EP3923320A4 - Cooling structure - Google Patents

Cooling structure Download PDF

Info

Publication number
EP3923320A4
EP3923320A4 EP20777960.4A EP20777960A EP3923320A4 EP 3923320 A4 EP3923320 A4 EP 3923320A4 EP 20777960 A EP20777960 A EP 20777960A EP 3923320 A4 EP3923320 A4 EP 3923320A4
Authority
EP
European Patent Office
Prior art keywords
cooling structure
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP20777960.4A
Other languages
German (de)
French (fr)
Other versions
EP3923320A1 (en
Inventor
Hiroaki SHOUDA
Takahiro Yamashita
Kazutake FUJISAWA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Showa Denko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Materials Co Ltd filed Critical Showa Denko Materials Co Ltd
Publication of EP3923320A1 publication Critical patent/EP3923320A1/en
Publication of EP3923320A4 publication Critical patent/EP3923320A4/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP20777960.4A 2019-03-22 2020-03-19 Cooling structure Pending EP3923320A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019055696 2019-03-22
PCT/JP2020/012487 WO2020196335A1 (en) 2019-03-22 2020-03-19 Cooling structure

Publications (2)

Publication Number Publication Date
EP3923320A1 EP3923320A1 (en) 2021-12-15
EP3923320A4 true EP3923320A4 (en) 2022-03-16

Family

ID=72611934

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20777960.4A Pending EP3923320A4 (en) 2019-03-22 2020-03-19 Cooling structure

Country Status (3)

Country Link
EP (1) EP3923320A4 (en)
JP (1) JP7164023B2 (en)
WO (1) WO2020196335A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6166937A (en) * 1998-06-02 2000-12-26 Hitachi Ltd. Inverter device with cooling arrangement therefor
US20040174651A1 (en) * 2001-02-15 2004-09-09 Integral Technologies, Inc. Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials
JP2012009498A (en) * 2010-06-22 2012-01-12 Fujitsu Ten Ltd Heat radiation structure of heating unit and audio amplifier equipped with heat radiation structure
WO2016210148A1 (en) * 2015-06-23 2016-12-29 Cubic Corporation Plastic chassis for liquid cooled electronic components
DE112017002572T5 (en) * 2016-05-17 2019-02-21 Autonetworks Technologies, Ltd. circuitry

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08204068A (en) * 1995-01-20 1996-08-09 Fuji Electric Co Ltd Semiconductor device of module structure
JP2003003248A (en) * 2001-06-25 2003-01-08 Sawaki Kogyo:Kk Sprayed metal layer coated sheet
JP5533350B2 (en) 2010-06-30 2014-06-25 株式会社デンソー Semiconductor device and manufacturing method thereof
CN206976318U (en) * 2014-11-21 2018-02-06 株式会社村田制作所 Module
JP2017161204A (en) * 2016-03-11 2017-09-14 富士通株式会社 Cooling device, manufacturing method of cooling device, and electronic device
JP6926883B2 (en) 2017-09-21 2021-08-25 Ｊｏｙｓｏｎ Ｓａｆｅｔｙ Ｓｙｓｔｅｍｓ Ｊａｐａｎ株式会社 Airbags and airbag devices
JP2018166400A (en) 2018-07-18 2018-10-25 三菱電機株式会社 Electric power conversion device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6166937A (en) * 1998-06-02 2000-12-26 Hitachi Ltd. Inverter device with cooling arrangement therefor
US20040174651A1 (en) * 2001-02-15 2004-09-09 Integral Technologies, Inc. Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials
JP2012009498A (en) * 2010-06-22 2012-01-12 Fujitsu Ten Ltd Heat radiation structure of heating unit and audio amplifier equipped with heat radiation structure
WO2016210148A1 (en) * 2015-06-23 2016-12-29 Cubic Corporation Plastic chassis for liquid cooled electronic components
DE112017002572T5 (en) * 2016-05-17 2019-02-21 Autonetworks Technologies, Ltd. circuitry

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2020196335A1 *

Also Published As

Publication number Publication date
WO2020196335A1 (en) 2020-10-01
JP7164023B2 (en) 2022-11-01
JPWO2020196335A1 (en) 2021-10-21
EP3923320A1 (en) 2021-12-15

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RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 23/373 20060101ALI20220209BHEP

Ipc: H01L 23/40 20060101ALI20220209BHEP

Ipc: H05K 7/20 20060101ALI20220209BHEP

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Effective date: 20220225

DAV Request for validation of the european patent (deleted)
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Owner name: RESONAC CORPORATION

RAP3 Party data changed (applicant data changed or rights of an application transferred)

Owner name: RESONAC CORPORATION