EP3689995A4 - Uv curable silicone adhesive composition and cured product thereof - Google Patents

Uv curable silicone adhesive composition and cured product thereof Download PDF

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Publication number
EP3689995A4
EP3689995A4 EP18863314.3A EP18863314A EP3689995A4 EP 3689995 A4 EP3689995 A4 EP 3689995A4 EP 18863314 A EP18863314 A EP 18863314A EP 3689995 A4 EP3689995 A4 EP 3689995A4
Authority
EP
European Patent Office
Prior art keywords
adhesive composition
cured product
curable silicone
silicone adhesive
curable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP18863314.3A
Other languages
German (de)
French (fr)
Other versions
EP3689995A1 (en
EP3689995B1 (en
Inventor
Kohei Otake
Nobuaki Matsumoto
Eri Asakura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of EP3689995A1 publication Critical patent/EP3689995A1/en
Publication of EP3689995A4 publication Critical patent/EP3689995A4/en
Application granted granted Critical
Publication of EP3689995B1 publication Critical patent/EP3689995B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/10—Block or graft copolymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
EP18863314.3A 2017-09-29 2018-09-19 Uv curable silicone adhesive composition and cured product thereof Active EP3689995B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017190639 2017-09-29
PCT/JP2018/034610 WO2019065398A1 (en) 2017-09-29 2018-09-19 Uv curable silicone adhesive composition and cured product thereof

Publications (3)

Publication Number Publication Date
EP3689995A1 EP3689995A1 (en) 2020-08-05
EP3689995A4 true EP3689995A4 (en) 2021-04-28
EP3689995B1 EP3689995B1 (en) 2022-03-23

Family

ID=65901376

Family Applications (1)

Application Number Title Priority Date Filing Date
EP18863314.3A Active EP3689995B1 (en) 2017-09-29 2018-09-19 Uv curable silicone adhesive composition and cured product thereof

Country Status (7)

Country Link
US (1) US11180680B2 (en)
EP (1) EP3689995B1 (en)
JP (1) JP6901003B2 (en)
KR (1) KR102560796B1 (en)
CN (1) CN111164177B (en)
TW (1) TWI787359B (en)
WO (1) WO2019065398A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11124680B2 (en) * 2017-06-06 2021-09-21 Shin-Etsu Chemical Co., Ltd. Ultraviolet-curable pressure-sensitive silicone adhesive composition and cured object obtained therefrom
JP7024872B2 (en) * 2018-07-25 2022-02-24 信越化学工業株式会社 UV curable silicone adhesive composition and its cured product
WO2020116126A1 (en) * 2018-12-04 2020-06-11 信越化学工業株式会社 Uv curable silicone adhesive composition and cured product thereof
WO2020121735A1 (en) * 2018-12-10 2020-06-18 信越化学工業株式会社 Ultraviolet-curable pressure-sensitive silicone adhesive composition and cured object obtained therefrom
JP7145125B2 (en) * 2019-06-24 2022-09-30 信越化学工業株式会社 Radical-curable silicone composition and cured product
JP7200884B2 (en) * 2019-08-27 2023-01-10 信越化学工業株式会社 Microstructure mounting method
JP7457604B2 (en) * 2019-09-12 2024-03-28 信越化学工業株式会社 Addition-curable silicone compositions, cured products, sheets, and optical components
JP7484196B2 (en) * 2020-02-03 2024-05-16 信越化学工業株式会社 Addition-curable silicone pressure-sensitive adhesive composition and its cured product
JP7342785B2 (en) * 2020-05-14 2023-09-12 信越化学工業株式会社 Substrate for transferring microstructures and manufacturing method thereof
KR20210144260A (en) 2020-05-22 2021-11-30 주식회사 엘지에너지솔루션 Foldable Pouch-type Battery Cell and Method for Manufacturing thereof
US20240117198A1 (en) * 2021-01-08 2024-04-11 Elkem Silicones France Sas Radiation-curable silicone composition comprising a release control additive
JP7342910B2 (en) * 2021-04-23 2023-09-12 信越化学工業株式会社 Ultraviolet curable silicone composition for stereolithography, cured product thereof, and method for producing the cured product

Citations (5)

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WO2001005846A1 (en) * 1999-07-19 2001-01-25 Loctite Corporation Resin-reinforced uv, moisture and uv/moisture dual curable silicone compositions
US20150217550A1 (en) * 2012-08-17 2015-08-06 Visual Physics, Llc Process for transferring microstructures to a final substrate
JP2016191001A (en) * 2015-03-31 2016-11-10 信越化学工業株式会社 Ultraviolet-curable liquid organopolysiloxane composition for image display device, adhesive for image display device containing the composition, image display device using the adhesive, and method for bonding using the adhesive
WO2017048890A1 (en) * 2015-09-18 2017-03-23 Henkel IP & Holding GmbH Curable and optically clear pressure sensitive adhesives and uses thereof
EP3636723A1 (en) * 2017-06-06 2020-04-15 Shin-Etsu Chemical Co., Ltd. Ultraviolet-curable pressure-sensitive silicone adhesive composition and cured object obtained therefrom

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WO2001005846A1 (en) * 1999-07-19 2001-01-25 Loctite Corporation Resin-reinforced uv, moisture and uv/moisture dual curable silicone compositions
US20150217550A1 (en) * 2012-08-17 2015-08-06 Visual Physics, Llc Process for transferring microstructures to a final substrate
JP2016191001A (en) * 2015-03-31 2016-11-10 信越化学工業株式会社 Ultraviolet-curable liquid organopolysiloxane composition for image display device, adhesive for image display device containing the composition, image display device using the adhesive, and method for bonding using the adhesive
WO2017048890A1 (en) * 2015-09-18 2017-03-23 Henkel IP & Holding GmbH Curable and optically clear pressure sensitive adhesives and uses thereof
EP3636723A1 (en) * 2017-06-06 2020-04-15 Shin-Etsu Chemical Co., Ltd. Ultraviolet-curable pressure-sensitive silicone adhesive composition and cured object obtained therefrom

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See also references of WO2019065398A1 *

Also Published As

Publication number Publication date
TW201925409A (en) 2019-07-01
EP3689995A1 (en) 2020-08-05
KR20200061358A (en) 2020-06-02
US20200270481A1 (en) 2020-08-27
WO2019065398A1 (en) 2019-04-04
EP3689995B1 (en) 2022-03-23
CN111164177A (en) 2020-05-15
CN111164177B (en) 2022-05-17
TWI787359B (en) 2022-12-21
JP6901003B2 (en) 2021-07-14
JPWO2019065398A1 (en) 2020-11-05
US11180680B2 (en) 2021-11-23
KR102560796B1 (en) 2023-07-28

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