ES266074A1 - A procedure for the copper inelectric coating (Machine-translation by Google Translate, not legally binding) - Google Patents

A procedure for the copper inelectric coating (Machine-translation by Google Translate, not legally binding)

Info

Publication number
ES266074A1
ES266074A1 ES266074A ES266074A ES266074A1 ES 266074 A1 ES266074 A1 ES 266074A1 ES 266074 A ES266074 A ES 266074A ES 266074 A ES266074 A ES 266074A ES 266074 A1 ES266074 A1 ES 266074A1
Authority
ES
Spain
Prior art keywords
copper
translation
machine
legally binding
*** translate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES266074A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of ES266074A1 publication Critical patent/ES266074A1/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

A process for the copper electrochemical coating characterized in that it comprises immersing the receptive surface to be coated into a bath composed of: water and a water soluble copper salt of 0002 to 015 moles; a copper composition agent of 1 to 15 times the moles of the copper salt; an alkali metal hydroxide to produce a ph of 105 to 14; formaldehyde 04 to 34 moles; and a soluble inorganic cyanide from 00002 to 0015 moles. (Machine-translation by Google Translate, not legally binding)
ES266074A 1960-05-03 1961-03-25 A procedure for the copper inelectric coating (Machine-translation by Google Translate, not legally binding) Expired ES266074A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US26401A US3095309A (en) 1960-05-03 1960-05-03 Electroless copper plating

Publications (1)

Publication Number Publication Date
ES266074A1 true ES266074A1 (en) 1961-06-16

Family

ID=21831628

Family Applications (1)

Application Number Title Priority Date Filing Date
ES266074A Expired ES266074A1 (en) 1960-05-03 1961-03-25 A procedure for the copper inelectric coating (Machine-translation by Google Translate, not legally binding)

Country Status (5)

Country Link
US (1) US3095309A (en)
CH (1) CH413540A (en)
DE (1) DE1696312C2 (en)
DK (1) DK105901C (en)
ES (1) ES266074A1 (en)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3326700A (en) * 1963-06-12 1967-06-20 Rudolph J Zeblisky Electroless copper plating
US3259559A (en) * 1962-08-22 1966-07-05 Day Company Method for electroless copper plating
US3321328A (en) * 1962-11-15 1967-05-23 Ibm Coating of aluminum substrates with a magnetic material
US3306830A (en) * 1963-06-13 1967-02-28 Bell Telephone Labor Inc Printed circuit boards and their fabrication
US3269861A (en) * 1963-06-21 1966-08-30 Day Company Method for electroless copper plating
DE1301186B (en) * 1963-09-19 1969-08-14 Basf Ag Process for the metallization of surfaces of plastic objects
US3377174A (en) * 1963-10-24 1968-04-09 Torigai Eiichi Method and bath for chemically plating copper
US3340164A (en) * 1963-12-26 1967-09-05 Sperry Rand Corp Method of copper plating anodized aluminum
US3403035A (en) * 1964-06-24 1968-09-24 Process Res Company Process for stabilizing autocatalytic metal plating solutions
US3322881A (en) * 1964-08-19 1967-05-30 Jr Frederick W Schneble Multilayer printed circuit assemblies
US3296012A (en) * 1965-04-30 1967-01-03 Corning Glass Works Electroless copper plating on ceramic material
US3607317A (en) * 1969-02-04 1971-09-21 Photocircuits Corp Ductility promoter and stabilizer for electroless copper plating baths
US3853590A (en) * 1969-08-20 1974-12-10 Crown City Plating Co Electroless plating solution and process
US4036651A (en) * 1974-02-26 1977-07-19 Rca Corporation Electroless copper plating bath
NL8103174A (en) * 1981-07-02 1983-02-01 Philips Nv METHOD FOR MANUFACTURING LAYERS AND PATTERNS OF GOLD AND GOLD ALLOYS ON SUBSTRATES, PRODUCED PRODUCTS AND SOLUTIONS TO BE USED FOR THAT.
US4460427A (en) * 1981-09-21 1984-07-17 E. I. Dupont De Nemours And Company Process for the preparation of flexible circuits
FR2527833A1 (en) * 1982-05-28 1983-12-02 Europ Composants Electron Economic metallic terminations on a ceramic multilayer capacitor - using non-precious metals after applying copper, nickel or platinum gp. cpd. sensitiser
US4548644A (en) * 1982-09-28 1985-10-22 Hitachi Chemical Company, Ltd. Electroless copper deposition solution
JPS6033358A (en) * 1983-08-04 1985-02-20 Hitachi Chem Co Ltd Electroless copper plating liquid
DE3404270A1 (en) * 1984-02-04 1985-08-08 Schering AG, 1000 Berlin und 4709 Bergkamen AQUEOUS ALKALINE BATH FOR CHEMICAL DEPOSITION OF COPPER, NICKEL, COBALT AND THEIR ALLOYS
EP0265895B1 (en) * 1986-10-31 1993-02-10 AMP-AKZO CORPORATION (a Delaware corp.) Method for electrolessly depositing high quality copper
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US5786030A (en) * 1996-11-12 1998-07-28 Henkel Corporation Spotting resistant gloss enhancement of autodeposition coating
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
US8673091B2 (en) * 2007-08-03 2014-03-18 Ppg Industries Ohio, Inc Pretreatment compositions and methods for coating a metal substrate
US9574093B2 (en) * 2007-09-28 2017-02-21 Ppg Industries Ohio, Inc. Methods for coating a metal substrate and related coated metal substrates
US20090238979A1 (en) * 2008-03-21 2009-09-24 William Decesare Method of Applying Catalytic Solution for Use in Electroless Deposition
US8282801B2 (en) * 2008-12-18 2012-10-09 Ppg Industries Ohio, Inc. Methods for passivating a metal substrate and related coated metal substrates
CN103009708A (en) * 2011-09-21 2013-04-03 深圳富泰宏精密工业有限公司 Film plating member and manufacturing method thereof
US9273399B2 (en) 2013-03-15 2016-03-01 Ppg Industries Ohio, Inc. Pretreatment compositions and methods for coating a battery electrode
CN106823469B (en) * 2017-01-10 2019-05-14 华南理工大学 Super-hydrophobic super-oleophylic copper mesh and preparation method thereof without low-surface energy substance modification
US10060034B2 (en) 2017-01-23 2018-08-28 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2391289A (en) * 1941-09-15 1945-12-18 Jr John F Beaver Bright copper plating
US2874072A (en) * 1956-09-17 1959-02-17 Gen Electric Autocatalytic copper plating process and solution
US2938805A (en) * 1958-03-31 1960-05-31 Gen Electric Process of stabilizing autocatalytic copper plating solutions
US2956901A (en) * 1958-08-06 1960-10-18 Alpha Metal Lab Inc Copper coating composition and method of coating

Also Published As

Publication number Publication date
DE1696312A1 (en) 1971-07-15
CH413540A (en) 1966-05-15
US3095309A (en) 1963-06-25
DE1696312B2 (en) 1971-07-15
DE1696312C2 (en) 1979-08-16
DK105901C (en) 1966-11-21

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