EP3765860A1 - Method for electrically connecting a test piece to an electrical test device - Google Patents
Method for electrically connecting a test piece to an electrical test deviceInfo
- Publication number
- EP3765860A1 EP3765860A1 EP19712725.1A EP19712725A EP3765860A1 EP 3765860 A1 EP3765860 A1 EP 3765860A1 EP 19712725 A EP19712725 A EP 19712725A EP 3765860 A1 EP3765860 A1 EP 3765860A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- contact
- probe card
- card according
- holding element
- guide plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 71
- 238000000034 method Methods 0.000 title description 9
- 239000000523 sample Substances 0.000 claims description 42
- 239000004020 conductor Substances 0.000 claims description 25
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 239000011521 glass Substances 0.000 claims description 12
- 239000000919 ceramic Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 125000006850 spacer group Chemical group 0.000 claims description 6
- 238000003780 insertion Methods 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 5
- 239000002347 wear-protection layer Substances 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 description 18
- 238000013461 design Methods 0.000 description 9
- 238000011161 development Methods 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 230000004323 axial length Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005201 scrubbing Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
Definitions
- the invention relates to a probe card for electrically connecting a test object to an electrical test device, comprising at least one holding element and a plurality of electrically conductive contact devices guided and / or carried by the holding element, wherein the holding element is for guiding and / or carrying the contact devices has a plurality of openings through which each one of the contact devices extends therethrough.
- test cards of the type mentioned are known from the prior art.
- the published patent application DE 10 2006 054 734 A1 discloses a test card, which is designed in particular as a vertical test card, and contact devices in the form of contact needles, in particular buckling needles, which are substantially perpendicular by two parallel and spaced apart guide plates, the Form holding elements for the contact devices, extend therethrough to contact one end of a test specimen electrically and the other end a test device.
- the electrical contacting takes place on both sides in particular by touch. If the electrical connection is made by the contact devices between the test object and the test device, this performs a test by applying a voltage or an electrical signal to the test object at the desired location and evaluating the electrical reaction of the test object.
- the invention has for its object to provide an improved probe card that allows increased functionality and improved handling of the probe card with low overhead.
- a probe card having the features of claim 1.
- This is characterized by the fact that the holding element is structured in three dimensions. Under a three-dimensional structuring of the holding element is to be understood that, in contrast to previous holding elements, which are structured two-dimensional, Structures are possible, which are possible in two-dimensionally structured holding elements only by the addition of additional elements. Due to the three-dimensional structure, the holding element is given a shape that has structures that extend in three dimensions, resulting in a body that does not arise solely from the projection of a two-dimensionally shaped base area.
- the holding element can be structured in such a way that it performs a plurality of functions, for example in relation to the guidance of the contact devices or stiffening means, by means of which the holding element acquires a higher rigidity.
- the holding element is a three-dimensionally structured glass, in particular quartz glass.
- the three-dimensional structuring of glass different production methods are already known.
- the use of glass provides a sturdy holding element which, thanks to its three-dimensional structure, also has the advantages mentioned above.
- particularly fine structures are possible, such as micro-openings or holes, which are on the one hand particularly small executable, and on the other allow a special shape, which increases the functionality of the probe card.
- the structuring is carried out in particular by means of fiber technology, whereby areas of the glass can be structured in a targeted manner by means of a fiber jet.
- the openings are wear-resistant, precise, with deviating from a circular shape contours and with clear contact surfaces for the contact devices produced by this structuring.
- the openings are formed by the three-dimensionally structured glass in particular such that the free contact tips of the contact devices, which are facing or can be assigned to the DUT, slidably mounted in the respective opening to the case of an axial load, so when touching the DUT, laterally to be moved. This so-called “scrubbing” causes the contact tips are moved over the contact points of the specimen, whereby they scratch into the contact points of the specimen and thereby establish a secure electrical contact. Due to the predeterminable shape of the openings, in particular their contour, a preferred direction for displacing the contact devices or the free contact tips can thus be precisely predefined.
- the holding element is a three-dimensionally structured ceramic element. This results in the same advantages, as already described above for the quartz glass. This differs only in the manufacturing process Ceramic element of the quartz glass, because here, if necessary, other process steps must be used to spend the ceramic element in the desired three-dimensional structure.
- the respective contact device is formed as a needle-shaped contact element, in particular as a buckling needle, or as a spring contact pin. This results in a simple and safe electrical contact with the device under test.
- the holding element is designed as a guide plate for the contact devices, wherein the openings are formed as microbores with a deviating from a cylinder course in the longitudinal direction.
- the microbores or microchannels thus differ from conventional guide openings in that, viewed in longitudinal section, they have a changing cross section. This makes it possible, for example, to selectively guide the above-described displacement of the contact tips on the side facing the test object in an axial direction of the contact devices in a desired direction.
- portions in the course of the microbore are possible, which allow a larger or smaller lateral clearance for the contact devices compared to other sections of the same microbore.
- a specific guidance of the contact devices can be achieved, which leads to a reduced wear in operation with sufficiently high freedom of movement, so that the test card reaches a high life or service life.
- At least one of the microbores has an opening entry which deviates in its shape from a ⁇ ffhungsaustritt the same microbore.
- the opening entry in its contour at least substantially corresponds to the contour of the male contact element, whereas the contour of the opening exit corresponds to that of a slot, so that the contact tip is displaceable in the direction of the oblong hole in order to perform the scrubbing.
- opening entrance and ⁇ ffhungsausstory may each be formed as a slot, but which are aligned in different directions.
- contours of ⁇ ffhungseintritt and ⁇ ffhungsaustritt can be reversed, so that, for example, the ⁇ ffhungsaustritt has a circular shape, while the ⁇ ffpur Vietnamesesseintritt has a slot shape.
- opening entrance and opening exit have a different size and / or a different contour.
- the cross-section of the microbore decreases in the direction of the outlet opening with the same cross-sectional shape, resulting in a centering guide of the contact element in the microbore or the opening, which in particular leaves the contact element so much game that it faces away from the DUT under axial load Side, in particular between two adjacent guide plates, can deflect laterally and forms a tilting bearing in the opening at the narrowest cross-sectional location.
- At least one microbore has an undercut in its longitudinal extension, in particular formed by a cross-sectional constriction or widening.
- the undercut results in the microbore in its longitudinal extent stages that can be used for example as an axial stop for the contact element.
- the steps can be used to selectively form guide sections in the microbore, which serve for the contact contacting and guiding the respective contact element, otherwise the contact element rests without contact in the microbore.
- At least one microbore in the region of the opening inlet and the outlet outlet each have a guide cross section for a contact element, and in an intermediate section, ie between the opening inlet and the outlet opening, a cross section which is larger than the respective guide cross section.
- the guide cross section is expediently adapted to a contour of the respective contact element in order to guide or hold this advantageously, the non-contacting section therebetween is wear-resistant for the contact element. On the one hand, this allows the contact element to move easily in the opening in the axial direction, and on the other hand results in an increased life due to the reduced wear.
- the ⁇ ffrangseintritt and / or the ⁇ ffhungsaustritt each have an insertion bevel or -rounding.
- the insertion or Ein 1500rundung facilitates insertion of the respective contact element in the respective Microbore, whereby both contact element and guide plate or retaining element are spared in particular during assembly. Wear is reduced and the durability of the test card increased.
- the probe card has a contact head having guide means for alignment with the test device and at least carrying a guide plate.
- the contact head thus serves for mounting and holding the one, preferably a plurality of guide plates, and has guide means for easy alignment and arrangement on the test device.
- the guide means are formed integrally with the contact head.
- the contact head, as well as the holding element, is particularly preferably made of three-dimensionally structured quartz glass or ceramic element, so that the advantages already mentioned above also result for the contact head.
- the contact head is formed integrally with the guide plate.
- the guide plate is particularly robust and resilient due to the integral design.
- the one-piece design reduces the number of individual parts of the test card and a test device having the test card, so that the assembly is simplified and component tolerances and / or manufacturing tolerances are reduced.
- the handling of the contact head is simplified.
- the contact head carries at least one further guide plate, which is insofar separately formed to the contact head, which in particular identifies a different thermal expansion from the contact head, in order to achieve improved cooperation, in particular with the test device.
- the material of the further guide plate is selected corresponding to that of the test device and / or the contact distance conversion device.
- the contact head has at least one spacer between the guide plates, through which the guide plates thus form fit are kept at a distance from each other.
- a clearance is created, in particular between the guide plates, in which the contact devices designed in particular as articulated needles can buckle under axial load.
- the contact head is formed, in particular by at least one check-side-side bevel, such that it does not protrude beyond the check-side-side guide plate.
- the guide plate has at least one integral stiffening rib. Due to the three-dimensional structure, the stiffening rib can be easily formed on the guide plate. Due to the integral design, the stiffening rib supports the guide plate with little additional assembly or manufacturing effort and due to the one-piece design with only a slight increase in weight. The increased rigidity of the guide plate is achieved that it is not or only slightly deformed at an axial load, so that the main burden is absorbed by the contact devices and in particular their elastic deformation.
- a plurality of microbores deviate from a vertical alignment, in particular of their longitudinal center axis, to the guide plate plane, in particular in such a way that the opening outlets that can be assigned to the test object lie closer to one another than the opening entries that can be assigned to the test device. It is thereby achieved that the contact tips of the contact devices are brought together more densely on the side facing the specimen, whereby smaller educafraster on the specimen can be realized.
- the holding element with the contact devices forms a Maisabstandumsetz noticed the probe card.
- the contact devices are designed as electrical conductors in the form of wires, coatings, plated-through holes or openings filled with electrical material of the retaining element.
- the conductors run from one surface to the other of the holding element such that they change the distance adjacent conductor ends, each forming a contact point from one surface to the other surface, in particular zoom in or out, so that in particular closely close to each other closely near test points contact lead apart contact points on the side facing away from the DUT side of the support member.
- the contact spacing conversion device has an embodiment as described below for a separate contact spacing conversion device which is provided in addition to the retaining element.
- the probe card in addition to the holding element with the contact device on at least one Maisabstandumsetz founded having an electrically non-conductive plate having a test-side first surface and a tester side second surface, wherein distributed on both surfaces each having a plurality of electrically conductive contact points are arranged, and wherein the contact points on the first surface are arranged closer to each other than on the second surface, and with the plate respectively passing electrical conductors, each electrically connect a pad on the first surface with a contact point on the second surface.
- the Kunststoffabstandumsetz also called Space Trans former, thus leading to an unbundling or broadening of the contact points of the first surface to the second surface.
- the grid of pads on the first surface is smaller than that on the second surface. This ensures that in particular the test device is easily electrically connected to the contact devices of the probe card.
- the contact points on the second surface can be electrically contacted with the test device by means of bonding connections, electrically conductive spring elements, in particular spring interposers, or spring contact pins. In principle, other electrical connections are conceivable.
- the electrical conductors connect a contact point located on the first surface to a contact point located on the second surface, so that the electrical path to the contact devices is ensured.
- the contact spacing conversion device is preferably also produced by a three-dimensionally structured quartz glass and / or a ceramic element, as already mentioned above. As a result, the contact spacing conversion device can be manufactured individually and precisely.
- the conductors are arranged in the plate passing through channels.
- the channels are preferably made in the manner of the aforementioned micro-bores, resulting in the above-mentioned advantages in terms of the variable design of the channels.
- the conductors are passed through the plate in an advantageous manner, wherein the channels may be aligned, for example, obliquely to the plane of the plate, or may have contact-free areas and guide cross-sections.
- At least one of the channels has a channel cross-section tapering towards the first surface.
- a particularly dense rastering of the contact points on the first surface is ensured because adjacent conductors or channels do not overlap and can be brought closer together in the direction of the first surface.
- several of the channels have a tapering to the first surface channel cross-section.
- the conductors are formed as a coating or as a filling in the channels.
- the conductors are formed as electrically conductive coatings on the inside of the channels, so that in particular a passageway remains through which, for example, a gas flow can take place or an additional contact element can be guided.
- the conductors are formed as fillings in the channels, so that a conductor in particular completely fills the respective channel. As a result, the electrical resistance of the respective conductor is reduced, so that this variant is particularly advantageous in applications with high electrical currents.
- the plate or the contact spacing conversion device has both channels with a filling as a conductor and channels with a coating as a conductor.
- At least two of the channels are brought together in the direction of one of the surfaces of the plate.
- the conductors located in the channels are thereby also brought together electrically. This results in a bundling of signals and / or a division of the current signals to a plurality of contact points, whereby the test of the test object can be further individualized and optimized.
- the plate of the contact distance conversion device is formed integrally with the at least one holding element and / or with the contact head.
- the three-dimensionally structured glass preferably has an electrically nonconductive wear protection layer, which reduces the wear of both the test card and the respective contact element.
- the wear protection layer has a diamond-like carbon, by which a particularly high scratch resistance of the holding element, the plate and / or the contact head is achieved, or ceramic material or silicon nitride.
- the invention relates to a method for producing a probe card, in particular as described above, wherein at least one holding element and a plurality of electrically conductive and guided by the holding member and / or portable contact devices are provided, wherein the holding member for guiding and / or carrying the contact devices is provided with a plurality of openings, in each of which one of the contact devices is inserted.
- the method according to the invention is characterized in that the holding element is structured in three dimensions or produced by a three-dimensional structuring method.
- the holding element is produced by a three-dimensional structured of a glass, in particular quartz glass or ceramic element.
- the quartz glass is patterned by laser processing and the glass modified by laser processing is removed in a subsequent chemical etching bath in order to obtain the desired shape.
- FIG. 1 shows a test device with an advantageous test card in a simplified sectional view
- FIGS. 2A and 2B show a first exemplary embodiment of the test card in a detailed view
- FIG. 3 shows a second embodiment of the probe card in a detail view
- FIGS. 4A and 4B show a third exemplary embodiment of the test card in a detailed view
- Figure 5 shows an advantageous contact head of the test device in a simplified
- FIG. 6 shows an advantageous contact distance conversion device of the test device in a simplified sectional view.
- FIG. 1 shows, in a simplified representation, a test card 1 for electrically contacting a test object 2.
- the test card 1 can be arranged between the test object 2 and a test device 3 and can be electrically connected to both by contact-contacting.
- the probe card 1 has two holding elements 4 and 5, which are formed as upper guide plate 6 and lower guide plate 7 and each having a plurality of openings 8, wherein at least some of the openings 8 each have a contact element 9 extends.
- the contact devices 9 are designed as contact needles, in particular as articulated needles, at both ends
- Each contact needle 9 extends through an opening 8 of both guide plates 6, 7.
- the guide plates 6, 7 are held on a contact head 11, which optionally a contact spacing conversion device 12 (Space Transformer) is assigned, which the tester 3 facing contact points 13 on a first top 14 and the contact pins 9 facing second contact points 15 on a second top 16 ,
- the contact points 13 are on the upper side 14 further apart than the Contact points 15 on the top 16 and connected to one of the contact points 15, so that on the top 16 a higher contact point density than on the top 14.
- the distances of adjacent electrical contact points are enlarged or unbalanced by the Kunststoffabstandumsetz worn 12 in the direction of the test device 3 out so that a simple and secure contact contacting of the individual contact needles is possible.
- the arrangement and number of contact points 15 on the contact devices 9 facing top 16 corresponds for example to the number and arrangement of the contact devices 9, so that each contact element 9 can be brought into contact with one of the contact points 15.
- the contact points 13 of the contact spacing conversion device 12 are electrically connected to a printed circuit board 43 having a plurality of electrical contact strips 42, the printed circuit board 43 being part of the test device 3 or the test card 1, as shown in FIG. 1 in the present exemplary embodiment.
- the contact tracks 42 of the printed circuit board 43 are then contacted electrically in accordance with contact terminals of the test device 3, such as spring contact pins.
- an interposer 44 for electrically connecting the contact points 13 with the electrical strip conductors / contact strips 42 of the printed circuit board 43 is arranged between the printed circuit board 43 and the contact spacing conversion device 12 or the test card 1.
- the contact needles are mounted in particular axially displaceable in the guide plates 6, 7, so that the touch contact is automatically made when the contact head 11 is placed on the totality of the test piece 2.
- the holding elements 4, 5 and the guide plates 6, 7 are made according to the present embodiment of three-dimensionally structured glass, in particular quartz glass, wherein in particular the openings 8 have a three-dimensional structure.
- All openings 8 are in particular formed as microbores 17, which deviate in the direction of their longitudinal extension of the shape of a cylinder, so for example have undercuts, bevels or the like.
- FIGS. 2A and 2B show a detailed view of the guide plate 7 according to the dashed circle A from FIG. 1.
- FIG. 2A shows a sectional view of the guide plate 7 and FIG. 2B shows a plan view of the guide plate 7.
- the opening 8 shown is, as already mentioned above, designed as a three-dimensionally structured microbore 17 which has a changing cross section in the longitudinal extent of the opening 8.
- the opening 8 has a ⁇ ffrangseintritt 18 and a ⁇ ffhungsaustritt 19, wherein according to the present embodiment, the opening outlet 19 of the DUT 2 and the opening entrance 18 of the guide plate 6 is assigned.
- the opening 8 thus extends channel-shaped from the opening inlet 18 to the ⁇ ffhungsaustritt 19, wherein the cross-section of the microbore 17 tapers in the direction of ⁇ ffhungsauseries 19 out. It is also provided that the ⁇ ffhungseintritt 18 has the contour of a slot 20, while the ⁇ ffhungsaustritt 19, the contour of a conventional circular bore 21.
- the opening 8 goes from a Langlochöffhung in a Kreislochöffhung over. This results in particular a forced operation for the plugged into the opening 8 contact element 9, which can move according to the slot 20 in only one direction transverse to its axial extent.
- all contact devices 9, in particular buckling needles a preferential movement direction can be predetermined, which prevents that can come into contact with each other under heavy load adjacent contact needles.
- the particular shape of the bore 8 or microbore 17 is produced in particular by an etching method or laser cutting method or 3D lithography method.
- Figure 3 shows a second embodiment of the guide plate 7 in a further sectional view in the region A of Figure 1.
- the bore 8 is formed as a micro-bore 17 symmetrically in its longitudinal extent.
- the micro-bore 17 in the region of the ⁇ ffhungsaustritts 19 and the opening inlet 18 each have a narrowed guide cross section 22 and 23, which serves to guide the inserted contact element 9.
- the micro bore 17 has an enlarged cross section 24, in which the contact element 9 in particular non-contact in the Guide plate 7 rests. As a result, the wear between the contact element 9 and guide plate 7 is reduced while still ensuring a secure guidance.
- ⁇ ffhungseinbaum 18 and / or ⁇ ffhungsaustritt 19 also insertion bevels (opening outlet 19) or Ein Industriesrundungen 26 (opening entrance 18), which further reduce wear and ensure easy installation.
- Figures 4A and 4B show a further embodiment of the design of the openings 8.
- the microbores 17 are formed such that both ⁇ ffrangseintritt 18 and ⁇ ffhungsaustritt 19 have the contour of a rectangle 27, wherein the rectangles 27 are rotated by 90 ° to each other , as can be seen in particular in the plan view of Figure 4B. This also results in an advantageous guidance of the respective contact element 9 in the opening eighth
- FIG. 5 shows in a further sectional illustration an advantageous embodiment of the contact head 11.
- the contact head 11 is formed integrally with the guide plate 7 and has a bearing surface 28 for the guide plate 6.
- the support surface 28 is formed as a step-shaped depression on the contact head 11.
- the guide plate 6 is aligned by a centering on the contact head 11.
- the contact head 11 and the guide plate 6 on suitable guide elements for centering the guide plate 6 on the contact head 11.
- the guide plate 6 is guided at its outer periphery by the contact head 11 in the stepped recess and directed.
- a simple assembly of the contact head 11 is ensured overall.
- the guide plate 7 of three-dimensionally structured quartz glass and the rest of the contact head 11 is made of the same material and in the same way, whereby the desired shapes can be produced in a simple and reliable manner.
- the contact head 11 and / or one of the guide plates 7, 6 has integrated guide elements 29, which in particular allow guidance and alignment of the contact head 11 and / or guide plate 6, 7, in particular on the contact distance changing device 12 and / or the test object 2.
- the guide means 29 of the contact head 11 are formed as guide webs, which allow a simple alignment and arrangement on the test device 3.
- the step-shaped depression with the Support surface 28 also provides a guide means, in this case, however, for the guide plate 6, is.
- the contact head 11 and / or one of the guide plates 6, 7 also stiffening ribs 30 which increase the robustness of the contact head 11 and thus the robustness and rigidity of the probe card 1 in a simple manner.
- one of the guide plates 6, 7 preferably has integrated or integrally formed spacers 31, which in particular determine the distance between the two guide plates 6, 7.
- the spacers 31 extend for example in one piece from the guide plate 7 in the direction of the guide plate 6, so that the guide plate 6 comes to rest on the spacer 31 and the support surface 28, whereby the guide plate 6 is held particularly stiff and robust in the contact head 11 ,
- the contact head 11 has both the guide means 29 for guiding the contact head 11 itself, as well as the guide plate 6, as well as the guide means for guiding the contact devices 9, namely in the form of openings 8, on.
- Contact head 11, guide means 29, guide plates 6, 7, stiffening ribs 30 and spacers 31 may be integrally formed in pairs or in larger groups. Some of these elements can also be manufactured conventionally.
- the contact head 11 has stiffening and force-absorbing elements, in particular analogous to Maisabstandsumsetzem.
- the contact head 11 also preferably at its end facing the specimen 2 adjacent to the guide plate 7 lying slopes 34, so that the guide plate 7 is the most projecting part of the contact head 11, and by the slopes 34 a collision with the specimen is safely avoided ,
- FIG. 6 shows an advantageous exemplary embodiment of the contact spacing conversion device 12, which has a plate 38 which, like the guide plates 6, 7, is made of three-dimensionally structured quartz glass and has a plurality of channels 39 which run obliquely to the plate plane or examination plane.
- pass the channels 39 which like the Micro holes 17 are made, such that the channel inlets 40 on the side facing the tester 3 side are further apart than the channel outlets 41 on the guide plate 6 facing side.
- the course of the channels 39 is not necessarily straight, but rather evasive channel-shaped designed such that an overlapping or crossing of channels 39 is prevented.
- FIG. 6 shows the overlap-free overlapping of two adjacent micro-bores at a point 32, which is identified by an arrow in FIG.
- At least two channels 39 can be brought together by the guidance of the channels 39, so that an assembly and / or unbundling of electrical connections takes place or at least is possible.
- the channels 39 are coated with an electrically conductive material on their upper side, so that they have an electrical conductor 33, which is formed as a coating 33.
- the conductor connects one of the contact points 13 on the upper side 14 facing the test device 3 to one of the contact points 15 on the surface 16 facing the test piece 2 or the guide plate 6.
- the channels 39 are completely filled with electrically conductive material 36.
- This also makes the electrical contact in a simple manner.
- the latter variant has the advantage that the contact points 13,15, which are formed in particular as a contact plate, each cover channel entrance 40 and channel exit 41 and thereby a particularly close screening of the respective page is possible.
- these also have a changing cross-section, and in particular decrease in width in the direction of the channel exits 41, so that the channel exits 41 rest particularly closely against one another and provide a particularly close rastering on the specimen 2 Side have.
- the contact spacing transformer or the contact spacing conversion device 12 is preferably also made of the three-dimensionally structured quartz glass and / or ceramic, as described above.
- This is Surface of the quartz glass preferably provided with an electrically non-conductive wear protection layer 37, which consists for example of a diamond-like carbon, a ceramic material or silicon nitride.
- the contact spacing conversion device 12 is designed as an additional component, according to a further exemplary embodiment, not shown here, the contact spacing conversion device 12 is formed by one of the holding elements 4, 5.
- the probe card 1 can be characterized in that one of the holding elements with the suitably designed contact devices, which are then formed, for example, according to the embodiment of Figure 6 as a coating or filling of the openings 8, the contact distance conversion means 12 forms and conventional guide plates for guiding the movable , In particular elastically deformable, contact devices 9 has.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102018204106.7A DE102018204106A1 (en) | 2018-03-16 | 2018-03-16 | Test card for electrically connecting a test object with an electrical test device |
PCT/EP2019/056607 WO2019175416A1 (en) | 2018-03-16 | 2019-03-15 | Method for electrically connecting a test piece to an electrical test device |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3765860A1 true EP3765860A1 (en) | 2021-01-20 |
Family
ID=65894987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19712725.1A Withdrawn EP3765860A1 (en) | 2018-03-16 | 2019-03-15 | Method for electrically connecting a test piece to an electrical test device |
Country Status (4)
Country | Link |
---|---|
US (1) | US20210025920A1 (en) |
EP (1) | EP3765860A1 (en) |
DE (1) | DE102018204106A1 (en) |
WO (1) | WO2019175416A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102022214237A1 (en) | 2022-12-21 | 2024-06-27 | Robert Bosch Gesellschaft mit beschränkter Haftung | Device and method for controlling a recovery process in a PEM fuel cell |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3806801A (en) * | 1972-12-26 | 1974-04-23 | Ibm | Probe contactor having buckling beam probes |
FR2493671A1 (en) * | 1980-10-30 | 1982-05-07 | Everett Charles Inc | CONTACTS SHIFT, TEST APPARATUS WITH CONTACTS SHIFT, AND METHOD FOR MANUFACTURING CONTACTS SHIFT |
DE3123627A1 (en) * | 1981-06-15 | 1982-12-30 | Siemens AG, 1000 Berlin und 8000 München | DEVICE FOR SIMULTANEOUSLY CONTACTING MULTIPLE CLOSE-UP CHECK POINTS, IN PARTICULAR OF GRID FIELDS |
DE3337915A1 (en) * | 1982-10-21 | 1984-05-24 | Feinmetall Gmbh, 7033 Herrenberg | Contacting device |
US5952843A (en) * | 1998-03-24 | 1999-09-14 | Vinh; Nguyen T. | Variable contact pressure probe |
US6608385B2 (en) * | 1998-11-30 | 2003-08-19 | Advantest Corp. | Contact structure and production method thereof and probe contact assembly using same |
IT1317517B1 (en) * | 2000-05-11 | 2003-07-09 | Technoprobe S R L | MEASUREMENT HEAD FOR MICROSTRUCTURES |
IT1318734B1 (en) * | 2000-08-04 | 2003-09-10 | Technoprobe S R L | VERTICAL PROBE MEASUREMENT HEAD. |
EP1233272A1 (en) * | 2001-02-19 | 2002-08-21 | MANIA GmbH & Co. | Manufacturing procedure for a probe adapter using a light sensitive photopolymer |
JP3791689B2 (en) * | 2004-01-09 | 2006-06-28 | 日本電子材料株式会社 | Probe card |
US7154285B2 (en) * | 2004-09-30 | 2006-12-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for providing PCB layout for probe card |
DE102006054734A1 (en) | 2005-12-05 | 2007-06-06 | Feinmetall Gmbh | Electrical test device for testing an electrical device under test and corresponding method |
JP4823667B2 (en) * | 2005-12-05 | 2011-11-24 | 日本発條株式会社 | Probe card |
US8264248B2 (en) * | 2007-03-30 | 2012-09-11 | Dsl Labs, Inc. | Micro probe assembly |
KR100791944B1 (en) * | 2007-08-21 | 2008-01-04 | (주)기가레인 | Probe block |
JP6341634B2 (en) * | 2013-05-28 | 2018-06-13 | 新光電気工業株式会社 | Probe guide plate, manufacturing method thereof, and semiconductor inspection apparatus |
CN106164680B (en) * | 2014-04-04 | 2019-11-22 | 精炼金属股份有限公司 | Contact spacing converter, electric detection means and the method for manufacturing contact spacing converter |
US20150369842A1 (en) * | 2014-06-19 | 2015-12-24 | Francis T. McQuade | Probe card for testing semiconductor wafers |
DE102015004150A1 (en) * | 2015-03-31 | 2016-10-06 | Feinmetall Gmbh | Process for the preparation of a contact gap converter and contact gap converter |
US10866266B2 (en) * | 2015-10-29 | 2020-12-15 | Taiwan Semiconductor Manufacturing Company Ltd. | Probe head receiver and probe card assembly having the same |
JP7039259B2 (en) * | 2017-11-16 | 2022-03-22 | 株式会社ヨコオ | Probe head |
-
2018
- 2018-03-16 DE DE102018204106.7A patent/DE102018204106A1/en not_active Ceased
-
2019
- 2019-03-15 EP EP19712725.1A patent/EP3765860A1/en not_active Withdrawn
- 2019-03-15 US US16/981,073 patent/US20210025920A1/en not_active Abandoned
- 2019-03-15 WO PCT/EP2019/056607 patent/WO2019175416A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
DE102018204106A1 (en) | 2019-09-19 |
US20210025920A1 (en) | 2021-01-28 |
WO2019175416A1 (en) | 2019-09-19 |
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