EP4250318A1 - Magnetic assembly - Google Patents
Magnetic assembly Download PDFInfo
- Publication number
- EP4250318A1 EP4250318A1 EP22185907.7A EP22185907A EP4250318A1 EP 4250318 A1 EP4250318 A1 EP 4250318A1 EP 22185907 A EP22185907 A EP 22185907A EP 4250318 A1 EP4250318 A1 EP 4250318A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- magnetic core
- pillars
- magnetic
- pillar
- air gaps
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000000694 effects Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000004804 winding Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 229910000976 Electrical steel Inorganic materials 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/26—Fastening parts of the core together; Fastening or mounting the core on casing or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F3/00—Cores, Yokes, or armatures
- H01F3/10—Composite arrangements of magnetic circuits
- H01F3/14—Constrictions; Gaps, e.g. air-gaps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2819—Planar transformers with printed windings, e.g. surrounded by two cores and to be mounted on printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09618—Via fence, i.e. one-dimensional array of vias
Definitions
- the disclosure relates to a magnetic assembly, and particularly to a thin type magnetic assembly.
- An existing magnetic element uses a single air gap formed between the central pillars of two magnetic cores to prevent magnetic saturation.
- the spacing of the single air gap is too large, it will cause higher magnetic loss, resulting in increased energy loss.
- a magnetic element with an air gap needs to use a winding set, the coil is wound on a winding frame, and the winding frame is fixed between two magnetic cores.
- a magnetic element cannot effectively achieve a light and thin type.
- the disclosure provides a magnetic assembly, which has the advantages of high efficiency, low leakage inductance, and low magnetic loss, and may meet the requirement of a thin type.
- a magnetic assembly of the disclosure includes a first magnetic core, a second magnetic core, at least one circuit board, and multiple pillars.
- the second magnetic core and the first magnetic core are assembled with each other to define an internal space.
- the circuit board is disposed in the internal space.
- the circuit board has multiple through holes separated from each other.
- the pillars are located in the internal space and respectively correspond to the through holes passing through the circuit board, and multiple air gaps are formed between the pillars or between the pillars and at least one of the first magnetic core and the second magnetic core.
- the above-mentioned pillars have the same height and are disposed on the first magnetic core. Air gaps of the same spacing are formed between the pillars and the second magnetic core.
- the above-mentioned pillars have the same height and are disposed on the second magnetic core. Air gaps of the same spacing are formed between the pillars and the first magnetic core.
- the above-mentioned pillars have the same height
- the air gaps include multiple first air gaps and multiple second air gaps.
- the first air gaps of the same spacing are formed between the pillars and the first magnetic core
- the second air gaps of the same spacing are formed between the pillars and the second magnetic core
- the spacing of the first air gaps is the same as the spacing of the second air gaps.
- the above-mentioned pillars have the same height
- the air gaps include multiple first air gaps and multiple second air gaps.
- the first air gaps of the same spacing are formed between the pillars and the first magnetic core
- the second air gaps of the same spacing are formed between the pillars and the second magnetic core
- the spacing of the first air gaps is different from the spacing of the second air gaps.
- the above-mentioned pillars include multiple first pillars and multiple second pillars.
- the first pillars are disposed on the first magnetic core
- the second pillars are disposed on the second magnetic core
- air gaps of the same spacing are formed between the first pillars and the corresponding second pillars.
- the above-mentioned pillars have the same height, and the pillars include at least one first pillar and at least one second pillar.
- the air gaps include at least one first air gap and at least one second air gap.
- the first pillar is disposed on the first magnetic core, and the second pillar is disposed on the second magnetic core.
- the first air gap is formed between the first pillar and the second magnetic core, the second air gap is formed between the second pillar and the first magnetic core, and the spacing of the first air gap and the spacing of the second air gap is the same.
- the above-mentioned first pillar and the first magnetic core are integrally formed, and the second pillar and the second magnetic core are integrally formed.
- the above-mentioned pillars include at least one first pillar and at least one second pillar, and the height of the first pillar is different from the height of the second pillar.
- the air gaps include at least one first air gap and at least one second air gap.
- One of the first pillar and the second pillar is disposed on the first magnetic core, and the other of the first pillar and the second pillar is disposed on the second magnetic core.
- the first air gap is formed between the first pillar and one of the first magnetic core and the second magnetic core
- the second air gap is formed between the second pillar and the other of the first magnetic core and the second magnetic core
- the spacing of the first air gap is different from the spacing of the second air gap.
- the above-mentioned first pillar and one of the first magnetic core and the second magnetic core are integrally formed, and the second pillar and the other of the first magnetic core and the second magnetic core are integrally formed.
- one of the first magnetic core and the second magnetic core described above is in the shape of a flat plate, and the other of the first magnetic core and the second magnetic core is in the shape of a groove.
- the above-mentioned first magnetic core and the second magnetic core are in the shape of a groove, respectively.
- the above-mentioned magnetic assembly further includes multiple connecting members.
- the circuit board further has multiple connecting holes around, and the connecting members correspond to the pass through connecting holes, respectively.
- the pillars respectively correspond to the through holes passing through the circuit board, and the air gaps are formed between the pillars or between the pillars and at least one of the first magnetic core and the second magnetic core.
- the work efficiency of the magnetic assembly of the disclosure may be improved, thereby having the advantages of high efficiency, low magnetic loss, and low leakage inductance.
- FIG. 1A is a schematic perspective view of a magnetic assembly according to an embodiment of the disclosure.
- FIG. 1B is an exploded schematic view of the magnetic assembly of FIG. 1A .
- FIG. 1C is a schematic cross-sectional view of the magnetic assembly of FIG. 1A along a line A-A. Please refer to FIGS. 1A , 1B , and 1C at the same time.
- a magnetic assembly 100a includes a first magnetic core 110a, a second magnetic core 120a, at least one circuit board 130 (multiple circuit boards 130 are schematically shown), and multiple pillars 140a.
- the second magnetic core 120a and the first magnetic core 110a are assembled with each other to define an internal space S1.
- the circuit boards 130 are stacked corresponding to each other and disposed in the internal space S1.
- Each of the circuit boards 130 has multiple through holes 132 separated from each other, and the through holes 132 of the circuit boards 130 are disposed corresponding to each other.
- the pillars 140a are located in the internal space S1 and respectively correspond to the through holes 132 passing through the circuit boards 130, and multiple air gaps A1 are formed between the pillars 140a or between the pillars 140a and at least one of the first magnetic 110a core and the second magnetic core 120a.
- one of the first magnetic core 110a and the second magnetic core 120a is in the shape of a flat plate, and the other of the first magnetic core 110a and the second magnetic core 120a is in the shape of a groove.
- the first magnetic core 110a is in the shape of the flat plate
- the second magnetic core 120a is in the shape of the groove
- the second magnetic core 120a and the first magnetic core 110a are assembled with each other to define the U-shaped internal space S1, which is not limited thereto.
- the material of the first magnetic core 110a and the second magnetic core 120a are, for example, ferrite, silicon steel sheets, or iron-nickel alloy, but the disclosure is not limited thereto.
- the circuit boards 130 are, for example, printed circuit boards, and the circuit boards 130 are directly in contact with each other and stacked with each other.
- the circuit boards 130 have the same size, but are not limited thereto, as long as the through holes 132 on the circuit boards 130 can correspond to each other.
- the pillars 140a of the embodiment have the same height, and are disposed on the first magnetic core 110a.
- the pillars 140a correspond to the through holes 132 passing through the circuit boards 130, respectively, and the air gaps A1 of the same spacing are formed between the pillars 140a and the second magnetic core 120a.
- the material of the pillars 140a are, for example, ferrite, silicon steel sheets, or iron-nickel alloy, but the disclosure is not limited thereto. In some embodiments, the material of the pillars 140a may be the same as or different from the materials of the first magnetic core 110a and the second magnetic core 120a, which is not limited thereto.
- the shape of the through holes 132 on each of the circuit boards 130 is a square, and the shape of the pillars 140a is a cube, but are not limited thereto.
- the shape of the through holes 132 may be a circle or other suitable shapes, and the shape of the pillars 140a may be a cylinder or other suitable shapes.
- the shape of the through holes 132 and the shape of the pillars 140a do not correspond to each other.
- the shape of the through holes 132 is a square, but the shape of the pillars 140a is a cylinder, which still belongs to the scope of the disclosure.
- the through holes 132 on the circuit board 130 are arranged in a matrix, but are not limited thereto.
- the through holes 132 on the circuit board 130 may be arranged regularly or irregularly, as long as the number of the pillars 140a and the number of the through holes 132 are the same and correspondingly disposed, which all belongs to the scope of the disclosure.
- the pillars 140a may be fixed in the through holes 132 of the circuit board 130 through an adhesive material (not shown) or other suitable means.
- the magnetic assembly 100a of the embodiment further includes multiple connecting members 150, and each of the circuit boards 130 further has multiple connecting holes 134 around.
- the connecting holes 134 of each of the circuit boards 130 are disposed correspondingly to each other, and the connecting members 150 respectively correspond to the pass through connecting holes 134.
- the connecting members 150 and the connecting holes 134 are both located outside the first magnetic core 110a and the second magnetic core 120a, and the circuit boards 130 may be electrically connected to an external circuit through the connecting members 150.
- the air gap leakage flux is equivalent to a semicircle or an arcuate shape with the gap of the air gap as a straight side on the cross section of the magnetic core, with the increase in the height of the air gap, the cross-sectional area of the leakage flux increases in square multiples, and for the actual three-dimensional space, the space increases in cubic multiples. Therefore, in the embodiment, the air gaps A1 with a single spacing are formed through the pillars 140a, in addition to the effect of preventing magnetic saturation, such a formation may also greatly reduce and disperse the magnetic leakage loss, reduce the diffused magnetic flux, and enable the magnetic assembly 100a to have low leakage inductance and low magnetic loss, thereby improving work efficiency.
- the winding sets in the prior art are replaced by the pillars 140a corresponding to the through holes 132 passing through the circuit boards 130, thereby enabling the magnetic assembly 100a to not only have the advantages of a thin type but also have the advantages of convenient assembly.
- the magnetic assembly 100a may also be enabled to have the advantages of high efficiency, low magnetic loss, and low leakage inductance.
- FIG. 2A is a schematic cross-sectional view of a magnetic assembly according to an embodiment of the disclosure. Please refer to FIGS. 1C and 2A at the same time.
- a magnetic assembly 100b of the embodiment is similar to the magnetic assembly 100a of the above-mentioned embodiment. The difference between the two is that in the embodiment, pillars 140b are disposed on the second magnetic core 120a, and air gaps A2 of the same spacing are formed between the pillars 140b and the first magnetic core 110a.
- FIG. 2B is a schematic cross-sectional view of a magnetic assembly according to another embodiment of the disclosure. Please refer to FIGS. 1C and 2B at the same time.
- a magnetic assembly 100c of the embodiment is similar to the magnetic assembly 100a of the above-mentioned embodiment. The difference between the two is that in the embodiment, pillars 140c and a first magnetic core 110c are integrally formed, and air gaps A3 of the same spacing are formed between the pillars 140c and the second magnetic core 120a. That is, the pillars 140c and the first magnetic core 110c in the embodiment have the same material.
- the assembly yield between the pillars 140c and the circuit boards 130 may be improved to prevent the pillars 140c from falling off the circuit boards 130.
- FIG. 2C is a schematic cross-sectional view of a magnetic assembly according to another embodiment of the disclosure. Please refer to FIGS. 2A and 2C at the same time.
- a magnetic assembly 100d of the embodiment is similar to the magnetic assembly 100b of the above-mentioned embodiment. The difference between the two is that in the embodiment, pillars 140d and a second magnetic core 120d are integrally formed, and air gaps A4 of the same spacing are formed between the pillars 140d and the first magnetic core 110a. That is, the pillars 140d and the second magnetic core 120d in the embodiment have the same material.
- the assembly yield between the pillars 140d and the circuit boards 130 may be improved to prevent the pillars 140d from falling off the circuit boards 130.
- FIG. 2D is a schematic cross-sectional view of a magnetic assembly according to another embodiment of the disclosure. Please refer to FIGS. 1C and 2D at the same time.
- a magnetic assembly 100e of the embodiment is similar to the magnetic assembly 100a of the above-mentioned embodiment. The difference between the two is that the air gaps of the embodiment includes multiple first air gaps A51 and multiple second air gaps A52.
- the first air gaps A51 of the same spacing are formed between pillars 140e and the first magnetic core 110a
- the second air gaps A52 of the same spacing are formed between the pillars 140e and the second magnetic core 120a
- the spacing of the first air gaps A51 and the spacing of the second air gaps A52 are the same.
- the pillars 140e are fixed in the through holes 132 of the circuit boards 130 without being in contact with the first magnetic core 110a and the second magnetic core 120a. That is, in the embodiment, the first air gaps A51 and the second air gaps A52 of the same spacing are formed through the pillars 140e, and in addition to the effect of preventing magnetic saturation, the magnetic assembly 100e may also be enabled to have the advantages of high efficiency, a thin type, easy assembly, high process production efficiency, low magnetic loss, and low leakage inductance.
- FIG. 2E is a schematic cross-sectional view of a magnetic assembly according to another embodiment of the disclosure. Please refer to FIGS. 2D and 2E at the same time.
- a magnetic assembly 100f of the embodiment is similar to the magnetic assembly 100e of the above-mentioned embodiment. The difference between the two is that the spacing of first air gaps A61 formed between pillars 140f and the first magnetic core 110a is different from the spacing of second air gaps A62 formed between the pillars 140f and the second magnetic core 120a.
- the pillars 140f are relatively close to the second magnetic core 120a, so that the spacing of the first air gaps A61 is greater than the spacing of the second air gaps A62.
- the first air gaps A61 and the second air gaps A62 of different spacing are formed through the pillars 140f, and in addition to the effect of preventing magnetic saturation, the magnetic assembly 100f may also be enabled to have the advantages of high efficiency, a thin type, easy assembly, high process production efficiency, low magnetic loss, and low leakage inductance.
- FIG. 3A is an exploded schematic view of a magnetic assembly according to another embodiment of the disclosure.
- FIG. 3B is a schematic cross-sectional view of the magnetic assembly of FIG. 3A .
- a magnetic assembly 200a of the embodiment is similar to the magnetic assembly 100a of the above-mentioned embodiment. The difference between the two is that a first magnetic core 210a and a second magnetic core 220a of the embodiment are respectively in the shape of a groove, and pillars include multiple first pillars 242a and multiple second pillars 244a.
- FIGS. 3A and 3B at the same time.
- the first magnetic core 210a and the second magnetic core 220a are assembled with each other to define an internal space S2.
- Circuit boards 230, the first pillars 242a and the second pillars 244a are stacked correspondingly, and are all located in the internal space S2.
- Connecting holes 234 of the circuit boards 230 are located outside the first magnetic core 210a and the second magnetic core 220a, and connecting members 250 respectively correspond to the pass through connecting holes 234, so that the circuit boards 230 may be electrically connected to an external circuit.
- the first pillars 242a are disposed on the first magnetic core 210a, and the first pillars 242a and the first magnetic core 210a are integrally formed.
- the second pillars 244a are disposed on the second magnetic core 220a, and the second pillars 244a and the second magnetic core 220a are integrally formed.
- the number of the first pillars 242a corresponds to the number of the second pillars 244a, and air gaps B1 of the same spacing are formed between the first pillars 242a and the corresponding second pillars 244a. Therefore, the magnetic assembly 200a of the embodiment has the advantages of high efficiency, a thin type, easy assembly, high process production efficiency, low magnetic loss, and low leakage inductance.
- FIG. 3C is a schematic cross-sectional view of a magnetic assembly according to another embodiment of the disclosure. Please refer to FIGS. 3B and 3C at the same time.
- a magnetic assembly 200b of the embodiment is similar to the magnetic assembly 200a of the above-mentioned embodiment. The difference between the two is that in the embodiment, first pillars 242b are disposed on a first magnetic core 210b, and the first pillars 242b and the first magnetic core 210b are separate components. Second pillars 244b are disposed on a second magnetic core 220b, and the second pillars 244b and the second magnetic core 220b are separate components. Air gaps B2 of the same spacing are formed between the first pillars 242b and the corresponding second pillars 244b.
- FIG. 4A is a schematic cross-sectional view of a magnetic assembly according to another embodiment of the disclosure. Please refer to FIGS. 3C and 4A at the same time.
- a magnetic assembly 200c of the embodiment is similar to the magnetic assembly 200b of the above-mentioned embodiment. The difference between the two is that in the embodiment, the number of first pillars 242c is different from the number of second pillars 244c.
- the first pillar 242c in the embodiment is schematically shown as one
- the second pillar 244c is schematically shown as two, but the disclosure is not limited thereto.
- the first pillar 242c is disposed on a first magnetic core 210c, and at least one first air gap B31 (one first air gap B31 is schematically shown) is formed between the first pillar 242c and a second magnetic core 220c.
- the second pillars 244c are disposed on the second magnetic core 220c, and at least one second air gap B32 (two second air gaps B32 are schematically shown) is formed between the second pillars 244c and the first magnetic core 210c.
- the spacing of the first air gap B31 is the same as the spacing of the second air gap B32.
- the first pillar 242c and the second pillars 244c in the embodiment are disposed alternately, so that the orthographic projection of the first pillar 242c on the second magnetic core 220c does not overlap with the second pillars 244c. That is, in the embodiment, the first air gap B31 and the second air gaps B32 of the same spacing are formed through the first pillar 242c and the second pillars 244c, and in addition to the effect of preventing magnetic saturation, the magnetic assembly 200c may also be enabled to have the advantages of high efficiency, a thin type, easy assembly, high process production efficiency, low magnetic loss, and low leakage inductance.
- FIG. 4B is a schematic cross-sectional view of a magnetic assembly according to another embodiment of the disclosure. Please refer to FIGS. 4A and 4B at the same time.
- the difference between a magnetic assembly 200d of the embodiment and the magnetic assembly 200c of the above-mentioned embodiment is that a first pillar 242d and a first magnetic core 210d of the embodiment are integrally formed, and second pillars 244d and a second magnetic core 220d are integrally formed.
- a first air gap B41 is formed between the first pillar 242d and the second magnetic core 220d, second air gaps B42 are formed between the second pillars 244d and the first magnetic core 210d, and the spacing of the first air gap B41 is the same as the spacing of the second air gaps B42.
- FIG. 4C is a schematic cross-sectional view of a magnetic assembly according to another embodiment of the disclosure. Please refer to FIGS. 4A and 4C at the same time.
- the difference between a magnetic assembly 200e of the embodiment and the magnetic assembly 200c of the above-mentioned embodiment is that a height H1 of a first pillar 242e of the embodiment is greater than a height H2 of a second pillar 244e, so that the spacing of a first air gap B51 is different from the spacing of second air gaps B52.
- the first air gap B51 is formed between the first pillar 242e and a second magnetic core 220e
- the second air gaps B52 are formed between the second pillars 244e and a first magnetic core 210e
- the spacing of the first air gap B51 is less than the spacing of the second air gaps B52. That is, in the embodiment, the first air gap B51 and the second air gaps B52 of different spacing are formed through the first pillar 242e and the second pillars 244e, and in addition to the effect of preventing magnetic saturation, the magnetic assembly 200e may also be enabled to have the advantages of high efficiency, a thin type, easy assembly, high process production efficiency, low magnetic loss, and low leakage inductance.
- FIG. 4D is a schematic cross-sectional view of a magnetic assembly according to another embodiment of the disclosure. Please refer to FIGS. 4B and 4D at the same time.
- a magnetic assembly 200f of the embodiment is similar to the magnetic assembly 200d of the above-mentioned embodiment. The difference between the two is that a height H3 of a first pillar 242f of the embodiment is greater than a height H4 of a second pillar 244f, so that the spacing of a first air gap B61 is different from the spacing of second air gaps B62.
- the first air gap B61 is formed between the first pillar 242f and a second magnetic core 220f
- the second air gaps B62 are formed between the second pillars 244f and a first magnetic core 210f
- the spacing of the first air gap B61 is smaller than the spacing of the second air gaps B62. That is, in the embodiment, the first air gap B61 and the second air gaps B62 of different spacing are formed through the first pillar 242f and the second pillars 244f, and in addition to the effect of preventing magnetic saturation, the magnetic assembly 200f may also be enabled to have the advantages of high efficiency, a thin type, easy assembly, high process production efficiency, low magnetic loss, and low leakage inductance.
- the pillars respectively correspond to the through holes passing through the circuit boards, and the air gaps are formed between the pillars or between the pillars and at least one of the first magnetic core and the second magnetic core.
- the work efficiency of the magnetic assembly of the disclosure may be improved, and has the advantages of high efficiency, low magnetic loss, and low leakage inductance.
- the thin type effect may be achieved, so that the magnetic assembly of the disclosure can meet the current requirements for the thin type electrical equipment.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
A magnetic assembly (100a, 100b, 100c, 100d, 100e, 100f, 200a, 200b, 200c, 200d, 200e, 200f) includes a first magnetic core (110a, 110c, 210a, 210b, 210c, 210d, 210e, 210f), a second magnetic core (120a, 120d, 220a, 220b, 220c, 220d, 220e, 220f), at least one circuit board (130, 230), and multiple pillars (140a, 140b, 140c, 140d, 140e, 140f). The second magnetic core (120a, 120d, 220a, 220b, 220c, 220d, 220e, 220f) and the first magnetic core (110a, 110c, 210a, 210b, 210c, 210d, 210e, 210f) are assembled with each other to define an internal space (S1, S2). The circuit board (130, 230) is disposed in the internal space (S1, S2). The circuit board (130, 230) has multiple through holes (132, 232) separated from each other. The pillars (140a, 140b, 140c, 140d, 140e, 140f) are located in the internal space (S1, S2) and respectively correspond to the through holes (132, 232) passing through the circuit board (130, 230), and multiple air gaps (A1, A2, A3, A4, B1, B2) are formed between the pillars (140a, 140b, 140c, 140d, 140e, 140f) or between the pillars (140a, 140b, 140c, 140d, 140e, 140f) and at least one of the first magnetic core (110a, 110c, 210a, 210b, 210c, 210d, 210e, 210f) and the second magnetic core (120a, 120d, 220a, 220b, 220c, 220d, 220e, 220f).
Description
- The disclosure relates to a magnetic assembly, and particularly to a thin type magnetic assembly.
- Today's electronic products often use various magnetic assemblies, such as transformers, inductance elements, etc., to meet the required circuit design by the principle of electromagnetic induction. An existing magnetic element uses a single air gap formed between the central pillars of two magnetic cores to prevent magnetic saturation. However, if the spacing of the single air gap is too large, it will cause higher magnetic loss, resulting in increased energy loss. Furthermore, currently, a magnetic element with an air gap needs to use a winding set, the coil is wound on a winding frame, and the winding frame is fixed between two magnetic cores. Thus, such a magnetic element cannot effectively achieve a light and thin type. In order to respond to light type electrical equipment, magnetic elements and winding sets used inside also need to develop toward thin types, so as to reduce the overall volume of electrical equipment. Therefore, how to get a thin type magnetic assembly while improving efficiency and reducing magnetic loss and leakage inductance has become one of the problems that need to be solved urgently in the art.
- The disclosure provides a magnetic assembly, which has the advantages of high efficiency, low leakage inductance, and low magnetic loss, and may meet the requirement of a thin type.
- A magnetic assembly of the disclosure includes a first magnetic core, a second magnetic core, at least one circuit board, and multiple pillars. The second magnetic core and the first magnetic core are assembled with each other to define an internal space. The circuit board is disposed in the internal space. Moreover, the circuit board has multiple through holes separated from each other. The pillars are located in the internal space and respectively correspond to the through holes passing through the circuit board, and multiple air gaps are formed between the pillars or between the pillars and at least one of the first magnetic core and the second magnetic core.
- In an embodiment of the disclosure, the above-mentioned pillars have the same height and are disposed on the first magnetic core. Air gaps of the same spacing are formed between the pillars and the second magnetic core.
- In an embodiment of the disclosure, the above-mentioned pillars have the same height and are disposed on the second magnetic core. Air gaps of the same spacing are formed between the pillars and the first magnetic core.
- In an embodiment of the disclosure, the above-mentioned pillars have the same height, and the air gaps include multiple first air gaps and multiple second air gaps. The first air gaps of the same spacing are formed between the pillars and the first magnetic core, the second air gaps of the same spacing are formed between the pillars and the second magnetic core, and the spacing of the first air gaps is the same as the spacing of the second air gaps.
- In an embodiment of the disclosure, the above-mentioned pillars have the same height, and the air gaps include multiple first air gaps and multiple second air gaps. The first air gaps of the same spacing are formed between the pillars and the first magnetic core, the second air gaps of the same spacing are formed between the pillars and the second magnetic core, and the spacing of the first air gaps is different from the spacing of the second air gaps.
- In an embodiment of the disclosure, the above-mentioned pillars include multiple first pillars and multiple second pillars. The first pillars are disposed on the first magnetic core, the second pillars are disposed on the second magnetic core, and air gaps of the same spacing are formed between the first pillars and the corresponding second pillars.
- In an embodiment of the disclosure, the above-mentioned pillars have the same height, and the pillars include at least one first pillar and at least one second pillar. The air gaps include at least one first air gap and at least one second air gap. The first pillar is disposed on the first magnetic core, and the second pillar is disposed on the second magnetic core. The first air gap is formed between the first pillar and the second magnetic core, the second air gap is formed between the second pillar and the first magnetic core, and the spacing of the first air gap and the spacing of the second air gap is the same.
- In an embodiment of the disclosure, the above-mentioned first pillar and the first magnetic core are integrally formed, and the second pillar and the second magnetic core are integrally formed.
- In an embodiment of the disclosure, the above-mentioned pillars include at least one first pillar and at least one second pillar, and the height of the first pillar is different from the height of the second pillar. The air gaps include at least one first air gap and at least one second air gap. One of the first pillar and the second pillar is disposed on the first magnetic core, and the other of the first pillar and the second pillar is disposed on the second magnetic core. The first air gap is formed between the first pillar and one of the first magnetic core and the second magnetic core, the second air gap is formed between the second pillar and the other of the first magnetic core and the second magnetic core, and the spacing of the first air gap is different from the spacing of the second air gap.
- In an embodiment of the disclosure, the above-mentioned first pillar and one of the first magnetic core and the second magnetic core are integrally formed, and the second pillar and the other of the first magnetic core and the second magnetic core are integrally formed.
- In an embodiment of the disclosure, one of the first magnetic core and the second magnetic core described above is in the shape of a flat plate, and the other of the first magnetic core and the second magnetic core is in the shape of a groove.
- In an embodiment of the disclosure, the above-mentioned first magnetic core and the second magnetic core are in the shape of a groove, respectively.
- In an embodiment of the disclosure, the above-mentioned magnetic assembly further includes multiple connecting members. The circuit board further has multiple connecting holes around, and the connecting members correspond to the pass through connecting holes, respectively.
- Based on the above, in the design of the magnetic assembly of the disclosure, the pillars respectively correspond to the through holes passing through the circuit board, and the air gaps are formed between the pillars or between the pillars and at least one of the first magnetic core and the second magnetic core. In this way, the work efficiency of the magnetic assembly of the disclosure may be improved, thereby having the advantages of high efficiency, low magnetic loss, and low leakage inductance.
- In order to make the aforementioned features and advantages of the disclosure comprehensible, embodiments accompanied with drawings are described in detail as follows.
-
-
FIG. 1A is a schematic perspective view of a magnetic assembly according to an embodiment of the disclosure. -
FIG. 1B is an exploded schematic view of the magnetic assembly ofFIG. 1A . -
FIG. 1C is a schematic cross-sectional view of the magnetic assembly ofFIG. 1A along a line A-A. -
FIG. 2A is a schematic cross-sectional view of a magnetic assembly according to an embodiment of the disclosure. -
FIG. 2B is a schematic cross-sectional view of a magnetic assembly according to another embodiment of the disclosure. -
FIG. 2C is a schematic cross-sectional view of a magnetic assembly according to another embodiment of the disclosure. -
FIG. 2D is a schematic cross-sectional view of a magnetic assembly according to another embodiment of the disclosure. -
FIG. 2E is a schematic cross-sectional view of a magnetic assembly according to another embodiment of the disclosure. -
FIG. 3A is an exploded schematic view of a magnetic assembly according to another embodiment of the disclosure. -
FIG. 3B is a schematic cross-sectional view of the magnetic assembly ofFIG. 3A . -
FIG. 3C is a schematic cross-sectional view of a magnetic assembly according to another embodiment of the disclosure. -
FIG. 4A is a schematic cross-sectional view of a magnetic assembly according to another embodiment of the disclosure. -
FIG. 4B is a schematic cross-sectional view of a magnetic assembly according to another embodiment of the disclosure. -
FIG. 4C is a schematic cross-sectional view of a magnetic assembly according to another embodiment of the disclosure. -
FIG. 4D is a schematic cross-sectional view of a magnetic assembly according to another embodiment of the disclosure. -
FIG. 1A is a schematic perspective view of a magnetic assembly according to an embodiment of the disclosure.FIG. 1B is an exploded schematic view of the magnetic assembly ofFIG. 1A .FIG. 1C is a schematic cross-sectional view of the magnetic assembly ofFIG. 1A along a line A-A. Please refer toFIGS. 1A ,1B , and1C at the same time. In the embodiment, amagnetic assembly 100a includes a firstmagnetic core 110a, a secondmagnetic core 120a, at least one circuit board 130 (multiple circuit boards 130 are schematically shown), andmultiple pillars 140a. The secondmagnetic core 120a and the firstmagnetic core 110a are assembled with each other to define an internal space S1. Thecircuit boards 130 are stacked corresponding to each other and disposed in the internal space S1. Each of thecircuit boards 130 has multiple throughholes 132 separated from each other, and the throughholes 132 of thecircuit boards 130 are disposed corresponding to each other. Thepillars 140a are located in the internal space S1 and respectively correspond to the throughholes 132 passing through thecircuit boards 130, and multiple air gaps A1 are formed between thepillars 140a or between thepillars 140a and at least one of the first magnetic 110a core and the secondmagnetic core 120a. - In detail, in the embodiment, one of the first
magnetic core 110a and the secondmagnetic core 120a is in the shape of a flat plate, and the other of the firstmagnetic core 110a and the secondmagnetic core 120a is in the shape of a groove. In the schematic views, the firstmagnetic core 110a is in the shape of the flat plate, the secondmagnetic core 120a is in the shape of the groove, and the secondmagnetic core 120a and the firstmagnetic core 110a are assembled with each other to define the U-shaped internal space S1, which is not limited thereto. The material of the firstmagnetic core 110a and the secondmagnetic core 120a are, for example, ferrite, silicon steel sheets, or iron-nickel alloy, but the disclosure is not limited thereto. - Furthermore, the
circuit boards 130 are, for example, printed circuit boards, and thecircuit boards 130 are directly in contact with each other and stacked with each other. In the embodiment, thecircuit boards 130 have the same size, but are not limited thereto, as long as the throughholes 132 on thecircuit boards 130 can correspond to each other. In particular, thepillars 140a of the embodiment have the same height, and are disposed on the firstmagnetic core 110a. Thepillars 140a correspond to the throughholes 132 passing through thecircuit boards 130, respectively, and the air gaps A1 of the same spacing are formed between thepillars 140a and the secondmagnetic core 120a. In the embodiment, the material of thepillars 140a are, for example, ferrite, silicon steel sheets, or iron-nickel alloy, but the disclosure is not limited thereto. In some embodiments, the material of thepillars 140a may be the same as or different from the materials of the firstmagnetic core 110a and the secondmagnetic core 120a, which is not limited thereto. - It should be noted that, as shown in
FIG. 1B , in the embodiment, the shape of the throughholes 132 on each of thecircuit boards 130 is a square, and the shape of thepillars 140a is a cube, but are not limited thereto. In other non-illustrated embodiments, the shape of the throughholes 132 may be a circle or other suitable shapes, and the shape of thepillars 140a may be a cylinder or other suitable shapes. Alternatively, the shape of the throughholes 132 and the shape of thepillars 140a do not correspond to each other. For example, the shape of the throughholes 132 is a square, but the shape of thepillars 140a is a cylinder, which still belongs to the scope of the disclosure. Furthermore, the throughholes 132 on thecircuit board 130 are arranged in a matrix, but are not limited thereto. In other non-illustrated embodiments, the throughholes 132 on thecircuit board 130 may be arranged regularly or irregularly, as long as the number of thepillars 140a and the number of the throughholes 132 are the same and correspondingly disposed, which all belongs to the scope of the disclosure. In addition, thepillars 140a may be fixed in the throughholes 132 of thecircuit board 130 through an adhesive material (not shown) or other suitable means. - In addition, referring to
FIGS. 1A and1B at the same time, themagnetic assembly 100a of the embodiment further includes multiple connectingmembers 150, and each of thecircuit boards 130 further has multiple connectingholes 134 around. The connectingholes 134 of each of thecircuit boards 130 are disposed correspondingly to each other, and the connectingmembers 150 respectively correspond to the pass through connectingholes 134. In the embodiment, the connectingmembers 150 and the connectingholes 134 are both located outside the firstmagnetic core 110a and the secondmagnetic core 120a, and thecircuit boards 130 may be electrically connected to an external circuit through the connectingmembers 150. - Generally speaking, since the air gap leakage flux is equivalent to a semicircle or an arcuate shape with the gap of the air gap as a straight side on the cross section of the magnetic core, with the increase in the height of the air gap, the cross-sectional area of the leakage flux increases in square multiples, and for the actual three-dimensional space, the space increases in cubic multiples. Therefore, in the embodiment, the air gaps A1 with a single spacing are formed through the
pillars 140a, in addition to the effect of preventing magnetic saturation, such a formation may also greatly reduce and disperse the magnetic leakage loss, reduce the diffused magnetic flux, and enable themagnetic assembly 100a to have low leakage inductance and low magnetic loss, thereby improving work efficiency. - In short, in the embodiment, the winding sets in the prior art are replaced by the
pillars 140a corresponding to the throughholes 132 passing through thecircuit boards 130, thereby enabling themagnetic assembly 100a to not only have the advantages of a thin type but also have the advantages of convenient assembly. Moreover, as the air gaps A1 with a single spacing are formed through thepillars 140a, in addition to the effect of preventing magnetic saturation, themagnetic assembly 100a may also be enabled to have the advantages of high efficiency, low magnetic loss, and low leakage inductance. - It must be noted here that the following embodiments use the element numerals and part of the contents of the foregoing embodiments, the same numerals are used to denote the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, and thus the description is not repeated in the following embodiments.
-
FIG. 2A is a schematic cross-sectional view of a magnetic assembly according to an embodiment of the disclosure. Please refer toFIGS. 1C and2A at the same time. Amagnetic assembly 100b of the embodiment is similar to themagnetic assembly 100a of the above-mentioned embodiment. The difference between the two is that in the embodiment,pillars 140b are disposed on the secondmagnetic core 120a, and air gaps A2 of the same spacing are formed between thepillars 140b and the firstmagnetic core 110a. -
FIG. 2B is a schematic cross-sectional view of a magnetic assembly according to another embodiment of the disclosure. Please refer toFIGS. 1C and2B at the same time. Amagnetic assembly 100c of the embodiment is similar to themagnetic assembly 100a of the above-mentioned embodiment. The difference between the two is that in the embodiment,pillars 140c and a firstmagnetic core 110c are integrally formed, and air gaps A3 of the same spacing are formed between thepillars 140c and the secondmagnetic core 120a. That is, thepillars 140c and the firstmagnetic core 110c in the embodiment have the same material. By the integral formation of thepillars 140c and the firstmagnetic core 110c, the assembly yield between thepillars 140c and thecircuit boards 130 may be improved to prevent thepillars 140c from falling off thecircuit boards 130. -
FIG. 2C is a schematic cross-sectional view of a magnetic assembly according to another embodiment of the disclosure. Please refer toFIGS. 2A and2C at the same time. Amagnetic assembly 100d of the embodiment is similar to themagnetic assembly 100b of the above-mentioned embodiment. The difference between the two is that in the embodiment,pillars 140d and a secondmagnetic core 120d are integrally formed, and air gaps A4 of the same spacing are formed between thepillars 140d and the firstmagnetic core 110a. That is, thepillars 140d and the secondmagnetic core 120d in the embodiment have the same material. By the integral formation of thepillars 140d and the secondmagnetic core 120d, the assembly yield between thepillars 140d and thecircuit boards 130 may be improved to prevent thepillars 140d from falling off thecircuit boards 130. -
FIG. 2D is a schematic cross-sectional view of a magnetic assembly according to another embodiment of the disclosure. Please refer toFIGS. 1C and2D at the same time. Amagnetic assembly 100e of the embodiment is similar to themagnetic assembly 100a of the above-mentioned embodiment. The difference between the two is that the air gaps of the embodiment includes multiple first air gaps A51 and multiple second air gaps A52. The first air gaps A51 of the same spacing are formed betweenpillars 140e and the firstmagnetic core 110a, the second air gaps A52 of the same spacing are formed between thepillars 140e and the secondmagnetic core 120a, and the spacing of the first air gaps A51 and the spacing of the second air gaps A52 are the same. In the embodiment, thepillars 140e are fixed in the throughholes 132 of thecircuit boards 130 without being in contact with the firstmagnetic core 110a and the secondmagnetic core 120a. That is, in the embodiment, the first air gaps A51 and the second air gaps A52 of the same spacing are formed through thepillars 140e, and in addition to the effect of preventing magnetic saturation, themagnetic assembly 100e may also be enabled to have the advantages of high efficiency, a thin type, easy assembly, high process production efficiency, low magnetic loss, and low leakage inductance. -
FIG. 2E is a schematic cross-sectional view of a magnetic assembly according to another embodiment of the disclosure. Please refer toFIGS. 2D and2E at the same time. Amagnetic assembly 100f of the embodiment is similar to themagnetic assembly 100e of the above-mentioned embodiment. The difference between the two is that the spacing of first air gaps A61 formed betweenpillars 140f and the firstmagnetic core 110a is different from the spacing of second air gaps A62 formed between thepillars 140f and the secondmagnetic core 120a. In the embodiment, thepillars 140f are relatively close to the secondmagnetic core 120a, so that the spacing of the first air gaps A61 is greater than the spacing of the second air gaps A62. That is, in the embodiment, the first air gaps A61 and the second air gaps A62 of different spacing are formed through thepillars 140f, and in addition to the effect of preventing magnetic saturation, themagnetic assembly 100f may also be enabled to have the advantages of high efficiency, a thin type, easy assembly, high process production efficiency, low magnetic loss, and low leakage inductance. -
FIG. 3A is an exploded schematic view of a magnetic assembly according to another embodiment of the disclosure.FIG. 3B is a schematic cross-sectional view of the magnetic assembly ofFIG. 3A . Please refer toFIGS. 1B and3A at the same time. Amagnetic assembly 200a of the embodiment is similar to themagnetic assembly 100a of the above-mentioned embodiment. The difference between the two is that a firstmagnetic core 210a and a secondmagnetic core 220a of the embodiment are respectively in the shape of a groove, and pillars include multiplefirst pillars 242a and multiplesecond pillars 244a. In detail, please refer toFIGS. 3A and3B at the same time. The firstmagnetic core 210a and the secondmagnetic core 220a are assembled with each other to define an internal space S2.Circuit boards 230, thefirst pillars 242a and thesecond pillars 244a are stacked correspondingly, and are all located in the internal space S2. Connectingholes 234 of thecircuit boards 230 are located outside the firstmagnetic core 210a and the secondmagnetic core 220a, and connectingmembers 250 respectively correspond to the pass through connectingholes 234, so that thecircuit boards 230 may be electrically connected to an external circuit. Furthermore, in the embodiment, thefirst pillars 242a are disposed on the firstmagnetic core 210a, and thefirst pillars 242a and the firstmagnetic core 210a are integrally formed. Thesecond pillars 244a are disposed on the secondmagnetic core 220a, and thesecond pillars 244a and the secondmagnetic core 220a are integrally formed. The number of thefirst pillars 242a corresponds to the number of thesecond pillars 244a, and air gaps B1 of the same spacing are formed between thefirst pillars 242a and the correspondingsecond pillars 244a. Therefore, themagnetic assembly 200a of the embodiment has the advantages of high efficiency, a thin type, easy assembly, high process production efficiency, low magnetic loss, and low leakage inductance. -
FIG. 3C is a schematic cross-sectional view of a magnetic assembly according to another embodiment of the disclosure. Please refer toFIGS. 3B and3C at the same time. Amagnetic assembly 200b of the embodiment is similar to themagnetic assembly 200a of the above-mentioned embodiment. The difference between the two is that in the embodiment,first pillars 242b are disposed on a firstmagnetic core 210b, and thefirst pillars 242b and the firstmagnetic core 210b are separate components.Second pillars 244b are disposed on a secondmagnetic core 220b, and thesecond pillars 244b and the secondmagnetic core 220b are separate components. Air gaps B2 of the same spacing are formed between thefirst pillars 242b and the correspondingsecond pillars 244b. -
FIG. 4A is a schematic cross-sectional view of a magnetic assembly according to another embodiment of the disclosure. Please refer toFIGS. 3C and4A at the same time. Amagnetic assembly 200c of the embodiment is similar to themagnetic assembly 200b of the above-mentioned embodiment. The difference between the two is that in the embodiment, the number offirst pillars 242c is different from the number ofsecond pillars 244c. For example, thefirst pillar 242c in the embodiment is schematically shown as one, and thesecond pillar 244c is schematically shown as two, but the disclosure is not limited thereto. Thefirst pillar 242c is disposed on a firstmagnetic core 210c, and at least one first air gap B31 (one first air gap B31 is schematically shown) is formed between thefirst pillar 242c and a secondmagnetic core 220c. Thesecond pillars 244c are disposed on the secondmagnetic core 220c, and at least one second air gap B32 (two second air gaps B32 are schematically shown) is formed between thesecond pillars 244c and the firstmagnetic core 210c. In the embodiment, the spacing of the first air gap B31 is the same as the spacing of the second air gap B32. In detail, thefirst pillar 242c and thesecond pillars 244c in the embodiment are disposed alternately, so that the orthographic projection of thefirst pillar 242c on the secondmagnetic core 220c does not overlap with thesecond pillars 244c. That is, in the embodiment, the first air gap B31 and the second air gaps B32 of the same spacing are formed through thefirst pillar 242c and thesecond pillars 244c, and in addition to the effect of preventing magnetic saturation, themagnetic assembly 200c may also be enabled to have the advantages of high efficiency, a thin type, easy assembly, high process production efficiency, low magnetic loss, and low leakage inductance. -
FIG. 4B is a schematic cross-sectional view of a magnetic assembly according to another embodiment of the disclosure. Please refer toFIGS. 4A and4B at the same time. The difference between amagnetic assembly 200d of the embodiment and themagnetic assembly 200c of the above-mentioned embodiment is that afirst pillar 242d and a firstmagnetic core 210d of the embodiment are integrally formed, andsecond pillars 244d and a secondmagnetic core 220d are integrally formed. A first air gap B41 is formed between thefirst pillar 242d and the secondmagnetic core 220d, second air gaps B42 are formed between thesecond pillars 244d and the firstmagnetic core 210d, and the spacing of the first air gap B41 is the same as the spacing of the second air gaps B42. -
FIG. 4C is a schematic cross-sectional view of a magnetic assembly according to another embodiment of the disclosure. Please refer toFIGS. 4A and4C at the same time. The difference between amagnetic assembly 200e of the embodiment and themagnetic assembly 200c of the above-mentioned embodiment is that a height H1 of afirst pillar 242e of the embodiment is greater than a height H2 of asecond pillar 244e, so that the spacing of a first air gap B51 is different from the spacing of second air gaps B52. In detail, the first air gap B51 is formed between thefirst pillar 242e and a secondmagnetic core 220e, the second air gaps B52 are formed between thesecond pillars 244e and a firstmagnetic core 210e, and the spacing of the first air gap B51 is less than the spacing of the second air gaps B52. That is, in the embodiment, the first air gap B51 and the second air gaps B52 of different spacing are formed through thefirst pillar 242e and thesecond pillars 244e, and in addition to the effect of preventing magnetic saturation, themagnetic assembly 200e may also be enabled to have the advantages of high efficiency, a thin type, easy assembly, high process production efficiency, low magnetic loss, and low leakage inductance. -
FIG. 4D is a schematic cross-sectional view of a magnetic assembly according to another embodiment of the disclosure. Please refer toFIGS. 4B and4D at the same time. Amagnetic assembly 200f of the embodiment is similar to themagnetic assembly 200d of the above-mentioned embodiment. The difference between the two is that a height H3 of afirst pillar 242f of the embodiment is greater than a height H4 of asecond pillar 244f, so that the spacing of a first air gap B61 is different from the spacing of second air gaps B62. In detail, the first air gap B61 is formed between thefirst pillar 242f and a secondmagnetic core 220f, the second air gaps B62 are formed between thesecond pillars 244f and a firstmagnetic core 210f, and the spacing of the first air gap B61 is smaller than the spacing of the second air gaps B62. That is, in the embodiment, the first air gap B61 and the second air gaps B62 of different spacing are formed through thefirst pillar 242f and thesecond pillars 244f, and in addition to the effect of preventing magnetic saturation, themagnetic assembly 200f may also be enabled to have the advantages of high efficiency, a thin type, easy assembly, high process production efficiency, low magnetic loss, and low leakage inductance. - In summary, in the design of the magnetic assembly of the disclosure, the pillars respectively correspond to the through holes passing through the circuit boards, and the air gaps are formed between the pillars or between the pillars and at least one of the first magnetic core and the second magnetic core. In this way, the work efficiency of the magnetic assembly of the disclosure may be improved, and has the advantages of high efficiency, low magnetic loss, and low leakage inductance. In addition, by replacing the existing winding sets with circuit boards stacked on each other, the thin type effect may be achieved, so that the magnetic assembly of the disclosure can meet the current requirements for the thin type electrical equipment.
Claims (13)
- A magnetic assembly (100a, 100b, 100c, 100d, 100e, 100f, 200a, 200b, 200c, 200d, 200e, 200f), comprising:a first magnetic core (110a, 110c, 210a, 210b, 210c, 210d, 210e, 210f);a second magnetic core (120a, 120d, 220a, 220b, 220c, 220d, 220e, 220f), assembled with the first magnetic core (110a, 110c, 210a, 210b, 210c, 210d, 210e, 210f) to define an internal space(S1, S2);at least one circuit board (130, 230), disposed in the internal space (SI, S2), wherein the at least one circuit board (130, 230) has a plurality of through holes (132, 232) separated from each other; anda plurality of pillars (140a, 140b, 140c, 140d, 140e, 140f), located in the internal space (S1, S2) and respectively corresponding to the plurality of through holes (132, 232) passing through the at least one circuit board (130, 230), and a plurality of air gaps (A1, A2, A3, A4, B1, B2) being formed between the plurality of pillars (140a, 140b, 140c, 140d, 140e, 140f) or between the plurality of pillars (140a, 140b, 140c, 140d, 140e, 140f) and at least one of the first magnetic core (110a, 110c, 210a, 210b, 210c, 210d, 210e, 210f) and the second magnetic core (120a, 120d, 220a, 220b, 220c, 220d, 220e, 220f).
- The magnetic assembly (100a, 100b, 100c, 100d, 100e, 100f, 200a, 200b, 200c, 200d, 200e, 200f) according to claim 1, wherein the plurality of pillars (140a, 140b, 140c, 140d, 140e, 140f) have the same height and are disposed on the first magnetic core (110a, 110c, 210a, 210b, 210c, 210d, 210e, 210f), and the plurality of air gaps (A1, A2, A3, A4, B1, B2) of the same spacing are formed between the plurality of pillars (140a, 140b, 140c, 140d, 140e, 140f) and the second magnetic core (120a, 120d, 220a, 220b, 220c, 220d, 220e, 220f).
- The magnetic assembly (100a, 100b, 100c, 100d, 100e, 100f, 200a, 200b, 200c, 200d, 200e, 200f) according to claim 1, wherein the plurality of pillars (140a, 140b, 140c, 140d, 140e, 140f) have the same height and are disposed on the second magnetic core (120a, 120d, 220a, 220b, 220c, 220d, 220e, 220f), and the plurality of air gaps (A1, A2, A3, A4, B1, B2) of the same spacing are formed between the plurality of pillars (140a, 140b, 140c, 140d, 140e, 140f) and the first magnetic core (110a, 110c, 210a, 210b, 210c, 210d, 210e, 210f).
- The magnetic assembly (100a, 100b, 100c, 100d, 100e, 100f, 200a, 200b, 200c, 200d, 200e, 200f) according to claim 1, wherein the plurality of pillars (140a, 140b, 140c, 140d, 140e, 140f) have the same height, the plurality of air gaps (A1, A2, A3, A4, B1, B2) comprise a plurality of first air gaps (A51, A61, B31, B41, B51, B61) and a plurality of second air gaps (A52, A62, B32, B42, B52, B62), the plurality of first air gaps (A51, A61, B31, B41, B51, B61) of the same spacing are formed between the plurality of pillars (140a, 140b, 140c, 140d, 140e, 140f) and the first magnetic core (110a, 110c, 210a, 210b, 210c, 210d, 210e, 210f), the plurality of second air gaps (A52, A62, B32, B42, B52, B62) of the same spacing are formed between the plurality of pillars (140a, 140b, 140c, 140d, 140e, 140f) and the second magnetic core (120a, 120d, 220a, 220b, 220c, 220d, 220e, 220f), and the spacing of the plurality of first air gaps (A51, A61, B31, B41, B51, B61) is the same as the spacing of the plurality of second air gaps (A52, A62, B32, B42, B52, B62).
- The magnetic assembly (100a, 100b, 100c, 100d, 100e, 100f, 200a, 200b, 200c, 200d, 200e, 200f) according to claim 1, wherein the plurality of pillars (140a, 140b, 140c, 140d, 140e, 140f) have the same height, the plurality of air gaps (A1, A2, A3, A4, B1, B2) comprise a plurality of first air gaps (A51, A61, B31, B41, B51, B61) and a plurality of second air gaps (A52, A62, B32, B42, B52, B62), the plurality of first air gaps (A51, A61, B31, B41, B51, B61) of the same spacing are formed between the plurality of pillars (140a, 140b, 140c, 140d, 140e, 140f) and the first magnetic core (110a, 110c, 210a, 210b, 210c, 210d, 210e, 210f), the plurality of second air gaps (A52, A62, B32, B42, B52, B62) of the same spacing are formed between the plurality of pillars (140a, 140b, 140c, 140d, 140e, 140f) and the second magnetic core (120a, 120d, 220a, 220b, 220c, 220d, 220e, 220f), and the spacing of the plurality of first air gaps (A51, A61, B31, B41, B51, B61) is different from the spacing of the plurality of second air gaps (A52, A62, B32, B42, B52, B62).
- The magnetic assembly (100a, 100b, 100c, 100d, 100e, 100f, 200a, 200b, 200c, 200d, 200e, 200f) according to claim 1, wherein the plurality of pillars (140a, 140b, 140c, 140d, 140e, 140f) comprise a plurality of first pillars (242a, 242b, 242c, 242d, 242e, 242f) and a plurality of second pillars (244a, 244b, 244c, 244d, 244e, 244f), the plurality of first pillars (242a, 242b, 242c, 242d, 242e, 242f) are disposed on the first magnetic core (110a, 110c, 210a, 210b, 210c, 210d, 210e, 210f), the plurality of second pillars (244a, 244b, 244c, 244d, 244e, 244f) are disposed on the second magnetic core (120a, 120d, 220a, 220b, 220c, 220d, 220e, 220f), and the plurality of air gaps (A1, A2, A3, A4, B1, B2) of the same spacing are formed between the plurality of first pillars (242a, 242b, 242c, 242d, 242e, 242f) and the corresponding plurality of second pillars (244a, 244b, 244c, 244d, 244e, 244f).
- The magnetic assembly (100a, 100b, 100c, 100d, 100e, 100f, 200a, 200b, 200c, 200d, 200e, 200f) according to claim 1, wherein the plurality of pillars (140a, 140b, 140c, 140d, 140e, 140f) have the same height, the plurality of pillars (140a, 140b, 140c, 140d, 140e, 140f) comprise at least one first pillar (242a, 242b, 242c, 242d, 242e, 242f) and at least one second pillar (244a, 244b, 244c, 244d, 244e, 244f), the plurality of air gaps (A1, A2, A3, A4, B1, B2) comprise at least one first air gap (A51, A61, B31, B41, B51, B61) and at least one second air gap (A52, A62, B32, B42, B52, B62), the at least one first pillar (242a, 242b, 242c, 242d, 242e, 242f) is disposed on the first magnetic core (110a, 110c, 210a, 210b, 210c, 210d, 210e, 210f), the at least one second pillar (244a, 244b, 244c, 244d, 244e, 244f) is disposed on the second magnetic core (120a, 120d, 220a, 220b, 220c, 220d, 220e, 220f), the at least one first air gap (A51, A61, B31, B41, B51, B61) is formed between the at least one first pillar (242a, 242b, 242c, 242d, 242e, 242f) and the second magnetic core (120a, 120d, 220a, 220b, 220c, 220d, 220e, 220f), the at least one second air gap (A52, A62, B32, B42, B52, B62) is formed between the at least one second pillar (244a, 244b, 244c, 244d, 244e, 244f) and the first magnetic core (110a, 110c, 210a, 210b, 210c, 210d, 210e, 210f), and spacing of the at least one first air gap (A51, A61, B31, B41, B51, B61) is the same as spacing of the at least one second air gap (A52, A62, B32, B42, B52, B62).
- The magnetic assembly (100a, 100b, 100c, 100d, 100e, 100f, 200a, 200b, 200c, 200d, 200e, 200f) according to claim 7, wherein the at least one first pillar (242a, 242b, 242c, 242d, 242e, 242f) and the first magnetic core (110a, 110c, 210a, 210b, 210c, 210d, 210e, 210f) are integrally formed, and the at least one second pillar (244a, 244b, 244c, 244d, 244e, 244f) and the second magnetic core (120a, 120d, 220a, 220b, 220c, 220d, 220e, 220f) are integrally formed.
- The magnetic assembly (100a, 100b, 100c, 100d, 100e, 100f, 200a, 200b, 200c, 200d, 200e, 200f) according to claim 1, wherein the plurality of pillars (140a, 140b, 140c, 140d, 140e, 140f) comprise at least one first pillar (242a, 242b, 242c, 242d, 242e, 242f) and at least one second pillar (244a, 244b, 244c, 244d, 244e, 244f), a height (HI, H3) of the at least one first pillar (242a, 242b, 242c, 242d, 242e, 242f) is different from a height (H2, H4) of the at least one second pillar (244a, 244b, 244c, 244d, 244e, 244f), the plurality of air gaps (A1, A2, A3, A4, B1, B2) comprise at least one first air gap (A51, A61, B31, B41, B51, B61) and at least one second air gap (A52, A62, B32, B42, B52, B62), one of the at least one first pillar (242a, 242b, 242c, 242d, 242e, 242f) and the at least one second pillar (244a, 244b, 244c, 244d, 244e, 244f) is disposed on the first magnetic core (110a, 110c, 210a, 210b, 210c, 210d, 210e, 210f), and the other of the at least one first pillar (242a, 242b, 242c, 242d, 242e, 242f) and the at least one second pillar (244a, 244b, 244c, 244d, 244e, 244f) is disposed on the second magnetic core (120a, 120d, 220a, 220b, 220c, 220d, 220e, 220f), the at least one first air gap (A51, A61, B31, B41, B51, B61) is formed between the at least one first pillar (242a, 242b, 242c, 242d, 242e, 242f) and one of the first magnetic core (110a, 110c, 210a, 210b, 210c, 210d, 210e, 210f) and the second magnetic core (120a, 120d, 220a, 220b, 220c, 220d, 220e, 220f), the at least one second air gap (A52, A62, B32, B42, B52, B62) is formed between the at least one second pillar (244a, 244b, 244c, 244d, 244e, 244f) and the other of the first magnetic core (110a, 110c, 210a, 210b, 210c, 210d, 210e, 210f) and the second magnetic core (120a, 120d, 220a, 220b, 220c, 220d, 220e, 220f), and spacing of the at least one first air gap (A51, A61, B31, B41, B51, B61) is different from spacing of the at least one second air gap (A52, A62, B32, B42, B52, B62).
- The magnetic assembly (100a, 100b, 100c, 100d, 100e, 100f, 200a, 200b, 200c, 200d, 200e, 200f) according to claim 9, wherein the at least one first pillar (242a, 242b, 242c, 242d, 242e, 242f) and one of the first magnetic core (110a, 110c, 210a, 210b, 210c, 210d, 210e, 210f) and the second magnetic core (120a, 120d, 220a, 220b, 220c, 220d, 220e, 220f) are integrally formed, and the at least one second pillar (244a, 244b, 244c, 244d, 244e, 244f) and the other of the first magnetic core (110a, 110c, 210a, 210b, 210c, 210d, 210e, 210f) and the second magnetic core (120a, 120d, 220a, 220b, 220c, 220d, 220e, 220f) are integrally formed.
- The magnetic assembly (100a, 100b, 100c, 100d, 100e, 100f, 200a, 200b, 200c, 200d, 200e, 200f) according to claim 1, wherein one of the first magnetic core (110a, 110c, 210a, 210b, 210c, 210d, 210e, 210f) and the second magnetic core (120a, 120d, 220a, 220b, 220c, 220d, 220e, 220f) is in a shape of a flat plate, and the other of the first magnetic core (110a, 110c, 210a, 210b, 210c, 210d, 210e, 210f) and the second magnetic core (120a, 120d, 220a, 220b, 220c, 220d, 220e, 220f) is in a shape of a groove.
- The magnetic assembly (100a, 100b, 100c, 100d, 100e, 100f, 200a, 200b, 200c, 200d, 200e, 200f) according to claim 1, wherein the first magnetic core (110a, 110c, 210a, 210b, 210c, 210d, 210e, 210f) and the second magnetic core (120a, 120d, 220a, 220b, 220c, 220d, 220e, 220f) are in a shape of a groove, respectively.
- The magnetic assembly (100a, 100b, 100c, 100d, 100e, 100f, 200a, 200b, 200c, 200d, 200e, 200f) according to claim 1, further comprising:
a plurality of connecting members (150, 250), and the at least one circuit board (130, 230) further has a plurality of connecting holes (134, 234) around, wherein the plurality of connecting members (150, 250) respectively correspond to the plurality of pass through connecting holes (134, 234).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111110685A TW202338868A (en) | 2022-03-22 | 2022-03-22 | Magnetic assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
EP4250318A1 true EP4250318A1 (en) | 2023-09-27 |
Family
ID=82584758
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP22185907.7A Pending EP4250318A1 (en) | 2022-03-22 | 2022-07-20 | Magnetic assembly |
Country Status (5)
Country | Link |
---|---|
US (1) | US20230307170A1 (en) |
EP (1) | EP4250318A1 (en) |
JP (1) | JP2023140258A (en) |
CN (2) | CN116825499A (en) |
TW (1) | TW202338868A (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170330678A1 (en) * | 2016-05-13 | 2017-11-16 | Enphase Energy, Inc. | Matrix planar transformer |
WO2018012760A1 (en) * | 2016-07-14 | 2018-01-18 | 이주열 | Common-coil planar transformer |
US20190043653A1 (en) * | 2017-08-02 | 2019-02-07 | General Electric Company | Integrated magnetic assemblies and methods of assembling same |
JP2020024997A (en) * | 2018-08-06 | 2020-02-13 | 株式会社京三製作所 | Reactor |
US20220084734A1 (en) * | 2020-09-17 | 2022-03-17 | Chicony Power Technology Co., Ltd. | Transformer |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59139610A (en) * | 1983-01-29 | 1984-08-10 | Matsushita Electric Works Ltd | Iron core |
JPH07335456A (en) * | 1994-06-09 | 1995-12-22 | Sony Corp | Saturable reactor transformer and converter transformer |
JPH0935965A (en) * | 1995-07-18 | 1997-02-07 | Matsushita Electric Ind Co Ltd | Reactor |
JP3163318B2 (en) * | 1995-10-24 | 2001-05-08 | 長野日本無線株式会社 | Core for inductive element and inductive element |
US6867678B2 (en) * | 2003-01-28 | 2005-03-15 | Entrust Power Co., Ltd. | Transformer structure |
JP2005109140A (en) * | 2003-09-30 | 2005-04-21 | Matsushita Electric Ind Co Ltd | Transformer |
JP2011100888A (en) * | 2009-11-06 | 2011-05-19 | Kitagawa Ind Co Ltd | Noise absorption device and noise absorption structure |
DE102016201258A1 (en) * | 2016-01-28 | 2017-08-03 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Electric voltage converter with several storage chokes |
CN107808756B (en) * | 2017-11-09 | 2020-03-20 | 西安华为技术有限公司 | Flat transformer and switching power adapter |
KR102619640B1 (en) * | 2018-12-10 | 2023-12-29 | 엘지이노텍 주식회사 | Planar coil and magnetic component including the same |
-
2022
- 2022-03-22 TW TW111110685A patent/TW202338868A/en unknown
- 2022-04-26 CN CN202210445274.6A patent/CN116825499A/en active Pending
- 2022-04-26 CN CN202220978774.1U patent/CN217114067U/en active Active
- 2022-06-26 US US17/849,693 patent/US20230307170A1/en active Pending
- 2022-07-20 EP EP22185907.7A patent/EP4250318A1/en active Pending
- 2022-09-08 JP JP2022142617A patent/JP2023140258A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170330678A1 (en) * | 2016-05-13 | 2017-11-16 | Enphase Energy, Inc. | Matrix planar transformer |
WO2018012760A1 (en) * | 2016-07-14 | 2018-01-18 | 이주열 | Common-coil planar transformer |
US20190043653A1 (en) * | 2017-08-02 | 2019-02-07 | General Electric Company | Integrated magnetic assemblies and methods of assembling same |
JP2020024997A (en) * | 2018-08-06 | 2020-02-13 | 株式会社京三製作所 | Reactor |
US20220084734A1 (en) * | 2020-09-17 | 2022-03-17 | Chicony Power Technology Co., Ltd. | Transformer |
Also Published As
Publication number | Publication date |
---|---|
JP2023140258A (en) | 2023-10-04 |
CN217114067U (en) | 2022-08-02 |
CN116825499A (en) | 2023-09-29 |
US20230307170A1 (en) | 2023-09-28 |
TW202338868A (en) | 2023-10-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7199694B2 (en) | Isolated dual-channel transformer | |
US8395470B2 (en) | Asymmetrical planar transformer having controllable leakage inductance | |
CN102893345A (en) | Miniature power inductor and methods of manufacture | |
EP1677080A3 (en) | Flat resolver | |
US20150302968A1 (en) | Magnetic element with multiple air gaps | |
US20230133417A1 (en) | Magnetic element and electronic device | |
US8188825B2 (en) | Transformer structure | |
CN101699584B (en) | Electronic transformer | |
EP4250318A1 (en) | Magnetic assembly | |
TWM630710U (en) | Magnetic assembly | |
CN101533705A (en) | High-power planar transformer | |
CN210606926U (en) | Two-way reactor | |
CN201611605U (en) | Electronic transformer | |
CN201323128Y (en) | High power planar transformer | |
CN110808151A (en) | Two-way reactor | |
CN107424776A (en) | A kind of transformer for increasing inductance value and differential mode sensibility reciprocal | |
CN213844981U (en) | High-frequency transformer with secondary led out by flying wire | |
CN217306284U (en) | Magnetic core skeleton structure for transformer | |
CN216562726U (en) | Transformer bobbin combined structure | |
CN110136935B (en) | Novel three-dimensional wound core | |
CN214505172U (en) | Magnetic core structure | |
CN213093016U (en) | Base integrated safety transformer | |
CN220962986U (en) | Combined transformer framework and transformer | |
CN209980933U (en) | Frameless resonant inductor | |
CN213691699U (en) | Transformer used on TV display screen |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
|
17P | Request for examination filed |
Effective date: 20220720 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |