EP3329737A1 - Verbinden thermisch aufgespritzter schichtstrukturen von heizeinrichtungen - Google Patents
Verbinden thermisch aufgespritzter schichtstrukturen von heizeinrichtungenInfo
- Publication number
- EP3329737A1 EP3329737A1 EP16740977.0A EP16740977A EP3329737A1 EP 3329737 A1 EP3329737 A1 EP 3329737A1 EP 16740977 A EP16740977 A EP 16740977A EP 3329737 A1 EP3329737 A1 EP 3329737A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- heating device
- solder
- thermally sprayed
- layer structure
- sprayed layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 78
- 229910000679 solder Inorganic materials 0.000 claims abstract description 117
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000005476 soldering Methods 0.000 claims description 54
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 12
- 238000002604 ultrasonography Methods 0.000 claims description 11
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000010411 cooking Methods 0.000 abstract description 13
- 238000005406 washing Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 96
- 239000004020 conductor Substances 0.000 description 37
- 239000000463 material Substances 0.000 description 37
- 239000000919 ceramic Substances 0.000 description 8
- 230000004907 flux Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 230000008901 benefit Effects 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000005304 joining Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 238000010285 flame spraying Methods 0.000 description 5
- 238000005507 spraying Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 2
- 238000007750 plasma spraying Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- -1 aluminum compound Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 235000013353 coffee beverage Nutrition 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010283 detonation spraying Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000015114 espresso Nutrition 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000008236 heating water Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/262—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an insulated metal plate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
Definitions
- the invention relates to a heating device for a domestic appliance, comprising a flat carrier with a carrier surface, at least one layer structure thermally sprayed onto the carrier surface and at least one solder volume, which is applied to at least one thermally sprayed layer structure.
- the invention also relates to a household appliance with such a heater.
- the invention further relates to a method for producing a heating device for a domestic appliance, in which a planar carrier is provided with at least one thermally sprayed layer structure applied thereto.
- the invention is particularly advantageously applicable to cooking appliances, in particular with Dampfgarfunktion gleich, on washing machines, on dishwashers, on laundry care appliances and small household appliances.
- soldering e.g., laser soldering, reflow soldering, bulb soldering, etc.
- the joint or solder joint is flux treated to allow solder or solder (also called solder) to adhere.
- solder also called solder
- the thermally sprayed layer has a thin oxide layer or "oxide skin", which makes adhesion of the solder mass greatly difficult or even virtually impossible.
- the flux serves to chemically break up the oxide skin.
- the flux disadvantageously penetrates into the thermally sprayed layer because it is typically slightly porous. It can even penetrate further into underlying porous layers (for example an insulating layer) and impair their function. In order to avoid a negative influence of the flux (e.g., a deterioration of an electrical insulation property), it has heretofore been difficult to wash out with solvent.
- thermally sprayed metals eg copper, tin, bronze
- solder these metals by means of classical soldering methods.
- non-all-over connection surfaces made of thermally sprayed metals eg connection surfaces, pads, etc.
- Wear on masks is high.
- An order efficiency is low.
- DE 10 2012 204 235 A1 discloses a household appliance for preparing food, with a first component and a second component connected to the first component, wherein at least at a junction of the two components, the first component of a first material and the second component of a for formed first material different second material, and at the connection point for connecting the components, a solder joint is formed, wherein the solder joint a
- Ultrasonic solder joint is. DE 10 2012 204 235 A1 also relates to a method for producing a household appliance.
- EP 0 963 143 A1 discloses a ceramic carrier with an electrical circuit and with a connection device which has at least one metallic connection, for example in the form of a threaded bolt.
- the connection or the connection device are connected to the carrier with compensation means, which consist of a metal with a higher deformability than the material of the connection, preferably by means of active soldering.
- the compensating means may or the like in the form of an annular disc. be made of copper and compensate for the stresses during cooling.
- the active solder advantageously has a base of silver and copper as well as a reactive alloy component, eg titanium or a rare earth metal.
- the connection device can represent both a heavy-duty mechanical fastening connection for the carrier and an electrical connection for the circuit.
- DE 20 2010 007 081 U1 discloses a device for producing a gas-tight ultrasonic solder joint of two different materials as joining partners A and B at low temperatures, which have a corresponding binding ability with the solder material used, with the following features: a positioning and preheating device for a joining partner B lying on the joining device at the bottom, a positioning and laying device for the joining partner A to be set up, a warm-up and soldering device for joint warming and soldering of the joining partners A and B of a removal device for the joined joining partners A and B.
- DE 10 2013 201 386 A1 discloses a hob with a hob plate, on which at least one cooking point is formed, and an operating device comprising electronic components, which are positioned in a plan view of the hob plate next to the cooking position, and a pan detection device, with which the position a pot on the hob is recognizable plate, wherein the pan detection means comprises at least one electrically conductive sensor which is formed as a conductor on the hob plate and positional pot detection for electrical interaction with a preparation vessel, and at least in sections as a surface boundary for a surface on the hob plate is arranged, within which the electronic components are arranged.
- a heating device for a domestic appliance comprising a flat carrier with a carrier surface, at least one thermally sprayed onto the carrier surface layer structure and at least one solder volume, which is applied to at least one thermally sprayed layer structure, wherein the at least one solder volume an ultrasound soldered solder volume is.
- This heating device has the advantage that the solder or the solder mass of the solder volume adheres firmly to a thermally sprayed layer structure without further auxiliaries, with a low electrical contact resistance. This is due to the fact that the oxide skin of the thermally sprayed layer structure is broken up by introducing ultrasound energy. Thereby, the connection of the solder is made possible with the underlying non-oxidized material of the thermally sprayed layer, and in particular without the use of material without organic components, in particular without flux.
- the solder or the solder mass advantageously has a high electrical conductivity.
- an electrical resistance and a current carrying capacity of an electrical line or solder joint formed by the solder are dimensioned such that suitability exceeds a safety extra-low voltage, in particular in a power range (eg from 230 V to more than 8 A).
- a safety extra-low voltage in particular in a power range (eg from 230 V to more than 8 A).
- Solder connection also sufficiently dimensioned for use in the high voltage range (for example from approx. 1250 V AC or 1800 V AC).
- solder solder mass Due to the ultrasound support, it is generally possible to solder solder mass to surfaces which are not wettable with conventional soldering methods using solder. It is generally possible to firmly and precisely wet even very heavily oxidized surfaces or non-metallic (e.g., glassy or ceramic surfaces) with solder. For example, by ultrasonic soldering, exposed ceramic insulation (e.g., a ceramic insulating layer) can be easily contacted with solder mass mechanically and electrically.
- exposed ceramic insulation e.g., a ceramic insulating layer
- the ultrasonic soldering is easy to use because it does not need to be masked. Furthermore, in comparison to the thermal spraying of metallic connection layers, etc., it is significantly more efficient in material utilization (use of material for producing the soldering or jointing point). In addition, a saving of cycle time and cost can be achieved.
- the good adhesion is also achieved when the thermally sprayed layer structure is porous.
- the good adhesion remains under thermal cycling.
- the ultrasonic solder joint can be configured to be temperature-stable up to at least 150 ° C. It can also have a thermal and / or thermal sprayed-on layer It is resistant to aging even at high continuous service temperatures over the entire product life.
- a flat carrier can be understood, for example, to be a flat carrier or a curved carrier (for example in the form of a tube). The carrier may in particular have a plate-like basic shape.
- the carrier surface is an electrically insulating carrier surface.
- the electrically insulating support surface may be an electrically insulating layer (e.g., ceramic) applied to a base or substrate of the support (e.g., a metal sheet). This layer may also have been thermally sprayed on.
- the electrically insulating support surface may also be a surface-treated (e.g., oxidized) layer region of a base body of the support.
- the electrically insulating carrier surface may in particular have a non-negligible porosity. If solder flux is used, it may penetrate into its pores and, if necessary, reduce or even virtually eliminate an electrical insulation capability, especially when high voltage is applied.
- the base itself is electrically insulating and temperature resistant (up to at least 150 ° C)
- the support surface then represents the non-modified surface of the body. This may for example be the case if the body is made of ceramic.
- the support surface may be formed over its entire surface electrically insulating at least on a flat side, where there is a thermally sprayed layer or layer structure.
- the carrier surface is designed to be electrically insulating only below electrically conductive layers or layer structures, possibly protruding laterally beyond the layers or layer structures.
- electrically conductive thermally sprayed layer structures can be thermally sprayed onto the same width or slightly wider layer structures of an electrically insulating layer.
- a thermally sprayed layer can be understood as a layer which can be, for example, by melt spraying, arc spraying, plasma spraying (eg atmosphere, under protective gas or under low pressure), flame spraying (eg powder flame spraying, wire flame spraying or plastic flame spraying), high-velocity flame spraying, detonation spraying, cold gas spraying, laser spraying or PTWA syringes has been prepared, in particular has been ejected onto the support surface.
- flame spraying eg powder flame spraying, wire flame spraying or plastic flame spraying
- high-velocity flame spraying eg powder flame spraying, wire flame spraying or plastic flame spraying
- detonation spraying cold gas spraying
- laser spraying or PTWA syringes has been prepared, in particular has been ejected onto the support surface.
- At least one thermally sprayed layer or layer structure may be, for example, a metallic layer or layer structure, e.g. comprising aluminum (AI), bronze, copper (Cu), silver (Ag), tin (Sn), etc., or an alloy thereof.
- the thermally sprayed layer may also be a nickel-chromium alloy (NiCr).
- the thermally sprayed layer can also be a ceramic layer, for example an electrically insulating layer. A surface of the thermally sprayed layer or layer structure may be oxidized.
- a layer structure is understood to mean a layer which, in plan view, has a different shape from the shape of the carrier surface, that is to say not a layer covering the entire carrier surface over its entire area. Rather, the layer structure on the carrier or on the carrier surface in plan view has its own contour ("outer contour") which extends at least partially on the carrier surface (and not only at its edge).
- the layer structure may, in particular, be in the form of at least one elongated line trace or trace.
- the path can be completely or partially straight and / or curved in whole or in sections.
- the conduit may have a meandering course.
- the conduction path can be e.g. also in the form of a short strip or a rectangular, round, oval, etc. contact field.
- An ultrasonically soldered solder volume is in particular a solder volume that has been applied by means of an ultrasonic soldering method.
- At least one thermally sprayed layer structure is a resistance heating conductor layer, in particular a thick layer.
- the heating conductor layer may in particular be an elongated heating conductor.
- the heating conductor can, for example, meander or spiral. Lotmasse can in particular in the range at least one end of the Schuleiter GmbH - in particular Schuleiterbahn - are applied to electrically connect them.
- aluminum, an aluminum compound or a nickel-chromium compound may be provided as the material of the heating conductor layer.
- the heat conductor layer can therefore represent in particular a thermally sprayed surface heating for household appliances.
- At least one ultrasonically soldered solder volume electrically connects the thermally sprayed layer structure with at least one other component of the heating device.
- solder volume soldered on by ultrasound is a solder volume produced in one step or in one stage, which enables a particularly simple and rapid electrical connection.
- the solder volume can be applied, for example, in one operation by means of an ultrasonic soldering iron between the thermally sprayed layer structure and another component.
- At least one ultrasonically soldered solder volume is electrically connected to at least one other component of the heating device by means of a further solder volume not applied by ultrasound.
- a part of a solder joint can also be produced by means of another soldering method (eg laser soldering, reflow soldering, hand soldering, etc.), which allows a particularly varied possibility for applying the solder volume.
- another soldering process for certain surfaces can be effected more gently and / or more quickly and / or more quickly for complex geometries.
- a solder volume can be ultrasonically soldered onto a thermally sprayed layer and then the ultrasound soldered volume can be electrically further connected via a soldering volume applied by other means.
- the ultrasonically soldered solder volume thus serves as the basis or reason for the solder volume not applied by ultrasound.
- the application of solder volumes by means of different soldering methods can be carried out in particular in the context of a multi-stage, eg two-stage, method. It is a further embodiment that at least one other component of the heating device is a further thermally sprayed layer structure on which at least one ultrasonically soldered solder volume is present.
- both thermally sprayed layer structures in general: joint partners
- both thermally sprayed layer structures can be provided with an ultrasound-soldered solder volume
- the two ultrasonically soldered solder volumes can subsequently be connected to one another in a second stage by means of another soldering method.
- such a layer structure produced by arc spraying can be connected to a layer structure produced by atmospheric plasma spraying, which are separated from one another by a laser cut.
- thermally sprayed traces may be interconnected across gaps (e.g., laser cuts). This can e.g. be used for the subsequent adjustment of an electrical resistance of a thermally sprayed heating conductor to ensure a required rated power of the heater ("trimming") and / or to repair defects in thermally sprayed conductors (such as Schuleiterbahnen). It is an alternative development that the solder volume in the second stage is also ultrasonically soldered or has been. This corresponds to a two-stage ultrasonic soldering of at least one thermally sprayed layer structure.
- At least one other component of the heater is a metallic contact. Then, e.g. In a first stage, the thermally sprayed layer structure is provided with an ultrasonically soldered solder volume and, in a second stage, the ultrasonically soldered solder volume is subsequently connected directly to the metallic contact by means of another soldering method.
- the metallic contact can be, for example, a contact field applied by electroplating, applying a metallic foil, etc., to the carrier surface, eg a contact element, for example made of copper. It is also a further embodiment that the metallic contact is a contact element of an electrical or electronic component, for example a contact pin of a plug connection part (eg connector plug) or an electrical connection of an electrical or electronic component (eg a contact area of an SMD component such as an NTC). Resistance, a fuse, a - eg in glass solder potted - sensor, etc.). As a result, a thermally sprayed layer can be connected in a particularly simple and durable manner to a circuit, etc.
- the electrical or electronic component is advantageously an SMD (Surface Mounted Devices component), so that thermally sprayed layer structures and electrical and / or electronic components can be connected to each other in a particularly simple and cost-effective manner
- SMD Surface Mounted Devices component
- the SMD component eg the size 0603, 0805 or 1206 ) can by means of a
- Vacuum gripper are placed.
- Wired components provided for THT may also be connected via their metallic contact with the thermally sprayed structure.
- At least one ultrasound-soldered solder volume covers at least a portion of the thermally sprayed layer structure - in particular a heat conductor layer - without electrically connecting it to another - in particular electrically conductive - component of the heating device.
- at least one solder layer (also referred to as a "conductive layer”) can be applied to the heating conductor layer in order to locally reduce an electrical power density in the heating conductor layer. In turn, local heating (so-called "hot spots”) can be prevented.
- a conductive layer can be applied, for example, to power connections, to constrictions in printed conductors, at corners and / or to reversal points in the heating conductor layout.
- the conductive layer or the solder material can also rest on the carrier surface.
- the object is also achieved by a household appliance with at least one heating device as described above.
- the domestic appliance gives the same advantages as the heating device and can be designed analogously.
- the household appliance may for example be a cooking appliance or an accessory for a cooking appliance (eg a heated cooking space divider).
- the cooking appliance may, for example, have a steam cooking function, the heating device being connected to a steam generating device. is ordered to evaporate water present in the steam generating device.
- the cooking appliance may be, for example, an oven with Dampfgarfunktion gleich or a dedicated steamer.
- the heater may then represent, for example, a bottom of a water tank.
- At least one thermally sprayed layer structure may be present on one or both sides, in particular at least one heat conductor layer (structure).
- the household appliance can also be a laundry care device. The heater can then be used for example as a lye heating a washing machine or a washer-dryer. Also, the heater may be provided as a process air heater. The household appliance may also be a dishwasher. The heater can then be used, for example, as a heater for heating the rinsing liquid. In this case, the heater is in particular a component of a Schupumpenbaury.
- the household appliance may also be an electrically operated household appliance, e.g. a kettle, a coffee machine (e.g., in the form of an espresso machine), a toaster, etc.
- a coffee machine e.g., in the form of an espresso machine
- a toaster e.g., a toaster
- the heating device may be formed as a tube (in general: a rotationally symmetrical body), wherein at least one thermally sprayed thick-film heating conductor is provided on a wall of the pipe of the household appliance.
- the tube can then in particular be used or regarded as a continuous flow heater for gas (eg process air) and / or liquid (for example water to be evaporated, rinsing liquid or alkali) passed through there.
- gas eg process air
- liquid for example water to be evaporated, rinsing liquid or alkali
- the object is also achieved by a method for producing a heating device for a household appliance, in which a flat (planar and / or curved) support is provided with at least one thermally sprayed layer structure applied thereto and at least one solder volume ultrasonically sprayed onto at least one thermally sprayed layer structure. is soldered.
- the procedure gives the same advantages as the heater and the household appliance and can be formed analogously, and vice versa.
- At least one thermally sprayed layer structure is ultrasonically soldered in one stage to another component of the heating device.
- a trace of solder from the at least one thermally sprayed layer structure are drawn to the other component.
- at least one thermally sprayed layer structure is ultrasonically soldered in two stages with another component of the heater by a solder volume is applied by ultrasonic soldering in a first stage at least at least one thermally sprayed layer structure and this solder volume in a second stage with the other Component of the heater is soldered.
- the soldering in the second stage can be carried out with or without ultrasound.
- the other component of the heating device is a thermally sprayed layer structure, on which in the first stage a solder volume is applied by ultrasonic soldering and soldered this ultrasonic deposited solder volume in the second stage with another ultrasonically applied solder volume of the heater becomes.
- the ultrasonic soldering is performed by means of an ultrasonic soldering iron.
- the ultrasonic soldering iron for example, have a sonotrode, which is designed as a soldering tip.
- the ultrasonic soldering by means of an ultrasonic Lotbads (or solder bath) is performed.
- a component to be wetted with solder can be immersed in a solder bath before or after mounting on the carrier.
- the wetting of this component does not need to be made on the carrier, which allows a simplified production.
- the respective individual steps can be improved by a heat treatment process (for example by preheating) of the component.
- FIG. 1 shows a plan view of a heating device of a household appliance
- FIG. 2 shows a sectional view in side view of a first section of the
- FIG. 5 shows a sectional side view of a fourth detail of the heating device according to Fig.1.
- the heating device 1 shows in plan view a heating device 1 of a household appliance H.
- the heating device 1 can be used, for example, for heating water located in a water tank of a steam generator.
- the domestic appliance H can, however, also be a baking oven with steaming functionality, a dedicated steamer, an electrically heatable cooking compartment divider, a laundry care appliance, a dishwasher, a household small appliance, etc.
- the heating device 1 comprises a sheet-like support 2 (for example made of a metal sheet) with an electrically insulating support surface 3 (for example made of a slightly porous, for example thermally sprayed, ceramic layer).
- a plurality of metallic layer structures 4 to 8 are thermally sprayed.
- the thermally sprayed layer structures 4 to 8 are electrically insulated from one another by the support surface 3 and comprise: a first (long) meandering heating conductor 4, a second (short) meandering heating conductor 5 and three short straight conductors 6 to 8.
- the two Schuleiterbahnen 4 and 5 are electrically connected to each other by two tracks 9 of a first solder or solder material 10. As a result, the two Schuleiterbah- NEN 4 and 5 electrically connected in series. If the second heating conductor 5 is not to be used, instead of the two traces 9, the two corresponding ends of the first heating conductor 4 could be connected to each other directly by means of a track of the first soldering material 10 (see FIG. Also, the electrical resistance can be trimmed precisely that a position of the lower track 9 here between the Schuleiterbahnen 4 and 5 can be varied, as indicated by the double arrow. By a suitable attachment of the tracks 9 consequently the common heating conductor 4, 5 can be trimmed. As shown in FIG.
- the track 9 of the first solder material 10 has been ultrasonically soldered thereto in one stage from the surface of the first heat conductor 4 via the carrier surface 3 to the surface of the second heat conductor 5. Due to the introduced ultrasonic energy, the first soldering material 10 holds both on the heating conductor tracks 4 and 5 and on the carrier surface 3, without the need for soldering flux.
- the track 9 can be applied, for example, by soldering with an ultrasonic soldering iron.
- connection plug 1 1 of the heating device 1 Adjacent conductor tracks 6 and 7 or 7 and 8 are connected via respective SMD components 12.
- the SMD components 12 are exemplary NTC resistors, the electrical contacts or contact pads 14 in the form of
- measured values belonging to a respective temperature for example electrical resistance values, voltage values or current values
- a respective temperature for example electrical resistance values, voltage values or current values
- the SMD components 12 are attached via solder points 13 of the first solder material 10 and a second solder material 15 to the conductor tracks 6 and 7 or 7 and 8, as shown in Figure 3 as a section BB from the heater 1.
- the conductor tracks 6 and 7 or 7 and 8 have been ultrasonically soldered to a solder volume from the first solder material 10.
- the SMD components 12 have been placed with their contact pads 14 on respective solder volumes of the solder 10.
- the solder volumes of the soldering material 10 with the associated contact pads 14 are separated by means of a non-soldering material.
- Ultrasonic soldering process (eg, a laser soldering, reflow soldering, hand soldering, etc.) has been soldered using the second solder material 15.
- the first solder material 10 and the second solder material 15 may be the same or different. Consequently, the two conductor tracks 7 and 8 are electrically connected to one another by the SMD component 12 via the soldering points 13, which have (partial) solder volumes 13a and 13b of the first solder material 10 and the second solder material 15, respectively.
- the electrical contacts 1 1 a (eg pins or contact pins) of the connector plug 1 1 are attached to the tracks 6 to 8, where they may have been immersed in a Lotbad (o. Fig.)
- the solder bath can work with or without ultrasound input.
- the solder material applied in the solder bath may e.g. one of the solder materials 10 or 15 be.
- two metallic contact surfaces 16 are additionally applied to the carrier surface, by way of which the combined heating conductor track 4 and 5 can be electrically connected on the end side, e.g. to a power supply. 4 shows a sectional view in side view of a section C-C from the heating device 1.
- solder volume (soldering point) 17 has been ultrasonically soldered from the first solder material 10 and then a track 18 made from the second solder material 15 with another (not based on ultrasound) soldering process from the solder volume 17 to the metallic contact surface 16, or vice versa, drawn.
- the two thermally sprayed Edelleiterbahnen 4 and 5 could also be each provided with ultrasonically soldered Lotvolumina 17 of the first solder material 10, which are connected to each other via a track 18 from the second solder material 15.
- a conductive layer 19 has been ultrasonically soldered onto the heating conductor 4 and possibly the carrier surface 3 in order to reduce a current density there and thus prevent the formation of so-called "hot spots" as shown in section DD in Fig.5.
- the present invention is not limited to the embodiment shown.
- a number may include exactly the specified number as well as a usual tolerance range, as long as this is not explicitly excluded.
Landscapes
- Resistance Heating (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015214627.8A DE102015214627A1 (de) | 2015-07-31 | 2015-07-31 | Verbinden thermisch aufgespritzter Schichtstrukturen von Heizeinrichtungen |
PCT/EP2016/065541 WO2017021076A1 (de) | 2015-07-31 | 2016-07-01 | Verbinden thermisch aufgespritzter schichtstrukturen von heizeinrichtungen |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3329737A1 true EP3329737A1 (de) | 2018-06-06 |
EP3329737B1 EP3329737B1 (de) | 2022-04-13 |
Family
ID=56464176
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP16740977.0A Active EP3329737B1 (de) | 2015-07-31 | 2016-07-01 | Verbinden thermisch aufgespritzter schichtstrukturen von heizeinrichtungen |
Country Status (6)
Country | Link |
---|---|
US (1) | US11641698B2 (de) |
EP (1) | EP3329737B1 (de) |
CN (1) | CN107926084B (de) |
DE (1) | DE102015214627A1 (de) |
PL (1) | PL3329737T3 (de) |
WO (1) | WO2017021076A1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102019213241A1 (de) * | 2019-07-26 | 2021-01-28 | Siemens Aktiengesellschaft | Verfahren zum thermischen Sprühen von Leiterbahnen und Elektronikmodul |
TWI748571B (zh) * | 2020-07-22 | 2021-12-01 | 敏翔股份有限公司 | 具加熱功能之裝置之電連接部 |
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WO2005051042A1 (en) * | 2003-11-20 | 2005-06-02 | Koninklijke Philips Electronics N.V. | Thin- film heating element |
DE10355043A1 (de) * | 2003-11-25 | 2005-06-23 | Watlow Electric Manufacturing Co., St. Louis | Verfahren zum Befestigen eines elektrischen Leiters auf einem Flächenelement, sowie Heißkanalelement, insbesondere für eine Kunststoff-Spritzeinrichtung |
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DE102009059995A1 (de) * | 2009-12-21 | 2011-06-22 | W.E.T. Automotive Systems AG, 85235 | Elektrische Heizeinrichtung |
DE202010007081U1 (de) | 2010-05-21 | 2010-08-26 | Bayerisches Zentrum für Angewandte Energieforschung e.V. | Vorrichtung zum Erzeugen einer gasdichten Ultraschall-Lötverbindung |
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DE102014116275A1 (de) * | 2014-11-07 | 2016-05-12 | Webasto SE | Verfahren zur Herstellung eines Kontaktbereichs für eine Schicht eines elektrischen Heizgeräts sowie Vorrichtung für ein elektrisches Heizgerät für ein Kraftfahrzeug |
DE102015214628A1 (de) * | 2015-07-31 | 2017-02-02 | BSH Hausgeräte GmbH | Heizeinrichtung für ein Haushaltsgerät |
KR102466203B1 (ko) * | 2016-03-22 | 2022-11-11 | 삼성전기주식회사 | 커패시터 및 그 제조방법 |
-
2015
- 2015-07-31 DE DE102015214627.8A patent/DE102015214627A1/de not_active Withdrawn
-
2016
- 2016-07-01 PL PL16740977.0T patent/PL3329737T3/pl unknown
- 2016-07-01 US US15/747,171 patent/US11641698B2/en active Active
- 2016-07-01 CN CN201680044726.2A patent/CN107926084B/zh active Active
- 2016-07-01 WO PCT/EP2016/065541 patent/WO2017021076A1/de active Application Filing
- 2016-07-01 EP EP16740977.0A patent/EP3329737B1/de active Active
Also Published As
Publication number | Publication date |
---|---|
WO2017021076A1 (de) | 2017-02-09 |
US11641698B2 (en) | 2023-05-02 |
US20180213607A1 (en) | 2018-07-26 |
CN107926084B (zh) | 2021-07-27 |
CN107926084A (zh) | 2018-04-17 |
PL3329737T3 (pl) | 2022-07-25 |
EP3329737B1 (de) | 2022-04-13 |
DE102015214627A1 (de) | 2017-02-02 |
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