conexión corta, desde la superficie del cátodo (309) hasta el ánodo (303), en donde las líneas del campo magnético que salen de la superficie del cátodo (309) inciden sobre el ánodo (303) en caso de que no entren en una zona central del cátodo (309) de la superficie del cátodo (309) y en donde en la zona central del cátodo (309) se tomaron precauciones que impiden esencialmente su erosión durante el funcionamiento del dispositivo de evaporación.

Description

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Claims (1)

  1. imagen1
ES11727116.3T 2010-06-22 2011-06-03 Fuente de deposición por arco con campo eléctrico definido Active ES2666234T3 (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US35727210P 2010-06-22 2010-06-22
US357272P 2010-06-22
PCT/EP2011/002734 WO2011160766A1 (de) 2010-06-22 2011-06-03 Arc-verdampfungsquelle mit definiertem elektrischem feld

Publications (1)

Publication Number Publication Date
ES2666234T3 true ES2666234T3 (es) 2018-05-03

Family

ID=44487011

Family Applications (1)

Application Number Title Priority Date Filing Date
ES11727116.3T Active ES2666234T3 (es) 2010-06-22 2011-06-03 Fuente de deposición por arco con campo eléctrico definido

Country Status (17)

Country Link
US (1) US10253407B2 (es)
EP (1) EP2585622B1 (es)
JP (1) JP6095568B2 (es)
KR (1) KR101854936B1 (es)
CN (1) CN102947478B (es)
BR (1) BR112012033065B1 (es)
CA (1) CA2803087C (es)
ES (1) ES2666234T3 (es)
HU (1) HUE038729T2 (es)
MX (1) MX361608B (es)
MY (1) MY170012A (es)
PL (1) PL2585622T3 (es)
PT (1) PT2585622T (es)
SG (1) SG186722A1 (es)
SI (1) SI2585622T1 (es)
TW (1) TWI553132B (es)
WO (1) WO2011160766A1 (es)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013000557A1 (en) * 2011-06-30 2013-01-03 Oerlikon Trading Ag, Trübbach Nano-layer coating for high performance tools
PT2761058T (pt) 2011-09-30 2019-11-25 Oerlikon Surface Solutions Ag Pfaeffikon Revestimento de nitreto de alumínio e titânio com morfologia adaptada para resistência ao desgaste melhorada em operações de maquinagem e seu método
EP2607517A1 (en) * 2011-12-22 2013-06-26 Oerlikon Trading AG, Trübbach Low temperature arc ion plating coating
WO2014066913A2 (en) * 2012-10-26 2014-05-01 Pixie Scientific, Inc Health diagnostic systems and methods
JP6842233B2 (ja) 2014-07-29 2021-03-17 サンドビック インテレクチュアル プロパティー アクティエボラーグ コーティングされた切削工具、及びコーティングされた切削工具の製造方法
WO2016191372A1 (en) 2015-05-22 2016-12-01 Pixie Scientific, Llc Indicator panels for incontinence products
RU2715267C2 (ru) * 2015-12-22 2020-02-26 Сандвик Интеллекчуал Проперти Аб Режущий инструмент с покрытием и способ
WO2019136261A1 (en) * 2018-01-04 2019-07-11 Ih Ip Holdings Limited Gas phase co-deposition of hydrogen/deuterium loaded metallic structures
EP3556901B1 (en) * 2018-04-20 2021-03-31 Plansee Composite Materials Gmbh Vacuum arc source
MX2022000138A (es) 2019-07-03 2022-02-17 Oerlikon Surface Solutions Ag Pfaeffikon Fuente de arco catodico.
KR102667048B1 (ko) * 2021-07-20 2024-05-22 한국생산기술연구원 중앙부 함몰형 자기장을 가지는 아크 증발원 및 이를 포함하는 아크 이온 플레이팅 장치, 그리고 이를 이용한 금속 및 금속화합물의 증착방법

Family Cites Families (15)

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Publication number Priority date Publication date Assignee Title
US3625848A (en) 1968-12-26 1971-12-07 Alvin A Snaper Arc deposition process and apparatus
SU1040631A1 (ru) * 1980-06-25 1983-09-07 Предприятие П/Я В-8851 Вакуумно-дуговое устройство
US4620913A (en) 1985-11-15 1986-11-04 Multi-Arc Vacuum Systems, Inc. Electric arc vapor deposition method and apparatus
US5306407A (en) * 1989-06-27 1994-04-26 Hauzer Holding Bv Method and apparatus for coating substrates
US5380421A (en) * 1992-11-04 1995-01-10 Gorokhovsky; Vladimir I. Vacuum-arc plasma source
WO2000016373A1 (de) * 1998-09-14 2000-03-23 Unaxis Trading Ag Targetanordnung für eine arc-verdampfungs-kammer
JP3917348B2 (ja) * 1999-05-26 2007-05-23 株式会社神戸製鋼所 アーク蒸発源、真空蒸着装置及び真空蒸着方法
JP4409015B2 (ja) * 1999-11-30 2010-02-03 株式会社神戸製鋼所 アークイオンプレーティング装置
CA2305938C (en) * 2000-04-10 2007-07-03 Vladimir I. Gorokhovsky Filtered cathodic arc deposition method and apparatus
DE10018143C5 (de) * 2000-04-12 2012-09-06 Oerlikon Trading Ag, Trübbach DLC-Schichtsystem sowie Verfahren und Vorrichtung zur Herstellung eines derartigen Schichtsystems
JP4000764B2 (ja) * 2000-09-18 2007-10-31 日新電機株式会社 真空アーク蒸発装置
JP4034563B2 (ja) * 2001-12-27 2008-01-16 株式会社神戸製鋼所 真空アーク蒸発源
JP4109503B2 (ja) * 2002-07-22 2008-07-02 日新電機株式会社 真空アーク蒸着装置
US20090050059A1 (en) * 2005-12-16 2009-02-26 Josu Goikoetxea Larrinaga Cathode evaporation machine
RU2456371C2 (ru) * 2006-10-10 2012-07-20 Эрликон Трейдинг Аг, Трюббах Слоистая система с по меньшей мере одним слоем смешанных кристаллов многокомпонентного оксида

Also Published As

Publication number Publication date
TWI553132B (zh) 2016-10-11
CN102947478B (zh) 2016-02-17
MY170012A (en) 2019-06-20
PT2585622T (pt) 2018-04-20
RU2013102585A (ru) 2014-08-10
SG186722A1 (en) 2013-02-28
MX361608B (es) 2018-12-07
WO2011160766A1 (de) 2011-12-29
MX2012015089A (es) 2013-05-28
US10253407B2 (en) 2019-04-09
PL2585622T3 (pl) 2018-07-31
KR20130121078A (ko) 2013-11-05
EP2585622B1 (de) 2018-01-17
BR112012033065A2 (pt) 2020-08-11
SI2585622T1 (en) 2018-06-29
BR112012033065B1 (pt) 2022-04-05
JP6095568B2 (ja) 2017-03-15
EP2585622A1 (de) 2013-05-01
CA2803087C (en) 2019-11-12
CA2803087A1 (en) 2011-12-29
KR101854936B1 (ko) 2018-06-14
HUE038729T2 (hu) 2018-11-28
TW201219582A (en) 2012-05-16
CN102947478A (zh) 2013-02-27
US20130126347A1 (en) 2013-05-23
JP2013533382A (ja) 2013-08-22

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