EP3465789A2 - Verfahren zur herstellung einer vielzahl von piezoelektrischen vielschichtbauelementen - Google Patents
Verfahren zur herstellung einer vielzahl von piezoelektrischen vielschichtbauelementenInfo
- Publication number
- EP3465789A2 EP3465789A2 EP17728135.9A EP17728135A EP3465789A2 EP 3465789 A2 EP3465789 A2 EP 3465789A2 EP 17728135 A EP17728135 A EP 17728135A EP 3465789 A2 EP3465789 A2 EP 3465789A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- piezoelectric
- components
- piezoelectric multilayer
- multilayer components
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 43
- 238000005299 abrasion Methods 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims description 60
- 238000000227 grinding Methods 0.000 claims description 26
- 238000000137 annealing Methods 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 239000011230 binding agent Substances 0.000 claims description 9
- 239000004014 plasticizer Substances 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 description 6
- 238000005245 sintering Methods 0.000 description 6
- 238000005496 tempering Methods 0.000 description 5
- 239000003082 abrasive agent Substances 0.000 description 4
- 239000006061 abrasive grain Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 238000005201 scrubbing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 235000004789 Rosa xanthina Nutrition 0.000 description 1
- 241000109329 Rosa xanthina Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000009991 scouring Methods 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
- H10N30/503—Piezoelectric or electrostrictive devices having a stacked or multilayer structure having a non-rectangular cross-section in a plane orthogonal to the stacking direction, e.g. polygonal or circular in top view
- H10N30/505—Piezoelectric or electrostrictive devices having a stacked or multilayer structure having a non-rectangular cross-section in a plane orthogonal to the stacking direction, e.g. polygonal or circular in top view the cross-section being annular
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
- H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
- H10N30/086—Shaping or machining of piezoelectric or electrostrictive bodies by machining by polishing or grinding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/40—Piezoelectric or electrostrictive devices with electrical input and electrical output, e.g. functioning as transformers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
Definitions
- the present invention relates to a method for
- Multilayer devices may be, for example, piezoelectric transformers suitable for producing a non-thermal atmospheric pressure plasma.
- the devices may be subjected to a process in which disordered loose grain devices are ground as an abrasive to achieve a smooth surface of the piezoelectric multilayer devices.
- the object of the present invention is now to provide an improved method for producing a plurality of piezoelectric multilayer components. This object is achieved by a method according to the present invention
- Claim 1 solved. It is proposed a method for producing a plurality of piezoelectric multilayer devices, wherein the piezoelectric multilayer devices are ground without the addition of an abrasive, wherein a material abrasion of the piezoelectric
- the material abrasion can be done only by rubbing the piezoelectric multilayer components together.
- the method thus uses no abrasive.
- abrasive may be understood here to mean any abrasive that can be used to achieve a removal of material, an abrasive which is typically a fine-grained, hard and sharp-edged substance
- abrasives are, for example, sand or ZrO.sub.2 through the
- Waiver of any abrasive It has been shown that by rubbing the multilayer components together significantly smoother surfaces can be achieved than is possible with abrasives.
- Abrasives for example sand with a grain size between 0.1 and 0.5 mm, cause severe scoring in the surface of the multilayer components in the scrubbing process. This can lead to local unevenness in the surface. These can be too local when using the multilayer components for plasma generation
- Component can come.
- the local field peak can be avoided by local peaks in the roughness of the surface. Also in the area of the edges of the
- Multilayer device can be a smooth, rounded
- Completion of the grinding process on the step of separation of the multilayer components of the abrasive can be dispensed with. This step may be very
- Abrasive can thus manufacture with less
- the material can be used in the process both by the same
- the outer surfaces may be four side surfaces whose surface normal in each case perpendicular to a longitudinal axis of the
- Multi-layer components is, and two end faces whose surface normal is parallel to the longitudinal axis, respectively. Two adjacent external surfaces can do this always perpendicular to each other. In this case, two adjacent outer surfaces adjoin one edge in each case.
- the piezoelectric multilayer component can in
- the method is also suitable for differently shaped multilayer components
- the outer surfaces can be smoother, d. H. the roughness of the
- External surfaces may decrease as a result of material abrasion.
- the edges can be rounded. Accordingly, by the method, a formerly sharp edge can be formed into a rounded edge, wherein the
- piezoelectric transformers have the advantage over sharp edges that there is no local field increase at a rounded edge. Accordingly, it may not be undesirable on a rounded edge
- Multilayer devices are present in a loose state.
- the components may be arranged in a loose state in a drum.
- a loose state can be called a state in which the Multilayer devices are not mechanically connected to each other.
- Multi-layer devices should serve to remove a surface of the piezoelectric multilayer devices themselves. The intention is not to free the surface of the piezoelectric multilayer components from contamination. In the manufacturing process there is usually no contamination on the surface that would have to be removed.
- the piezoelectric multilayer components can be used as a laminated layer of the piezoelectric multilayer components.
- a green body is an unfired blank.
- a green body is a body in the green state, that is, a ceramic body before performing a burning or
- Multi-layer devices are removed in a simple manner, since the hardness of the multilayer components is significantly lower before sintering than after performing a
- a green body has a hardness which is significantly lower than the hardness of a typical hard bulk material, such as a screw, a nail or a steel spring.
- Green body is softer and more elastic than such
- the green body often contains an organic binder needed for the previous molding.
- the organic binder typically has plasticizers. These can be removed by a temperature treatment, wherein the device is harder.
- a tempering process can be performed before the grinding of the piezoelectric components.
- the piezoelectric device may be exposed to elevated temperatures of 100 ° C to 150 ° C.
- the plasticizers of the organic binder can be at least partially removed. By removing the plasticizer, the hardness of the
- the hardness of the device can be adjusted as desired.
- the tempering process may allow the hardness of the piezoelectric components to be adjusted such that they are not undesirably deformed during the grinding.
- the temperature selected during the annealing process depends on the plasticizer used.
- the tempering process can be carried out under reduced pressure.
- the tempering process can serve to evaporate solvents and / or plasticizers from an organic binder and thus from the piezoelectric multilayer component.
- the multilayer components are hardened by the annealing process.
- the binder or a polymer of the binder is not decomposed.
- the binder is not expelled in gaseous form from a ceramic of the piezoelectric multilayer component.
- the annealing process is not debinding.
- the temperature range of 100 ° C to 150 ° C, which occurs during the annealing process, is not sufficient for debindering.
- the polymer is during the
- the component can be hardened by the at least partial removal of the solvent and / or the plasticizer, but it remains a green compact.
- the step of debinding can only after the step of grinding without the addition of abrasive
- a hardness of the piezoelectric multilayer component can be increased during the annealing process.
- Plasticizer of an organic binder are at least partially removed from the piezoelectric multilayer component.
- the piezoelectric multilayer components can be exposed to temperatures of 100 ° C to 150 ° C during the annealing process.
- the components can optionally be dried.
- thermal processes are carried out, for example
- the grinding can be carried out in a drum equipped with a variety of piezoelectric
- Multilayer components is loaded, the material abrasion by adjusting at least one of running time of
- Rotation speed of the drum is set in the desired manner.
- the three parameters mentioned here are the three parameters mentioned here.
- the rotational speed of the drum that is the
- the speed with which the drum rotates also influences the material abrasion of the multilayer components.
- Material abrasion depends on the geometry and the size as well as the exact structure of the multilayer components.
- Rotation speed should be chosen so that the highest possible material abrasion per second is achieved, in order to increase the duration of the grinding process
- the number of piezoelectric multilayer components in the drum should also be set to an optimum value for material abrasion. Be too many per unit volume
- Multi-layer devices loaded into the drum so the multilayer devices can wedge each other and it Hardly comes to a rubbing of the components together. As a result, the material abrasion is greatly inhibited. Even if too few multilayer components are loaded into the drum, only a few rubbing processes of the components occur
- the multilayer components may be surrounded by the medium of water in the grinding. Water does not act as an abrasive because the water does not cause any material abrasion from the surface of the multilayer components.
- the abraded material may be deposited as dust on the surfaces of the
- the water can also serve to influence a surface tension.
- soap may be added to the water.
- the piezoelectric multilayer components may be piezoelectric transformers.
- these may be transformers suitable for use in a plasma generator for producing non-thermal atmospheric pressure plasma.
- a plasma generator for producing non-thermal atmospheric pressure plasma.
- it is particularly important to achieve a smooth, rounded surface, since otherwise by local field peaks plasma ignitions in
- Component could be damaged.
- FIG. 1 shows a perspective view of a
- FIG. 2 shows a detail of a
- FIG. 3 shows a detail of a comparative example of a multilayer component which was produced using the scrubber Zr0 2 .
- FIG. 4 shows a further detail of a
- Comparative example of a multilayer component which was manufactured using a scouring agent.
- FIG. 1 shows a perspective view of a
- Piezoelectric multilayer component 1 is a piezoelectric transformer.
- the piezoelectric transformer can be used in particular in a device for generating non-atmospheric atmospheric pressure plasma.
- a piezoelectric transformer is a type of resonant transformer based on piezoelectricity and unlike the conventional magnetic ones
- the piezoelectric transformer is, for example, a
- the piezoelectric multilayer component 1 has a
- the piezoelectric multilayer component 1 has electrodes 4, to which an alternating voltage can be applied.
- Electrodes 4 extend in the longitudinal direction z of the piezoelectric multilayer component 1
- Electrodes 4 are stacked alternately with a piezoelectric material 5 in a stacking direction x which is perpendicular to the longitudinal direction z.
- the piezoelectric material 5 is polarized in the stacking direction x.
- a y-direction y is perpendicular to the respective
- the electrodes 4 are inside the piezoelectric
- Multilayer component 1 is arranged and also called
- the piezoelectric Multilayer component 1 has a first side surface 6 and a second side surface 7, which lies opposite the first side surface 6. On the first side surface 6, a first outer electrode 8 is arranged. On the second
- a second outer electrode (not shown) is arranged.
- the internal electrodes 4 are in
- the piezoelectric multilayer component 1 has a third side surface 20 and a fourth side surface 21 facing each other and perpendicular to the first side surface 6 and the second side surface 7
- the surface normals of the third and fourth side surfaces 20, 21 each point in the stacking direction x.
- the input region 2 can be driven with a low alternating voltage, which is applied between the electrodes 4. Due to the piezoelectric effect, the
- the input side applied AC voltage is first converted into a mechanical vibration.
- the output region 3 comprises piezoelectric material 9 and is free of internal electrodes.
- Piezoelectric material 9 in the output region is polarized in the longitudinal direction z.
- Piezoelectric material 9 of the output region 3 may be the same material as the piezoelectric material Material 5 of the input area 2 act, with the piezoelectric materials 5 and 9 in their
- the piezoelectric material 9 is formed into a single monolithic layer
- Output area 3 only a single polarization direction.
- the exit area 3 has an exit-side end face 10.
- an electrical voltage is thus generated between the end face 10 and the end of the electrodes 4 of the input region 2.
- a high voltage is generated. It also arises between the output side face and an environment of
- Multilayer Device 1 high electric fields capable of ionizing gases or liquids by electrical excitation.
- Ignition field strength of the plasma exceeds.
- ignition field strength of a plasma is the field strength that is required for the ionization of the atoms or molecules.
- the piezoelectric multilayer component 1 further has an input-side end face 22, which is the
- Output side end face 10 is opposite. Furthermore, the piezoelectric multilayer component 1 has edges 23. The edges 23 may be rounded. The piezoelectric multilayer component 1 is subjected during its manufacture to a grinding process in which no abrasive is used and in which
- Multilayer component 1 by rubbing the
- piezoelectric multilayer component 1 takes place on further piezoelectric multilayer components.
- Figure 2 shows a detailed view of a section of a piezoelectric multilayer component 1, which was manufactured by the method described here, wherein a
- the multilayer components are arranged in a loose state in a drum.
- FIG. 3 shows a detail of a comparative example of a multilayer component which has been subjected to a scrubbing process using ZrÜ 2 as an abrasive.
- Abandoning an abrasive material from the Side surfaces and edges of the multilayer components m can be removed in a way that less rough
- FIG. 4 shows a detailed view of a comparative example of a multilayer piezoelectric component which has been ground without the prior use of an annealing process and with the use of an abrasive substance which has abrasive grains.
- FIG. 4 shows that an abrasive grain 24 is in the piezoelectric process during the grinding process
- Multilayer component was pressed and remained in this after the grinding process.
- the abrasive grain 24 has a negative effect in the multilayer component 1. It leads
- Multi-layer components to be ground together with ceramic cones and without the addition of an abrasive.
- a smoothness of the surfaces can be achieved, the is comparable to the result of the material abrasion by rubbing the piezoelectric multilayer components 1 together.
- an additional step for the separation of the piezoelectric multilayer components and the ceramic cone after grinding is still required.
- Multi-layer components 1 are rounded in the desired manner.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102016110216.4A DE102016110216B4 (de) | 2016-06-02 | 2016-06-02 | Verfahren zur Herstellung einer Vielzahl von piezoelektrischen Vielschichtbauelementen |
PCT/EP2017/063196 WO2017207654A2 (de) | 2016-06-02 | 2017-05-31 | Verfahren zur herstellung einer vielzahl von piezoelektrischen vielschichtbauelementen |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3465789A2 true EP3465789A2 (de) | 2019-04-10 |
Family
ID=59014595
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP17728135.9A Pending EP3465789A2 (de) | 2016-06-02 | 2017-05-31 | Verfahren zur herstellung einer vielzahl von piezoelektrischen vielschichtbauelementen |
Country Status (6)
Country | Link |
---|---|
US (1) | US11024794B2 (de) |
EP (1) | EP3465789A2 (de) |
JP (1) | JP6735418B2 (de) |
CN (1) | CN109643753A (de) |
DE (1) | DE102016110216B4 (de) |
WO (1) | WO2017207654A2 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102019107238A1 (de) * | 2019-03-21 | 2020-09-24 | Relyon Plasma Gmbh | Vorrichtung und Bauelement zur Erzeugung einer hohen Spannung oder hohen Feldstärke |
DE102019135497B4 (de) * | 2019-12-20 | 2021-11-11 | Nova Plasma Ltd | Piezoelektrischer Plasmagenerator und Verfahren zum Betrieb eines piezoelektrischen Plasmagenerators |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE691672C (de) | 1936-03-07 | 1940-06-03 | Fraembs & Freudenberg | Antrieb von Polierbehaeltern fuer Massengueter |
JP3053962B2 (ja) * | 1992-06-03 | 2000-06-19 | イビデン株式会社 | セラミックス多層基板の製造方法 |
JPH07335481A (ja) | 1994-06-10 | 1995-12-22 | Murata Mfg Co Ltd | セラミック電子部品及びその製造方法 |
JPH08316088A (ja) * | 1995-05-12 | 1996-11-29 | Murata Mfg Co Ltd | セラミック電子部品の製造方法 |
US5801073A (en) * | 1995-05-25 | 1998-09-01 | Charles Stark Draper Laboratory | Net-shape ceramic processing for electronic devices and packages |
DE10205928A1 (de) | 2001-02-21 | 2002-08-22 | Ceramtec Ag | Verfahren zur Herstellung piezokeramischer Vielschichtaktoren |
JP2005038904A (ja) * | 2003-07-15 | 2005-02-10 | Murata Mfg Co Ltd | 積層セラミック電子部品およびその製造方法 |
JP2005183477A (ja) | 2003-12-16 | 2005-07-07 | Murata Mfg Co Ltd | セラミック電子部品およびその製造方法 |
JP4687670B2 (ja) | 2007-03-14 | 2011-05-25 | Tdk株式会社 | 積層型セラミック電子部品の製造方法 |
DE102007019316A1 (de) | 2007-04-24 | 2008-11-06 | Rösler Holding GmbH & Co. KG | Gleitschliffanlage |
JP4655117B2 (ja) * | 2008-06-27 | 2011-03-23 | Tdk株式会社 | チップ部品の製造方法 |
JP5177452B2 (ja) * | 2010-01-20 | 2013-04-03 | Tdk株式会社 | 積層型電子部品の製造方法 |
JP5246215B2 (ja) * | 2010-07-21 | 2013-07-24 | 株式会社村田製作所 | セラミック電子部品及び配線基板 |
US20130342080A1 (en) | 2011-04-05 | 2013-12-26 | Honda Motor Co., Ltd. | Laminated piezoelectric body |
KR101511001B1 (ko) * | 2012-11-14 | 2015-04-10 | 엔지케이 인슐레이터 엘티디 | 복합 기판 |
JP6442881B2 (ja) | 2014-06-17 | 2018-12-26 | 株式会社村田製作所 | セラミック電子部品の製造方法 |
DE102014110405A1 (de) * | 2014-07-23 | 2016-01-28 | Epcos Ag | Piezoelektrischer Transformator |
-
2016
- 2016-06-02 DE DE102016110216.4A patent/DE102016110216B4/de active Active
-
2017
- 2017-05-31 EP EP17728135.9A patent/EP3465789A2/de active Pending
- 2017-05-31 CN CN201780045723.5A patent/CN109643753A/zh active Pending
- 2017-05-31 WO PCT/EP2017/063196 patent/WO2017207654A2/de unknown
- 2017-05-31 US US16/306,512 patent/US11024794B2/en active Active
- 2017-05-31 JP JP2019516066A patent/JP6735418B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
CN109643753A (zh) | 2019-04-16 |
US11024794B2 (en) | 2021-06-01 |
JP6735418B2 (ja) | 2020-08-05 |
DE102016110216A1 (de) | 2017-12-07 |
WO2017207654A3 (de) | 2018-01-25 |
DE102016110216B4 (de) | 2018-10-11 |
JP2019522381A (ja) | 2019-08-08 |
US20190252598A1 (en) | 2019-08-15 |
WO2017207654A2 (de) | 2017-12-07 |
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