Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
  • H05K7/20254—Cold plates transferring heat from heat source to coolant
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
  • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds

Definitions

• Cooling device for cooling a large number of electronic components which are arranged on a circuit board and emit heat, and a system comprising the cooling device
• the invention relates to a cooling device for cooling a large number of electronic components which are arranged on a circuit board and which emit heat, as well as a system comprising such a cooling device and a circuit board with a large number of electronic components arranged thereon.
• Electronic components such as CPUs or GPUs, which give off heat during operation, must be cooled, with both the cooling capacity and the efficiency of the cooling being decisive for the efficiency of the electronic components.
• the cooling of the electronic components or the dissipation of heat from the electronic components is a space and cost problem.
• such systems are nowadays more and more compact or more systems are provided in a very small space, which is disadvantageous for the cooling, so that the necessary cooling capacity or the power consumption caused by the cooling increase as a result.
• Liquid-based cooling is an alternative, especially since the heat output in water is around 100 times higher than in air, although even higher values can be achieved with other liquid coolants. With comparatively small water-filled pipes, a comparatively large amount of heat can be removed.
• immersion cooling is known in the prior art.
• the entire system or the circuit boards of the system are arranged in an immersion bath so that the liquid can flow around and cool all components.
• a low-corrosion, non-conductive, liquid coolant such as oil, for example, must be used as the coolant or coolant.
• such solutions are usually difficult to seal, so leakages and “water” damage are likely.
• due to the large amount of liquid required for this, such systems are heavy and cannot be transported. If conductive foreign bodies get into the system or the liquid, short circuits can also occur on the circuit boards.
• a comparatively new solution also provides for cooling using a mixing system or two separate liquids.
• a non-conductive, low-corrosion liquid is provided in a sealed system, which absorbs the heat from the components and transfers it to an immediately adjacent liquid-cooled plate.
• Another cooling medium flows through the plate, which dissipates the heat. Since such systems can be made tight and do not require individual flexible hoses at least directly on the circuit board, they are relatively easy to manufacture, although they are still comparatively heavy due to the amounts of liquid used.
• the invention is therefore based on the object of overcoming the aforementioned disadvantages and providing a cooling device for cooling a large number of electronic components which are arranged on a circuit board and emit heat, which can be produced simply and cost-effectively and which effectively cools the large number of components
• the circuit board enables components to be arranged with a comparatively low weight.
• a cooling device for cooling a plurality of electronic components which are arranged on a circuit board and emit heat.
• the cooling device has a distribution unit and at least one cooling satellite.
• the distributor unit which is preferably dimensionally stable, has a coolant inlet and a coolant outlet and a coolant can flow through it from its coolant inlet to its coolant outlet along a predetermined and fixed coolant path.
• the at least one cooling satellite is fixed on the distribution unit in a spatial position that is predetermined relative to the distribution unit and has a cooling body, a coolant inlet and a coolant outlet.
• the heat sink of the at least one cooling satellite can be contacted over a large area with at least one electronic component of the multitude of electronic components.
• the coolant can flow through the cooling satellite from its coolant inlet to its coolant outlet along the coolant path, the coolant path running through the distributor unit and the at least one cooling satellite and in sections along the cooling body of the cooling satellite.
• the basic inventive idea is therefore to provide a distribution unit on which a cooling satellite or several cooling satellites are provided, through which certain electronic components of the board are targeted contacted and cooled.
• the distributor unit which can be provided as a distributor plate, has a fixed and predetermined position in relation to the plate and is preferably dimensionally stable, so that simple and automated assembly is possible.
• the distribution unit or the coolant transported therein can not only absorb heat via the cooling satellites, but also heat which is transported to the distribution unit or the coolant contained therein via other heat transport phenomena, so that the electronic components of a circuit board are split into two Groups can be split up.
• a first group is intended to be cooled directly by the cooling satellites and a second group, the electronic components of which are not directly connected to the cooling satellites, can transfer heat to the distribution unit via further heat transport phenomena is discharged.
• Both the distribution unit and the cooling satellites can each have a plurality of coolant inlets and a plurality of coolant outlets, which can flow through along a coolant path or along a plurality of parallel coolant paths.
• the cooling device can thereby be designed in a modularized manner and the cooling device can be put together individually for different boards.
• Boards usually have a standardized size, so that a uniform distribution unit can be provided for all boards of one size, which itself has a specific shape and size adapted to the size of the board.
• the cooling satellite or the cooling satellites can be placed on the distribution unit along a grid or freely, with the coolant inlet and the coolant outlet of the cooling satellite or the coolant inlets and the coolant outlets of the cooling satellites must be fluidically connected to a cooling channel provided in the distribution unit, so that each Cooling satellite is flowed through along a common or along different Strö flow paths of the coolant from the coolant inlet to the coolant outlet of the distribution unit.
• the distributor unit is flat or frame-shaped.
• the distributor unit is flat and implemented as a distributor plate and further preferably has a length and width equal to the length and width of the board.
• the distributor unit is also designed to be hollow, at least in sections, and has one or more cooling channels in its interior, the flow path of the coolant or the coolant path being determined in sections by the cooling channel or channels of the distributor unit and the cooling satellites.
• the distribution unit is designed in the form of a frame, the circuit board or the electronic components arranged on it are flanked at least in sections.
• This also includes, in particular, an embodiment in which the distributor unit is designed in two parts and the board is arranged between the parts of the distributor unit so that the parts or levels of the distributor unit are diametrically opposite one another with respect to the board and the parts of the distributor unit through the Width or length of the board are spaced from one another.
• the distributor unit has a cooling surface which, when used as intended, faces the electronic components on the circuit board.
• the cooling surface is preferably aligned parallel to the surface of the board or orthogonally to it.
• the cooling surface serves to absorb heat, which is generated, for example, by convection or via the air lying between the electronic components and the cooling surface
• Electronic components of the board which are not or at least not directly in contact with one of the cooling satellites, are released and taken up by the cooling surface.
• the distributor unit has in its interior at least one cooling channel which determines the coolant path.
• the cooling channel is used to transport the coolant from the cooling channel inlet of the distribution unit to the cooling channel inlets of the respective cooling satellites as well as to transport the heat away from any cooling surface of the distribution unit, so that the coolant which flows through the cooling channel or the cooling channels flows through both the cooling satellites and the un indirectly absorbed by the distribution unit heat can be removed from themévor direction.
• the cooling device provides that the cooling channel is constructed in several parts. Furthermore, a first part of the cooling channel extends from the coolant inlet of the distributor unit to the coolant inlet of a cooling satellite and a second part of the cooling channel extends from the coolant outlet of a cooling satellite to the coolant outlet of the distributor unit.
• part of the cooling channel connects the coolant inlet of the distribution unit in terms of flow with all coolant inlets of the cooling satellites.
• a second part of the cooling channel also connects all coolant outlets of the cooling satellites in terms of flow with the coolant outlet of the distribution unit.
• the cooling satellites are arranged parallel to one another.
• the cooling satellites are arranged in series in terms of flow.
• a first part of the cooling channel connects the coolant inlet of the distribution unit fluidically with the coolant inlet of a first cooling satellite.
• a second part of the cooling channel connects the coolant outlet of the first cooling satellite in terms of flow with the coolant inlet of a second cooling satellite.
• This structure that is to say the switching of the cooling satellites in series through parts of the cooling channel which connect the cooling satellites to one another, can continue as desired up to the last of the cooling satellites connected in series.
• a last part of the cooling duct connects the coolant outlet of the last cooling satellite with the coolant outlet of the distribution unit.
• a third variant provides a mixture of the two first variants, in which groups of cooling satellites arranged in series in terms of flow are connected to one another in terms of flow in parallel.
• an advantageous variation of the cooling device provides that the cooling channel runs in a meandering manner in the distributor unit. Through a uniform meandering course, a fixed pattern or grid can also be formed at the same time, by means of which the cooling satellites can be attached to the distributor unit in a particularly simple manner and connected to the cooling channel in terms of flow.
• the meandering course on the cooling surface of the distributor unit can be marked or recognizable, so that the cooling channel can be opened from the outside, for example by drilling, and a section of the cooling satellite, such as the supply line or drainage explained below, can be inserted.
• the distributor unit is two separate and fluidically connected to the coolant only by the at least one cooling satellite Has flowable levels.
• the planes can be arranged directly adjacent to one another or adjacent to one another or at a distance from one another.
• the coolant inlet of each cooling satellite is fluidically connected directly to a first level of the two levels or directly to a part of the cooling channel running in the first level.
• the coolant outlet of each cooling satellite is fluidically connected directly to a second level of the two levels or directly to a part of the cooling channel running in the second level.
• the coolant inlet of the distributor unit is arranged in the first level and the coolant outlet of the distributor unit in the second level or are connected in terms of flow.
• the coolant inlet of the distributor unit is fluidically connected to the part of the cooling channel which runs in the first level
• the coolant outlet of the distributor unit is fluidically preferably connected to the part of the cooling channel which runs in the second plane.
• an advantageous variant of the cooling device also provides that a cooling satellite and preferably each of the cooling satellites have at least one tubular supply line and one tubular Having derivation.
• the tubular supply line connects the coolant inlet of the cooling satellite with the cooling element in terms of flow.
• the tubular discharge connects the heat sink with the cooling satellite's coolant outlet in terms of flow technology.
• the cross-sectional area of the supply line through which the coolant can flow corresponds to the cross-sectional area of the discharge line through which the flow can flow and, in particular in the case of a serial connection or series connection of the cooling satellites, also the cross-sectional area of a cooling channel in the distribution unit that can be flowed through, so that a allows even volume flow of the coolant becomes. Accordingly, the supply line and the discharge line are traversed by the coolant, so that the supply line and the discharge line each determine a section of the coolant path.
• the cooling Sateilit is connected through the supply line and the discharge line with the distribution unit and fixed to it. In addition, the cooling satellite is also held in the predetermined position with respect to the distribution unit by the inlet and outlet.
• Both angular shapes and round shapes come into consideration as cross-sectional shapes for the supply line and the discharge line.
• the feed line and the discharge line are preferably formed at a distance from one another, a variant also being advantageous in which the feed line and discharge line are arranged coaxially to one another.
• the respective inner line can be connected to and / or integrally formed by the heat sink at the same time and the inner line thus serves as a cooling rib or cooling surface around which the coolant flowing through the outer line flows. It is advantageous if the outer line extends into a first level of the distribution unit and the inner line extends into a second level of the distribution unit, which is arranged behind the first level as seen from the cooling satellite.
• the feed line and / or the discharge line has a width or a diameter which corresponds to the width or the diameter of the cooling channel in the distributor unit, so that the cooling channel in the distributor unit passes through Pushing the supply line or the discharge line into the cooling channel is sealed and the coolant must flow through an opening provided in the supply line or the discharge line.
• a preferably lateral opening is provided for the feed line and / or the discharge line in the section with which the feed line or discharge line extends into the distributor unit, through which the coolant flows into or out of the feed line from the cooling channel of the distributor unit the discharge can flow into the cooling channel of the distribution unit.
• An advantageous embodiment variant of the cooling device provides that the at least one cooling satellite forms a cavity adjacent to the cooling body, which cavity defines a section of the coolant path and through which the coolant can flow.
• the at least one cooling satellite also has cooling fins connected to the cooling body in the cavity.
• cooling fins extend into the supply line and / or the discharge line so that the coolant already flows around the cooling fins in the supply line or the discharge line.
• cooling satellites can also be designed differently with regard to the length of the section of the coolant path which is determined by the cooling satellites. If, for example, an electronic component is to be cooled by a first cooling satellite which requires more cooling compared to another electronic component provided on the circuit board, the cooling element of the first cooling satellite can be designed with a larger area and that along the cooling element leading section of the coolant path can be made longer, so that more heat can be absorbed and dissipated by the coolant flowing through the first cooling satellite.
• a cooling capacity adapted to the respective component to be cooled can also be achieved by locally varying the flow rate of the coolant on the component and the resulting flow effects.
• the respective cooling satellites are also adapted to the respective electronic component and have, for example, inlet and outlet lines of different lengths, so that the cooling satellites can adjoin the electronic components as intended, despite the different dimensions of the electronic components.
• a respective cooling satellite In order to attach a respective cooling satellite to the respective electronic component, it can also be provided that the respective cooling satellite is pressed onto the electronic component by fixing the distributor plate with respect to the circuit board or by connecting elements of the distributor plate for fixing to the circuit board.
• a mounting base can also be provided on at least one part of the cooling satellites, so that the respective cooling satellites can be fixed directly to the circuit board and pressed onto the respective electronic component.
• connecting elements for fixing the distribution unit on the board are provided on the distribution unit.
• the connecting elements have a predetermined position with respect to the at least one cooling satellite, so that by arranging the distributor unit on the board with the connecting elements, the cooling satellites can be arranged on the respective associated components to be cooled. Accordingly, the distribution unit can be arranged in a predetermined position with respect to the circuit board and the cooling satellites in a predetermined position with respect to or on the electronic components.
• the cooling device can have a housing or a frame which is designed to accommodate the distributor unit and the cooling satellites as well as the circuit board.
• the hous se can be designed to accommodate the circuit board.
• the housing can be opened on one side, wherein the circuit board can be inserted into the opening and thereby forms a cover that closes the open cavity of the housing.
• the housing can also form the connecting elements integrally and thereby determine the predetermined position or the holding of the predetermined position of the distributor unit in relation to the circuit board.
• Another aspect of the invention also relates to a system with an invented proper cooling device and a circuit board with electronic components which are arranged thereon and which emit heat. It is provided that the distribution unit of the cooling device has a predetermined position compared to the circuit board and the at least one cooling satellite is in contact with its heat sink with at least one of the electronic components.
• the heat sink can be in direct contact with the electronic component, whereby it can also be provided that the heat sink is indirectly contacted with the electronic component via a heat conduction means, for example a heat conduction pad or a heat conduction paste.
• a heat conduction means for example a heat conduction pad or a heat conduction paste.
• the distribution unit is designed as a flat distribution plate and is arranged in parallel at a predetermined distance from the board and the at least one cooling satellite is arranged between the board and the distribution plate, where a Supply line and a discharge line of the cooling satellite extend orthogonally to the board to the distribution plate.
• the distribution unit is designed in the shape of a frame.
• the distributor unit runs around the circuit board and / or the electronic components arranged on it at least in sections or flanks them, with planes or sections of the distributor unit preferably facing each other and the cooling satellites being arranged between these sections or planes and these Connect fluidically with each other.
• an embodiment of the system is advantageous in which the system provides a housing and the circuit board and / or the distributor unit integrally form a section of the housing.
• the electronic components and the cooling satellites are arranged in an interior space formed by the housing.
• the distributor unit has a cooling surface which integrally has an inner surface facing the interior of the Forms housing, so that heat given off by the electronic components can be at least partially absorbed by the cooling surface and removed via the distributor unit or the coolant flowing through it.
• the housing has ventilation openings through which the interior space opens to the outside and air can flow through the interior space, for example, so that in addition to liquid cooling, air cooling can also be implemented at the same time.
• a method for producing the cooling device can also be named as a further aspect.
• a uniform distributor unit is provided for a large number of circuit boards. Then, depending on the position of the electronic components to be cooled on the board, openings are made in the distribution unit, into which the supply lines and the leads of the cooling satellites are then inserted, the leads and the leads being designed in such a way that the heat sinks of the respective cooling -Satellites contact the respective electronic components and at the same time the distribution unit is in the predetermined position with respect to the board.
• FIG. 1 shows a first variant of a cooling device or a system comprising a cooling device and a circuit board
• FIG. 2 shows a second variant of a cooling device or a system comprising a cooling device and a circuit board
• FIG. 3 shows a third variant of a cooling device
• FIG. 5 shows a fifth variant of a cooling device in a first view
• FIG. 6 shows the fifth variant of a cooling device in a second view
• FIG. 12 shows a schematic diagram of a first two-level variant of a cooling device
• FIG. 13 shows a sixth variant of a cooling device
• FIG. 14 shows a schematic diagram of a second variant of a cooling device having two levels
• FIGS. 1 and 2 a variant of a cooling device 1 is shown together with a circuit board 2, the electronic components 3 with the Cooling satellites 20 of the cooling device 1 are contacted and can be cooled thereby.
• the cooling device 1 in FIGS. 1 and 2 together with the respective circuit board 2 therefore at the same time corresponds to a system V comprising the cooling device 1 and the circuit board 2.
• the circuit board provided as an example in FIGS. 1 and 2 each has three electronic components 3 to be cooled, Deviating from this, electronic components 3 to be cooled to a greater or lesser extent can also be provided.
• the cooling device 1 is in each case adapted to the circuit board and has, for example, cooling satellites 20 in a corresponding arrangement corresponding to the number of electronic components 3 to be cooled.
• further electronic components can also be provided on the circuit board, which are not or should not be cooled directly by the cooling satellites 20 of the cooling device 1.
• a distributor unit 10 with two levels 101, 102 is provided in each case.
• the two levels 101, 102 of the distribution unit 10 are fluidically separated or connected exclusively via the three cooling satellites 20 each, which are arranged fluidically parallel between the levels 101, 102.
• the coolant is guided along a coolant path (not shown in FIGS. 1 and 2) to the three cooling satellites 20, through which it flows to the second level 102 of the distributor unit 10 and is passed to the coolant outlet 12 of the distributor unit 10.
• the coolant absorbs heat which was given off by the electronic components 3 to the respective adjacent cooling satellites 20, and transported this off.
• the frame-shaped distribution units 10 of the variants shown in Figures 1 and 2 each form one or more cooling surfaces 13 running orthogonally to the board 2, which additionally absorb heat given off by the components of the board 2 and transfer it to the coolant, so that the components that are not cooled directly by means of the cooling satellites 20 can be cooled.
• the cooling satellites 20 used in the variant according to FIG. 2 are explained in more detail in the description associated with FIG. 11.
• the cooling satellites 20 of the variant according to FIG. 1 basically have an identical structure, but are flatter, with the supply line 24 and discharge line 25 of the respective cooling satellite 20 running directly adjacent to the board 2 in the variant in FIG.
• FIGS. 3 and 4 A further embodiment of the cooling device 1 is disclosed in each of FIGS. 3 and 4, in which a distributor unit 10 is provided with only one level.
• the respective distribution unit 10 is arranged parallel to the circuit board (not shown), so that the cooling satellite 20 or the cooling satellites 20 are arranged between the circuit board and the distribution unit 10.
• a flat distribution unit 10 or distribution plate is provided, on which a single cooling satellite 20 is arranged. This is formed in one piece and integrally with the distributor unit 10.
• openings or free spaces 15 are provided in the distributor unit 10 to save material and weight.
• a cooling channel (not shown) is formed in each case, which determines the coolant path through the distribution unit 10 and the cooling satellites 20.
• the cooling channel can be designed in one piece or in several parts and connect existing cooling satellites 20 in parallel or in series with respect to the coolant inlet 11 of the distributor unit 10 and the coolant outlet 12 of the distributor unit 10.
• Figures 5 and 6 show a further advantageous variant of a cooling device 1 in a view obliquely from below, so that the cooling satellites 20, 20 'provided on the distribution unit 10 and the cooling surface 13 facing the electronic components 3 of a circuit board 2 (not shown) Distribution unit 10 are visible.
• the distributor unit 10 is also designed as a flat distributor plate with a single level in which the coolant is guided through a cooling channel 14, as shown in FIG. 6, from the coolant inlet 11 of the distributor unit 10 to the coolant outlet 12 of the distributor unit 10 .
• the cooling satellites 20, 20 ' are fluidically arranged in series with one another, so that the cooling duct 14 is divided into several sections or parts by the supply lines 24 and discharge lines 25 of the two cooling satellites 20, 20'.
• a first part 141 of the cooling channel 14 leads from the coolant inlet 11 of the distribution unit 10 to the coolant inlet 21 of a first cooling satellite 20, a third part 143 of the cooling channel 14 leads from the coolant outlet 22 of the first cooling satellite 20 to the coolant inlet 21 of a
• the second cooling satellite 20 'and a second part 142 of the cooling channel 14 lead from the coolant outlet 22 of the second cooling satellite 20 to the coolant outlet 12 of the distributor unit 10.
• the individual parts 141, 142, 143 of the cooling channel 14 or the entire cooling channel 14 runs in a meandering manner in the distributor unit 10, so that the entire cooling surface 13 of the distributor unit is cooled by the coolant flowing through the cooling channel 14 and the heat is dissipated.
• the cooling channel 14 in the distributor unit 10, as shown in FIG. 6, can be formed, for example, in that the cooling channel 14 is formed in the distributor plate from a solid material by milling and the as a result, as shown in FIG. 6, the open top is closed by a cover.
• two different cooling satellites 20, 20 ′ are provided, which essentially differ only in the shape of their supply line 24 and their discharge line 25.
• two identical cooling satellites 20, 20 ' can also be provided.
• the supply line 24 and the discharge line 25 each have a rectangular cross-section through which a flow can flow or are provided as rectangular tubes.
• the second variant of the cooling satellite 20 ‘provides a round cross-section through which a flow can flow for the supply line 24 and the discharge line 25 or provides a round tube for each of them.
• the width or the diameter of the supply line 24 and the discharge line 25 are equal to the width of the cooling channel 14, so that the cooling channel 14 is pushed in or introduced the supply line 24 and the discharge line 25 of the cooling satellites 20, 20 'is closed and the coolant must flow through the coolant inlets 21 and coolant outlets 22 of the cooling satellites 20, 20' or through the cooling satellites 20, 20 '.
• FIGS. 7 and 8, FIG. 8 showing a schematic cross section through the cooling satellite 20.
• a rectangular tube is seen for the supply line 24 and the discharge line 25, each of which extends from a base body 28 to the coolant inlet 21 or the coolant outlet 22 of the cooling satellite 20.
• a flea space 26 is defined which adjoins the cooling body 23, the cooling body 23 preferably being formed from a material that is particularly good at conducting heat, such as copper.
• the heat sink 23 is formed with its side facing away from the hollow space 26 directly or via a heat conduction means with a Electronic component 3 of the board 2 to be contacted.
• the coolant path P or the section of the coolant path P running in the cooling satellite 20 leads from the coolant inlet 21 through the supply line 24 into the cavity 26 and from the cavity 26 through the discharge line 25 to the coolant outlet 22 of the cooling satellite 20
• the coolant path P runs in the cavity 26 adjacent to the cooling body 23.
• the coolant path P can run in a meandering shape in the cavity, the cavity 26 being designed accordingly for this or having guide elements defining the coolant path P.
• FIGS. 9 and 10 A modification of the variant of the cooling satellite 20 from FIGS. 7 and 8 is disclosed in FIGS. 9 and 10.
• cooling fins 27 are provided which are fixed to the cooling body 23 or are formed integrally with it.
• the cooling fins 27 are made of a material such as copper, which conducts heat well. In the embodiment shown, it is provided that the cooling fins 27 extend into the supply line 24 and the discharge line 25 of the cooling satellite 20 and essentially as far as the coolant inlet 21 or the coolant outlet 22 of the cooling satellite 20. Heat, which is transferred to the heat sink 23, can therefore be transferred to the coolant or dispensed via the cooling fins 27 over a larger area and along a longer section of the coolant path P and thus transported away more effectively.
• the variant of the cooling satellite 20 shown in FIG. 11 is preferably used in an embodiment of the cooling device 1 in which, as in FIG. 2, two separate levels 101, 102 of the distribution unit 10 are fluidically connected to one another by one or more cooling satellites 20 should be.
• the cooling satellite 20 in FIG. 11 also essentially comprises a base body 28 which is connected to a cooling body 23 (not shown) and in its interior a flat if not shown cavity 26 is determined.
• the cavity 26 is connected to the coolant inlet 21 of the cooling satellite 20 through the here round and tubular feed line 24 and through the here round and tubular outlet 25 to the coolant outlet 22, wherein the section of the coolant path running in the base body can be designed in a meandering manner, as is also indicated in FIG.
• the distributor unit 10 is divided into a first level 101 and a second level 102, the principle illustration corresponding to FIG corresponds to FIGS. 1 and 2.
• a distribution unit 10 which has a first level 101 and a level 102 directly adjoining it.
• the first level 101 corresponds to a distributor for cold coolant, in which the coolant is guided from the coolant inlet of the distributor unit to all coolant inlets 21 of the cooling satellites 20.
• the coolant flows via the cooling satellite 20 into the second level 102 and is heated in the cooling satellite 20 in the process.
• the coolant of all cooling satellites 20 is collected and led to the coolant outlet of the distribution unit.
• the coolant path P is therefore divided into several sections P1, P2, P3.
• the coolant is supplied to all cooling satellites 20 via the first section P1 of the coolant path.
• a second section P2 of the coolant path each runs through a cooling satellite 20.
• a third section P3 of the coolant path determines the path of the coolant in the second level 102 and leads from the coolant outlets 22 of the cooling satellites 20 to the coolant outlet 12 of the distribution unit 10 or the second level 102.
• FIG. 12 corresponds to the variant in FIG 13, in which it is visible that a section of the supply line 24 extends through a second level 102 into a first level 101 of the distribution unit 10 and a section of the discharge line 25 extends only into the second level 102, but not into the first level 101 extends.
• the planes 101, 102 of the distribution unit 10 are not designed to be completely congruent, but each define sections in which the planes 101, 102 directly adjoin one another.
• the distributor unit 10 or the levels 101, 102 also determine free spaces 15 in order to save material and weight. It is advantageous here that sections can also be provided in which only one of the levels 101, 102 is present.
• FIG. 14 shows a variant of the cooling device 1 or of the system V, in which the distributor unit 10 is formed from two planes 101, 102 spaced apart from one another.
• the levels 101, 102 are fluidically connected by the cooling satellites 20, the cooling liquid or the coolant being distributed from the coolant inlet 11 in the first level 11 along the section P1 of the coolant path P to all cooling satellites 20, which Coolant flows along the respective section P2 of the coolant path P through the cooling satellites 20 and thereby absorbs heat and the coolant is collected along the section P3 of the coolant path in the second level 102 and conducted to the coolant outlet 12 of the distribution unit 10.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• Thermal Sciences (AREA)
• Cooling Or The Like Of Electrical Apparatus (AREA)
• Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=72470349

Family Applications (1)

Country Status (6)

Family Cites Families (11)

• 2019
  • 2019-12-19 DE DE102019135101.4A patent/DE102019135101A1/de active Pending
• 2020
  • 2020-09-07 EP EP20771243.1A patent/EP4052549A1/de active Pending
  • 2020-09-07 WO PCT/EP2020/074952 patent/WO2021121688A1/de unknown
  • 2020-09-07 JP JP2022538210A patent/JP2023507205A/ja active Pending
  • 2020-09-07 KR KR1020227024111A patent/KR20220118474A/ko active Search and Examination
  • 2020-09-07 CN CN202080087578.9A patent/CN114902822A/zh active Pending

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