ES2100808A1 - Baño galvanoplastico y proceso para paladio blanco - Google Patents

Baño galvanoplastico y proceso para paladio blanco

Info

Publication number
ES2100808A1
ES2100808A1 ES09401818A ES9401818A ES2100808A1 ES 2100808 A1 ES2100808 A1 ES 2100808A1 ES 09401818 A ES09401818 A ES 09401818A ES 9401818 A ES9401818 A ES 9401818A ES 2100808 A1 ES2100808 A1 ES 2100808A1
Authority
ES
Spain
Prior art keywords
electroplating bath
palladium
bath
white palladium
white
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES09401818A
Other languages
English (en)
Other versions
ES2100808B1 (es
Inventor
Jr Vicent Paneccasio
Elena Too
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Enthone OMI Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone OMI Inc filed Critical Enthone OMI Inc
Publication of ES2100808A1 publication Critical patent/ES2100808A1/es
Application granted granted Critical
Publication of ES2100808B1 publication Critical patent/ES2100808B1/es
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Pyridine Compounds (AREA)
  • Nitrogen Condensed Heterocyclic Rings (AREA)
  • Electroluminescent Light Sources (AREA)
  • Optical Filters (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

BAÑO GALVANOPLASTICA Y PROCESO PARA PALADIO BLANCO. LA PRESENTE INVENCION SE RELACIONA CON UN BAÑO GALVANOPLASTICO DE PALADIO MEJORADO Y LIBRE DE ADITIVOS METALICOS CONSISTENTE EN EL USO DE UN COMPUESTO ACIDO SULFONICO EN COMBINACION CON UNA CLASE ESPECIAL DE COMPUESTOS NITROGENADOS RELACIONADOS CON LA PIRIDINA TANTO PARA ESTABILIZAR EL BAÑO COMO PARA PROPORCIONAR DEPOSITOS BLANCOS DE PALADIO EN UN AMPLIO RANGO DE GROSORES DE CHAPADO.
ES09401818A 1993-08-16 1994-08-12 Baño galvanoplastico y proceso para paladio blanco Expired - Fee Related ES2100808B1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/106,672 US5415685A (en) 1993-08-16 1993-08-16 Electroplating bath and process for white palladium

Publications (2)

Publication Number Publication Date
ES2100808A1 true ES2100808A1 (es) 1997-06-16
ES2100808B1 ES2100808B1 (es) 1998-01-16

Family

ID=22312650

Family Applications (1)

Application Number Title Priority Date Filing Date
ES09401818A Expired - Fee Related ES2100808B1 (es) 1993-08-16 1994-08-12 Baño galvanoplastico y proceso para paladio blanco

Country Status (7)

Country Link
US (1) US5415685A (es)
JP (1) JP2722328B2 (es)
DE (1) DE4428966C2 (es)
ES (1) ES2100808B1 (es)
FR (1) FR2709312B1 (es)
GB (1) GB2283498B (es)
IT (1) IT1266196B1 (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19803818A1 (de) * 1997-11-15 1999-05-27 Doduco Gmbh Elektrolytisches Bad zum Abscheiden von Palladium und von Legierungen des Palladiums
EP0916747B1 (de) * 1997-11-15 2002-10-16 AMI Doduco GmbH Elektrolytisches Bad zum Abscheiden von Palladium und von Legierungen des Palladiums
TWI354716B (en) * 2007-04-13 2011-12-21 Green Hydrotec Inc Palladium-containing plating solution and its uses
US20110147225A1 (en) * 2007-07-20 2011-06-23 Rohm And Haas Electronic Materials Llc High speed method for plating palladium and palladium alloys
CN101348928B (zh) 2007-07-20 2012-07-04 罗门哈斯电子材料有限公司 镀钯及镀钯合金之高速方法
ES2387055T3 (es) * 2008-05-07 2012-09-12 Umicore Galvanotechnik Gmbh Baños de electrolitos de Pd y Pd-Ni
CN105332022A (zh) * 2015-11-20 2016-02-17 无锡市嘉邦电力管道厂 一种含亚硝酸钠、溴化异丙基三苯基磷鎓的钯电镀液及其电镀方法
JP7108153B1 (ja) * 2021-04-02 2022-07-27 松田産業株式会社 導電性材料

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4098656A (en) * 1976-03-11 1978-07-04 Oxy Metal Industries Corporation Bright palladium electroplating baths
FR2501243A1 (fr) * 1981-03-06 1982-09-10 Langbein Pfanhauser Werke Ag Bain de galvanoplastie pour deposer un alliage nickel-palladium, procede d'utilisation de ce bain

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3290234A (en) * 1963-10-29 1966-12-06 Technic Electrodeposition of palladium
US3458409A (en) * 1964-10-12 1969-07-29 Shinichi Hayashi Method and electrolyte for thick,brilliant plating of palladium
JPS4733176B1 (es) * 1967-01-11 1972-08-23
CH479715A (fr) * 1967-09-08 1969-10-15 Sel Rex Corp Procédé de placage électrolytique de palladium, et bain pour la mise en oeuvre de ce procédé
US3925170A (en) * 1974-01-23 1975-12-09 American Chem & Refining Co Method and composition for producing bright palladium electrodepositions
DE2607306C2 (de) * 1975-06-13 1983-12-22 Lea-Ronal, Inc., Freeport, N.Y. Wäßriges, elektrolytisches Palladium-Plattierungsbad
GB1495910A (en) * 1975-10-30 1977-12-21 Ibm Method and bath for electroplating palladium on an articl
US4066517A (en) * 1976-03-11 1978-01-03 Oxy Metal Industries Corporation Electrodeposition of palladium
US4100039A (en) * 1976-11-11 1978-07-11 International Business Machines Corporation Method for plating palladium-nickel alloy
DE2939920C2 (de) * 1979-10-02 1982-09-23 W.C. Heraeus Gmbh, 6450 Hanau Verwendung eines Amins in einem Bad zum galvanischen Abscheiden von Palladium
US4297177A (en) * 1980-09-19 1981-10-27 American Chemical & Refining Company Incorporated Method and composition for electrodepositing palladium/nickel alloys
US4299670A (en) * 1980-09-22 1981-11-10 Bell Telephone Laboratories, Incorporated Palladium plating procedure and bath
US4487665A (en) * 1980-12-17 1984-12-11 Omi International Corporation Electroplating bath and process for white palladium
US4486274A (en) * 1981-02-27 1984-12-04 At&T Bell Laboratories Palladium plating prodedure
GB2115440A (en) * 1982-02-25 1983-09-07 Engelhard Ind Ltd Electroplating bath for the production of palladium-nickel alloy contact material
US4406755A (en) * 1982-03-08 1983-09-27 Technic Inc. Bright palladium electrodeposition
FR2539145B1 (fr) * 1983-01-07 1986-08-29 Omi Int Corp Procede pour former a grande vitesse, par electrolyse, une couche de revetement en palladium sur un substrat et bain pour la mise en oeuvre de ce procede
DE3347384A1 (de) * 1983-12-29 1985-07-11 Inovan-Stroebe GmbH & Co KG, 7534 Birkenfeld Palladiumbad
US4741818A (en) * 1985-12-12 1988-05-03 Learonal, Inc. Alkaline baths and methods for electrodeposition of palladium and palladium alloys
JPS62139893A (ja) * 1985-12-12 1987-06-23 リ−ロ−ナル　インコ−ポレ−テツド パラジウムまたはパラジウム合金の電着用アルカリ性めつき浴および電着方法
US4673472A (en) * 1986-02-28 1987-06-16 Technic Inc. Method and electroplating solution for deposition of palladium or alloys thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4098656A (en) * 1976-03-11 1978-07-04 Oxy Metal Industries Corporation Bright palladium electroplating baths
FR2501243A1 (fr) * 1981-03-06 1982-09-10 Langbein Pfanhauser Werke Ag Bain de galvanoplastie pour deposer un alliage nickel-palladium, procede d'utilisation de ce bain

Also Published As

Publication number Publication date
JP2722328B2 (ja) 1998-03-04
ES2100808B1 (es) 1998-01-16
DE4428966C2 (de) 2000-01-13
FR2709312B1 (fr) 1997-01-31
GB9415764D0 (en) 1994-09-28
ITTO940660A1 (it) 1996-02-12
JPH07188973A (ja) 1995-07-25
ITTO940660A0 (it) 1994-08-12
US5415685A (en) 1995-05-16
GB2283498B (en) 1997-06-25
IT1266196B1 (it) 1996-12-23
DE4428966A1 (de) 1995-02-23
FR2709312A1 (fr) 1995-03-03
GB2283498A (en) 1995-05-10

Similar Documents

Publication Publication Date Title
GB2273941B (en) Functional fluid additives for acid copper electroplating baths
DK0660707T3 (da) Amantadin og beslægtede forbindelser til anvendelse i behandlingen af perifer neuropati
DE69400952D1 (de) Alkalisches Bad für die galvanische Abscheidung von Zink-Nickel-Legierungen
EP0545089A3 (en) Additive composition, acid zinc and zinc-alloy plating baths and methods for electrodepositing zinc and zinc alloys
AU558953B2 (en) Plating of zinc plated steel
IT1256790B (it) Soluzioni migliorate di zincato per il trattamento di alluminio e leghe di alluminio.
DE3465344D1 (en) Process for the activation of substrates for electroless metal plating
ES2100808A1 (es) Baño galvanoplastico y proceso para paladio blanco
SE8203232L (sv) Elektropleteringskomposition med zinklegering innehallande ett glansmedel
ES8101655A1 (es) Un procedimiento para galvanoplastra de un deposito de ni- quel-hierro brillante.
EP0521738A3 (en) Bath and method for the electroless plating of tin and tin-lead alloy
GB1507095A (en) Electro-deposition of zinc
ES8101656A1 (es) Un procedimiento para depositar una capa de cinc brillante sobre un sustrato.
UA37311C2 (uk) Засіб для лікування статевої дисфункції і фармацевтичний препарат
SE8300416L (sv) Zink-coboltbaserat elektropleteringsbad, forfarande for framstellningen av en zink-koboltpletering och derigenom framstellt, pleterat foremal
GB2189259B (en) Electroplating bath for forming zinc-nickel alloy coating
DE3475535D1 (en) Aqueous alcaline bath for chemically plating copper or nickel
DE3473478D1 (en) Plating bath composition for copper-tin-zinc alloy
ES8407118A1 (es) Un metodo de electrochapar un deposito de paladio sobre una pieza de trabajo
ES2021949A6 (es) Composicion de deposicion de niquel no electrolitico conteniendo sacarina y procedimiento de preparacion de un deposito de niquel no electrolitico negro.
EP0147463A4 (en) Zn-Ni ALLOY PLATING SOLUTION BASED ON A CHLORIDE BATH.
GB848387A (en) An electrolytic bath mixture
GB1473223A (en) Circuit board blanks
CA2054201A1 (en) Protection of lead-containing anodes during chromium electroplating
Kasaaian et al. Effects of Chromium Electroplating Solution Composition on Properties of the Deposits

Legal Events

Date Code Title Description
EC2A Search report published

Date of ref document: 19970616

Kind code of ref document: A1

Effective date: 19970616

FD1A Patent lapsed

Effective date: 20050813