EP4062487A1 - Puce radar à couplage de guide d'ondes - Google Patents

Puce radar à couplage de guide d'ondes

Info

Publication number
EP4062487A1
EP4062487A1 EP20803123.7A EP20803123A EP4062487A1 EP 4062487 A1 EP4062487 A1 EP 4062487A1 EP 20803123 A EP20803123 A EP 20803123A EP 4062487 A1 EP4062487 A1 EP 4062487A1
Authority
EP
European Patent Office
Prior art keywords
waveguide
radar
substrate
line
radar chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP20803123.7A
Other languages
German (de)
English (en)
Inventor
Roland Baur
Steffen WÄLDE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vega Grieshaber KG
Original Assignee
Vega Grieshaber KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vega Grieshaber KG filed Critical Vega Grieshaber KG
Publication of EP4062487A1 publication Critical patent/EP4062487A1/fr
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
    • G01S7/027—Constructional details of housings, e.g. form, type, material or ruggedness
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
    • H01P5/107—Hollow-waveguide/strip-line transitions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
    • G01S13/88—Radar or analogous systems specially adapted for specific applications
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/12—Hollow waveguides
    • H01P3/121—Hollow waveguides integrated in a substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/225—Supports; Mounting means by structural association with other equipment or articles used in level-measurement devices, e.g. for level gauge measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/02—Waveguide horns

Definitions

  • the invention relates to radar measurement technology.
  • the invention relates to a radar chip with a waveguide coupling, the use of such a radar chip in a radar measuring device, and a method for producing such a radar chip.
  • Radar measuring devices can be used in automation technology in an industrial environment. For example, they are designed in the form of radar level measuring devices, which are very often equipped with horn antennas that are fed via waveguides. Especially in the frequency range between 40 and 300 GHz, the mechanical dimensions of the waveguide components are in a range that they can be easily integrated into the radar device.
  • the coupling of the radar signals generated by the high-frequency circuit of the measuring device into the horn antenna can take place via a so-called stripline, which is also called a microstrip line, which protrudes into a waveguide of the horn antenna.
  • the high-frequency circuit which can be designed as a radar chip, from mechanical stress, it can be cast in a potting compound.
  • a first aspect of the present disclosure relates to a radar chip with a waveguide coupling, set up for coupling a radar signal of the radar chip into an antenna or a waveguide of a radar measuring device and / or for coupling out a radar signal from the antenna or the waveguide.
  • This waveguide can in particular be a part of the antenna that introduces the coupled radar signal into the antenna horn.
  • the waveguide coupling has a high-frequency substrate, for example in the form of a circuit board, with a line, a radiator element and a substrate-integrated waveguide arranged therebetween and connected to it, which is integrated in the substrate.
  • the radiator element can be, for example, a flat exciter patch, or else an exciter pin or a single or double fin.
  • This arrangement is set up for transmitting the radar signal from the radar chip to an antenna or a waveguide of the radar measuring device, as well as for coupling the radar signal into the antenna or the waveguide of the radar measuring device.
  • the radar signals reflected on the medium to be measured can also be transmitted from the antenna to the radar chip via this arrangement.
  • the substrate-integrated waveguide can be viewed as a filled waveguide. According to one embodiment, it has a flat top side and a flat bottom side, between which there is substrate material and which are electrically conductively connected to one another by means of plated-through holes or vias that form the “side walls” of the “waveguide”.
  • the line, the radiator element and the upper side of the substrate-integrated waveguide arranged therebetween are arranged in the same plane of the high-frequency substrate.
  • This plane can be an outer plane, but it can also be a plane inside the high-frequency substrate.
  • the line and an upper side of the substrate-integrated waveguide are arranged in the same plane of the high-frequency substrate, the radiator element and an underside of the substrate-integrated waveguide being arranged in a different plane.
  • the feed or line and the upper side of the substrate-integrated waveguide arranged therebetween are arranged on the surface of the high-frequency substrate.
  • the line is connected to or connected to an initial region of the upper side of the waveguide.
  • This starting area is, for example, the “front edge” of the top.
  • the radiator element is correspondingly connected to or connected to an end region (the rear edge) of the top side of the substrate-integrated waveguide.
  • the substrate-integrated waveguide of the waveguide coupling has a width which is many times greater than the widths of the line and the radiator element.
  • the width runs parallel to the surface of the substrate and perpendicular to the direction of propagation of the radar signal.
  • the width is not necessarily the width of the conductor track.
  • the edge and thus the width of the substrate-integrated waveguide is defined by the vias.
  • the upper side of the substrate-integrated waveguide can, however, extend over a large area and be connected to ground (circuit ground) from the “direct current point of view”. This in turn offers advantages in terms of Ex approval. This is because no voltage can build up on the unforgotten microstrip line that feeds the waveguide, since it is short-circuited from a direct current point of view via the waveguide integrated into the substrate. This in turn means that a potentially flammable atmosphere cannot ignite via this line.
  • the width of the line is less than the width of the radiator element.
  • the radar chip with the waveguide coupling has a potting compound in which the radar chip, the line and a portion of the top of the substrate-integrated waveguide are embedded, set up to protect the radar chip from mechanical loads.
  • This potting compound can be, for example, a relatively hard potting compound, for example a two-component resin, for example GlobTop.
  • This potting compound also embeds the bond wires or soldered connections.
  • a further potting compound can also be provided, which is applied to the first potting compound after the first potting compound and, for example, completely embeds it.
  • This can be a softer potting compound, for example a gelatinous one. This should in particular provide explosion protection for the entire arrangement.
  • the line has a first matching structure in the area of the connection to the substrate-integrated waveguide.
  • the radiator element or its connection line can have a second matching structure in the area of its connection to the substrate-integrated waveguide.
  • the substrate-integrated waveguide has vias from its upper side to its lower side.
  • the radar measuring device has an antenna or a waveguide which rests on the upper side of the substrate-integrated waveguide so that a potting compound can flow into the interior of the antenna or the waveguide.
  • Another aspect relates to a method for producing a radar chip with a waveguide coupling described above and below, in which a radar chip with a waveguide coupling is first provided, which is set up to couple a radar signal from the radar chip into an antenna or a waveguide, followed by potting of the radar chip, the line and a portion of the top of the substrate-integrated waveguide with a first potting compound to protect the radar chip from mechanical loads.
  • the radar chip is potted with a further potting compound, which is applied to the first potting compound.
  • the flat structure of the upper metal layer of the substrate-integrated waveguide makes it possible to to realize a seal between the potting compound and the waveguide, since penetration of the second potting compound into the waveguide would result in the latter no longer fulfilling its task.
  • the second encapsulation can provide efficient explosion protection.
  • Fig. 1 shows a waveguide coupling according to an embodiment.
  • FIG. 2 shows the waveguide coupling of FIG. 1 without a circular waveguide.
  • FIG 3 shows the side view of a radar measuring device with a waveguide coupling.
  • FIG. 4 shows a side sectional view of a radar measuring device with a waveguide coupling according to one embodiment.
  • FIG. 5 shows the top view of the waveguide coupling shown in FIG. 3.
  • FIG. 6 shows a plan view of the waveguide coupling shown in FIG. 4.
  • FIG. 7 shows a flow diagram of a method according to an embodiment.
  • Radar level gauges are very often equipped with horn antennas that are fed via waveguides. Especially in the frequency range between 40 and 300 GHz, the mechanical dimensions of the waveguide components are in a range that they can be easily integrated into the radar device.
  • a high-frequency measurement signal is used in the electronics unit for radar-based level measurement of a radar module 300 is generated on a radar chip 301.
  • the unhoused radar chip sits on a special printed circuit board substrate 302 that has good high-frequency properties, such as low signal attenuation. It is glued on there, for example, and is contacted with bond connections 303.
  • the high-frequency radar signal is then fed to a stripline 304 (microstrip line) via the bond connection 303.
  • the chip can also be soldered onto the substrate.
  • the radar signal is then routed to a stripline 304 (microstrip line) via a soldered connection.
  • the microstrip line in turn leads directly into a waveguide 305 which is perpendicular to the high-frequency substrate.
  • the waveguide has a small gate 306 through which the microstrip line is passed.
  • the waveguide is connected to the antenna 307.
  • the radar signal can be sent and received via this arrangement.
  • a resonator 308 integrated in the substrate can be used to increase the bandwidth of the transition between the microstrip line and the waveguide.
  • the resin is applied to the chip and the substrate in liquid form. The resin flows over the microstrip line to an undefined point.
  • a disadvantage is that the GlobTop 309 only covers the microstrip line up to an undefined area. Since the GlobTop 309 differs from air in its dielectric properties, the microstrip line has a different impedance in the area in which it is covered by the GlobTop material than in the area in which the line is surrounded by air. Furthermore, under certain conditions, radar devices can receive approval for use in potentially explosive areas. A prerequisite for this can be that the entire electronics unit is encapsulated under a potting compound 401 so that no ignitable mixture can accumulate in the electronics. In order to be able to encapsulate such an electronic unit, it must be sealed from the outside. However, this can present a problem with the high frequency signal. The waveguide shouldn't fill with potting compound, otherwise its high-frequency properties can be impaired. However, since the microstrip line leads through a gate into the waveguide, this would inevitably happen with the structure described above.
  • FIG. 1 A solution to this problem is shown in FIG.
  • the electromagnetic wave propagates between the conductor track located at the top and the ground layer in the dielectric of the PCB. This wave is transferred into a filled waveguide consisting of the PCB material 302, the two copper layers 102a 102b and vias 101, which in the context of this description is also referred to as a substrate-integrated waveguide.
  • the term copper layer is to be interpreted broadly.
  • the substrate-integrated waveguide 102a, 102b, 101 leads directly into the waveguide 305 of the antenna and the high-frequency signal is coupled in there.
  • Adaptation structures in the form of tapers 104 which, from a high-frequency technical point of view, create a transition between the respective line structures with less attenuation and reflection have proven advantageous.
  • the electromagnetic wave is fed into the waveguide of the antenna via a correspondingly matched exciter patch 201, which lies on the same level as the upper metal layer of the substrate-integrated waveguide and, like this surface, is also at ground potential, or another type of radiator element .
  • the resonator pot (resonator element) 308 represents a possibility of transferring (coupling in) the high-frequency signal, which is carried on a printed circuit board, over a broadband into the waveguide and vice versa. Without the resonator element, the signal could only be transmitted in a narrow band.
  • the resonant element generates an additional resonance in the transmission behavior of the conductivity type on the circuit board and the waveguide.
  • the first resonance (the energy is transferred very well into the waveguide at resonance points) forms the radiator element. Its geometric dimensions are coordinated in such a way that it (precisely) generates a resonance in the desired frequency range.
  • the second resonance (that of the resonator pot) can be significantly influenced by the pot depth.
  • the depth is in the range of a quarter wavelength in the substrate.
  • a double fin can be provided as a radiator element.
  • the glob top material 309 can now be led out to the smooth surface 102a of the waveguide 102a, 102b, 101, 302 integrated in the substrate. Due to its nature, the substrate-integrated waveguide is completely independent of things on its top and bottom, including the GlobTop material. It is therefore of little relevance at this point how far the GlobTop flows in its liquid form onto the substrate-integrated waveguide.
  • the impedance of the line can be adjusted to a defined impedance of, for example, 50 ohms.
  • the taper 104 is matched to the GlobTop material.
  • the metallic waveguide can now be designed in such a way that its outer wall 402 rests directly on the surface of the waveguide integrated in the substrate, see FIG. 4.
  • a sealing surface is no longer necessary because there is no longer an opening in the waveguide of the antenna and thus the potting compound described above does not flow into the waveguide, but at the same time the high-frequency signal can be coupled into the waveguide.
  • FIG. 2 shows the waveguide coupling of FIG. 1 without a circular waveguide.
  • the metallic top side 102a of the substrate-integrated waveguide opens into an annular structure, which is also connected to the lower copper layer 102b by means of vias.
  • the two layers 102a, 102b do not have to have any annular end regions. However, it is advantageous if they have at least one circular inner contour so that the radiator element 201 has sufficient space. It is advisable to adapt the inner contour of the two layer end regions to the inner contour of the waveguide 402 placed thereon, as shown in the figures (here the waveguide 402 is a round waveguide).
  • the inner contours can, however, also be oval or rectangular. In the latter case, one speaks of a rectangular waveguide.
  • Figures 5 and 6 each show the top view of corresponding radar modules.
  • Figure 5 shows the embodiment of Figure 3.
  • Figure 6 shows the case that the GlobTop Material 309 finds a defined termination through the substrate-integrated waveguide on the microstrip line.
  • Another aspect relates to the avoidance of undefined points of the impedance jump between the microstrip line surrounded by GlobTop and the air-covered microstrip line.
  • a tolerance-afflicted “gate” to the waveguide can be omitted, which means that there is less variation in performance in production.
  • the distance between the radar chip and the waveguide can also be reduced, as a result of which a more compact design is possible.
  • the copper layer on top which can be seen in FIG. 1, shows the stripline 103 on the left, onto which the radar chip 301 feeds. In the middle is the area with the substrate-integrated waveguide and the smooth copper surface.
  • the transparent contour 309 (see FIG. 6), which lies above the stripline for signal feed and half above the filled, substrate-integrated waveguide, represents the GlobTop material. On the right-hand side you can see the substrate-integrated waveguide that guides the signal into the antenna .
  • the bevels 104 at the transition from the stripline 103 to the ground plane 102a of the waveguide serve to improve the transition between the stripline and the waveguide and improve the adaptation and thus reduce the reflections.
  • the plated-through holes 101 form the two walls of the filled waveguide and connect the copper surfaces
  • the electromagnetic wave is excited in the waveguide via a patch 201, which is connected to the upper copper layer 102a at the end of the substrate-integrated waveguide.
  • the two copper surfaces 102a and 102b can be connected to the ground potential.
  • 7 shows a flow diagram of a method according to an embodiment.
  • a radar chip as described above with a waveguide coupling is provided.
  • the radar chip, its line and a partial area of the top of the substrate-integrated waveguide are encapsulated with a first potting compound to protect the radar chip from mechanical loads.
  • the radar chip is potted with a further potting compound, which is applied to the first potting compound, for explosion protection.

Landscapes

  • Engineering & Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Waveguide Aerials (AREA)
  • Radar Systems Or Details Thereof (AREA)

Abstract

L'invention concerne une puce radar dotée d'un couplage de guide d'ondes, ayant un substrat haute fréquence comprenant une ligne, un élément rayonnant et un guide d'ondes intégré à un substrat disposé entre ceux-ci, pour injecter le signal radar dans l'antenne ou le guide d'ondes de la jauge radar et l'émettre à partir de ceux-ci.
EP20803123.7A 2019-11-18 2020-11-04 Puce radar à couplage de guide d'ondes Pending EP4062487A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102019217736.0A DE102019217736A1 (de) 2019-11-18 2019-11-18 Radarchip mit einer Hohlleitereinkopplung
PCT/EP2020/080980 WO2021099122A1 (fr) 2019-11-18 2020-11-04 Puce radar à couplage de guide d'ondes

Publications (1)

Publication Number Publication Date
EP4062487A1 true EP4062487A1 (fr) 2022-09-28

Family

ID=73138821

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20803123.7A Pending EP4062487A1 (fr) 2019-11-18 2020-11-04 Puce radar à couplage de guide d'ondes

Country Status (5)

Country Link
US (1) US20230358855A1 (fr)
EP (1) EP4062487A1 (fr)
CN (1) CN114730982A (fr)
DE (1) DE102019217736A1 (fr)
WO (1) WO2021099122A1 (fr)

Families Citing this family (2)

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DE102022202220A1 (de) * 2022-03-04 2023-09-07 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung für einen Übergang einer Hochfrequenzverbindung zwischen einer Streifenleiterverbindung und einem Hohlleiter, Hochfrequenzanordnung und Radarsystem
US20240019537A1 (en) * 2022-06-15 2024-01-18 Krohne Messtechnik Gmbh Radar Arrangement

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Also Published As

Publication number Publication date
WO2021099122A1 (fr) 2021-05-27
US20230358855A1 (en) 2023-11-09
DE102019217736A1 (de) 2021-05-20
CN114730982A (zh) 2022-07-08

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