EP3611294A4 - Electroplating method and device - Google Patents

Electroplating method and device Download PDF

Info

Publication number: EP3611294A4
Authority: EP; European Patent Office
Prior art keywords: electroplating method; electroplating
Prior art date: 2017-04-14
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP17905121.4A

Other languages

German (de)

French (fr)

Other versions

EP3611294B1 (en

EP3611294A1 (en

Inventor

Masayuki IIMORI

Ryosuke TAKEDA

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

YKK Corp

Original Assignee

YKK Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2017-04-14

Filing date

2017-05-11

Publication date

2021-01-13

2017-05-11 Application filed by YKK Corp filed Critical YKK Corp

2020-02-19 Publication of EP3611294A1 publication Critical patent/EP3611294A1/en

2021-01-13 Publication of EP3611294A4 publication Critical patent/EP3611294A4/en

2024-01-24 Application granted granted Critical

2024-01-24 Publication of EP3611294B1 publication Critical patent/EP3611294B1/en

Status Active legal-status Critical Current

2037-05-11 Anticipated expiration legal-status Critical

Links

238000009713 electroplating Methods 0.000 title 1
238000000034 method Methods 0.000 title 1

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/02—Slide fasteners
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C25D17/18—Apparatus for electrolytic coating of small objects in bulk having closed containers
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/007—Electroplating using magnetic fields, e.g. magnets
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/623—Porosity of the layers
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
- A—HUMAN NECESSITIES
- A44—HABERDASHERY; JEWELLERY
- A44B—BUTTONS, PINS, BUCKLES, SLIDE FASTENERS, OR THE LIKE
- A44B19/00—Slide fasteners
- A44B19/24—Details
- A44B19/26—Sliders
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/625—Discontinuous layers, e.g. microcracked layers

EP17905121.4A 2017-04-14 2017-05-11 Electroplating method Active EP3611294B1 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
PCT/JP2017/015365 WO2018189901A1 (en)	2017-04-14	2017-04-14	Plated material and manufacturing method therefor
PCT/JP2017/017949 WO2018189916A1 (en)	2017-04-14	2017-05-11	Electroplating method and device

Publications (3)

Publication Number	Publication Date
EP3611294A1 EP3611294A1 (en)	2020-02-19
EP3611294A4 true EP3611294A4 (en)	2021-01-13
EP3611294B1 EP3611294B1 (en)	2024-01-24

Family

ID=63792499

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
EP17905121.4A Active EP3611294B1 (en)	2017-04-14	2017-05-11	Electroplating method
EP18784523.5A Active EP3611293B1 (en)	2017-04-14	2018-04-03	Plated material and manufacturing method therefor

Family Applications After (1)

Application Number	Title	Priority Date	Filing Date
EP18784523.5A Active EP3611293B1 (en)	2017-04-14	2018-04-03	Plated material and manufacturing method therefor

Country Status (10)

Country	Link
US (2)	US11236431B2 (en)
EP (2)	EP3611294B1 (en)
JP (2)	JP6722821B2 (en)
KR (2)	KR102282185B1 (en)
CN (2)	CN110475913B (en)
BR (1)	BR112019011899B1 (en)
MX (2)	MX2019011879A (en)
RU (1)	RU2718587C1 (en)
TW (2)	TWI679315B (en)
WO (3)	WO2018189901A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2019127014A1 (en) *	2017-12-26	2019-07-04	汉玛科技股份有限公司	Electroplating assembly mechanism
WO2021130873A1 (en) *	2019-12-24	2021-07-01	Ykk株式会社	Electroplating system
US20220411951A1 (en) *	2019-12-24	2022-12-29	Ykk Corporation	Electroplating device and method for manufacturing plated product
JP2021160117A (en) *	2020-03-31	2021-10-11	株式会社日立製作所	Laminate, metal plating liquid, and laminate manufacturing method
CN117836472A (en) *	2021-08-06	2024-04-05	Ykk株式会社	Fastener stringer, fastener chain, method for manufacturing fastener, and electroplating apparatus
JP7466069B1 (en)	2023-03-13	2024-04-11	三井金属鉱業株式会社	Zinc foil and its manufacturing method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5911865A (en) *	1997-02-07	1999-06-15	Yih; Pay	Method for electroplating of micron particulates with metal coatings
US20090145772A1 (en) *	2007-12-11	2009-06-11	Gm Global Technology Operation, Inc.	Method of treating nanoparticles using an intermittently processing electrochemical cell
CN101954618A (en) *	2009-07-13	2011-01-26	豪昱电子有限公司	Magnetic grinder

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS4725051Y1 (en)	1968-11-09	1972-08-05
JPS555658A (en)	1978-06-29	1980-01-16	Kogyo Gijutsuin	Drive control method of muscular potential operating apparatus
JP2698871B2 (en)	1987-11-25	1998-01-19	有限会社カネヒロ・メタライジング	Barrel plating equipment
JP2628184B2 (en) *	1988-04-25	1997-07-09	日新製鋼株式会社	Method of electroplating metal on fine powder
JPH0544083A (en) *	1991-08-13	1993-02-23	Nisshin Steel Co Ltd	Elctroplating method for powder
JPH0711479A (en)	1993-06-28	1995-01-13	Nkk Corp	Zinc alloy plated steel sheet and its production
JP3087554B2 (en)	1993-12-16	2000-09-11	株式会社村田製作所	Plating method
US6010610A (en) *	1996-04-09	2000-01-04	Yih; Pay	Method for electroplating metal coating(s) particulates at high coating speed with high current density
KR100574215B1 (en) *	1997-04-17	2006-04-27	세키스이가가쿠 고교가부시키가이샤	Conductive particles
JP3282585B2 (en) *	1998-06-02	2002-05-13	株式会社村田製作所	Plating apparatus and plating method
JP2002042556A (en) *	2000-07-28	2002-02-08	Hitachi Cable Ltd	Flat cable, conductor for it, and manufacturing method thereof
JP2002069667A (en)	2000-08-28	2002-03-08	Sony Corp	Tin-based multi-element alloy plated coating film and forming method therefor
JP3746221B2 (en)	2001-10-11	2006-02-15	日本エレクトロプレイテイング・エンジニヤース株式会社	Cup type plating equipment
JP3930832B2 (en) *	2003-06-06	2007-06-13	株式会社山本鍍金試験器	Aquarium
JP4367149B2 (en)	2004-01-30	2009-11-18	日立電線株式会社	Flat cable conductor, method of manufacturing the same, and flat cable
JP2006032851A (en)	2004-07-21	2006-02-02	Mitsui Mining & Smelting Co Ltd	Coating copper, method for suppressing generation of whiskers, printed-wiring board, and semiconductor device
JP4725051B2 (en)	2004-08-04	2011-07-13	株式会社村田製作所	Plating method and plating apparatus
JP2009065005A (en) *	2007-09-07	2009-03-26	Panasonic Corp	Manufacturing method of chip-like electronic component
JP4959592B2 (en)	2008-01-18	2012-06-27	株式会社日立製作所	Network video monitoring system and monitoring device
KR101596342B1 (en) *	2009-01-20	2016-02-22	미츠비시 신도 가부시키가이샤	Conductive member and method for producing the same
JP4987028B2 (en)	2009-03-31	2012-07-25	Ｊｘ日鉱日石金属株式会社	Copper alloy tin plating material for printed circuit board terminals
BRPI1010877B1 (en)	2009-06-08	2020-09-15	Modumetal, Inc	CORROSION RESISTANT MULTILAYER COATING AND ELECTRODEPOSITION METHOD
JP5435355B2 (en) *	2009-09-04	2014-03-05	日立金属株式会社	Plating equipment
JP5650899B2 (en) *	2009-09-08	2015-01-07	上村工業株式会社	Electroplating equipment
JP5598754B2 (en) *	2010-06-08	2014-10-01	日立金属株式会社	Plating equipment
JP2012025975A (en) *	2010-07-20	2012-02-09	Hitachi Metals Ltd	Plating equipment
JP5440958B2 (en) *	2010-08-16	2014-03-12	日立金属株式会社	Plating equipment
JP2012087388A (en) *	2010-10-21	2012-05-10	Furukawa Electric Co Ltd:The	Surface-treated copper foil and copper-clad laminate sheet
US20120245019A1 (en) *	2011-03-23	2012-09-27	Brookhaven Science Associates, Llc	Method and Electrochemical Cell for Synthesis of Electrocatalysts by Growing Metal Monolayers, or Bilayers and Treatment of Metal, Carbon, Oxide and Core-Shell Nanoparticles
RU2464361C1 (en) *	2011-04-11	2012-10-20	Федеральное государственное образовательное учреждение высшего профессионального образования "РОССИЙСКИЙ ГОСУДАРСТВЕННЫЙ АГРАРНЫЙ ЗАОЧНЫЙ УНИВЕРСИТЕТ"	Application device of galvanic coatings
JP5741944B2 (en)	2011-09-02	2015-07-01	株式会社村田製作所	Plating apparatus and plating method
JP2013119650A (en)	2011-12-07	2013-06-17	Mitsubishi Electric Corp	Partial plating method
KR101461125B1 (en) *	2012-03-23	2014-11-13	히다찌긴조꾸가부시끼가이사	Solder-coated ball and method for manufacturing same
US20130282917A1 (en)	2012-04-24	2013-10-24	Vid Scale, Inc.	Method and apparatus for smooth stream switching in mpeg/3gpp-dash
US9388502B2 (en) *	2012-07-12	2016-07-12	Ykk Corporation	Button or fastener member of copper-plated aluminum or aluminum alloy and method of production thereof
CN102925937B (en) *	2012-09-07	2015-07-01	上海大学	Method and device for continuously preparing high-silicon steel ribbon under magnetic field
JP5667152B2 (en) *	2012-09-19	2015-02-12	Jx日鉱日石金属株式会社	Surface treatment plating material, method for producing the same, and electronic component
JP2014070265A (en) *	2012-10-01	2014-04-21	Panasonic Corp	Barrel plating apparatus, and method for producing electronic component using the barrel plating apparatus
JP2015063711A (en)	2013-09-24	2015-04-09	吉昭濱田	Surface treatment device and plating method
RU153631U1 (en) *	2014-01-09	2015-07-27	Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования Волгоградский государственный аграрный университет	GALVANIC BATH FOR COATING DETAILS OF CYLINDRICAL FORM
JP6197778B2 (en)	2014-10-24	2017-09-20	Ｊｆｅスチール株式会社	Steel plate for container and method for producing the same
BR122017009844B1 (en) *	2014-11-14	2022-05-03	Ykk Corporation	Electrolytic surface treatment apparatus for subjecting metallic clothing accessories to electrolytic surface treatment
JP6463622B2 (en) *	2014-11-27	2019-02-06	Ykk株式会社	Plating equipment, plating unit, and plating line
JP6328288B2 (en)	2017-03-23	2018-05-23	Ykk株式会社	Surface electrolysis equipment for clothing accessories

2017
- 2017-04-14 WO PCT/JP2017/015365 patent/WO2018189901A1/en active Application Filing
- 2017-05-11 EP EP17905121.4A patent/EP3611294B1/en active Active
- 2017-05-11 CN CN201780089163.3A patent/CN110475913B/en active Active
- 2017-05-11 BR BR112019011899-3A patent/BR112019011899B1/en active IP Right Grant
- 2017-05-11 WO PCT/JP2017/017949 patent/WO2018189916A1/en active Application Filing
- 2017-05-11 RU RU2019131191A patent/RU2718587C1/en active
- 2017-05-11 KR KR1020197018582A patent/KR102282185B1/en active IP Right Grant
- 2017-05-11 JP JP2019512172A patent/JP6722821B2/en active Active
- 2017-05-11 MX MX2019011879A patent/MX2019011879A/en unknown
- 2017-05-11 US US16/495,733 patent/US11236431B2/en active Active
2018
- 2018-04-03 KR KR1020197018583A patent/KR102243188B1/en active IP Right Grant
- 2018-04-03 JP JP2019512458A patent/JP6793251B2/en active Active
- 2018-04-03 EP EP18784523.5A patent/EP3611293B1/en active Active
- 2018-04-03 CN CN201880021279.8A patent/CN110462110B/en active Active
- 2018-04-03 WO PCT/JP2018/014318 patent/WO2018190202A1/en active Application Filing
- 2018-04-03 US US16/493,539 patent/US11072866B2/en active Active
- 2018-04-03 MX MX2019010840A patent/MX2019010840A/en unknown
- 2018-04-13 TW TW107112695A patent/TWI679315B/en active
- 2018-10-12 TW TW107135980A patent/TWI691621B/en active

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5911865A (en) *	1997-02-07	1999-06-15	Yih; Pay	Method for electroplating of micron particulates with metal coatings
US20090145772A1 (en) *	2007-12-11	2009-06-11	Gm Global Technology Operation, Inc.	Method of treating nanoparticles using an intermittently processing electrochemical cell
CN101954618A (en) *	2009-07-13	2011-01-26	豪昱电子有限公司	Magnetic grinder

Also Published As

Publication number	Publication date
WO2018189916A1 (en)	2018-10-18
TW201942420A (en)	2019-11-01
KR20190087586A (en)	2019-07-24
WO2018190202A1 (en)	2018-10-18
EP3611293A4 (en)	2021-02-17
CN110475913A (en)	2019-11-19
KR20190087585A (en)	2019-07-24
TW201842235A (en)	2018-12-01
US20200095700A1 (en)	2020-03-26
BR112019011972A2 (en)	2019-11-05
TWI691621B (en)	2020-04-21
JP6722821B2 (en)	2020-07-15
BR112019011899A2 (en)	2019-10-22
US11236431B2 (en)	2022-02-01
JP6793251B2 (en)	2020-12-02
BR112019011899B1 (en)	2023-01-17
RU2718587C1 (en)	2020-04-08
JPWO2018190202A1 (en)	2019-11-07
US11072866B2 (en)	2021-07-27
CN110462110A (en)	2019-11-15
EP3611293B1 (en)	2024-01-03
TWI679315B (en)	2019-12-11
EP3611294B1 (en)	2024-01-24
KR102282185B1 (en)	2021-07-27
CN110462110B (en)	2020-08-11
CN110475913B (en)	2020-09-01
MX2019010840A (en)	2019-11-18
KR102243188B1 (en)	2021-04-22
MX2019011879A (en)	2019-12-02
JPWO2018189916A1 (en)	2019-11-07
US20200032410A1 (en)	2020-01-30
WO2018189901A1 (en)	2018-10-18
EP3611294A1 (en)	2020-02-19
EP3611293A1 (en)	2020-02-19

Legal Events

Date	Code	Title	Description
2018-10-20	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE
2020-01-17	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2020-01-17	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE
2020-02-19	17P	Request for examination filed	Effective date: 20190528
2020-02-19	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
2020-02-19	AX	Request for extension of the european patent	Extension state: BA ME
2020-07-22	DAV	Request for validation of the european patent (deleted)
2020-07-22	DAX	Request for extension of the european patent (deleted)
2021-01-13	A4	Supplementary search report drawn up and despatched	Effective date: 20201211
2021-01-13	RIC1	Information provided on ipc code assigned before grant	Ipc: C25D 21/10 20060101ALI20201207BHEP Ipc: C25D 17/16 20060101AFI20201207BHEP Ipc: C25D 5/10 20060101ALI20201207BHEP Ipc: C25D 7/02 20060101ALI20201207BHEP Ipc: C25D 17/18 20060101ALI20201207BHEP Ipc: C25D 3/56 20060101ALI20201207BHEP Ipc: C25D 5/00 20060101ALI20201207BHEP
2022-10-28	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: EXAMINATION IS IN PROGRESS
2022-11-30	17Q	First examination report despatched	Effective date: 20221028
2023-11-01	GRAP	Despatch of communication of intention to grant a patent	Free format text: ORIGINAL CODE: EPIDOSNIGR1
2023-11-01	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: GRANT OF PATENT IS INTENDED
2023-11-29	INTG	Intention to grant announced	Effective date: 20231102
2023-11-29	RIN1	Information on inventor provided before grant (corrected)	Inventor name: TAKEDA, RYOSUKE Inventor name: IIMORI, MASAYUKI
2023-12-15	GRAS	Grant fee paid	Free format text: ORIGINAL CODE: EPIDOSNIGR3
2023-12-22	GRAA	(expected) grant	Free format text: ORIGINAL CODE: 0009210
2023-12-22	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE PATENT HAS BEEN GRANTED
2024-01-17	P01	Opt-out of the competence of the unified patent court (upc) registered	Effective date: 20231208
2024-01-24	AK	Designated contracting states	Kind code of ref document: B1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
2024-01-24	REG	Reference to a national code	Ref country code: GB Ref legal event code: FG4D
2024-01-31	REG	Reference to a national code	Ref country code: CH Ref legal event code: EP
2024-02-08	REG	Reference to a national code	Ref country code: DE Ref legal event code: R096 Ref document number: 602017078812 Country of ref document: DE
2024-02-14	REG	Reference to a national code	Ref country code: IE Ref legal event code: FG4D

Publication	Publication Date	Title
EP3550485A4 (en)	2019-10-09	Ex-warehousing method and device
EP3668154A4 (en)	2020-09-02	Configuration method and corresponding apparatus
EP3664513A4 (en)	2020-07-22	Positioning method and apparatus
EP3696648A4 (en)	2021-07-07	Interaction method and device
EP3565283A4 (en)	2019-11-27	Positioning method and device
EP3439403A4 (en)	2019-10-23	Device and method
EP3644663A4 (en)	2020-10-07	Positioning method and apparatus
EP3554163A4 (en)	2019-12-25	Scheduling method and related device
EP3361741A4 (en)	2019-01-23	Receiving device and receiving method
EP3635418A4 (en)	2021-03-03	Power-outage-assessment apparatuses and methods
EP3591793A4 (en)	2020-08-05	Arbitrary rapid-charging apparatus and method
EP3564710A4 (en)	2020-01-22	Positioning method and apparatus
EP3611294A4 (en)	2021-01-13	Electroplating method and device
EP3665779A4 (en)	2021-03-24	Method and apparatus
EP3703321A4 (en)	2020-11-18	Configuration method and apparatus
EP3649828A4 (en)	2021-02-24	Method and apparatus
EP3567786A4 (en)	2020-01-15	Indication method and device
EP3554041A4 (en)	2020-02-26	Method and device for sequence determination
EP3648364A4 (en)	2020-06-10	Beamforming method and device
EP3721749A4 (en)	2021-09-22	Drawing device and drawing method
EP3445143A4 (en)	2019-11-20	Mounting apparatus and mounting method
EP3584015A4 (en)	2020-05-27	Coating device and coating method
EP3597310A4 (en)	2020-04-15	Coating device and coating method
EP3422763A4 (en)	2019-03-06	Device and method
EP3706464A4 (en)	2020-11-18	Scheduling method and device