ES2104689T3 - Estructura de magnetron cilindrico rotatorio para revestimiento de superficies grandes. - Google Patents

Estructura de magnetron cilindrico rotatorio para revestimiento de superficies grandes.

Info

Publication number
ES2104689T3
ES2104689T3 ES91900458T ES91900458T ES2104689T3 ES 2104689 T3 ES2104689 T3 ES 2104689T3 ES 91900458 T ES91900458 T ES 91900458T ES 91900458 T ES91900458 T ES 91900458T ES 2104689 T3 ES2104689 T3 ES 2104689T3
Authority
ES
Spain
Prior art keywords
large surfaces
target structure
rotary cylindrical
magnetron
cylindrical magnetron
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES91900458T
Other languages
English (en)
Inventor
Alex Boozenny
Josef T Hoog
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Linde LLC
Original Assignee
BOC Group Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOC Group Inc filed Critical BOC Group Inc
Application granted granted Critical
Publication of ES2104689T3 publication Critical patent/ES2104689T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Nozzles (AREA)
  • Coating By Spraying Or Casting (AREA)

Abstract

MECANISMOS PARA SOPORTAR, GIRAR, ENFRIAR Y DAR ENERGIA A UNA ESTRUCTURA DEL BLANCO DE MAGNETRON CILINDRICA (56, 61) EN UN SOPORTE DE PASO (65, 69) EN CADA EXTREMO DE LA ESTRUCTURA DEL BLANCO. SE DESCRIBEN DOS CONFIGURACIONES ESPECIFICAS. SE PROPORCIONAN MONTAJES PARTICULARES (72) DE IMANES DENTRO DEL CILINDRO-BLANCO. SE PUEDEN EMPLEAR OPCIONALMENTE DOS CILINDROS BLANCO GIRATORIOS ADYACENTES PARA INCREMENTAR LA VELOCIDAD DE DEPOSICION DE MATERIAL PULVERIZADO EN UN SUSTRATO. LAS VARIAS CARACTERISTICAS DE ESTA INVENCION ESTAN PARTICULARMENTE ADAPTADAS PARA UN MAGNETRON CILINDRICO DE GRAN ESCALA UTILIZADO PARA PULVERIZAR RECUBRIMIENTOS EN PANELES DE VIDRIO PARA ARQUITECTURA, PARABRISAS DE COCHES , Y SIMILARES, PERO TAMBIEN SON VENTAJOSOS PARA UTILIZAR EN EL RECUBRIMIENTO DE SUSTRATOS MUY PEQUEÑOS.
ES91900458T 1989-11-08 1990-11-07 Estructura de magnetron cilindrico rotatorio para revestimiento de superficies grandes. Expired - Lifetime ES2104689T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US43365389A 1989-11-08 1989-11-08
US07/609,815 US5096562A (en) 1989-11-08 1990-11-06 Rotating cylindrical magnetron structure for large area coating

Publications (1)

Publication Number Publication Date
ES2104689T3 true ES2104689T3 (es) 1997-10-16

Family

ID=27029926

Family Applications (1)

Application Number Title Priority Date Filing Date
ES91900458T Expired - Lifetime ES2104689T3 (es) 1989-11-08 1990-11-07 Estructura de magnetron cilindrico rotatorio para revestimiento de superficies grandes.

Country Status (10)

Country Link
US (1) US5096562A (es)
EP (1) EP0500774B1 (es)
JP (1) JP3281371B2 (es)
KR (1) KR0173132B1 (es)
AU (1) AU631712B2 (es)
CA (1) CA2069328A1 (es)
DE (1) DE69031126T2 (es)
DK (1) DK0500774T3 (es)
ES (1) ES2104689T3 (es)
WO (1) WO1991007521A1 (es)

Families Citing this family (111)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5106474A (en) * 1990-11-21 1992-04-21 Viratec Thin Films, Inc. Anode structures for magnetron sputtering apparatus
GB9121665D0 (en) * 1991-10-11 1991-11-27 Boc Group Plc Sputtering processes and apparatus
US5487822A (en) * 1993-11-24 1996-01-30 Applied Materials, Inc. Integrated sputtering target assembly
US5433835B1 (en) * 1993-11-24 1997-05-20 Applied Materials Inc Sputtering device and target with cover to hold cooling fluid
US5405517A (en) * 1993-12-06 1995-04-11 Curtis M. Lampkin Magnetron sputtering method and apparatus for compound thin films
US5616225A (en) * 1994-03-23 1997-04-01 The Boc Group, Inc. Use of multiple anodes in a magnetron for improving the uniformity of its plasma
US5571393A (en) * 1994-08-24 1996-11-05 Viratec Thin Films, Inc. Magnet housing for a sputtering cathode
US5518592A (en) 1994-08-25 1996-05-21 The Boc Group, Inc. Seal cartridge for a rotatable magnetron
US5445721A (en) 1994-08-25 1995-08-29 The Boc Group, Inc. Rotatable magnetron including a replacement target structure
CA2218279A1 (en) * 1995-04-25 1996-10-31 The Boc Group, Inc. Sputtering system using cylindrical rotating magnetron electrically powered using alternating current
US5591314A (en) * 1995-10-27 1997-01-07 Morgan; Steven V. Apparatus for affixing a rotating cylindrical magnetron target to a spindle
US5985115A (en) * 1997-04-11 1999-11-16 Novellus Systems, Inc. Internally cooled target assembly for magnetron sputtering
JP3634606B2 (ja) * 1997-12-15 2005-03-30 三洋電機株式会社 回転電極を用いた薄膜形成装置
US6340415B1 (en) 1998-01-05 2002-01-22 Applied Materials, Inc. Method and apparatus for enhancing a sputtering target's lifetime
EP1147065B1 (en) † 1998-12-21 2003-04-09 Cardinal CG Company Soil-resistant coating for glass surfaces
US6179973B1 (en) 1999-01-05 2001-01-30 Novellus Systems, Inc. Apparatus and method for controlling plasma uniformity across a substrate
US6207026B1 (en) 1999-10-13 2001-03-27 Applied Materials, Inc. Magnetron with cooling system for substrate processing system
DE19953470A1 (de) * 1999-11-05 2001-05-23 Heraeus Gmbh W C Rohrtarget
US6409897B1 (en) 2000-09-20 2002-06-25 Poco Graphite, Inc. Rotatable sputter target
DE10102493B4 (de) * 2001-01-19 2007-07-12 W.C. Heraeus Gmbh Rohrförmiges Target und Verfahren zur Herstellung eines solchen Targets
SE521095C2 (sv) * 2001-06-08 2003-09-30 Cardinal Cg Co Förfarande för reaktiv sputtring
US7399385B2 (en) 2001-06-14 2008-07-15 Tru Vue, Inc. Alternating current rotatable sputter cathode
DE10145201C1 (de) * 2001-09-13 2002-11-21 Fraunhofer Ges Forschung Einrichtung zum Beschichten von Substraten mit gekrümmter Oberfläche durch Pulsmagnetron-Zerstäuben
US6736948B2 (en) 2002-01-18 2004-05-18 Von Ardenne Anlagentechnik Gmbh Cylindrical AC/DC magnetron with compliant drive system and improved electrical and thermal isolation
US20030173217A1 (en) * 2002-03-14 2003-09-18 Sputtering Components, Inc. High-power ion sputtering magnetron
DE10213049A1 (de) * 2002-03-22 2003-10-02 Dieter Wurczinger Drehbare Rohrkatode
US7351480B2 (en) * 2002-06-11 2008-04-01 Southwest Research Institute Tubular structures with coated interior surfaces
DE60304745T2 (de) * 2002-12-18 2007-01-25 Cardinal Cg Co., Eden Prairie Plasmaunterstützte filmabscheidung
US20040200418A1 (en) * 2003-01-03 2004-10-14 Klaus Hartig Plasma spray systems and methods of uniformly coating rotary cylindrical targets
US20040129561A1 (en) * 2003-01-07 2004-07-08 Von Ardenne Anlagentechnik Gmbh Cylindrical magnetron magnetic array mid span support
US6905579B2 (en) * 2003-02-13 2005-06-14 Sputtering Components, Inc. Cylindrical magnetron target and spindle apparatus
US20050051422A1 (en) * 2003-02-21 2005-03-10 Rietzel James G. Cylindrical magnetron with self cleaning target
US7014741B2 (en) * 2003-02-21 2006-03-21 Von Ardenne Anlagentechnik Gmbh Cylindrical magnetron with self cleaning target
DE10312631A1 (de) * 2003-03-21 2004-10-07 Interpane Entwicklungs- Und Beratungsgesellschaft Mbh & Co.Kg Magnetron mit Kühlmittelschutz
DE10312632B4 (de) * 2003-03-21 2005-11-24 Interpane Entwicklungs- Und Beratungsgesellschaft Mbh & Co.Kg Magnetron mit zweistufiger Dichtung
WO2004085902A1 (en) * 2003-03-25 2004-10-07 Bekaert Advanced Coatings Universal vacuum coupling for cylindrical target
US6878242B2 (en) * 2003-04-08 2005-04-12 Guardian Industries Corp. Segmented sputtering target and method/apparatus for using same
JP2009513818A (ja) * 2003-07-04 2009-04-02 ベーカート・アドヴァンスト・コーティングス 回転管状スパッタターゲット組立体
US7513141B2 (en) * 2003-09-09 2009-04-07 Applied Films Corporation Method for differentially pumping endblock seal cavity
US20070106374A1 (en) * 2004-01-22 2007-05-10 Isoflux, Inc. Radiopaque coating for biomedical devices
SG118232A1 (en) * 2004-02-27 2006-06-27 Superiorcoat Private Ltd Cathodic arc coating apparatus
DE102004014323B4 (de) * 2004-03-22 2009-04-02 Von Ardenne Anlagentechnik Gmbh Verfahren und Anordnung zur Herstellung von Gradientenschichten oder Schichtenfolgen durch physikalische Vakuumzerstäubung
US20050224343A1 (en) * 2004-04-08 2005-10-13 Richard Newcomb Power coupling for high-power sputtering
ATE459092T1 (de) * 2004-05-05 2010-03-15 Applied Materials Gmbh & Co Kg Beschichtungsvorrichtung mit grossflächiger anordnung von drehbaren magnetronkathoden
US20060049043A1 (en) * 2004-08-17 2006-03-09 Matuska Neal W Magnetron assembly
US20060065524A1 (en) * 2004-09-30 2006-03-30 Richard Newcomb Non-bonded rotatable targets for sputtering
US7520965B2 (en) * 2004-10-12 2009-04-21 Southwest Research Institute Magnetron sputtering apparatus and method for depositing a coating using same
US7790003B2 (en) * 2004-10-12 2010-09-07 Southwest Research Institute Method for magnetron sputter deposition
WO2006042808A1 (en) * 2004-10-18 2006-04-27 Bekaert Advanced Coatings An end-block for a rotatable target sputtering apparatus
DK1799876T3 (da) * 2004-10-18 2009-04-20 Bekaert Advanced Coatings Flad endeblok som bærer for et drejeligt forstövningsmål
GB2419894B (en) * 2004-10-22 2009-08-26 Plasma Quest Ltd Sputtering system
US20060096855A1 (en) * 2004-11-05 2006-05-11 Richard Newcomb Cathode arrangement for atomizing a rotatable target pipe
ATE546561T1 (de) * 2004-11-19 2012-03-15 Applied Materials Gmbh & Co Kg Trägerplatte mit einer darauf aufgesetzten gekühlten rückenplatte
US7592051B2 (en) * 2005-02-09 2009-09-22 Southwest Research Institute Nanostructured low-Cr Cu-Cr coatings for high temperature oxidation resistance
PL1856303T3 (pl) * 2005-03-11 2009-06-30 Bekaert Advanced Coatings Pojedynczy, prostokątny blok czołowy
US20060278519A1 (en) * 2005-06-10 2006-12-14 Leszek Malaszewski Adaptable fixation for cylindrical magnetrons
US20060278521A1 (en) * 2005-06-14 2006-12-14 Stowell Michael W System and method for controlling ion density and energy using modulated power signals
US20060278524A1 (en) * 2005-06-14 2006-12-14 Stowell Michael W System and method for modulating power signals to control sputtering
US20070089982A1 (en) * 2005-10-24 2007-04-26 Hendryk Richert Sputtering target and method/apparatus for cooling the target
US20070095281A1 (en) * 2005-11-01 2007-05-03 Stowell Michael W System and method for power function ramping of microwave liner discharge sources
US7842355B2 (en) * 2005-11-01 2010-11-30 Applied Materials, Inc. System and method for modulation of power and power related functions of PECVD discharge sources to achieve new film properties
DE502005006841D1 (de) 2005-12-22 2009-04-23 Applied Materials Gmbh & Co Kg Zerstäubungsvorrichtung mit einer Rohrkathode und Verfahren zum Betreiben dieser Zerstäubungsvorrichtung
EP1840926B1 (de) * 2006-03-29 2011-10-19 Applied Materials GmbH & Co. KG Isolierende Vakuumdrehdurchführung für Rotationsmagnetrons
DE102006017455A1 (de) * 2006-04-13 2007-10-25 Applied Materials Gmbh & Co. Kg Rohrkathode
US20070289869A1 (en) * 2006-06-15 2007-12-20 Zhifei Ye Large Area Sputtering Target
EP2030221A1 (en) * 2006-06-19 2009-03-04 Bekaert Advanced Coatings Insert piece for an end-block of a sputtering installation
US20080011599A1 (en) 2006-07-12 2008-01-17 Brabender Dennis M Sputtering apparatus including novel target mounting and/or control
US20080011601A1 (en) * 2006-07-14 2008-01-17 Applied Materials, Inc. Cooled anodes
US7879203B2 (en) * 2006-12-11 2011-02-01 General Electric Company Method and apparatus for cathodic arc ion plasma deposition
EP1973141A1 (en) 2007-03-21 2008-09-24 Applied Materials, Inc. Sputter cathode assembly and sputter coating device
DE102008026001B4 (de) * 2007-09-04 2012-02-16 Von Ardenne Anlagentechnik Gmbh Verfahren und Vorrichtung zur Erzeugung und Bearbeitung von Schichten auf Substraten unter definierter Prozessatmosphäre und Heizelement
DE102008018609B4 (de) * 2008-04-11 2012-01-19 Von Ardenne Anlagentechnik Gmbh Antriebsendblock für ein rotierendes Magnetron
US9812299B2 (en) * 2008-04-28 2017-11-07 Cemecon Ag Apparatus and method for pretreating and coating bodies
DE102008033904B4 (de) * 2008-07-18 2012-01-19 Von Ardenne Anlagentechnik Gmbh Antriebsendblock für eine Magnetronanordnung mit einem rotierenden Target
US9751254B2 (en) 2008-10-09 2017-09-05 Bobst Manchester Ltd Apparatus for treating substrates
EP2175047B1 (en) * 2008-10-09 2017-02-08 Bobst Manchester Ltd Apparatus for plasma treating substrates and method
US20100101949A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Rotatable sputter target backing cylinder, rotatable sputter target, method of producing a rotatable sputter target, and coating installation
DE102008058528B4 (de) * 2008-11-21 2011-03-03 Von Ardenne Anlagentechnik Gmbh Endblock für eine Magnetronanordnung mit einem rotierenden Target
WO2010105077A2 (en) * 2009-03-12 2010-09-16 Applied Materials, Inc. Minimizing magnetron substrate interaction in large area sputter coating equipment
US8182662B2 (en) * 2009-03-27 2012-05-22 Sputtering Components, Inc. Rotary cathode for magnetron sputtering apparatus
CN101988187B (zh) * 2009-08-07 2012-11-07 沈阳科友真空技术有限公司 一种真空磁控溅射彩镀设备
JP5270505B2 (ja) * 2009-10-05 2013-08-21 株式会社神戸製鋼所 プラズマｃｖｄ装置
WO2011056581A2 (en) 2009-10-26 2011-05-12 General Plasma, Inc. Rotary magnetron magnet bar and apparatus containing the same for high target utilization
CZ304905B6 (cs) 2009-11-23 2015-01-14 Shm, S.R.O. Způsob vytváření PVD vrstev s pomocí rotační cylindrické katody a zařízení k provádění tohoto způsobu
DE102009056241B4 (de) * 2009-12-01 2012-07-12 Von Ardenne Anlagentechnik Gmbh Stützeinrichtung für eine Magnetronanordnung mit einem rotierenden Target
US8398834B2 (en) 2010-04-02 2013-03-19 NuvoSun, Inc. Target utilization improvement for rotatable magnetrons
WO2012094566A2 (en) 2011-01-06 2012-07-12 Sputtering Components, Inc. Sputtering apparatus
DE102011075543B4 (de) * 2011-05-10 2015-10-08 Von Ardenne Gmbh Anordnung zur Kühlung eines längserstreckten Magnetron
US10138544B2 (en) 2011-06-27 2018-11-27 Soleras, LTd. Sputtering target
JP2015505901A (ja) * 2011-12-09 2015-02-26 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 回転可能なスパッタターゲット
CN103184421A (zh) * 2011-12-30 2013-07-03 鸿富锦精密工业（深圳）有限公司 真空溅射靶磁芯
KR101920840B1 (ko) * 2012-07-02 2018-11-21 어플라이드 머티어리얼스, 인코포레이티드 스퍼터링된 물질의 층을 기판 상에 코팅하기 위한 장치 및 증착 시스템
KR102101720B1 (ko) * 2012-09-04 2020-04-21 뷔홀러 아게 스퍼터링 장치
KR101441481B1 (ko) * 2012-09-11 2014-09-17 주식회사 에스에프에이 회전형 캐소드 및 이를 구비한 스퍼터 장치
US9312108B2 (en) 2013-03-01 2016-04-12 Sputtering Components, Inc. Sputtering apparatus
US9418823B2 (en) 2013-03-01 2016-08-16 Sputtering Components, Inc. Sputtering apparatus
BE1020564A5 (nl) * 2013-04-04 2013-12-03 Soleras Advanced Coatings Bvba Spindel voor magnetron sputter inrichting.
KR102205398B1 (ko) * 2013-07-25 2021-01-21 삼성디스플레이 주식회사 스퍼터링 장치 및 이를 이용한 박막 형성 방법
US9809876B2 (en) * 2014-01-13 2017-11-07 Centre Luxembourgeois De Recherches Pour Le Verre Et La Ceramique (C.R.V.C.) Sarl Endblock for rotatable target with electrical connection between collector and rotor at pressure less than atmospheric pressure
WO2016033475A1 (en) 2014-08-29 2016-03-03 Sputtering Components, Inc. Dual power feed rotary sputtering cathode
EP3032566B1 (en) 2014-12-08 2019-11-06 Soleras Advanced Coatings bvba Cylindrical structure for use in an RF sputter process and a sputtering system comprising same
EP3032565A1 (en) 2014-12-08 2016-06-15 Soleras Advanced Coatings bvba A device having two end blocks, an assembly and a sputter system comprising same, and a method of providing RF power to a target tube using said device or assembly
JP6469432B2 (ja) * 2014-12-09 2019-02-13 株式会社アルバック ロータリーカソード、および、スパッタ装置
JP2016204705A (ja) 2015-04-22 2016-12-08 キヤノントッキ株式会社 成膜装置及び成膜方法
BE1023876B1 (nl) 2016-07-13 2017-08-31 Soleras Advanced Coatings Bvba Elektrische overdracht in een eindblok
WO2018093985A1 (en) 2016-11-17 2018-05-24 Cardinal Cg Company Static-dissipative coating technology
BE1024754B9 (nl) 2016-11-29 2018-07-24 Soleras Advanced Coatings Bvba Een universeel monteerbaar eindblok
BE1026859B1 (nl) 2018-10-22 2020-07-14 Soleras Advanced Coatings Bv Magnetron met geïntegreerd circuit voor het monitoren en controle
CN111139439B (zh) * 2020-01-21 2021-09-28 国家纳米科学中心 一种在大面积衬底上磁控溅射制备薄膜的方法
KR102509946B1 (ko) * 2022-07-11 2023-03-14 국형원 아크이온 증착장치
KR102509947B1 (ko) * 2022-07-20 2023-03-14 국형원 아크이온 증착장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3718572A (en) * 1971-10-07 1973-02-27 Hewlett Packard Co Sputtering system with spirally coiled coolant coil
US4422916A (en) * 1981-02-12 1983-12-27 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
US4356073A (en) * 1981-02-12 1982-10-26 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
DD217964A3 (de) * 1981-10-02 1985-01-23 Ardenne Manfred Einrichtung zum hochratezerstaeuben nach dem plasmatronprinzip
US4417968A (en) * 1983-03-21 1983-11-29 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
US4445997A (en) * 1983-08-17 1984-05-01 Shatterproof Glass Corporation Rotatable sputtering apparatus
US4443318A (en) * 1983-08-17 1984-04-17 Shatterproof Glass Corporation Cathodic sputtering apparatus
US4466877A (en) * 1983-10-11 1984-08-21 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus

Also Published As

Publication number Publication date
JPH05504373A (ja) 1993-07-08
US5096562A (en) 1992-03-17
AU6894891A (en) 1991-06-13
KR0173132B1 (ko) 1999-02-18
EP0500774A4 (en) 1993-04-28
KR920702436A (ko) 1992-09-04
JP3281371B2 (ja) 2002-05-13
WO1991007521A1 (en) 1991-05-30
EP0500774B1 (en) 1997-07-23
DE69031126T2 (de) 1998-01-15
EP0500774A1 (en) 1992-09-02
CA2069328A1 (en) 1991-05-09
DK0500774T3 (da) 1997-08-25
DE69031126D1 (de) 1997-08-28
AU631712B2 (en) 1992-12-03

Similar Documents

Publication Publication Date Title
ES2104689T3 (es) Estructura de magnetron cilindrico rotatorio para revestimiento de superficies grandes.
DE3476563D1 (de) Magnetron cathode sputtering apparatus
DE59101796D1 (de) Anordnung zum Beschichten von Substraten mit Magnetronkathoden.
DE69906808D1 (de) Schmutzabweisende beschichtung für glasoberflächen
DE69410830D1 (de) Induktiv-gekoppelte plasma-zerstaübungskammer mit fähigkeiten zur zerstaübung von leitendem material
RU94019986A (ru) Микроструктурная мембрана и способ ее изготовления
BR8904897A (pt) Composicao de revestimento de esmalte de vidro,substrato de vidro e processo para a formacao de uma folha de vidro revestida com esmalte de vidro
BR9001501A (pt) Processo para producao de um composto para uso em composicoes de revestimento;composicao de revestimento em agua;composicao de revestimento em solvente organico;e composicao de revestimento em po
ATE357292T1 (de) Sprühpistole zum beschichten von objekten
BR8906845A (pt) Processo para produzir um revestimento com uma pistola de pulverizacao termica
FI932062A0 (fi) Menetelmä piilolinssien värjäämiseksi ja väripäällystekoostumus
BR9405125A (pt) Composição e processo para melhorar a adesão de um revestimento a substratos gredosos
BR9203838A (pt) Sal de poliimida-amonio,processo de producao do mesmo,composicao compreendendo uma solucao do mesmo,processo de revestimento de substrato com o mesmo,e compostos do mesmo
BR8803527A (pt) Celula eletrolitica de aluminio,material adequado para uso como revestimento de uma celula eletrolitica de aluminio,processo de modificacao de uma celula eletrolitica de aluminio e processo de producao de aluminio
AU4909490A (en) Crosslinkable coating composition
FR2714677B1 (fr) Revêtement de matériau architectural.
DE59701095D1 (de) Vakuumbeschichtungsanlage mit einer beschichtungskammer und zumindest einer quellenkammer
ES2010431A6 (es) Procedimiento para fabricar rodillos de pintura.
DE69403940D1 (de) Feldemissionskathodenstruktur und Herstellungsverfahren
DE19781237D2 (de) Spritzpistole mit zugeordneter Mischkammer
BR8804836A (pt) Processo para fabricacao de bloco de cilindro para compressor rotativo com pistao girante e processo para fabricacao de compressor rotativo com pistao girante
DE69629330D1 (de) Sprühzerstäuber mit Gegenelektrode
BR9407747A (pt) Processo e intermediários antiparasíticos para doramectina
DE69314770D1 (de) Reaktives Abscheidungsverfahren mittels ionisiertem Cluster-Strahl
BR8102770A (pt) Sistema de ajuste de alta tensao, sistema ministrador de material de revestimento e processo e aparelho para controlar a diferenca de potencial entre um dispositivo ministrador de material de revestimento e um alvo

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 500774

Country of ref document: ES