ES2030692T3 - Dispositivo refrigerador para componentes electricos. - Google Patents

Dispositivo refrigerador para componentes electricos.

Info

Publication number
ES2030692T3
ES2030692T3 ES198787115118T ES87115118T ES2030692T3 ES 2030692 T3 ES2030692 T3 ES 2030692T3 ES 198787115118 T ES198787115118 T ES 198787115118T ES 87115118 T ES87115118 T ES 87115118T ES 2030692 T3 ES2030692 T3 ES 2030692T3
Authority
ES
Spain
Prior art keywords
cavity
cooling
heat
electrical components
refrigerator device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES198787115118T
Other languages
English (en)
Inventor
Xaver Vogel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
Original Assignee
BBC Brown Boveri AG Switzerland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Switzerland filed Critical BBC Brown Boveri AG Switzerland
Application granted granted Critical
Publication of ES2030692T3 publication Critical patent/ES2030692T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Executing Machine-Instructions (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Dairy Products (AREA)

Abstract

EN UN DISPOSITIVO DE ENFRIAMIENTO DE EBULLICION PARA ELEMENTOS DE CONSTRUCCION SEMICONDUCTORES, PARTIENDO DE UN ENFRIAMIENTO DE LA CALDERA CON UN REFRIGERANTE (1) QUE CONTIENE UN LIQUIDO REFRIGERANTE (8) EN UN ESPACIO HUECO (4), QUE ESTA EN ESTRECHO CONTACTO TERMICO CON EL ELEMENTO DE CONSTRUCCION SEMICONDUCTOR (6) EN EL EXTERIOR DEL ESPACIO HUECO (4). EL CALOR SE CONDUCE SOBRE UN CONDUCTOR DE CALOR (5) EN EL LIQUIDO REFRIGERANTE (8) QUE CIERRA EL ESPACIO HUECO (4) POR UN LADO Y SE AISLA DEL REFRIGERANTE. EN ESTE DISPOSITIVO SE CONSIGUE UNA CONSTRUCCION MAS FACIL Y COMPACTA Y AL MISMO TIEMPO UNA FELXIBILIDAD ALTAMENTE MODULAR.
ES198787115118T 1986-10-29 1987-10-16 Dispositivo refrigerador para componentes electricos. Expired - Lifetime ES2030692T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH427986 1986-10-29

Publications (1)

Publication Number Publication Date
ES2030692T3 true ES2030692T3 (es) 1992-11-16

Family

ID=4273148

Family Applications (1)

Application Number Title Priority Date Filing Date
ES198787115118T Expired - Lifetime ES2030692T3 (es) 1986-10-29 1987-10-16 Dispositivo refrigerador para componentes electricos.

Country Status (9)

Country Link
EP (1) EP0268081B1 (es)
JP (1) JPS63116452A (es)
AT (1) ATE75074T1 (es)
DE (1) DE3778304D1 (es)
ES (1) ES2030692T3 (es)
FI (1) FI874753A (es)
IN (1) IN170337B (es)
NO (1) NO874515L (es)
ZA (1) ZA878041B (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO894328L (no) * 1989-10-30 1991-05-02 Dolphin Server Technology As Fremgangsmaate og anordning for kjoeling av elektroniske komponenter.
GB2380057A (en) * 2001-09-19 2003-03-26 Thermosonic Technology Inc Heat dissipation structure with cavity for improved heat transfer
JP4764073B2 (ja) * 2005-06-07 2011-08-31 キヤノン株式会社 シート供給装置及び記録装置
JP5880318B2 (ja) * 2012-07-04 2016-03-09 三菱電機株式会社 半導体装置
DE102016224232B4 (de) 2016-07-19 2024-03-21 Hanon Systems Efp Deutschland Gmbh Leiterplattenvorrichtung
DE202018003992U1 (de) 2018-08-26 2018-09-13 Hochschule Mittweida (Fh) Siedekühlbares Substrat mit wenigstens einem mikroelektronischen Bauelement und/oder als Träger mikroelektronischer Einheiten
DE102018006806B4 (de) 2018-08-26 2023-01-19 Hochschule Mittweida (Fh) Verwendung wenigstens eines Lasers zur Strukturierung mindestens eines Bereichs einer Oberfläche eines Substrats mit wenigstens einem mikroelektronischen Bauelement und/oder als Träger mikroelektronischer Einheiten

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2886746A (en) * 1956-01-05 1959-05-12 Gen Electric Evaporative cooling system for electrical devices
CH342661A (de) * 1956-08-11 1959-11-30 Bbc Brown Boveri & Cie Kühler für die Kühlung eines Halbleiterelementes
US3852806A (en) * 1973-05-02 1974-12-03 Gen Electric Nonwicked heat-pipe cooled power semiconductor device assembly having enhanced evaporated surface heat pipes
US4145708A (en) * 1977-06-13 1979-03-20 General Electric Company Power module with isolated substrates cooled by integral heat-energy-removal means
JPS5936827B2 (ja) * 1979-01-12 1984-09-06 日本電信電話株式会社 集積回路素子の冷却装置
DE3302840C2 (de) * 1983-01-28 1985-06-27 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Einrichtung zur Wärmeabführung von energieelektronischen Bauelementen

Also Published As

Publication number Publication date
ATE75074T1 (de) 1992-05-15
FI874753A (fi) 1988-04-30
NO874515L (no) 1988-05-02
JPS63116452A (ja) 1988-05-20
NO874515D0 (no) 1987-10-29
EP0268081B1 (de) 1992-04-15
DE3778304D1 (de) 1992-05-21
FI874753A0 (fi) 1987-10-28
ZA878041B (en) 1988-04-29
EP0268081A1 (de) 1988-05-25
IN170337B (es) 1992-03-14

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