ES2556981T3 - Composición de pre-ataque químico y proceso de ataque químico para sustratos de plástico - Google Patents

Composición de pre-ataque químico y proceso de ataque químico para sustratos de plástico Download PDF

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ES2556981T3
ES2556981T3 ES12165248.1T ES12165248T ES2556981T3 ES 2556981 T3 ES2556981 T3 ES 2556981T3 ES 12165248 T ES12165248 T ES 12165248T ES 2556981 T3 ES2556981 T3 ES 2556981T3
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attack
composition
chemical
acid
chemical pre
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Christin Ziegert
Christian Rietmann
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MacDermid Enthone Inc
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Enthone Inc
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • C23C18/30Activating or accelerating or sensitising with palladium or other noble metal
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/02Chemical treatment or coating of shaped articles made of macromolecular substances with solvents, e.g. swelling agents
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/2066Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073Multistep pretreatment
    • C23C18/2086Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22Roughening, e.g. by etching
    • C23C18/24Roughening, e.g. by etching using acid aqueous solutions

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemically Coating (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Una composición de pre-ataque químico acuosa para el tratamiento de sustratos no conductores en un proceso de recubrimiento para la deposición de una capa de metal sobre una superficie de sustrato, en donde la composición de pre-ataque químico contiene por lo menos un disolvente soluble en agua, en donde la composición contiene por lo menos un compuesto seleccionado de entre el grupo que consiste en terpenos, fenilpropanoides, isovainillina y vainillina caracterizada por que la composición contiene adicionalmente por lo menos un disolvente seleccionado de entre el grupo que consiste en éster dimetílico del ácido 2-metilpentanodioico, isopentil diol, 6,6-dimetil biciclo- (3,1,1)-2-hepteno-2-etanol y etilacetoacetato.

Description

imagen1
imagen2
imagen3
imagen4
imagen5
en la que R1 = C3H5,C3H3O, o C3H5O, R2 = H, OCH3, OH, y R3 = H, OH, OCH3, COOCH3, en la que por lo menos R1 difiere con respecto a R2 o R3, o R2 y R3 como un agente de hinchamiento en un proceso de deposición de
5 metal sobre una superficie de sustrato de plástico, como por ejemplo la superficie de un sustrato que se fabrica a partir de ABS, PC, PEI, o una mezcla que comprende por lo menos uno de los plásticos que se han mencionado en lo que antecede.
En otra realización, la invención se refiere al uso de un compuesto del grupo que consiste en anetol, estragol,
10 eugenol, isoeugenol, vainillina, isovainillina, metil eugenol, cinamaldehído, ácido cinámico, alcohol coniferílico, safrol, apiol, dilapiol, citral, mirceno, geraniol, citronelal, citronelol, 1,8-cineol, carvona, felandreno, α-pineno, β-pineno, limoneno, canfeno, 3-careno, terpinoleno, acetato de bornilo, mentol, mentona, citronelol, nerol, linalool, farnesol, rodinol, sabineno, borneol, isoborneol, α-terpineol, β-terpineol, γ-terpineol, δ-terpineol, trans-verbenol, cis-verbenol, ácido isovalérico y ácido giberélico o una mezcla de estos como un agente de hinchamiento en un proceso de
15 deposición de metal sobre una superficie de sustrato de plástico.
En otra realización, la invención se refiere al uso de un terpeno y/o un fenilpropanoide como un agente de hinchamiento en un proceso de deposición de una capa de metal sobre una superficie de sustrato no conductor en combinación con un disolvente soluble en agua. Preferiblemente, el disolvente está seleccionado de entre el grupo 20 que consiste en glicoles y sus derivados, por ejemplo dipropilen glicol (DPG), dietilen glicol monobutil éter (DEG-MBE), dietilen glicol, etilen glicol, etilen glicol dimetil éter, trietilen glicol, dietilen glicol dimetil éter (diglima), trietilen glicol dimetil éter (triglima), tetraetilen glicol dimetil éter (tatraglima), dipropilen glicol dimetil éter (proglima), polietilen glicol dimetil éter (poliglima), también varios disolventes como alcoholes solubles, éteres, ésteres, por ejemplo isopentil diol (IPD), 3-metoxi-3-metilbutan-1-ol (MMB) o su acetato (MMB-Ac), butiro-1.4-lactona, 1.3
25 dioxaciclopentano, 4-metil-1.3-dioxaciclopentano o una mezcla de estos.
La invención se explica en lo siguiente en términos de ejemplos.
Ejemplos de composiciones de pre-ataque químico
30 Tabla 1
Ejemplo n.º
Disolvente Terpeno / fenilpropanoide / vainillina Aditivo Ácido/Hidróxido
1
DPG, 400 ml/l + DEG-MBE, 30 ml/l Citral, 10 ml/l éster dimetílico del ácido 2-metilpentanodioico, 20 ml/l
2
DEG-MBE 300 ml/l Cineol, 10 ml/l éster dimetílico del ácido 2-metilpentanodioico, 20 ml/l
3
DPG, 100 ml/l Eugenol, 5 ml/l éster dimetílico del ácido 2-metilpentanodioico, 20 ml/l
4
DPG, 250 ml/l Limoneno, 20 ml/l
5
DEG-MBE 300 ml/l Citronelol, 30 ml/l Etilacetoacetato, 80 ml/l
6
DPG, 440 ml/l + DEG-MBE, 30 ml/l Carvona, 10 ml/l
7
DPG, 430 ml/l + DEG-MBE, 30 ml/l + MMB-Ac, 5 ml/l + IPD, 30 ml/l Citral, 10 ml/l
8
DPG, 20 ml/l Ácido isovalérico, 10 g/l éster dimetílico del ácido 2-metilpentanodioico, 20 ml/l
9
IPD, 400 ml/l Eugenol, 10 ml/l
10
DEG-MBE, 250 ml/l Cineol, 10 ml/l
11
DPG, 460 ml/l Felandreno, 10 ml/l
12
DPG, 250 ml/l Prenol, 10 ml/l
6
imagen6
Agente de ataque químico de permanganato alcalino
Permanganato de potasio Hidróxido de sodio 15 g/l 40 g/l 65 10
Neutralizador 1
Ácido oxálico Ácido ascórbico 5 g/l 10 g/l 30 4
Neutralizador 2 (Acondicionador)
Trietanol amina 10 g/l 35 2
Enjuagado
Agua
Activador UDIQUE PD plus
Estabilizador UDIQUE DP-310 Activador UDIQUE DP-320 Ácido clorhídrico 100 ml/l 20 ml/l 275 ml/l 45 4
Enjuagado
Agua
Conductor UDIQUE DP plus
Conductor UDIQUE DP-410-A Conductor UDIQUE DP-420-B 100 ml/l 200 ml/l 55 4
Enjuagado
Agua
Cuprostar 1560
CuSO4 * H2O Ácido sulfúrico Ácido clorhídrico APORTE Cuprostar 1560 VEHÍCULO Cuprostar 1560 NIVELADOR Cuprostar 1560 AGENTE HUMECTANTE Cuprostar 1560 215 g/l 35 ml/l 0,25 ml/l 6 ml/l 0,5 ml/l 0,4 ml/l 0,5 ml/l 25 50
Las composiciones UDIQUE y las composiciones Cuprostar tal como se menciona en la tabla 4 son facilitadas comercialmente por Enthone Inc., West Haven, Connecticut, EE. UU.
Resultados de prueba de adherencia
Tabla 5
Agente de ataque químico
Ácido crómico -sulfúrico Permanganato ácido Permanganato alcalino
ABS
0,59 N/mm 0,57 N/mm 0,68 N/mm
PC-ABS
0,70 N/mm 0,68 N/mm 0,70 N/mm
Los sustratos que se mencionan en la tabla 5 se trataron de acuerdo con el procedimiento global tal como se divulga en la tabla 4. Las pruebas de adherencia se realizaron de acuerdo con la norma DIN 53494 (1984).
8

Claims (1)

  1. imagen1
    imagen2
ES12165248.1T 2012-04-24 2012-04-24 Composición de pre-ataque químico y proceso de ataque químico para sustratos de plástico Active ES2556981T3 (es)

Applications Claiming Priority (1)

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EP12165248.1A EP2657367B1 (en) 2012-04-24 2012-04-24 Pre-etching composition and etching process for plastic substrates

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ES2556981T3 true ES2556981T3 (es) 2016-01-21

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2937446B1 (en) * 2013-10-22 2018-06-13 Okuno Chemical Industries Co., Ltd. Composition for etching treatment of resin material
PT3126547T (pt) * 2014-04-01 2020-05-19 Atotech Deutschland Gmbh Composição e processo para metalizar superfícies plásticas não condutoras
CN110344033A (zh) 2014-07-10 2019-10-18 奥野制药工业株式会社 树脂镀敷方法以及树脂镀敷用蚀刻浴的管理方法
EP3059277B2 (en) 2015-02-23 2022-03-30 MacDermid Enthone Inc. Inhibitor composition for racks when using chrome free etches in a plating on plastics process
US20200087791A1 (en) * 2017-06-01 2020-03-19 Jcu Corporation Multi-stage resin surface etching method, and plating method on resin using same
EP4299790A1 (en) 2022-06-30 2024-01-03 Atotech Deutschland GmbH & Co. KG Method for etching a plastic substrate including spraying and electrolytic regeneration

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA999826A (en) * 1973-12-03 1976-11-16 Derek G.E. Kerfoot Photodeposition of metals on a non-conductive substrate
US5015329A (en) * 1988-11-07 1991-05-14 Jp Laboratories, Inc. Pre-swelling and etching of plastics for plating
CA2031422A1 (en) * 1990-05-01 1991-11-02 Richard C. Retallick Method for improving metal adhesion to polyimide surfaces
US5271773A (en) * 1990-12-07 1993-12-21 Golden Technologies Company, Inc. Process for cleaning articles with an aqueous solution of terpene and recycle water after separation
US5332465A (en) * 1993-09-08 1994-07-26 Macdermid, Incorporated Process for preparing plastic surfaces to be plated
DE19740431C1 (de) 1997-09-11 1998-11-12 Atotech Deutschland Gmbh Verfahren zum Metallisieren eines elektrisch nichtleitende Oberflächenbereiche aufweisenden Substrats
FR2786664B1 (fr) * 1998-12-03 2001-03-09 Xeda Internat Sa Procede de traitement de fruits et legumes utilisant l'eugenol et/ou l'isoeugenol et utilisation d'une composition a base d'eugenol et/ou d'isoeugenol
DE10054544A1 (de) 2000-11-01 2002-05-08 Atotech Deutschland Gmbh Verfahren zum chemischen Metallisieren von Oberflächen
DE10124631C1 (de) 2001-05-18 2002-11-21 Atotech Deutschland Gmbh Verfahren zum direkten elektrolytischen Metallisieren von elektrisch nichtleiteitenden Substratoberflächen
US20050199587A1 (en) 2004-03-12 2005-09-15 Jon Bengston Non-chrome plating on plastic
DE102005051632B4 (de) 2005-10-28 2009-02-19 Enthone Inc., West Haven Verfahren zum Beizen von nicht leitenden Substratoberflächen und zur Metallisierung von Kunststoffoberflächen
ATE445667T1 (de) 2007-08-10 2009-10-15 Enthone Chromfreie beize für kunststoffoberflächen
EP2576747B1 (en) * 2010-05-31 2014-04-23 Unilever NV Hard surface treatment composition

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EP2657367A1 (en) 2013-10-30
WO2013163316A3 (en) 2014-06-12
WO2013163316A2 (en) 2013-10-31

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