EP3947580A4 - Additives to improve particle dispersion for cmp slurry - Google Patents
Additives to improve particle dispersion for cmp slurry Download PDFInfo
- Publication number
- EP3947580A4 EP3947580A4 EP20780026.9A EP20780026A EP3947580A4 EP 3947580 A4 EP3947580 A4 EP 3947580A4 EP 20780026 A EP20780026 A EP 20780026A EP 3947580 A4 EP3947580 A4 EP 3947580A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- additives
- particle dispersion
- cmp slurry
- improve particle
- improve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000654 additive Substances 0.000 title 1
- 239000006185 dispersion Substances 0.000 title 1
- 239000002245 particle Substances 0.000 title 1
- 239000002002 slurry Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Composite Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962823258P | 2019-03-25 | 2019-03-25 | |
PCT/US2020/024131 WO2020198102A1 (en) | 2019-03-25 | 2020-03-23 | Additives to improve particle dispersion for cmp slurry |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3947580A1 EP3947580A1 (en) | 2022-02-09 |
EP3947580A4 true EP3947580A4 (en) | 2022-12-14 |
Family
ID=72606682
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP20780026.9A Pending EP3947580A4 (en) | 2019-03-25 | 2020-03-23 | Additives to improve particle dispersion for cmp slurry |
Country Status (6)
Country | Link |
---|---|
US (1) | US20200308451A1 (en) |
EP (1) | EP3947580A4 (en) |
JP (1) | JP2022527089A (en) |
KR (1) | KR20210132204A (en) |
CN (1) | CN113661219A (en) |
WO (1) | WO2020198102A1 (en) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003068882A1 (en) * | 2002-02-11 | 2003-08-21 | Ekc Technology, Inc. | Free radical-forming activator attached to solid and used to enhance cmp formulations |
US20040192049A1 (en) * | 2002-03-04 | 2004-09-30 | Koji Ohno | Polishing composition and method for forming wiring structure using the same |
WO2007056002A1 (en) * | 2005-11-02 | 2007-05-18 | Dupont Air Products Nanomaterials Llc | Free radical-forming activator attached to solid and used to enhance cmp formulations |
US20080171441A1 (en) * | 2005-06-28 | 2008-07-17 | Asahi Glass Co., Ltd. | Polishing compound and method for producing semiconductor integrated circuit device |
EP2139029A1 (en) * | 2007-04-17 | 2009-12-30 | Asahi Glass Company, Limited | Polishing agent composition and method for manufacturing semiconductor integrated circuit device |
WO2011152356A1 (en) * | 2010-06-03 | 2011-12-08 | 旭硝子株式会社 | Polishing agent and polishing method |
EP2922085A1 (en) * | 2012-11-15 | 2015-09-23 | Fujimi Incorporated | Polishing composition |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3619459A (en) * | 1968-06-11 | 1971-11-09 | Dow Chemical Co | Process for potting plasticized acetylated cellulose hollow fiber membranes |
JP2000160138A (en) * | 1998-12-01 | 2000-06-13 | Fujimi Inc | Grinding composition |
US6376584B1 (en) * | 1999-02-25 | 2002-04-23 | Ciba Specialty Chemicals Corporation | Hydroxy-substituted N-alkoxy hindered amines and compositions stabilized therewith |
US20040002559A1 (en) * | 2002-04-10 | 2004-01-01 | Malisa Troutman | Flame retardant coatings |
CA2517334A1 (en) * | 2003-02-26 | 2004-09-10 | Ciba Specialty Chemicals Holding Inc. | Water compatible sterically hindered alkoxyamines and hydroxy substituted alkoxyamines |
WO2007128672A1 (en) * | 2006-05-03 | 2007-11-15 | Ciba Holding Inc. | Substituted hexahydro-1,4-diazepin-5-ones and compositions stabilized therewith |
US8697576B2 (en) * | 2009-09-16 | 2014-04-15 | Cabot Microelectronics Corporation | Composition and method for polishing polysilicon |
US20120029222A1 (en) * | 2010-07-30 | 2012-02-02 | E. I. Du Pont De Nemours And Company | Surface-modified particles for polyester nanocomposites |
US9279067B2 (en) * | 2013-10-10 | 2016-03-08 | Cabot Microelectronics Corporation | Wet-process ceria compositions for polishing substrates, and methods related thereto |
JP2016124943A (en) * | 2014-12-26 | 2016-07-11 | ニッタ・ハース株式会社 | Polishing composition |
JP7010229B2 (en) * | 2016-09-21 | 2022-01-26 | 昭和電工マテリアルズ株式会社 | Slurry and polishing method |
CN108463562B (en) * | 2016-10-14 | 2022-05-03 | 日产化学工业株式会社 | Saccharification reaction liquid, saccharifying enzyme composition, method for producing sugar, and method for producing ethanol |
JP7210285B2 (en) * | 2016-12-28 | 2023-01-23 | 株式会社ニコン・エシロール | Composition for forming hard coat layer, spectacle lens |
-
2020
- 2020-03-23 WO PCT/US2020/024131 patent/WO2020198102A1/en unknown
- 2020-03-23 EP EP20780026.9A patent/EP3947580A4/en active Pending
- 2020-03-23 US US16/826,409 patent/US20200308451A1/en not_active Abandoned
- 2020-03-23 CN CN202080024505.5A patent/CN113661219A/en active Pending
- 2020-03-23 JP JP2021557597A patent/JP2022527089A/en active Pending
- 2020-03-23 KR KR1020217033901A patent/KR20210132204A/en active Search and Examination
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003068882A1 (en) * | 2002-02-11 | 2003-08-21 | Ekc Technology, Inc. | Free radical-forming activator attached to solid and used to enhance cmp formulations |
US20040192049A1 (en) * | 2002-03-04 | 2004-09-30 | Koji Ohno | Polishing composition and method for forming wiring structure using the same |
US20080171441A1 (en) * | 2005-06-28 | 2008-07-17 | Asahi Glass Co., Ltd. | Polishing compound and method for producing semiconductor integrated circuit device |
WO2007056002A1 (en) * | 2005-11-02 | 2007-05-18 | Dupont Air Products Nanomaterials Llc | Free radical-forming activator attached to solid and used to enhance cmp formulations |
EP2139029A1 (en) * | 2007-04-17 | 2009-12-30 | Asahi Glass Company, Limited | Polishing agent composition and method for manufacturing semiconductor integrated circuit device |
WO2011152356A1 (en) * | 2010-06-03 | 2011-12-08 | 旭硝子株式会社 | Polishing agent and polishing method |
EP2922085A1 (en) * | 2012-11-15 | 2015-09-23 | Fujimi Incorporated | Polishing composition |
Non-Patent Citations (1)
Title |
---|
See also references of WO2020198102A1 * |
Also Published As
Publication number | Publication date |
---|---|
TW202041627A (en) | 2020-11-16 |
EP3947580A1 (en) | 2022-02-09 |
WO2020198102A1 (en) | 2020-10-01 |
US20200308451A1 (en) | 2020-10-01 |
CN113661219A (en) | 2021-11-16 |
KR20210132204A (en) | 2021-11-03 |
JP2022527089A (en) | 2022-05-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
|
17P | Request for examination filed |
Effective date: 20211019 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
DAV | Request for validation of the european patent (deleted) | ||
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20221110 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: B24B 1/04 20060101ALI20221104BHEP Ipc: B24B 37/04 20120101ALI20221104BHEP Ipc: C09K 3/14 20060101ALI20221104BHEP Ipc: C09G 1/02 20060101AFI20221104BHEP |
|
RAP3 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: CMC MARERIALS LLC |
|
RAP3 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: CMC MATERIALS LLC |