ES2152709T3 - Base de soporte para un circuito integrado. - Google Patents
Base de soporte para un circuito integrado.Info
- Publication number
- ES2152709T3 ES2152709T3 ES97951096T ES97951096T ES2152709T3 ES 2152709 T3 ES2152709 T3 ES 2152709T3 ES 97951096 T ES97951096 T ES 97951096T ES 97951096 T ES97951096 T ES 97951096T ES 2152709 T3 ES2152709 T3 ES 2152709T3
- Authority
- ES
- Spain
- Prior art keywords
- integrated circuit
- printed
- circuit board
- elements
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
- H05K7/1084—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding pin grid array package carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
LA INVENCION SE REFIERE A UNA BASE PARA UN CIRCUITO INTEGRADO, ADECUADA PARA SER MONTADA EN UNA PLACA DE CIRCUITO IMPRESO (9), Y TIENE UNA UNIDAD (7) DE CONTACTO CON LA BASE, CON ELEMENTOS DE CONTACTO (53) A TRAVES DE LOS CUALES PUEDEN PRODUCIRSE CONEXIONES ELECTRICAS ENTRE TERMINALES DE CIRCUITO INTEGRADO (1) QUE VAN MONTADOS EN UNA PLACA DE CIRCUITO IMPRESO PARA SU MONTAJE A PRESION, Y ELEMENTOS DE CONEXION DE LA PLACA DE CIRCUITO IMPRESO (9). SEGUN LA INVENCION, LOS ELEMENTOS DE CONTACTO (53) ESTAN DISEÑADOS DE MANERA QUE SE ESTABLEZCA EL CONTACTO CON LOS ELEMENTOS DE CONEXION EN LA PLACA DE CIRCUITO IMPRESO (9) EN UNA TECNICA DE DISPOSITIVOS DE MONTAJE EN SUPERFICIE. LA INVENCION SE APLICA A BASES PARA ELEMENTOS ESTRUCTURALES MULTIPOLARES.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE29620593U DE29620593U1 (de) | 1996-11-26 | 1996-11-26 | Sockel für eine integrierte Schaltung |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2152709T3 true ES2152709T3 (es) | 2001-02-01 |
Family
ID=8032495
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES97951096T Expired - Lifetime ES2152709T3 (es) | 1996-11-26 | 1997-11-25 | Base de soporte para un circuito integrado. |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0941643B1 (es) |
AT (1) | ATE196222T1 (es) |
DE (2) | DE29620593U1 (es) |
ES (1) | ES2152709T3 (es) |
WO (1) | WO1998024284A1 (es) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3161423B2 (ja) * | 1998-08-11 | 2001-04-25 | 日本電気株式会社 | Lsiの実装構造 |
DE20117526U1 (de) * | 2001-10-26 | 2003-03-06 | EKL AG, 88299 Leutkirch | Elektromagnetische Abschirmung für Mikroprozessoren |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2919058A1 (de) * | 1979-05-10 | 1980-11-20 | Siemens Ag | Elektronisches geraet mit mindestens einer leiterplatte |
GB2163287B (en) * | 1984-08-07 | 1988-06-08 | Aavid Eng Inc | Electronic chip-carrier heat sinks |
US4679318A (en) * | 1986-02-06 | 1987-07-14 | Amp Incorporated | Application tool and method for positioning electrical sockets on circuit boards for surface soldering |
DE3629567A1 (de) * | 1986-08-30 | 1988-03-03 | Bbc Brown Boveri & Cie | Halbleiterblock |
DE8716007U1 (de) * | 1987-12-03 | 1989-01-05 | Siemens AG, 1000 Berlin und 8000 München | Vorrichtung zur Abführung von Verlustwärme aus integrierten Schaltungen |
JPH062316Y2 (ja) * | 1988-07-08 | 1994-01-19 | アルプス電気株式会社 | シールドケースの底面カバー取付構造 |
DE3910518A1 (de) * | 1989-04-01 | 1990-10-04 | Manfred Haller | Schaltungsplatine fuer die optimale entkopplung von schaltungen mit digitalen ic's |
US4969828A (en) * | 1989-05-17 | 1990-11-13 | Amp Incorporated | Electrical socket for TAB IC's |
US5151039A (en) * | 1990-04-06 | 1992-09-29 | Advanced Interconnections Corporation | Integrated circuit adapter having gullwing-shaped leads |
US5058265A (en) * | 1990-05-10 | 1991-10-22 | Rockwell International Corporation | Method for packaging a board of electronic components |
US5303466A (en) * | 1991-03-25 | 1994-04-19 | Daiichi Denshi Kogyo Kabushiki Kaisha | Method of mounting surface connector |
DE4326207A1 (de) * | 1992-10-06 | 1994-04-07 | Hewlett Packard Co | Mechanisch schwimmendes Mehr-Chip-Substrat |
JPH06164265A (ja) * | 1992-11-16 | 1994-06-10 | Toshiba Corp | マイクロ波増幅器 |
US5302853A (en) * | 1993-01-25 | 1994-04-12 | The Whitaker Corporation | Land grid array package |
DE4310446C1 (de) * | 1993-03-31 | 1994-05-05 | Export Contor Ausenhandelsgese | Schaltungsanordnung |
US5396403A (en) * | 1993-07-06 | 1995-03-07 | Hewlett-Packard Company | Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate |
US5473510A (en) * | 1994-03-25 | 1995-12-05 | Convex Computer Corporation | Land grid array package/circuit board assemblies and methods for constructing the same |
DE19511229A1 (de) * | 1994-03-28 | 1995-10-05 | Whitaker Corp | Chipträgersystem |
DE4420527A1 (de) * | 1994-06-13 | 1995-06-29 | Siemens Nixdorf Inf Syst | Verbindungssystem zum Kontaktieren von Bauelementen mit Pinanschluß und Finepitch-Rasterung auf Leiterplatten |
GB2293502A (en) * | 1994-09-26 | 1996-03-27 | Methode Electronics Inc | Miniature grid array socketing system |
-
1996
- 1996-11-26 DE DE29620593U patent/DE29620593U1/de not_active Expired - Lifetime
-
1997
- 1997-11-25 DE DE59702325T patent/DE59702325D1/de not_active Expired - Fee Related
- 1997-11-25 ES ES97951096T patent/ES2152709T3/es not_active Expired - Lifetime
- 1997-11-25 AT AT97951096T patent/ATE196222T1/de not_active IP Right Cessation
- 1997-11-25 WO PCT/DE1997/002758 patent/WO1998024284A1/de active IP Right Grant
- 1997-11-25 EP EP97951096A patent/EP0941643B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE29620593U1 (de) | 1998-01-02 |
WO1998024284A1 (de) | 1998-06-04 |
DE59702325D1 (de) | 2000-10-12 |
EP0941643B1 (de) | 2000-09-06 |
EP0941643A1 (de) | 1999-09-15 |
ATE196222T1 (de) | 2000-09-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DK0920714T4 (da) | Elektrisk eller elektronisk apparat | |
ATE252773T1 (de) | Leiterplattenverbinder | |
ATE52361T1 (de) | Elektrischer kontaktstift fuer gedruckte leiterplatte. | |
MY111967A (en) | Apparatus for interconnecting electrical contacts | |
DE59609280D1 (de) | Elektrischer Verbinder | |
GB2251125B (en) | Electronic component and method for its construction | |
ATE182424T1 (de) | Verbinder fuer gedruckte leiterplatten | |
SE8902342L (sv) | Aktiv proppbar funktionsenhet | |
NO981648L (no) | Multippel koaksialkontakt | |
ES2152709T3 (es) | Base de soporte para un circuito integrado. | |
ATE365387T1 (de) | Sub-d-stecker in smd-technik | |
EP1471780A3 (en) | Socket for connecting an integrated circuit to a printed wiring board | |
ATE268452T1 (de) | Lampenanordnung und zugehöriges testverfahren | |
MXPA00012488A (es) | Bastidor con soportes de placa, y el metodo y dispositivo de fabricacion de los soportes de placa en un bastidor. | |
WO2000004585A3 (de) | Chipträgeranordnung sowie verfahren zur herstellung einer chipträgeranordnung mit elektrischem test | |
TW348366B (en) | Method of removably mounting electronic components to a circuit board, and sockets formed by the methods | |
SE9404083L (sv) | Förfarande, anordning och kretskort för test av elektroniska komponenter | |
DE59804304D1 (de) | Elektrisches oder elektronisches gerät | |
WO1998041069A3 (de) | Flachbaugruppe und verfahren zum nachträglichen aufbringen von zusatzbauelementen auf eine leiterplatte | |
HUP9802165A2 (hu) | Villamos csatlakozó | |
EP1406351A3 (de) | Stiftleiste | |
SE8602006D0 (sv) | Kontaktanordning | |
EP1079476A3 (de) | Zur Montage auf eine Leiterplatte ausgelegtes Bauteil | |
WO2004046766A3 (en) | Optical component mounting and interconnect apparatus | |
EP0804062A3 (en) | Electronic device unit |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
Ref document number: 941643 Country of ref document: ES |