ES2105096T3 - Dispositivo optico y procedimiento de su fabricacion. - Google Patents

Dispositivo optico y procedimiento de su fabricacion.

Info

Publication number
ES2105096T3
ES2105096T3 ES93300550T ES93300550T ES2105096T3 ES 2105096 T3 ES2105096 T3 ES 2105096T3 ES 93300550 T ES93300550 T ES 93300550T ES 93300550 T ES93300550 T ES 93300550T ES 2105096 T3 ES2105096 T3 ES 2105096T3
Authority
ES
Spain
Prior art keywords
slot
way
optical device
manufacturing procedure
reflecting surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES93300550T
Other languages
English (en)
Inventor
Alan James Jacobs-Cook
Peter Edward Michael Frere
Mark Edward Christopher Bowen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZF International UK Ltd
Original Assignee
Lucas Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucas Industries Ltd filed Critical Lucas Industries Ltd
Application granted granted Critical
Publication of ES2105096T3 publication Critical patent/ES2105096T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/26Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
    • G01D5/268Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light using optical fibres
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/18Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
    • G01L1/183Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material by measuring variations of frequency of vibrating piezo-resistive material
    • G01L1/186Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material by measuring variations of frequency of vibrating piezo-resistive material optical excitation or measuring of vibrations
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0001Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means
    • G01L9/0008Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations
    • G01L9/0019Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations of a semiconductive element
    • G01L9/002Optical excitation or measuring
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4202Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G02B6/4203Optical features
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/36Mechanical coupling means
    • G02B6/3628Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/36Mechanical coupling means
    • G02B6/3628Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3684Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
    • G02B6/3692Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier with surface micromachining involving etching, e.g. wet or dry etching steps

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

UN BLOQUE DE SILICIO MONOCRISTALINO (1) ORIENTADO DE TAL MODO COMO PARA TENER UNA SUPERFICIE DEL CUERPO (2) ALINEADA EN UN PLANO CRISTALOGRAFICO {110}, ES GRABADA CON ACIDO SELECTIVAMENTE DE TAL MODO COMO PARA DEFINIR UNA RANURA (4) DESTINADA A RECIBIR UN GUIAONDAS OPTICO (8,24) Y UNA SUPERFICIE REFLECTANTE (7) MIRANDO A LA RANURA (4). LA RANURA (4) ESTA ALINEADA CON UN EJE CRISTALOGRAFICO <110>. LA SUPERFICIE REFLECTANTE (7) ESTA EN UN PLANO CRISTALOGRAFICO {100}. DE ESTE MODO LA RANURA ES PARALELA A LA SUPERFICIE DEL CUERPO (2) Y LA SUPERFICIE REFLECTANTE (7) ESTA A 45 (GRADOS) DE LA SUPERFICIE DEL CUERPO.
ES93300550T 1992-02-14 1993-01-26 Dispositivo optico y procedimiento de su fabricacion. Expired - Lifetime ES2105096T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB929203128A GB9203128D0 (en) 1992-02-14 1992-02-14 Alignment device for optical fibre

Publications (1)

Publication Number Publication Date
ES2105096T3 true ES2105096T3 (es) 1997-10-16

Family

ID=10710375

Family Applications (1)

Application Number Title Priority Date Filing Date
ES93300550T Expired - Lifetime ES2105096T3 (es) 1992-02-14 1993-01-26 Dispositivo optico y procedimiento de su fabricacion.

Country Status (6)

Country Link
US (1) US5384872A (es)
EP (1) EP0555968B1 (es)
JP (1) JPH0618740A (es)
DE (1) DE69311922T2 (es)
ES (1) ES2105096T3 (es)
GB (1) GB9203128D0 (es)

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CA2139086C (en) * 1993-12-27 2000-06-13 Kiyoto Matsumoto Light-receiving structure for waveguide type optical devices
GB9405265D0 (en) * 1994-03-17 1994-04-27 Lucas Ind Plc Magnetic field sensor
GB9405355D0 (en) * 1994-03-18 1994-05-04 Lucas Ind Plc Vibrating element transducer
KR0177101B1 (ko) * 1996-01-25 1999-05-15 김광호 광섬유 접속자 보호 지지대
US6866426B1 (en) * 2000-04-07 2005-03-15 Shipley Company, L.L.C. Open face optical fiber array for coupling to integrated optic waveguides and optoelectronic submounts
US7255978B2 (en) * 2000-05-09 2007-08-14 Shipley Company, L.L.C. Multi-level optical structure and method of manufacture
US6756185B2 (en) * 2000-05-09 2004-06-29 Shipley Company, L.L.C. Method for making integrated optical waveguides and micromachined features
US6425663B1 (en) 2000-05-25 2002-07-30 Encad, Inc. Microwave energy ink drying system
US6444964B1 (en) 2000-05-25 2002-09-03 Encad, Inc. Microwave applicator for drying sheet material
US6508550B1 (en) 2000-05-25 2003-01-21 Eastman Kodak Company Microwave energy ink drying method
US7345316B2 (en) * 2000-10-25 2008-03-18 Shipley Company, L.L.C. Wafer level packaging for optoelectronic devices
US6932519B2 (en) 2000-11-16 2005-08-23 Shipley Company, L.L.C. Optical device package
US6827503B2 (en) * 2000-12-01 2004-12-07 Shipley Company, L.L.C. Optical device package having a configured frame
US6883977B2 (en) 2000-12-14 2005-04-26 Shipley Company, L.L.C. Optical device package for flip-chip mounting
US6907150B2 (en) * 2001-02-07 2005-06-14 Shipley Company, L.L.C. Etching process for micromachining crystalline materials and devices fabricated thereby
US6885786B2 (en) * 2001-02-07 2005-04-26 Shipley Company, L.L.C. Combined wet and dry etching process for micromachining of crystalline materials
US20030021572A1 (en) * 2001-02-07 2003-01-30 Steinberg Dan A. V-groove with tapered depth and method for making
US6964804B2 (en) * 2001-02-14 2005-11-15 Shipley Company, L.L.C. Micromachined structures made by combined wet and dry etching
WO2002079845A1 (en) * 2001-03-28 2002-10-10 Iljin Corporation Small-formed optical module with optical waveguide
US20020195417A1 (en) * 2001-04-20 2002-12-26 Steinberg Dan A. Wet and dry etching process on <110> silicon and resulting structures
US7078671B1 (en) * 2001-08-06 2006-07-18 Shipley Company, L.L.C. Silicon optical microbench devices and wafer-level testing thereof
GB0123741D0 (en) 2001-10-03 2001-11-21 Qinetiq Ltd Mounting of optical components
US7128943B1 (en) * 2002-02-20 2006-10-31 University Of South Florida Methods for fabricating lenses at the end of optical fibers in the far field of the fiber aperture
US6920267B2 (en) * 2002-05-13 2005-07-19 Alps Electric Co., Ltd Optical coupling device and manufacturing method thereof
US6786654B2 (en) * 2002-08-21 2004-09-07 Hymite A/S Encapsulated optical fiber end-coupled device
US6980724B2 (en) * 2003-02-15 2005-12-27 Intel Corporation Monitoring power in optical networks
TWI254025B (en) 2003-05-23 2006-05-01 Rohm & Haas Elect Mat Etching process for micromachining crystalline materials and devices fabricated thereby
US8477298B2 (en) * 2009-09-30 2013-07-02 Corning Incorporated Angle-cleaved optical fibers and methods of making and using same
US20110075976A1 (en) * 2009-09-30 2011-03-31 James Scott Sutherland Substrates and grippers for optical fiber alignment with optical element(s) and related methods
US8295671B2 (en) * 2009-10-15 2012-10-23 Corning Incorporated Coated optical fibers and related apparatuses, links, and methods for providing optical attenuation
JP5647485B2 (ja) * 2010-10-25 2014-12-24 パナソニックIpマネジメント株式会社 光モジュール
JP5654316B2 (ja) * 2010-10-29 2015-01-14 パナソニックIpマネジメント株式会社 光モジュール
FR2985809B1 (fr) * 2012-01-16 2015-12-25 Laboratoire Nat De Metrologie Et Dessais Sonde optique interferometrique de mesure dimensionnelle
US20160161326A1 (en) * 2013-12-01 2016-06-09 Mao-Jen Wu Flexible Optical Sensor Module
US10782468B2 (en) 2016-10-13 2020-09-22 Stmicroelectronics Sa Method for manufacturing an optical device

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US4130343A (en) * 1977-02-22 1978-12-19 Bell Telephone Laboratories, Incorporated Coupling arrangements between a light-emitting diode and an optical fiber waveguide and between an optical fiber waveguide and a semiconductor optical detector
US4210923A (en) * 1979-01-02 1980-07-01 Bell Telephone Laboratories, Incorporated Edge illuminated photodetector with optical fiber alignment
US4294510A (en) * 1979-12-10 1981-10-13 International Business Machines Corporation Semiconductor fiber optical detection
DE3236149A1 (de) * 1982-09-29 1984-03-29 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von lichtwellenleiter-abzweigern und -multi-/demultiplexern nach dem strahlteilerprinzip
US4611884A (en) * 1982-11-24 1986-09-16 Magnetic Controls Company Bi-directional optical fiber coupler
JPH0622065B2 (ja) * 1987-02-25 1994-03-23 株式会社日立製作所 集積型光ヘツド
CA1309240C (en) * 1987-03-20 1992-10-27 Minoru Seino Method of connecting optical fibers
GB8729253D0 (en) * 1987-12-15 1988-01-27 Stc Plc Ridge waveguide to photodetector coupling
US4810557A (en) * 1988-03-03 1989-03-07 American Telephone And Telegraph Company, At&T Bell Laboratories Method of making an article comprising a tandem groove, and article produced by the method
US4916497A (en) * 1988-05-18 1990-04-10 Harris Corporation Integrated circuits including photo-optical devices and pressure transducers and method of fabrication
US5017263A (en) * 1988-12-23 1991-05-21 At&T Bell Laboratories Optoelectronic device package method
US5087124A (en) * 1989-05-09 1992-02-11 Smith Rosemary L Interferometric pressure sensor capable of high temperature operation and method of fabrication
US5243673A (en) * 1989-08-02 1993-09-07 E. I. Du Pont De Nemours And Company Opto-electronic component having positioned optical fiber associated therewith
EP0418423B2 (de) * 1989-09-22 1998-12-09 Siemens Aktiengesellschaft Verfahren zum anisotropen Ätzen von Silizium
US5071213A (en) * 1990-10-31 1991-12-10 The Boeing Company Optical coupler and method of making optical coupler
US5121457A (en) * 1991-05-21 1992-06-09 Gte Laboratories Incorporated Method for coupling laser array to optical fiber array

Also Published As

Publication number Publication date
EP0555968B1 (en) 1997-07-09
EP0555968A1 (en) 1993-08-18
JPH0618740A (ja) 1994-01-28
DE69311922D1 (de) 1997-08-14
US5384872A (en) 1995-01-24
DE69311922T2 (de) 1997-12-11
GB9203128D0 (en) 1992-04-01

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