ES199818U - Conjunto de circuito laminar. - Google Patents

Conjunto de circuito laminar.

Info

Publication number
ES199818U
ES199818U ES0199818U ES199818U ES199818U ES 199818 U ES199818 U ES 199818U ES 0199818 U ES0199818 U ES 0199818U ES 199818 U ES199818 U ES 199818U ES 199818 U ES199818 U ES 199818U
Authority
ES
Spain
Prior art keywords
laminar circuit
laminar
circuit
translation
machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES0199818U
Other languages
English (en)
Other versions
ES199818Y (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lucas Electrical Co Ltd
Original Assignee
Lucas Electrical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucas Electrical Co Ltd filed Critical Lucas Electrical Co Ltd
Publication of ES199818U publication Critical patent/ES199818U/es
Application granted granted Critical
Publication of ES199818Y publication Critical patent/ES199818Y/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Conjunto de circuito laminar, caracterizado porque comprende un circuito laminar y una caja para dicho circuito laminar, comprendiendo dicha caja una placa de soporte que está formada a base de un material que posee una alta conductividad térmica y sobre la cual está soportado, dicho circuito laminar, incluyendo además la caja una tapa que, junto con la placa de soporte, encierra a dicho circuito laminar, una capa de un material fluido, que tiene una alta conductividad térmica, emparedada entre el circuito laminar y dicha placa de soporte, y una pluralidad de conectores eléctricos elásticos llevados por dicha tapa y que cooperan elásticamente con dicho circuito laminar, definiendo dicha tapa y dicho circuíto laminar, entre ambos, una cavidad que está por lo menos parcialmente llena de un material para proteger a dicho circuito laminar.
ES1974199818U 1973-01-16 1974-01-16 Conjunto de circuito laminar. Expired ES199818Y (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB224073*[A GB1397181A (en) 1973-01-16 1973-01-16 Film circuit assemblies

Publications (2)

Publication Number Publication Date
ES199818U true ES199818U (es) 1975-09-16
ES199818Y ES199818Y (es) 1976-01-16

Family

ID=9736072

Family Applications (1)

Application Number Title Priority Date Filing Date
ES1974199818U Expired ES199818Y (es) 1973-01-16 1974-01-16 Conjunto de circuito laminar.

Country Status (11)

Country Link
US (1) US3906144A (es)
JP (1) JPS5519429B2 (es)
AR (1) AR198551A1 (es)
AU (1) AU475418B2 (es)
DE (1) DE2401463C3 (es)
ES (1) ES199818Y (es)
FR (1) FR2214171B1 (es)
GB (1) GB1397181A (es)
IN (1) IN138683B (es)
IT (1) IT1008697B (es)
ZA (1) ZA739180B (es)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5727143Y2 (es) * 1976-09-06 1982-06-14
DE2819499C3 (de) * 1978-05-03 1981-01-29 Siemens Ag, 1000 Berlin Und 8000 Muenchen Gehäuse für eine Halbleiteranordnung
US4750031A (en) * 1982-06-25 1988-06-07 The United States Of America As Represented By The United States National Aeronautics And Space Administration Hermetically sealable package for hybrid solid-state electronic devices and the like
JPS59502003A (ja) * 1982-11-09 1984-11-29 シリコン　コネクシヨン，インコ−ポレ−テツド 電子回路チツプ接続アツセンブリおよび方法
JPS59208800A (ja) * 1983-05-12 1984-11-27 株式会社日立製作所 自動車用電子装置
DE3603912A1 (de) * 1985-02-09 1986-08-14 Alps Electric Co., Ltd., Tokio/Tokyo Elektronischer netzwerk-baustein und verfahren zur herstellung desselben
JPS62154868U (es) * 1985-08-09 1987-10-01
JPH07120733B2 (ja) * 1985-09-27 1995-12-20 日本電装株式会社 車両用半導体素子パッケージ構造とその製造方法
US4916522A (en) * 1988-04-21 1990-04-10 American Telephone And Telegraph Company , At & T Bell Laboratories Integrated circuit package using plastic encapsulant
US4965699A (en) * 1989-04-18 1990-10-23 Magnavox Government And Industrial Electronics Company Circuit card assembly cold plate
FR2669177B1 (fr) * 1990-11-09 1992-12-31 Sofradir Ste Fse Detecteurs In Procede pour realiser l'assemblage reversible d'un circuit electronique de lecture et/ou d'exploitation et d'un support conducteur ou non de l'electricite.
US5258650A (en) * 1991-08-26 1993-11-02 Motorola, Inc. Semiconductor device having encapsulation comprising of a thixotropic fluorosiloxane material
US5539151A (en) * 1992-09-25 1996-07-23 Vlsi Technology, Inc. Reinforced sealing technique for an integrated-circuit package
US5477611A (en) * 1993-09-20 1995-12-26 Tessera, Inc. Method of forming interface between die and chip carrier
US5834339A (en) 1996-03-07 1998-11-10 Tessera, Inc. Methods for providing void-free layers for semiconductor assemblies
US5776796A (en) * 1994-05-19 1998-07-07 Tessera, Inc. Method of encapsulating a semiconductor package
US5915170A (en) * 1994-09-20 1999-06-22 Tessera, Inc. Multiple part compliant interface for packaging of a semiconductor chip and method therefor
US6214640B1 (en) 1999-02-10 2001-04-10 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages
KR101391925B1 (ko) * 2007-02-28 2014-05-07 페어차일드코리아반도체 주식회사 반도체 패키지 및 이를 제조하기 위한 반도체 패키지 금형
DE102018200512A1 (de) * 2018-01-12 2019-07-18 Robert Bosch Gmbh Vorrichtung aufweisend eine Elektronikeinheit und ein Gehäuse sowie ein Verfahren zur Herstellung einer solchen Vorrichtung

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3209065A (en) * 1962-08-02 1965-09-28 Westinghouse Electric Corp Hermetically enclosed electronic device
US3178506A (en) * 1962-08-09 1965-04-13 Westinghouse Electric Corp Sealed functional molecular electronic device
US3258661A (en) * 1962-12-17 1966-06-28 Sealed semiconductor device
FR1518374A (fr) * 1966-04-14 1968-03-22 Int Rectifier Corp Dispositif semi-conducteur
JPS448926Y1 (es) * 1966-09-10 1969-04-11
US3622419A (en) * 1969-10-08 1971-11-23 Motorola Inc Method of packaging an optoelectrical device
JPS4730126U (es) * 1971-05-06 1972-12-05
US3689804A (en) * 1971-09-30 1972-09-05 Nippon Denso Co Hybrid circuit device
US3801874A (en) * 1972-10-30 1974-04-02 Gen Electric Isolation mounting for semiconductor device

Also Published As

Publication number Publication date
DE2401463B2 (de) 1977-07-14
JPS5519429B2 (es) 1980-05-26
US3906144A (en) 1975-09-16
AU475418B2 (en) 1976-08-19
IN138683B (es) 1976-03-13
DE2401463A1 (de) 1974-07-18
FR2214171B1 (es) 1977-09-09
IT1008697B (it) 1976-11-30
FR2214171A1 (es) 1974-08-09
AU6333173A (en) 1975-06-12
GB1397181A (en) 1975-06-11
ES199818Y (es) 1976-01-16
DE2401463C3 (de) 1978-03-09
ZA739180B (en) 1974-10-30
AR198551A1 (es) 1974-06-28
JPS5069553A (es) 1975-06-10

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