EP3586093A4 - Capacitive micromachined ultrasonic transducers (cmuts) and related apparatus and methods - Google Patents

Capacitive micromachined ultrasonic transducers (cmuts) and related apparatus and methods Download PDF

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Publication number
EP3586093A4
EP3586093A4 EP18758144.2A EP18758144A EP3586093A4 EP 3586093 A4 EP3586093 A4 EP 3586093A4 EP 18758144 A EP18758144 A EP 18758144A EP 3586093 A4 EP3586093 A4 EP 3586093A4
Authority
EP
European Patent Office
Prior art keywords
cmuts
methods
ultrasonic transducers
related apparatus
micromachined ultrasonic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP18758144.2A
Other languages
German (de)
French (fr)
Other versions
EP3586093A1 (en
Inventor
Jonathan M. Rothberg
Keith G. Fife
Susan A. Alie
Joseph Lutsky
David GROSJEAN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Butterfly Network Inc
Original Assignee
Butterfly Network Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Butterfly Network Inc filed Critical Butterfly Network Inc
Publication of EP3586093A1 publication Critical patent/EP3586093A1/en
Publication of EP3586093A4 publication Critical patent/EP3586093A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0086—Electrical characteristics, e.g. reducing driving voltage, improving resistance to peak voltage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
    • B81C1/00698—Electrical characteristics, e.g. by doping materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2406—Electrostatic or capacitive probes, e.g. electret or cMUT-probes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0161—Controlling physical properties of the material
    • B81C2201/0171—Doping materials
    • B81C2201/0173—Thermo-migration of impurities from a solid, e.g. from a doped deposited layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/11—Treatments for avoiding stiction of elastic or moving parts of MEMS
    • B81C2201/115—Roughening a surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/038—Bonding techniques not provided for in B81C2203/031 - B81C2203/037
EP18758144.2A 2017-02-27 2018-02-26 Capacitive micromachined ultrasonic transducers (cmuts) and related apparatus and methods Withdrawn EP3586093A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762464346P 2017-02-27 2017-02-27
US201762524438P 2017-06-23 2017-06-23
PCT/US2018/019697 WO2018157050A1 (en) 2017-02-27 2018-02-26 Capacitive micromachined ultrasonic transducers (cmuts) and related apparatus and methods

Publications (2)

Publication Number Publication Date
EP3586093A1 EP3586093A1 (en) 2020-01-01
EP3586093A4 true EP3586093A4 (en) 2021-01-06

Family

ID=63245908

Family Applications (1)

Application Number Title Priority Date Filing Date
EP18758144.2A Withdrawn EP3586093A4 (en) 2017-02-27 2018-02-26 Capacitive micromachined ultrasonic transducers (cmuts) and related apparatus and methods

Country Status (6)

Country Link
US (1) US10850306B2 (en)
EP (1) EP3586093A4 (en)
AU (1) AU2018225762A1 (en)
CA (1) CA3052485A1 (en)
TW (1) TW201834025A (en)
WO (1) WO2018157050A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2018225762A1 (en) * 2017-02-27 2019-08-22 Butterfly Network, Inc. Capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods
FR3077163B1 (en) * 2018-01-22 2021-08-27 Soitec Silicon On Insulator DESIGN AND MANUFACTURING METHODS OF A DEVICE INCLUDING A NETWORK OF MICRO-FACTORY ELEMENTS, A DEVICE OBTAINED AS A RESULT OF SUCH METHODS
JP7385652B2 (en) * 2018-09-28 2023-11-22 バタフライ ネットワーク，インコーポレイテッド Manufacturing technology and structure of gettering material in ultrasonic transducer cavity
CA3119753A1 (en) 2018-11-15 2020-05-22 Butterfly Network, Inc. Anti-stiction bottom cavity surface for micromachined ultrasonic transducer devices
EP3930923A4 (en) 2019-02-25 2023-01-11 Bfly Operations, Inc. Adaptive cavity thickness control for micromachined ultrasonic transducer devices
WO2020210470A1 (en) 2019-04-12 2020-10-15 Butterfly Network, Inc. Bottom electrode via structures for micromachined ultrasonic transducer devices
WO2021019296A1 (en) * 2019-07-26 2021-02-04 Vermon Sa Cmut transducer and method for manufacturing
US20220141565A1 (en) * 2020-03-30 2022-05-05 Boe Technology Group Co., Ltd. Acoustic transducer and manufacturing method thereof
WO2021211822A1 (en) 2020-04-16 2021-10-21 Bfly Operations, Inc. Methods and circuitry for built-in self-testing of circuitry and/or transducers in ultrasound devices
CN114506811A (en) * 2021-12-22 2022-05-17 杭州士兰集成电路有限公司 MEMS device and manufacturing method thereof
TWI814593B (en) * 2022-09-28 2023-09-01 國立清華大學 Capacitive ultrasonic transducer device, manufacturing method thereof and transducer array

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5470797A (en) * 1993-04-05 1995-11-28 Ford Motor Company Method for producing a silicon-on-insulator capacitive surface micromachined absolute pressure sensor
US5861321A (en) * 1995-11-21 1999-01-19 Texas Instruments Incorporated Method for doping epitaxial layers using doped substrate material
US20060019465A1 (en) * 2004-07-22 2006-01-26 Texas Instruments Incorporated Method and system for dopant containment
US20070180916A1 (en) * 2006-02-09 2007-08-09 General Electric Company Capacitive micromachined ultrasound transducer and methods of making the same
US20100254222A1 (en) * 2007-12-03 2010-10-07 Kolo Technologies, Inc Dual-Mode Operation Micromachined Ultrasonic Transducer

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6396368B1 (en) * 1999-11-10 2002-05-28 Hrl Laboratories, Llc CMOS-compatible MEM switches and method of making
JP4347885B2 (en) 2004-06-03 2009-10-21 オリンパス株式会社 Manufacturing method of capacitive ultrasonic transducer, ultrasonic endoscope apparatus including capacitive ultrasonic transducer manufactured by the manufacturing method, capacitive ultrasonic probe, and capacitive ultrasonic transducer Sonic transducer
US7545075B2 (en) * 2004-06-04 2009-06-09 The Board Of Trustees Of The Leland Stanford Junior University Capacitive micromachined ultrasonic transducer array with through-substrate electrical connection and method of fabricating same
US20060004289A1 (en) * 2004-06-30 2006-01-05 Wei-Cheng Tian High sensitivity capacitive micromachined ultrasound transducer
JP5408937B2 (en) * 2007-09-25 2014-02-05 キヤノン株式会社 Electromechanical transducer and manufacturing method thereof
JP5408935B2 (en) * 2007-09-25 2014-02-05 キヤノン株式会社 Electromechanical transducer and manufacturing method thereof
CN102159334A (en) 2008-09-16 2011-08-17 皇家飞利浦电子股份有限公司 Capacitive micromachined ultrasound transducer
US9351081B2 (en) * 2013-02-27 2016-05-24 Texas Instruments Incorporated Capacitive micromachined ultrasonic transducer (CMUT) with through-substrate via (TSV) substrate plug
US9520811B2 (en) * 2013-02-27 2016-12-13 Texas Instruments Incorporated Capacitive micromachined ultrasonic transducer (CMUT) device with through-substrate via (TSV)
CN105307975B (en) 2013-03-15 2017-04-26 蝴蝶网络有限公司 Complementary metal oxide semiconductor (cmos) ultrasonic transducers and methods for forming the same
US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
JP6873156B2 (en) * 2016-04-26 2021-05-19 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． Ultrasonic device in contact
AU2018225762A1 (en) * 2017-02-27 2019-08-22 Butterfly Network, Inc. Capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5470797A (en) * 1993-04-05 1995-11-28 Ford Motor Company Method for producing a silicon-on-insulator capacitive surface micromachined absolute pressure sensor
US5861321A (en) * 1995-11-21 1999-01-19 Texas Instruments Incorporated Method for doping epitaxial layers using doped substrate material
US20060019465A1 (en) * 2004-07-22 2006-01-26 Texas Instruments Incorporated Method and system for dopant containment
US20070180916A1 (en) * 2006-02-09 2007-08-09 General Electric Company Capacitive micromachined ultrasound transducer and methods of making the same
US20100254222A1 (en) * 2007-12-03 2010-10-07 Kolo Technologies, Inc Dual-Mode Operation Micromachined Ultrasonic Transducer

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2018157050A1 *

Also Published As

Publication number Publication date
US20180243792A1 (en) 2018-08-30
CA3052485A1 (en) 2018-08-30
WO2018157050A1 (en) 2018-08-30
US10850306B2 (en) 2020-12-01
AU2018225762A1 (en) 2019-08-22
TW201834025A (en) 2018-09-16
EP3586093A1 (en) 2020-01-01

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