ES2074139T3 - Tarjeta de c.i. que tiene un modulo de circuito integrado. - Google Patents
Tarjeta de c.i. que tiene un modulo de circuito integrado.Info
- Publication number
- ES2074139T3 ES2074139T3 ES90311820T ES90311820T ES2074139T3 ES 2074139 T3 ES2074139 T3 ES 2074139T3 ES 90311820 T ES90311820 T ES 90311820T ES 90311820 T ES90311820 T ES 90311820T ES 2074139 T3 ES2074139 T3 ES 2074139T3
- Authority
- ES
- Spain
- Prior art keywords
- card
- recess
- module
- circuit board
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
UNA TARJETA DE CI CONSTA DE UNA BASE HECHA DE RESINA SINTETICA Y TIENE UNA PRIMERA RANURA Y UNA SEGUNDA RANURA, UN MODULO DE CI QUE CONSTA DE UN TABLERO DE CIRCUITOS QUE TIENE REDES DE CONTACTO COLOCADAS SOBRE EL, UN CHIP DE CI COLOCADO SOBRE EL TABLERO DE CIRCUITOS Y UNA PARTE DE SELLADO QUE SELLA EL CHIP DE CI. LA PARTE DE SELLADO DEL MODULO DE CI ESTA COLOCADA EN LA PRIMERA RANURA DE LA BASE DE LA TARJETA Y EL TABLERO DE CIRCUITOS ESTA UNIDO A LA PRIMERA RANURA MEDIANTE UN ADHESIVO TERMOREACTIVO. LA TARJETA DE CI TIENE, ENTRE LA BASE DE LA TARJETA Y EL MODULO DE CI, UNA ABERTURA PARA SACAR EL AIRE A LA ATMOSFERA.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28190789 | 1989-10-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
ES2074139T3 true ES2074139T3 (es) | 1995-09-01 |
ES2074139T5 ES2074139T5 (es) | 1999-01-01 |
Family
ID=17645621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES90311820T Expired - Lifetime ES2074139T5 (es) | 1989-10-31 | 1990-10-29 | Tarjeta de c.i. que tiene un modulo de circuito integrado. |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0426406B2 (es) |
JP (1) | JP3095766B2 (es) |
AT (1) | ATE122485T1 (es) |
CA (1) | CA2027823C (es) |
DE (1) | DE69019298T3 (es) |
ES (1) | ES2074139T5 (es) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07182471A (ja) * | 1991-01-10 | 1995-07-21 | Nec Corp | Icカード |
FR2684471B1 (fr) * | 1991-12-02 | 1994-03-04 | Solaic | Procede de fabrication d'une carte a memoire et carte a memoire ainsi obtenue. |
DE4209184C1 (es) * | 1992-03-21 | 1993-05-19 | Orga Kartensysteme Gmbh, 6072 Dreieich, De | |
JPH06166286A (ja) * | 1992-11-30 | 1994-06-14 | Sony Corp | メモリカードの加熱圧着方法及び圧着機 |
US5956601A (en) * | 1996-04-25 | 1999-09-21 | Kabushiki Kaisha Toshiba | Method of mounting a plurality of semiconductor devices in corresponding supporters |
DE29709618U1 (de) * | 1997-06-03 | 1997-08-07 | Sternberg, Dirk, 94568 St Oswald | Chipkarte und Kartenadapter |
FR2794552B1 (fr) * | 1999-06-03 | 2001-08-31 | Gemplus Card Int | Procede de collage a chaud d'un module electronique dans une carte a puce |
GB2352999A (en) * | 1999-07-21 | 2001-02-14 | Allan Walter Sills | Smart card with chip carrier with contact pads fitted into aperture of card base |
EP2418608A1 (fr) * | 2010-07-23 | 2012-02-15 | Gemalto SA | Module électronique sécurisé, dispositif à module électronique sécurisé et procédé de fabrication |
EP3168788A1 (en) | 2015-11-11 | 2017-05-17 | Mastercard International Incorporated | Integrated circuit card |
EP3168787A1 (en) | 2015-11-11 | 2017-05-17 | Mastercard International Incorporated | Integrated circuit card |
PL3491584T3 (pl) | 2016-07-27 | 2022-11-07 | Composecure Llc | Elektroniczne komponenty do kart transakcyjnych i sposoby ich wytwarzania |
US10762412B2 (en) | 2018-01-30 | 2020-09-01 | Composecure, Llc | DI capacitive embedded metal card |
US10977540B2 (en) | 2016-07-27 | 2021-04-13 | Composecure, Llc | RFID device |
US11618191B2 (en) | 2016-07-27 | 2023-04-04 | Composecure, Llc | DI metal transaction devices and processes for the manufacture thereof |
CN111201538A (zh) | 2017-09-07 | 2020-05-26 | 安全创造有限责任公司 | 具有嵌入式电子部件的交易卡及其制造方法 |
US11151437B2 (en) | 2017-09-07 | 2021-10-19 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
DK3698280T3 (da) | 2017-10-18 | 2022-10-31 | Composecure Llc | Metal-, keramik- eller keramikbelagt transaktionskort med vindue eller vinduesmønster og eventuelt baggrundsbelysning |
JP7485005B1 (ja) * | 2022-12-19 | 2024-05-16 | 株式会社レゾナック | 接合体の製造方法、接合体、及び電気電子部品 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3151408C1 (de) * | 1981-12-24 | 1983-06-01 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit einem IC-Baustein |
DE3338597A1 (de) * | 1983-10-24 | 1985-05-02 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
JPS6394646A (ja) * | 1986-10-08 | 1988-04-25 | Mitsubishi Electric Corp | 電子装置 |
-
1990
- 1990-10-17 CA CA002027823A patent/CA2027823C/en not_active Expired - Fee Related
- 1990-10-23 JP JP02283422A patent/JP3095766B2/ja not_active Expired - Fee Related
- 1990-10-29 EP EP90311820A patent/EP0426406B2/en not_active Expired - Lifetime
- 1990-10-29 DE DE69019298T patent/DE69019298T3/de not_active Expired - Fee Related
- 1990-10-29 ES ES90311820T patent/ES2074139T5/es not_active Expired - Lifetime
- 1990-10-29 AT AT90311820T patent/ATE122485T1/de active
Also Published As
Publication number | Publication date |
---|---|
JPH03205197A (ja) | 1991-09-06 |
CA2027823C (en) | 1994-11-08 |
EP0426406A2 (en) | 1991-05-08 |
EP0426406B1 (en) | 1995-05-10 |
JP3095766B2 (ja) | 2000-10-10 |
DE69019298D1 (de) | 1995-06-14 |
DE69019298T2 (de) | 1996-01-04 |
EP0426406B2 (en) | 1998-08-19 |
ES2074139T5 (es) | 1999-01-01 |
ATE122485T1 (de) | 1995-05-15 |
CA2027823A1 (en) | 1991-05-01 |
DE69019298T3 (de) | 1999-04-15 |
EP0426406A3 (en) | 1993-03-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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