EP3369296A1 - Control device for a gearbox control system of a motor vehicle - Google Patents
Control device for a gearbox control system of a motor vehicleInfo
- Publication number
- EP3369296A1 EP3369296A1 EP16760711.8A EP16760711A EP3369296A1 EP 3369296 A1 EP3369296 A1 EP 3369296A1 EP 16760711 A EP16760711 A EP 16760711A EP 3369296 A1 EP3369296 A1 EP 3369296A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- circuit board
- heat sink
- control device
- heat
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 150000001875 compounds Chemical class 0.000 claims abstract description 13
- 238000004382 potting Methods 0.000 claims abstract description 11
- 230000005540 biological transmission Effects 0.000 claims description 16
- 239000011888 foil Substances 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000011156 evaluation Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000002470 thermal conductor Substances 0.000 claims description 2
- 238000001816 cooling Methods 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 description 7
- 239000003921 oil Substances 0.000 description 3
- 230000000284 resting effect Effects 0.000 description 3
- 230000010512 thermal transition Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000012208 gear oil Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- 241000137586 Ambigolimax valentianus Species 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16H—GEARING
- F16H61/00—Control functions within control units of change-speed- or reversing-gearings for conveying rotary motion ; Control of exclusively fluid gearing, friction gearing, gearings with endless flexible members or other particular types of gearing
- F16H61/0003—Arrangement or mounting of elements of the control apparatus, e.g. valve assemblies or snapfittings of valves; Arrangements of the control unit on or in the transmission gearbox
- F16H61/0006—Electronic control units for transmission control, e.g. connectors, casings or circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20463—Filling compound, e.g. potted resin
Definitions
- control devices for transmissions inside gearboxes.
- the control devices are in contact with a transmission oil.
- the control devices for transmission controls, especially in automatic transmissions, today not only control solenoid valves for the hydraulic control, but also electric motor driven oil pumps, in particular, to realize start-stop functions.
- the required power components in the control device in this case generate a high power loss, which are dissipated via thermal dissipation devices.
- PCBs Printed Circuit Boards, PCBs, in the
- DE 10 2013 215 364 describes an electronic circuit module with components arranged on both sides of a printed circuit board, wherein at least one heat sink exerts a contact force in the direction of an electronic component to be cooled in the direction of the printed circuit board and is spaced from the printed circuit board. Disclosure of the invention
- Embodiments of the present invention may advantageously enable to provide a compact control device for a transmission control of a motor vehicle with a good heat dissipation.
- a control device for a transmission control of a motor vehicle may advantageously enable to provide a compact control device for a transmission control of a motor vehicle with a good heat dissipation.
- a rigid circuit board which is equipped on both sides with electrical components, and arranged with at least one heat sink to the circuit board, wherein the arranged at least one heat sink on the side of the circuit board is on the
- Power components are arranged, and having a potting compound which at least partially surrounds the components.
- the control device according to the invention is characterized in particular by the fact that the printed circuit board is fastened directly on the heat sink.
- the at least one heat sink is preferably produced as a stamped sheet metal part, wherein in particular the preferred material is aluminum.
- the printed circuit board is, as described above, preferably designed such that it normal operating temperatures of
- two heat sinks are preferably arranged in a stacked manner, wherein in particular the two heat sinks are produced in the production process by punch riveting.
- the two stacked cooling plates also provide improved flexural rigidity.
- other components can be better and safer attached to the circuit board or on the outer heat sink and shorten the heat removal paths.
- the printed circuit board is glued to the heat sink for thermal heat conduction and in particular fixed mechanically to the heat sink.
- the circuit board has at least one thick copper conductor track with particular 100 ⁇ conductor track thickness, wherein in addition to electrically conductive traces thermal traces are formed, leading to passages from the top of the circuit board and staggered passages from the bottom of the circuit board and are formed.
- the control device is designed as an integrated module with sensors and evaluation and control electronics as active components with electrical circuit.
- the sensors may be, for example, pressure sensors for hydraulic devices or speed sensors. More preferably, the sensors are clamped to the control device, in particular between the circuit board and the at least two heat sinks arranged and fixed. In particular, a further fuse may additionally be arranged on the outer heat sink.
- Control device by means of the heat sink mechanically fastened to the transmission housing in the transmission interior.
- the at least one heat sink which is the furthest spaced from the circuit board, holes, so that the control device can be fastened by means of, for example, a screw in the transmission inner housing.
- Heat conducting device in particular a heat conducting foil, further preferably arranged a multilayer heat conducting foil or a heat conducting foil with a larger foil thickness between component and heat sink.
- a continuous heat conduction path for components which are arranged on the underside of the circuit board, to the outer, of the circuit board
- FIG. 1 shows a cross-sectional view of a control device according to the invention.
- the control device 100 has a rigid printed circuit board 1, so-called Printed Circuit Board, PCB.
- the circuit board 1 is equipped on both sides la, lb with electrical components 3, 4, 15, 18.
- the electrical components 3, 4, 15, 18 have different heights
- the components 4, which have a low power loss, are arranged on the upper side 1a, and the components 3, in particular power components with a high power dissipation, are arranged on the underside 1b of the printed circuit board 1, on which two heat sinks 21, 22 are arranged.
- the components 4 on the top la of the circuit board 1 are enveloped by a potting compound 9 and against external influences,
- the device 15 which is mounted on the bottom lb of the circuit board 1, the terminal tips on the top la of
- circuit board 1 are also with the potting compound.
- the circuit board 1 is according to the invention directly on the heat sink 21.
- the heat sink 21 has recesses 10 in which components 3 and power components and electronic sensors 15, 18 are arranged.
- heat conduction paths and thermal transitions are shortened and minimized. Longer heat paths and longer thermal transitions are possible Components 4, which have a lower power loss.
- Power components 3 for example for the control of an electric pump, are arranged on the underside 1b of the printed circuit board 1.
- the heat sink 21 and the second heat sink 22 are both preferably one
- the printed circuit board 1 is a conventional printed circuit board, which can withstand an operating temperature of 150 ° C and therefore does not have to be made of a ceramic.
- the components 3 with a high power dissipation which are arranged on the underside 1b of the printed circuit board 1, are used in a so-called slug-up design.
- the electrical circuit 31 spaced from the circuit board 1 in the vicinity lying on the second heat sink 22 on the surface of the device 3 are arranged.
- either a heat-conducting foil 8 between the component 3 and the electrical circuit 31 is shown resting on the heat sink 22 by means of one layer or two layers.
- the recess 10 of the heat sink 21, in each of which the component 3 is arranged with a heat-conducting foil 8, is filled up by means of the potting compound 9.
- the potting compound 9 is also formed thermally conductive and heat dissipating.
- components 4 are arranged with an electric circuit 41 in a slug down design.
- the electrical circuits 41 are arranged on the bottom of the component, so that they rest directly on the circuit board 1.
- passages 7, so-called vias are formed by the printed circuit board 1, which dissipate the heat from the component 4 to the heat sink 21 and 22.
- section X in the left component 4 shown in FIG. 1, a special heat conduction construction is realized.
- a thick copper layer in the circuit board 1 e.g. with a thickness of 100 ⁇ not only assigned electrical conductors, but at least one self-contained thermal conductor 6 is created by the fact that passages 7 of the
- the heat sink 21 is located directly on the underside 1b, so that the heat is drawn off here via the heat sink 21 and the heat sink 22 attached thereto.
- Heatsink 21, 22 passes efficiently, the circuit board 1 is glued to the heat sink 21 for a short thermal heat path and additionally mechanically fixed.
- the control device 100 is an integrated module with sensors and active components with electrical circuitry, which has an evaluation and / or
- Control electronics include.
- the components 3 can be different
- the components 3 are directly on the heat sink 22 or indirectly over a heat-conducting foil 8. The components 3 therefore have a short thermal transition and a very short heat path.
- the potting compound 9, which is a plastic compound, is on the
- the control device 100 is mounted in the interior, for example by means of screw 12 in the interior of a transmission.
- the control unit is mounted on hydraulic circuit boards 13, whereby thereby introduced into the heat sinks 21, 22 power loss can be forwarded to the large thermal mass of the circuit boards.
- the circuit board 1 has at least one connector 14 as a socket or plug, which is contacted with a vehicle wiring harness and with the other sensors are electrically contacted.
- the other sensors are speed, position and / or pressure sensors.
- the pressure sensor is on the pins, so-called.
- speed sensors 18 can be clamped between the circuit board 1 and the heat sink plate 22 and accurately positioned by holes 19 in the plate 22.
- the speed sensors 18 are soldered to the printed circuit board 1 also via solder joints 20, on the top side la electrically conductive.
- solder joints 20 on the top side la electrically conductive.
- Gear oil may include electrically conductive metals as a result of wear and abrasion, which could cause a short circuit. It is also known that gear oil in conjunction with other materials and high temperatures form conductive deposits which also lead to electrical short circuits. By covering all electrical contact points with the
- Heat dissipation is realized in a control device 100.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015221149.5A DE102015221149A1 (en) | 2015-10-29 | 2015-10-29 | Control device for a transmission control of a motor vehicle |
PCT/EP2016/070859 WO2017071860A1 (en) | 2015-10-29 | 2016-09-05 | Control device for a gearbox control system of a motor vehicle |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3369296A1 true EP3369296A1 (en) | 2018-09-05 |
EP3369296B1 EP3369296B1 (en) | 2020-08-26 |
Family
ID=56877034
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP16760711.8A Active EP3369296B1 (en) | 2015-10-29 | 2016-09-05 | Control device for a gearbox control system of a motor vehicle |
Country Status (5)
Country | Link |
---|---|
US (1) | US10925193B2 (en) |
EP (1) | EP3369296B1 (en) |
CN (1) | CN108141975B (en) |
DE (1) | DE102015221149A1 (en) |
WO (1) | WO2017071860A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017211513A1 (en) * | 2017-07-06 | 2019-01-10 | Robert Bosch Gmbh | Electronic module and combination of an electronic module with a hydraulic plate |
DE102018007243B4 (en) * | 2018-09-13 | 2020-08-13 | Diehl Ako Stiftung & Co. Kg | Electrical circuit |
DE102018217349A1 (en) * | 2018-10-10 | 2020-04-16 | Conti Temic Microelectronic Gmbh | Circuit board |
DE102020208376A1 (en) * | 2020-07-03 | 2022-01-05 | Continental Teves Ag & Co. Ohg | Pump unit with thermally conductive material on a film layer |
DE102020132449A1 (en) | 2020-12-07 | 2022-06-09 | Nidec Gpm Gmbh | Electric centrifugal pump |
DE102020132447A1 (en) | 2020-12-07 | 2022-06-09 | Nidec Gpm Gmbh | Electric centrifugal pump |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19722357C1 (en) * | 1997-05-28 | 1998-11-19 | Bosch Gmbh Robert | Control unit |
DE19910500A1 (en) | 1999-03-10 | 2000-10-05 | Bosch Gmbh Robert | Electrical device such as control device with printed circuit board having heat generating components, has heat sink elements located for easy soldering to printed circuit board |
US6605778B2 (en) * | 2000-10-02 | 2003-08-12 | Siemens Aktiengesellschaft | Circuit carrier, in particular printed circuit board |
DE10127268A1 (en) * | 2000-10-02 | 2002-04-25 | Siemens Ag | Printed circuit board as a circuit carrier with two metal outer layers and a metal intermediate layer has insulating layers between the outer and intermediate layers with a cooling component on an outer layer linked via a heat path. |
JP3910497B2 (en) * | 2002-07-03 | 2007-04-25 | 株式会社オートネットワーク技術研究所 | Power circuit waterproofing method and power module having power circuit |
JP4311243B2 (en) * | 2004-03-15 | 2009-08-12 | 株式会社デンソー | Electronics |
DE102004021365A1 (en) * | 2004-03-16 | 2005-10-06 | Robert Bosch Gmbh | Housing for an electronic circuit and method for sealing the housing |
JP4473141B2 (en) | 2005-01-04 | 2010-06-02 | 日立オートモティブシステムズ株式会社 | Electronic control unit |
DE102005002813B4 (en) * | 2005-01-20 | 2006-10-19 | Robert Bosch Gmbh | control module |
AT8722U1 (en) * | 2005-06-06 | 2006-11-15 | Siemens Ag Oesterreich | Arrangement for cooling a group of power electronic components |
DE102007029913A1 (en) * | 2007-06-28 | 2009-01-02 | Robert Bosch Gmbh | Electric control unit |
DE102007061116A1 (en) * | 2007-12-19 | 2009-06-25 | Robert Bosch Gmbh | Control unit housing |
JP2010245174A (en) * | 2009-04-02 | 2010-10-28 | Denso Corp | Electronic control unit and method of manufacturing the same |
JP5110049B2 (en) * | 2009-07-16 | 2012-12-26 | 株式会社デンソー | Electronic control device |
CN201805622U (en) | 2010-08-23 | 2011-04-20 | 中兴通讯股份有限公司 | Printed circuit board component and electronic equipment |
JP5570361B2 (en) * | 2010-09-22 | 2014-08-13 | 三菱電機株式会社 | Waterproof electronic device and method of assembling the same |
US20120240898A1 (en) * | 2011-03-23 | 2012-09-27 | Visteon Global Technologies, Inc. | Integrated plastic throttle body, electronic control unit, and sensors for small engine |
US20130308274A1 (en) * | 2012-05-21 | 2013-11-21 | Triquint Semiconductor, Inc. | Thermal spreader having graduated thermal expansion parameters |
JP2014063930A (en) * | 2012-09-21 | 2014-04-10 | Hitachi Automotive Systems Ltd | Electronic controller |
DE102013212398A1 (en) * | 2013-06-27 | 2014-12-31 | Zf Friedrichshafen Ag | Circuit device and method for producing a circuit device for controlling a transmission of a vehicle |
DE102013215368A1 (en) | 2013-08-05 | 2015-02-05 | Zf Friedrichshafen Ag | Electronic unit with circuit board |
DE102013215364A1 (en) | 2013-08-05 | 2015-02-05 | Zf Friedrichshafen Ag | Electronic circuit module with fixed heat sink and manufacturing process |
DE102013223542A1 (en) * | 2013-11-19 | 2015-05-21 | Zf Friedrichshafen Ag | Electronic unit with circuit board |
DE102013226150A1 (en) * | 2013-12-17 | 2015-06-18 | Robert Bosch Gmbh | Method for producing an electronic module with positively connected housing part element |
-
2015
- 2015-10-29 DE DE102015221149.5A patent/DE102015221149A1/en not_active Withdrawn
-
2016
- 2016-09-05 EP EP16760711.8A patent/EP3369296B1/en active Active
- 2016-09-05 US US15/767,414 patent/US10925193B2/en active Active
- 2016-09-05 WO PCT/EP2016/070859 patent/WO2017071860A1/en active Application Filing
- 2016-09-05 CN CN201680063414.6A patent/CN108141975B/en active Active
Also Published As
Publication number | Publication date |
---|---|
US10925193B2 (en) | 2021-02-16 |
DE102015221149A1 (en) | 2017-05-04 |
EP3369296B1 (en) | 2020-08-26 |
CN108141975A (en) | 2018-06-08 |
US20180303009A1 (en) | 2018-10-18 |
WO2017071860A1 (en) | 2017-05-04 |
CN108141975B (en) | 2021-07-30 |
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