ES2187285B1 - Procedimiento de multifresado para la fabricacion de circuitos impresos y circuito impreso asi obtenido. - Google Patents

Procedimiento de multifresado para la fabricacion de circuitos impresos y circuito impreso asi obtenido.

Info

Publication number
ES2187285B1
ES2187285B1 ES200101962A ES200101962A ES2187285B1 ES 2187285 B1 ES2187285 B1 ES 2187285B1 ES 200101962 A ES200101962 A ES 200101962A ES 200101962 A ES200101962 A ES 200101962A ES 2187285 B1 ES2187285 B1 ES 2187285B1
Authority
ES
Spain
Prior art keywords
printed circuit
printed
procedure
multifresado
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn - After Issue
Application number
ES200101962A
Other languages
English (en)
Other versions
ES2187285A1 (es
Inventor
Ramon Piñana Lopez
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lear Automotive EEDS Spain SL
Original Assignee
Lear Automotive EEDS Spain SL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lear Automotive EEDS Spain SL filed Critical Lear Automotive EEDS Spain SL
Priority to ES200101962A priority Critical patent/ES2187285B1/es
Priority to PCT/ES2002/000410 priority patent/WO2003020001A1/es
Priority to EP02796283A priority patent/EP1427267A1/en
Publication of ES2187285A1 publication Critical patent/ES2187285A1/es
Priority to US10/707,927 priority patent/US20040172820A1/en
Application granted granted Critical
Publication of ES2187285B1 publication Critical patent/ES2187285B1/es
Anticipated expiration legal-status Critical
Withdrawn - After Issue legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Procedimiento de multifresado para la fabricación de circuitos impresos y circuito impreso así obtenido constituido por un procedimiento de adecuación del substrato de las placas de circuitos impresos (1), para la producción de zonas de pliegue (2) por donde doblar dichos circuitos impresos (1). Este procedimiento consiste en un sistema de multifresado, mediante una fresa (3) de especiales características, compuesta por un rodillo provisto en su superficie de multitud de bandas de pulido, susceptibles de hacer un rebaje en bandas paralelas (4) en la citada zona de pliegue (2) de un circuito impreso (1), posibilitando su posterior pliegue sin deteriorar las pistas conductoras de material metálico, adheridas al substrato del circuito impreso, por la cara opuesta a la superficie fresada.
ES200101962A 2001-08-24 2001-08-24 Procedimiento de multifresado para la fabricacion de circuitos impresos y circuito impreso asi obtenido. Withdrawn - After Issue ES2187285B1 (es)

Priority Applications (4)

Application Number Priority Date Filing Date Title
ES200101962A ES2187285B1 (es) 2001-08-24 2001-08-24 Procedimiento de multifresado para la fabricacion de circuitos impresos y circuito impreso asi obtenido.
PCT/ES2002/000410 WO2003020001A1 (es) 2001-08-24 2002-08-21 Procedimiento de multifresado para la fabricacion de circuitos impresos y circuito impreso asi obtenido
EP02796283A EP1427267A1 (en) 2001-08-24 2002-08-21 Multi-milling method for the production of printed circuits and the printed circuits thus obtained
US10/707,927 US20040172820A1 (en) 2001-08-24 2004-01-26 Multi-Milling Method for the Production of Printed Circuits and the Printed Circuits Thus Obtained

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES200101962A ES2187285B1 (es) 2001-08-24 2001-08-24 Procedimiento de multifresado para la fabricacion de circuitos impresos y circuito impreso asi obtenido.

Publications (2)

Publication Number Publication Date
ES2187285A1 ES2187285A1 (es) 2003-05-16
ES2187285B1 true ES2187285B1 (es) 2004-08-16

Family

ID=8498788

Family Applications (1)

Application Number Title Priority Date Filing Date
ES200101962A Withdrawn - After Issue ES2187285B1 (es) 2001-08-24 2001-08-24 Procedimiento de multifresado para la fabricacion de circuitos impresos y circuito impreso asi obtenido.

Country Status (4)

Country Link
US (1) US20040172820A1 (es)
EP (1) EP1427267A1 (es)
ES (1) ES2187285B1 (es)
WO (1) WO2003020001A1 (es)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2234430B1 (es) * 2003-12-11 2006-11-01 Vitelcom Mobile Technology, S.A. Estructura de placa de circuito impreso (pcb) configurada con distintos niveles.
US6927344B1 (en) * 2004-02-27 2005-08-09 Motorola, Inc. Flexible circuit board assembly
DE102005033218A1 (de) * 2005-07-15 2007-01-18 Printed Systems Gmbh Dreidimensionale Schaltung
US8022307B2 (en) * 2006-07-10 2011-09-20 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Fabric circuits and method of manufacturing fabric circuits
JP2013084729A (ja) * 2011-10-07 2013-05-09 Fujitsu Ltd 多層配線基板、電子装置、及び多層配線基板の製造方法
KR101958802B1 (ko) 2012-07-26 2019-03-18 삼성디스플레이 주식회사 접이식 표시 장치
WO2015100414A1 (en) 2013-12-27 2015-07-02 Arizona Board Of Regents On Behalf Of Arizona State University Deformable origami batteries
US10418664B2 (en) 2014-09-26 2019-09-17 Arizona Board Of Regents On Behalf Of Arizona State University Stretchable batteries
WO2016109652A1 (en) 2015-01-02 2016-07-07 Arizona Board Of Regents On Behalf Of Arizona State University Archimedean spiral design for deformable electronics
US10502991B2 (en) * 2015-02-05 2019-12-10 The Arizona Board Of Regents On Behalf Of Arizona State University Origami displays and methods for their manufacture
US10390698B2 (en) 2016-06-16 2019-08-27 Arizona Board Of Regents On Behalf Of Arizona State University Conductive and stretchable polymer composite
DE102018128594A1 (de) * 2017-11-15 2019-05-16 Steering Solutions Ip Holding Corporation Halbflexible, gefurchte leiterplattenanordnung
CN112165763A (zh) * 2018-05-11 2021-01-01 张海根 多组柔性pcb电子器件褶皱制备柜的制备方法
CN110625914B (zh) * 2019-11-07 2021-04-30 立讯智造(浙江)有限公司 一种按压式折弯装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3255299A (en) * 1964-03-16 1966-06-07 United Carr Inc Right-angle printed circuit board
GB1543381A (en) * 1975-05-13 1979-04-04 Pritelli Spa Automatic plant for machining panels sheets or planks of wood or wood derivatives
FR2457734A1 (fr) * 1979-06-01 1980-12-26 Orleans Atel Outillage Perfectionnements apportes aux procedes et machines du genre de ceux pour rainurer des plaques, notamment a circuits imprimes
US4901039A (en) * 1989-03-06 1990-02-13 The United States Of America As Represented By The Secretary Of The Navy Coupled strip line circuit
ES2021545A6 (es) * 1990-05-14 1991-11-01 Mecanismos Aux Ind Perfeccionamientos en el procedimiento para la fabricacion de cajas de distribucion electrica.
DE69305667T2 (de) * 1992-03-09 1997-05-28 Sumitomo Metal Ind Wärmesenke mit guten wärmezerstreuenden Eigenschaften und Herstellungsverfahren
CN1050810C (zh) * 1993-06-09 2000-03-29 利尔Eeds因特瑞尔公司 复合式联接器
US5697282A (en) * 1994-03-15 1997-12-16 Schuller International, Inc. Apparatus for and method of forming large diameter duct with liner and the product formed thereby
US5434362A (en) * 1994-09-06 1995-07-18 Motorola, Inc. Flexible circuit board assembly and method
US5925298A (en) * 1995-06-26 1999-07-20 Ford Motor Company Method for reworking a multi-layer circuit board using a shape memory alloy material
ES2127125B1 (es) * 1997-02-05 1999-11-16 Mecanismos Aux Ind Unos perfeccionamientos introducidos en la fabricacion de circuitos impresos.

Also Published As

Publication number Publication date
WO2003020001A1 (es) 2003-03-06
EP1427267A1 (en) 2004-06-09
ES2187285A1 (es) 2003-05-16
US20040172820A1 (en) 2004-09-09

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