EP4115120B1 - Led system without heat sink - Google Patents

Led system without heat sink Download PDF

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Publication number
EP4115120B1
EP4115120B1 EP21709802.9A EP21709802A EP4115120B1 EP 4115120 B1 EP4115120 B1 EP 4115120B1 EP 21709802 A EP21709802 A EP 21709802A EP 4115120 B1 EP4115120 B1 EP 4115120B1
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EP
European Patent Office
Prior art keywords
substrate
diodes
sheath
recesses
twice
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Active
Application number
EP21709802.9A
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German (de)
French (fr)
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EP4115120A1 (en
EP4115120C0 (en
Inventor
Jacques Bordes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agomoon Srl
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Agomoon Srl
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Publication of EP4115120C0 publication Critical patent/EP4115120C0/en
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
    • F21Y2105/16—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array square or rectangular, e.g. for light panels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a lighting system based on electroluminescent diode lamp technology responding to the horticulture and domestic or industrial lighting markets.
  • the document FR3045777 A1 discloses lighting devices having adopted these types of protections.
  • the device according to the invention makes it possible to remedy these drawbacks by providing a lighting system that is powerful, robust, durable and has a protection index of up to IP69, while maintaining a low manufacturing cost.
  • the principle of the invention is to use a heat shrinkable sheath, translucent or transparent and whose thermal conductivity is of the order of ten times greater than that of air.
  • An insulated metal substrate in the shape of a straight block, of length twice the width and width twice the thickness, will be slipped into this sheath.
  • the material of the sheath will then make it possible to evenly dissipate the heat from the circuit, while protecting the latter from any external aggression and any human contact.
  • the [ fig. 1 ] presents a device comprising an insulated metal substrate (1), on which is placed a connector (3) and a set of surface-mounted light-emitting diodes (2).
  • the substrate (1) and the set of diodes (2) are inserted into a heat-shrinkable sheath (4), so as to eliminate the air trapped between the diodes and the sheath.
  • An elastomeric overmolding (5) covers each of the two ends of the substrate (1) and the sheath (4), as well as the connector (3) at one of the ends, so as to ensure the protection and sealing of the assembly.
  • the overmolding (5) around the connector (3) forms a circular lip (6), which will fit and compress around the complementary power connector, in order to increase the protection index of the bare connector.
  • the overmolding (5) has a recess (7), smaller than the recess in the substrate, in order to coat it without blocking it and thus allow the device to be fixed using clips or screws .
  • a metal block (8) is glued to the back of the substrate (1) using double-sided thermally conductive adhesive tape, before wrapping the device in the heat-shrinkable sheath and overmolding it at its ends, this in order to increase the mechanical rigidity of the assembly.
  • the substrate made of aluminum, will have dimensions of around 500 millimeters long, 30 millimeters wide and 1 millimeter thick.
  • the metal block aimed at increasing rigidity will have the same dimensions and will be made of stainless steel.
  • the diodes will be SMD2835 type, and will consume 20 watts overall.
  • the connector will be DC type 5.5 x 2.1 millimeters.
  • the overmolding will be made of a thermoplastic elastomer to facilitate molding.
  • the material used for the heat shrinkable sheath will be a fluoropolymer with a shrinkage temperature greater than 140°C, in order to remain stable under the temperature of the diodes which can reach 80°C. It may be translucent or transparent depending on the targeted application.
  • the device according to the invention is particularly intended for domestic, industrial and horticultural lighting.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Description

La présente invention concerne un système d'éclairage basé sur la technologie des lampes à diode électro luminescente répondant aux marchés de l'horticulture et de l'éclairage domestique ou industriel.The present invention relates to a lighting system based on electroluminescent diode lamp technology responding to the horticulture and domestic or industrial lighting markets.

Les diodes électroluminescentes, type CMS (Composant Monté en Surface) ou COB (Puce sur circuit imprimé), constituant de systèmes d'éclairage, ont besoin d'être protégées, afin de ne pas être en contact direct avec l'environnement dans lequel elles opèrent. Il existe, principalement, deux types de protection, aujourd'hui :

  • Protéger les diodes via l'ajout d'une coque ou d'une paroi rigide transparente. L'air est alors emprisonné avec les diodes. Si l'on ne veut pas limiter le dispositif en puissance, il faudra refroidir le circuit soit par l'ajout d'un radiateur à l'arrière des diodes (système passif), soit par la mise en place d'un système de ventilation permettant de renouveler l'air (système actif). Les systèmes passifs sont encombrants et onéreux. Les systèmes actifs sont onéreux et de durabilité moins importante que les LED elles-mêmes.
  • Poser un verni protecteur directement sur les diodes. L'épaisseur du verni étant faible, cela limitera également la puissance des diodes, pour des problèmes de température. De plus, le système restera sensible aux chocs et aux manipulations. Enfin, l'application du verni reste un procédé délicat et nécessitant des outils de production onéreux.
Light-emitting diodes, type CMS (Surface Mounted Component) or COB (Chip on printed circuit), constituting lighting systems, need to be protected, so as not to be in direct contact with the environment in which they operate. There are mainly two types of protection today:
  • Protect the diodes by adding a shell or a transparent rigid wall. The air is then trapped with the diodes. If we do not want to limit the power of the device, it will be necessary to cool the circuit either by adding a radiator behind the diodes (passive system), or by installing a ventilation system. allowing the air to be renewed (active system). Passive systems are bulky and expensive. Active systems are expensive and less durable than the LEDs themselves.
  • Apply a protective varnish directly to the diodes. The thickness of the varnish being low, this will also limit the power of the diodes, due to temperature problems. In addition, the system will remain sensitive to shocks and manipulation. Finally, the application of varnish remains a delicate process requiring expensive production tools.

Le document FR3045777 A1 divulgue des dispositifs d'éclairage ayant adopté ces types de protections.The document FR3045777 A1 discloses lighting devices having adopted these types of protections.

Le dispositif, selon l'invention, permet de remédier à ces inconvénients en fournissant un système d'éclairage à la fois puissant, robuste, durable et possédant un indice de protection allant jusqu'à IP69, tout en gardant un coût de fabrication faible.The device according to the invention makes it possible to remedy these drawbacks by providing a lighting system that is powerful, robust, durable and has a protection index of up to IP69, while maintaining a low manufacturing cost.

Le principe de l'invention est d'utiliser une gaine thermo rétractable, translucide ou transparente et dont la conductivité thermique est de l'ordre de dix fois supérieure à celle de l'air. On glissera dans cette gaine un substrat métallique isolé de la forme d'un pavé droit, de longueur deux fois supérieure à la largeur et de largeur deux fois supérieure à l'épaisseur. On lui aura préalablement déposé sur une des deux plus grandes faces, au moins une diode électroluminescente montée en surface, type CMS ou COB, ainsi qu'un connecteur ou câble d'alimentation en extrémité. Une fois « rétractée », la chaussette sera directement en contact avec les diodes et le circuit, ne laissant pas d'air confiné. La matière de la gaine permettra alors de dissiper de façon homogène la chaleur du circuit, tout en protégeant ce dernier de toute agression extérieure et de tout contact humain. On surmoulera alors les extrémités, afin de rendre le système étanche électriquement, en utilisant un polymère.The principle of the invention is to use a heat shrinkable sheath, translucent or transparent and whose thermal conductivity is of the order of ten times greater than that of air. An insulated metal substrate in the shape of a straight block, of length twice the width and width twice the thickness, will be slipped into this sheath. We will have previously placed on one of the two largest faces, at least one light-emitting diode mounted on the surface, CMS or COB type, as well as a connector or power cable at the end. Once "retracted", the sock will be in direct contact with the diodes and circuit, leaving no confined air. The material of the sheath will then make it possible to evenly dissipate the heat from the circuit, while protecting the latter from any external aggression and any human contact. We will then overmold the ends, in order to make the system electrically waterproof, using a polymer.

Selon des modes particuliers de réalisation :

  • Le surmoulage peut-être en élastomère et ainsi utilisé pour créer une lèvre autour du connecteur d'alimentation, qui viendra épouser le connecteur complémentaire lors de son insertion. Cette lèvre permettra d'obtenir une connexion à l'indice de protection plus élevé que le connecteur nu, réalisant ainsi des économies de coût.
  • Le substrat peut présenter deux évidements à ses extrémités, traversant l'épaisseur et se situant en dehors de la zone couverte par la gaine, évidements que le surmoulage viendra enrober sans obturer. Ces évidements permettent de venir fixer à l'aide de vis ou de clips plastiques le dispositif.
  • Un second pavé d'alliage métallique, au module d'élasticité supérieur au substrat et possédant deux évidements correspondant aux évidements du premier pavé, peut être collé contre ce dernier, à l'opposé de la surface des diodes, à l'aide d'une matière thermiquement conductrice, ceci afin de rendre le système plus rigide.
  • On peut profiter du surmoulage pour créer des évidements supplémentaires, qui ne soient pas à la fois circulaires et concentriques aux deux évidements de fixation. Ces évidements permettront d'empêcher la rotation du système d'éclairage autour des axes de fixation, permettant ainsi de combiner ensembles plusieurs systèmes d'éclairage, en utilisant la rigidité intrinsèque de chaque système.
According to particular embodiments:
  • The overmolding can be made of elastomer and thus used to create a lip around the power connector, which will fit the complementary connector when it is inserted. This lip will provide a connection with a higher protection rating than the bare connector, thus achieving cost savings.
  • The substrate may have two recesses at its ends, crossing the thickness and located outside the area covered by the sheath, recesses which the overmolding will coat without closing. These recesses allow the device to be fixed using screws or plastic clips.
  • A second block of metal alloy, with a modulus of elasticity greater than the substrate and having two recesses corresponding to the recesses of the first block, can be stuck against the latter, opposite the surface of the diodes, using a thermally conductive material, in order to make the system more rigid.
  • We can take advantage of overmolding to create additional recesses, which are not both circular and concentric with the two fixing recesses. These recesses will prevent the lighting system from rotating around the fixing axes, thus making it possible to combine several lighting systems together, using the intrinsic rigidity of each system.

Les dessins annexés illustrent l'invention :

  • La [fig.1] est une vue en perspective du substrat métallique isolé avec un ensemble de LED ainsi qu'un connecteur posé sur l'une des deux plus grandes faces.
  • La [fig.2] est une vue en perspective du circuit enrobé de la gaine thermo rétractée et surmoulée aux extrémités par le polymère.
  • La [fig.3] est une vue de coupe longitudinale du système d'éclairage présentant la lèvre d'étanchéité autour du connecteur.
  • La [fig.4] est une vue en perspective du système d'éclairage présentant un évidement de fixation à chaque extrémité.
  • La [fig.5] est une vue en coupe longitudinale du système d'éclairage présentant un deuxième pavé d'alliage métallique collé au substrat.
  • La [fig.6] est une vue en perspective du système d'éclairage présentant un évidement non circulaire à chaque extrémité.
  • La [fig.7] est une vue en perspective de deux systèmes d'éclairage fixés ensembles grâce à deux supports.
The accompanying drawings illustrate the invention:
  • There [ fig.1 ] is a perspective view of the isolated metal substrate with a set of LEDs and a connector placed on one of the two larger faces.
  • There [ fig.2 ] is a perspective view of the circuit coated in the heat-shrunk sheath and overmolded at the ends by the polymer.
  • There [ fig.3 ] is a longitudinal sectional view of the lighting system showing the sealing lip around the connector.
  • There [ fig.4 ] is a perspective view of the lighting system having a fixing recess at each end.
  • There [ fig.5 ] is a longitudinal sectional view of the lighting system presenting a second block of metal alloy bonded to the substrate.
  • There [ fig.6 ] is a perspective view of the lighting system having a non-circular recess at each end.
  • There [ fig.7 ] is a perspective view of two lighting systems fixed together using two supports.

En référence à ces dessins, la [fig. 1] présente un dispositif comportant un substrat métallique isolé (1), sur lequel est placé un connecteur (3) et un ensemble de diodes électroluminescentes montées en surface (2). Sur la [fig.2], on vient insérer le substrat (1) et l'ensemble de diodes (2) dans une gaine thermo rétractable (4), de façon à éliminer l'air emprisonné entre les diodes et la gaine. Un surmoulage élastomère (5) recouvre chacune des deux extrémités du substrat (1) et de la gaine (4), ainsi que le connecteur (3) à l'une des extrémités, de façon à assurer la protection et l'étanchéité de l'ensemble.With reference to these drawings, the [ fig. 1 ] presents a device comprising an insulated metal substrate (1), on which is placed a connector (3) and a set of surface-mounted light-emitting diodes (2). On the [ fig.2 ], the substrate (1) and the set of diodes (2) are inserted into a heat-shrinkable sheath (4), so as to eliminate the air trapped between the diodes and the sheath. An elastomeric overmolding (5) covers each of the two ends of the substrate (1) and the sheath (4), as well as the connector (3) at one of the ends, so as to ensure the protection and sealing of the assembly.

Dans la forme de réalisation selon la [fig.3], le surmoulage (5) autour du connecteur (3) vient former une lèvre circulaire (6), qui viendra épouser et se compresser autour du connecteur d'alimentation complémentaire, afin d'augmenter l'indice de protection du connecteur nu.In the embodiment according to [ fig.3 ], the overmolding (5) around the connector (3) forms a circular lip (6), which will fit and compress around the complementary power connector, in order to increase the protection index of the bare connector.

Dans la forme de réalisation selon la [fig.4], le surmoulage (5) présente un évidement (7), plus petit que l'évidement du substrat, afin de venir l'enrober sans l'obturer et de permettre ainsi la fixation du dispositif à l'aide de clips ou de vis.In the embodiment according to [ fig.4 ], the overmolding (5) has a recess (7), smaller than the recess in the substrate, in order to coat it without blocking it and thus allow the device to be fixed using clips or screws .

Dans la forme de la réalisation selon la [fig.5], un pavé métallique (8) est collé au dos du substrat (1) à l'aide d'un ruban adhésif thermo conductif double face, avant d'envelopper le dispositif de la gaine thermo rétractable et de le surmouler à ses extrémités, ceci afin d'augmenter la rigidité mécanique de l'ensemble.In the form of the embodiment according to [ fig.5 ], a metal block (8) is glued to the back of the substrate (1) using double-sided thermally conductive adhesive tape, before wrapping the device in the heat-shrinkable sheath and overmolding it at its ends, this in order to increase the mechanical rigidity of the assembly.

Dans la forme de la réalisation selon la [fig.6], des évidements (9) sont réalisés lors du surmoulage, autour des évidements de fixations (7), permettant d'empêcher la rotation entre le système d'éclairage et les pièces de maintien que l'on viendra clipper. Un exemple de montage de deux systèmes d'éclairage est ainsi proposé [fig.7].In the form of the embodiment according to [ fig.6 ], recesses (9) are made during overmolding, around the fixing recesses (7), making it possible to prevent rotation between the lighting system and the holding parts that will be clipped. An example of mounting two lighting systems is thus proposed [ fig.7 ].

A titre d'exemple non limitatif, le substrat, en aluminium, aura des dimensions de l'ordre de 500 millimètres de long, 30 millimètres de large et 1 millimètre d'épaisseur. Le pavé métallique visant à augmenter la rigidité aura les mêmes dimensions et sera constitué d'acier inoxydable. Les diodes seront de type SMD2835, et consommeront 20 watts dans leur ensemble. Le connecteur sera de type DC 5,5 x 2,1 millimètres. Le surmoulage sera constitué d'un élastomère thermoplastique afin de faciliter le moulage. La matière utilisée pour la gaine thermo rétractable sera un fluoropolymère possédant une température de rétreint supérieure à 140°C, afin de rester stable sous la température des diodes qui peut atteindre 80°C. Elle pourra être translucide ou transparente selon l'application ciblée.As a non-limiting example, the substrate, made of aluminum, will have dimensions of around 500 millimeters long, 30 millimeters wide and 1 millimeter thick. The metal block aimed at increasing rigidity will have the same dimensions and will be made of stainless steel. The diodes will be SMD2835 type, and will consume 20 watts overall. The connector will be DC type 5.5 x 2.1 millimeters. The overmolding will be made of a thermoplastic elastomer to facilitate molding. The material used for the heat shrinkable sheath will be a fluoropolymer with a shrinkage temperature greater than 140°C, in order to remain stable under the temperature of the diodes which can reach 80°C. It may be translucent or transparent depending on the targeted application.

Le dispositif selon l'invention est particulièrement destiné à l'éclairage domestique, industriel et horticole.The device according to the invention is particularly intended for domestic, industrial and horticultural lighting.

Claims (6)

  1. The device consists of an insulated metal substrate (1) in the form of a straight block, the length of which is at least twice as great as the width, which is at least twice as great as the thickness, comprising, on one of the two larger surfaces, at least one SMD-type (Surface Mounted Device) or COB-type (Chip on Board) light-emitting diode (2), supplied by a connector (3) at one of the ends of the circuit, characterised in that said substrate (1) is covered with a transparent or translucent heat-shrinkable sheath (4) covering the diodes, and in that the substrate (1) and the sheath (4) are overmoulded at the ends by a polymer (5) electrically insulating the system.
  2. Device according to claim 1, characterised in that the material used for the overmoulding (5) is an elastomer, and in that this overmoulding (5) has, at the opening of the connector, a lip (6), which seals the connection (3).
  3. Device according to claim 2, characterised in that the substrate (1) has a recess (7) at each end, passing through the thickness, and located outside the area covered by the sheath (4), recesses that the overmoulding (5) covers without sealing.
  4. Device according to claim 3, characterised in that a second block (8) consisting of a metal alloy with a higher modulus of elasticity than the insulated metal substrate (1) having two recesses which correspond to the recesses (7) of the circuit (1) is stuck to the substrate (1) on the surface opposite the diodes, by means of a thermally conductive material.
  5. Device according to claim 3 or 4, characterised in that each end of the system has a recess (9) in the overmoulding which is not both circular and concentric to the recess (7).
  6. The device consists of an insulated metal substrate (1) in the form of a straight block, the length of which is at least twice as great as the width, which is at least twice as great as the thickness, comprising, on one of the two larger surfaces, at least one SMD-type (Surface Mounted Device) or COB-type (Chip on Board) light-emitting diode (2), supplied by a cable at one of the ends of the circuit, characterised in that said substrate (1) is covered with a transparent or translucent heat-shrinkable sheath (4) covering the diodes, and in that the substrate (1) and the sheath (4) are overmoulded at the ends by a polymer (5) electrically insulating the system.
EP21709802.9A 2020-03-05 2021-02-23 Led system without heat sink Active EP4115120B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2002246A FR3107944B1 (en) 2020-03-05 2020-03-05 LED system without heat sink
PCT/IB2021/051511 WO2021176302A1 (en) 2020-03-05 2021-02-23 Led system without heat sink

Publications (3)

Publication Number Publication Date
EP4115120A1 EP4115120A1 (en) 2023-01-11
EP4115120B1 true EP4115120B1 (en) 2024-03-27
EP4115120C0 EP4115120C0 (en) 2024-03-27

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Application Number Title Priority Date Filing Date
EP21709802.9A Active EP4115120B1 (en) 2020-03-05 2021-02-23 Led system without heat sink

Country Status (4)

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US (1) US11732880B2 (en)
EP (1) EP4115120B1 (en)
FR (1) FR3107944B1 (en)
WO (1) WO2021176302A1 (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11480306B2 (en) * 2008-09-05 2022-10-25 Jiaxing Super Lighting Electric Appliance Co., Ltd. LED tube lamp
GB2472833B (en) * 2009-08-20 2013-12-18 Graviton Lite Ltd Mounting For A Light Emitting Diode
KR100997646B1 (en) * 2010-04-02 2010-12-01 루미리치 주식회사 Led lighting lamp
US20140009923A1 (en) * 2012-07-06 2014-01-09 Tan Chih Wu Led tube lamp structure
WO2014075001A1 (en) * 2012-11-12 2014-05-15 A Zykin Led spirit system and manufacturing method
KR101873177B1 (en) * 2014-09-11 2018-06-29 후지필름 가부시키가이샤 Laminated structure, touch panel, display device with touch panel, and method for manufacturing same
FR3045777B1 (en) * 2015-12-22 2020-06-05 Led-Ner LED FILAMENT WITH CURRENT REGULATOR AND LED FILAMENT LIGHTING DEVICE
DE102016012639B4 (en) * 2016-10-24 2018-09-20 Nicola Barthelme Chainable, fully encapsulated, flexible light emitting diode strip and method for its production

Also Published As

Publication number Publication date
US11732880B2 (en) 2023-08-22
WO2021176302A1 (en) 2021-09-10
FR3107944A1 (en) 2021-09-10
FR3107944B1 (en) 2022-02-11
EP4115120A1 (en) 2023-01-11
EP4115120C0 (en) 2024-03-27
US20230123362A1 (en) 2023-04-20

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