EP3350511A1 - Heat sink device for a motor vehicle lighting module - Google Patents
Heat sink device for a motor vehicle lighting moduleInfo
- Publication number
- EP3350511A1 EP3350511A1 EP16763816.2A EP16763816A EP3350511A1 EP 3350511 A1 EP3350511 A1 EP 3350511A1 EP 16763816 A EP16763816 A EP 16763816A EP 3350511 A1 EP3350511 A1 EP 3350511A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- base
- printed circuit
- cooling fins
- heat dissipation
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims abstract description 31
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 19
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 230000017525 heat dissipation Effects 0.000 claims description 21
- 238000002788 crimping Methods 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 abstract 1
- 238000006116 polymerization reaction Methods 0.000 description 6
- 239000012080 ambient air Substances 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000003570 air Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 230000011664 signaling Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 208000021017 Weight Gain Diseases 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000004584 weight gain Effects 0.000 description 1
- 235000019786 weight gain Nutrition 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/49—Attachment of the cooling means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
- F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/005—Sealing arrangements therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/10—Protection of lighting devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/50—Waterproofing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
Definitions
- the invention relates to the field of lighting and light signaling, in particular for a motor vehicle.
- LEDs In the field of lighting and light signaling for motor vehicles, it is becoming more and more common to use light sources with electroluminescent semiconductor components, for example light-emitting diodes, LEDs.
- An LED component emits light rays when a voltage of a value at least equal to a threshold value called forward voltage is applied to these terminals.
- one or more LEDs of a light module for a motor vehicle are powered through power control means, which include converter circuits.
- the power control means are configured to convert an electric current of a first intensity, for example provided by a current source of the motor vehicle, such as a battery, into a charging current having a second intensity, different from the first.
- the charging current generally has a constant intensity.
- the object of the invention is to propose a solution that overcomes the aforementioned problem.
- the invention proposes a device for light heat dissipation with a high thermal conductivity and capable, in preferred embodiments, to be installed according to several orientations, while ensuring good dissipation of the heat produced by the electronic components of a light module for a motor vehicle.
- the invention relates to a heat dissipation device for a light module of a motor vehicle.
- the device comprises a base intended to receive on a first face a printed circuit and comprising heat dissipation means on a second opposite face.
- the device is remarkable in that the heat dissipation means comprise cooling fins formed by folds of at least one metal sheet, the fins of heat dissipation being secured to the base by means of a fastener between at least one of the folds. and the base.
- the base may preferably form a main heat sink of the device.
- the base may be stamped aluminum.
- the base may advantageously have a generally flat geometry. Preferably, it may have a generally rectangular outline.
- the base may preferably be intended to receive a printed circuit on one of its faces.
- the printed circuit may comprise a circuit for controlling the power supply of the light source of the light module, in particular capable of controlling the power supply of these light sources for the selective production of a plurality of light functions, for example lighting driving lights, dipped lights, daytime running lights, or position lights.
- the cooling fins may preferably be aluminum.
- the metal foil may preferably have a thickness of less than 1 mm, preferably 0.6 mm.
- the dissipation fins may be formed by one or more cladded and knurled aluminum sheets.
- the height of the cooling fins relative to the base may preferably be between 15 mm and 25 mm.
- the base and / or the cooling fins may have a thermal conductivity between 180 and 230 W / (mK).
- the fins of heat dissipation may preferably extendretret following at least two different directions parallel to the base.
- the device may preferably comprise a plurality of cooling fins, at least two groups of fins extend in two directions perpendicular to each other.
- Said plurality of vanes may comprise a first group of vanes extending peripherally of the base, along two first parallel and opposite edges of the base and a second group of vanes extending peripherally of the base, along two second parallel and opposite edges of the base and in particular perpendicular to the first edges.
- the plurality of vanes may comprise a third group of vanes extending in a central region of the base and in a direction parallel to that of the first group.
- the device may comprise a plurality of cooling fins which extend radially in a plurality of directions from a central portion of the base.
- the device may preferably comprise a thermal interface disposed between the cooling fins and the base, for example silicone.
- the cooling fins may preferably be glued to the base of the device.
- the bonding can be carried out using a polymerization adhesive in a polymerization furnace.
- the glue may be a high thermal conduction glue.
- the cooling fins can be attached to the base by soldering.
- the brazing may preferably be carried out by means of aluminum oxide.
- the base may preferably comprise, on its first face, crimping pins for fixing a printed circuit on this face.
- the crimp pins may preferably be formed by stamping.
- the device may further include a stamped aluminum cover for sealingly attaching to the first face of the base.
- the thermal conductivity of the lid may preferably be between 180 and 230 W / (mK).
- the lid can be attached to the base by means of a seal.
- the seal may for example be rubber.
- the cover may preferably comprise an opening giving access to the interior of the device, that is to say to the space intended to receive a printed circuit.
- the opening makes it possible for example to make an electrical connection from the outside of the device with the printed circuit
- the device may preferably comprise a protective grid, preferably made of plastic, for covering the cooling fins.
- the subject of the invention is also a light module for a motor vehicle comprising at least one light source with a semiconductor element and a printed circuit comprising a circuit for controlling the power supply of the light source (s).
- the light module is remarkable in that the printed circuit is fixed on a thermal dissipation device of the module, the device being in accordance with the invention.
- the base of the device may preferably comprise means for fixing the device in the module.
- the printed circuit board may preferably be sealed by a cover of the heat dissipating device.
- the measures of the invention are interesting in that they make it possible to propose a compact and lightweight heat dissipation device, nevertheless having a significant heat dissipation capacity. This is due to the use of high conductivity aluminum which is stamped and / or bent to make the components of the device. Compared to known solutions making use of injected aluminum comprising a large percentage of additives, production cost savings of about 30% and weight gains of about 40% have been observed.
- the bonding step can be performed together with the bonding of the printed circuit.
- the arrangement of the fins in a plurality of directions ensures that air can flow between the fins regardless of the orientation and location of the device within a light module for a motor vehicle.
- the heat dissipation power can be adjusted by adapting the dimensions of the fins, and in particular their height relative to the base of the device.
- FIG. 1 is a perspective view from below of a device according to a preferred embodiment of the present invention.
- FIG. 2 is a perspective view from above of a device according to a preferred embodiment of the present invention.
- FIG. 3 is a perspective view from above of a device according to a preferred embodiment of the present invention, including a printed circuit;
- FIG. 4 is a perspective view from above of a device according to a preferred embodiment of the present invention, including a cover;
- FIG. 5 is a perspective view from above of a device according to a preferred embodiment of the present invention.
- FIG. 6 is a schematic representation of a bottom view of a device according to a preferred embodiment of the present invention.
- like reference numerals will be used to describe similar concepts through different embodiments of the invention.
- the numbers 100, 200, 300 describe a heat dissipation device in three different embodiments according to the invention.
- FIG. 1 shows a heat dissipation device 100 for a light module of a motor vehicle according to a first exemplary embodiment of the invention.
- the device comprises a base 10 with a generally flat geometry, which is preferably of substantially pure aluminum, and which has a thermal conductivity between 180 and 230 W / (m-K).
- the base has a contour of generally rectangular shape.
- the base forms a main heat sink element of the device.
- a first face 1 12, shown facing downwards, is intended to receive a printed circuit not shown.
- the printed circuit may for example comprise light sources of the light module. They may be light sources with a semiconductor component, for example light-emitting diodes, LEDs. Alternatively, the printed circuit may comprise a circuit for controlling the power supply of such light sources. Converters of such a circuit, such as light sources, generate in general a significant heat during operation, that the device 100 must be able to dissipate.
- a second face 1 14, opposite the first face 1 12 and illustrated upwardly, comprises cooling fins 120 which are secured to the base by means of a fixing between at least one of the folds and the base.
- the fins extend in the example shown and according to a preferred embodiment, in at least two different directions but parallel to the plane of the base 1 10 to create grooves or channels of air flow. In the example shown, there are two directions A, B generally perpendicular to each other.
- the fins of cooling 140 are formed by folds of a metal sheet.
- the sheet preferably has a thin thickness of less than one millimeter, for example 0.6 mm.
- it is also made of aluminum and has a high thermal conductivity which is between 180 and 230 W / (mK).
- the dissipation fins may be formed by one or more cladded and knurled aluminum sheets.
- the height of the folds is chosen according to the intended application. A greater height of the folds involves an increased heat exchange surface of the fins relative to the ambient air, and therefore a greater heat dissipation of the device.
- the height of the folds may, for example, be between 15 and 25 mm.
- the cooling fins are fixed to the face 1 14 of the base 1 10 so as to ensure good mechanical strength and a good thermal connection between the two elements.
- the bond is preferably made by bonding with a polymerization adhesive which is cured during a passage of the device in a polymerization furnace.
- FIG. 1 shows several fin groups, two in each of directions A and B, which can be bent from the same aluminum sheet. Alternatively each group, or each of the fins can be folded from a dedicated aluminum sheet.
- a non-illustrated protective grid preferably made of plastic, may be provided to cover the cooling fins, in order to protect them against possible mechanical shocks.
- Figure 2 shows the first face 1 12, which is opposite to the face 1 14 of the base 1 10 of the device 100. This face is intended to receive a printed circuit which comprises active electronic elements producing heat.
- the face 1 12 comprises crimping pins 1 13 intended to cooperate with holes provided for this purpose in the substrate of a printed circuit.
- the crimping pins 1 13 are preferably drawn out of the aluminum plate which forms the base 1 10. To ensure this effect, it is necessary to provide a thickness of the base of at least 3 to 4 mm.
- FIG. 3 shows, as an example, a printed circuit 10, without illustrating the electronic components thereof, retained by the pins 1, 13.
- the crimping makes it possible to ensure good mechanical strength and good thermal contact between the substrate of the printed circuit and the base 1 10, to ensure the heat exchange between the two elements.
- the printed circuit can be glued with a thermal conductivity glue, for example a polymerization glue on the face 1 12 of the base 1 10.
- the heat exchange is first between the printed circuit, on which the heat is produced, and the base 1 10 of the device 100. Then, through the thermal connection of the base 1 10 with the cooling fins 120, the heat passes to them.
- the cooling fins have a large heat exchange surface with ambient air that dissipates heat.
- FIG. 4 shows the device 100 comprising the base 1 10, on a face 1 14 of which the cooling fins 120 are fixed.
- the opposite face 1 12 of the base 1 10 is covered by a cover 130.
- the cover protects the circuit board that it covers on the face 1 12 with respect to mechanical shocks, and with respect to possible electromagnetic interference. It can also contribute to the overall heat dissipation capability of the device.
- the shape of the sheet is obtained by stamping with a suitable tool.
- the aluminum variant used preferably has a thermal conductivity which is between 180 and 230 W / (mK).
- the lower edge of the lid can in known manner cooperate with the edge of the base 1 10 in order to bind the two elements.
- FIG. 5 shows another embodiment of the heat dissipation device 200 according to the invention.
- the device comprises a base 210 with a generally flat geometry, which is preferably made of aluminum and which has a thermal conductivity between 180 and 230 W / (mK).
- a first face 212 shown facing upwards, is intended to receive a printed circuit not shown.
- a second face 214 opposite the first face 212 and shown facing downwards, comprises cooling fins 220 which extend in at least two different directions but parallel to the plane of the base 210.
- the face 212 has the particularity that a recessed portion 216 has been made by stamping the base 210.
- Such a configuration is advantageous when the heat dissipating device 200 is provided to house a printed circuit which comprises electronic components mounted on these two planar surfaces.
- FIG. 6 shows a diagrammatic view from above of a further embodiment of the heat dissipating device 300 according to the invention.
- the face 314 of the base 310 is shown. This is the face on which the cooling fins 320 are fixed.
- an alternative arrangement of the cooling fins is exemplarily illustrated.
- the fins 320 extend radially from a central portion of the base 310 to form a star or circular structure. Each pair whose cooling fins are radially opposite to the center is oriented in one direction. Other geometries of arrangement of the cooling fins are conceivable.
- a greater plurality of directions in which the cooling fins extend generally implies greater flexibility in the placement and orientation of the device 300 within a light module. With the increasing number of ambient air flow directions, the likelihood of heat exchange between the cooling fins and the ambient air is generally increased.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Motor Or Generator Cooling System (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1558520A FR3041080B1 (en) | 2015-09-14 | 2015-09-14 | THERMAL DISSIPATION DEVICE FOR A LIGHT MODULE OF A MOTOR VEHICLE |
PCT/EP2016/071379 WO2017046016A1 (en) | 2015-09-14 | 2016-09-09 | Heat sink device for a motor vehicle lighting module |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3350511A1 true EP3350511A1 (en) | 2018-07-25 |
EP3350511B1 EP3350511B1 (en) | 2019-08-28 |
Family
ID=54707946
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP16763816.2A Active EP3350511B1 (en) | 2015-09-14 | 2016-09-09 | Heat sink device for a motor vehicle lighting module |
Country Status (5)
Country | Link |
---|---|
US (1) | US20180252383A1 (en) |
EP (1) | EP3350511B1 (en) |
CN (1) | CN108139070A (en) |
FR (1) | FR3041080B1 (en) |
WO (1) | WO2017046016A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3115860A1 (en) * | 2020-10-30 | 2022-05-06 | Valeo Vision | LIGHT SOURCE SUPPORT WITH HEAT TRANSFER GROOVE |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10260705B2 (en) * | 2015-03-31 | 2019-04-16 | Koninklijke Philips N.V. | LED lighting module with heat sink and a method of replacing an LED module |
JP2022500840A (en) * | 2018-09-07 | 2022-01-04 | ルミレッズ リミテッド ライアビリティ カンパニー | Lighting devices including circuit boards |
EP3663642A1 (en) * | 2018-12-04 | 2020-06-10 | ZKW Group GmbH | Heat sink for a motor vehicle light module |
WO2022103432A1 (en) * | 2020-11-13 | 2022-05-19 | Hgci, Inc. | Heat sink for light fixture for indoor grow application |
EP4022219A4 (en) * | 2020-11-13 | 2023-04-12 | HGCI, Inc. | Heat sink for light fixture for indoor grow application |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1721808A (en) * | 1920-08-23 | 1929-07-23 | Gen Motors Res Corp | Heat-exchange apparatus |
US6401807B1 (en) * | 1997-04-03 | 2002-06-11 | Silent Systems, Inc. | Folded fin heat sink and fan attachment |
WO2005070159A2 (en) * | 2004-01-12 | 2005-08-04 | Litelaser L.L.C. | Laser cooling system and method |
JP2008059965A (en) * | 2006-09-01 | 2008-03-13 | Stanley Electric Co Ltd | Vehicular headlamp, lighting system and its heat radiation member |
JP5059479B2 (en) * | 2007-04-26 | 2012-10-24 | 株式会社小糸製作所 | Vehicle headlamp |
CN101368713B (en) * | 2007-08-17 | 2010-11-10 | 富准精密工业(深圳)有限公司 | Heat radiator |
CN201892180U (en) * | 2010-01-28 | 2011-07-06 | 陈世明 | Combined structure of bent-surface fin module and heat source |
DE202010002406U1 (en) * | 2010-02-16 | 2010-05-06 | Automotive Lighting Reutlingen Gmbh | Lighting device of a motor vehicle |
JP5497102B2 (en) * | 2011-06-08 | 2014-05-21 | 株式会社Uacj | Pre-coated aluminum alloy plate for heat dissipation member and heat dissipation member using the same |
JP3181237U (en) * | 2012-11-13 | 2013-01-31 | 昭欽 葉 | LED lamp |
EP2738456A1 (en) * | 2012-11-28 | 2014-06-04 | Chao-Chin Yeh | Combination led lamp and heat sink structure |
FR3004787B1 (en) * | 2013-04-19 | 2017-09-08 | Valeo Vision | COOLING DEVICE AND LIGHTING OR SIGNALING DEVICE FOR A MOTOR VEHICLE COMPRISING SUCH AN ORGAN |
CN203273812U (en) * | 2013-05-24 | 2013-11-06 | 苏州红壹佰照明有限公司 | LED lamp radiator |
CN204227205U (en) * | 2014-11-12 | 2015-03-25 | 深圳市永欣光电子有限公司 | A kind of heat dissipation type floodlight |
-
2015
- 2015-09-14 FR FR1558520A patent/FR3041080B1/en active Active
-
2016
- 2016-09-09 US US15/759,967 patent/US20180252383A1/en not_active Abandoned
- 2016-09-09 WO PCT/EP2016/071379 patent/WO2017046016A1/en active Application Filing
- 2016-09-09 CN CN201680051888.9A patent/CN108139070A/en active Pending
- 2016-09-09 EP EP16763816.2A patent/EP3350511B1/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3115860A1 (en) * | 2020-10-30 | 2022-05-06 | Valeo Vision | LIGHT SOURCE SUPPORT WITH HEAT TRANSFER GROOVE |
Also Published As
Publication number | Publication date |
---|---|
WO2017046016A1 (en) | 2017-03-23 |
FR3041080A1 (en) | 2017-03-17 |
FR3041080B1 (en) | 2020-05-29 |
CN108139070A (en) | 2018-06-08 |
US20180252383A1 (en) | 2018-09-06 |
EP3350511B1 (en) | 2019-08-28 |
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