EP3302012A1 - Rackmount chassis - Google Patents
Rackmount chassis Download PDFInfo
- Publication number
- EP3302012A1 EP3302012A1 EP17161193.2A EP17161193A EP3302012A1 EP 3302012 A1 EP3302012 A1 EP 3302012A1 EP 17161193 A EP17161193 A EP 17161193A EP 3302012 A1 EP3302012 A1 EP 3302012A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- chassis
- aluminum
- panel portion
- rackmount
- base piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 21
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- 230000013011 mating Effects 0.000 claims abstract description 4
- 229910000831 Steel Inorganic materials 0.000 description 9
- 239000010959 steel Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 230000000171 quenching effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
- H05K7/1487—Blade assemblies, e.g. blade cases or inner arrangements within a blade
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
- B62D—MOTOR VEHICLES; TRAILERS
- B62D29/00—Superstructures, understructures, or sub-units thereof, characterised by the material thereof
- B62D29/007—Superstructures, understructures, or sub-units thereof, characterised by the material thereof predominantly of special steel or specially treated steel, e.g. stainless steel or locally surface hardened steel
Definitions
- the present invention relates to the field of rack mounted devices. More particularly, the invention relates to a chassis providing beneficial mechanical characteristics for such devices.
- a rack is a type of frame that facilitates the stacking of electronic devices one on top of the other.
- a rack typically, but not necessarily, having a width of 19 inches is used for the compact stacking of each rectangular chassis that houses an electronic device, for example a power supply, memory device or network communication device.
- the chassis is traditionally made of steel as a result of its structural strength, widespread availability and relatively low cost. Since steel tends to corrode when exposed to moisture in the surrounding air, a thin zinc coating is applied to protect the steel from corrosion.
- zinc whiskers characterized by tiny hair-like filaments are known to grow from zinc-coated metal surfaces, and some experts maintain that their growth is encouraged by exposure to compressive mechanical stresses. The presence of whiskers can be very damaging to the electronic devices housed in the chassis when they break off and cause short circuits or act as miniature antennas to affect circuit impedance in fast digital circuits.
- the present invention provides a rectilinear rackmount chassis, comprising a three-dimensional base piece fabricated from a single piece of sheet metal which is made of aluminum 6061 T651, and a cover piece fitted over, and mating with, said base piece.
- the structural strength of aluminum 6061-T651 is particularly suited for preventing buckling of a rackmount chassis having a large width of 19 inches, or more, yet such a rackmount chassis is significantly lighter than its steel counterpart.
- the base piece is configured with a central portion, a front panel portion, a rear panel portion, and two opposed side portions, said front panel portion, rear panel portion, and two opposed side portions being bendable with respect to said central portion to facilitate a fixed connection between each of said two side portions and said front and rear panel portions.
- the fixed connection may be a tab which is bent and welded.
- the cover piece may also be made of aluminum 6061-T651.
- Fig. 1 illustrates rackmount chassis 10, according to one embodiment of the invention, which is made entirely of aluminum.
- the aluminum chassis is significantly lighter than a prior art carbon steel rackmount chassis to reduce transportation costs, yet is structurally strong. Since aluminum is corrosion resistant, chassis 10 does not have to be coated, and is therefore not prone to whisker formation. Rectilinear chassis 10 preferably has a width of 19 inches, although other widths are also in the scope of the invention.
- Chassis 10 may advantageously be made of two pieces of aluminum sheet material: a first lower base piece 3 that encloses the circuitry of the electronic device and a second cover piece 9 fitted over, and mating with, base piece 3.
- Base piece 3 has sufficiently bendability to allow a first portion 4 thereof, for example a front panel, to be connected to a second portion 6 thereof, for example a side surface.
- An exemplary aluminum sheet material thickness is 1.2 mm and an exemplary internal bend radius is 1.2 mm.
- the sheet metal of base piece 3 is shown in an unbent condition in Fig. 2 .
- Central bottom portion 5 is interposed between front panel portion 4 and rear panel portion 7, and is also interposed between side portions 6 and 8, which are at right angles to front panel portion 4 and rear panel portion 7.
- Panel portions 4 and 7 are formed with a plurality of cutouts 13 to accommodate the placement of input or display elements associated with the circuitry of the housed electronic device.
- Rear panel portion 7 is also formed with a plurality of cutouts 14 to define air openings. Regions 9 of bottom portion 5 are punched out to define corresponding rectangular, integral flexible contacts 11, and other regions are punched out to define mounting holes 16.
- Side portions 6 and 8 are each delimited by an upper edge 15 and by two opposed side edges 17 that are perpendicular to the corresponding upper edge 15.
- An embossed region 12, e.g. rectangular, is formed in each side portion to increase the rigidity of base piece 3 when fabricated.
- Each side edge 17 of a side portion is contiguous with, and protrudes from, a triangular tab 18 of the adjacent panel portion.
- Each panel portion is also configured with a rectangular tab 19 that is contiguous with edge 21 of the corresponding panel portion. Rectangular tab 19 is shorter than triangular tab 18, as measured from a side edge 26 of the panel portion.
- Fig. 3 illustrates base piece 3 when set to a three-dimensional fabricated condition, such that each side portion is connected to both panel portions.
- the flexible contacts 11 are shown to be in a bent condition, for connection to an electronic component.
- rear panel portion 7 and side portion 8 are bent about bottom portion 5 to define horizontal bend lines 23 and 24, respectively.
- front panel portion 4 and side portion 6 are bent about bottom portion 5.
- triangular tab 18 is bent about rear panel portion 7 to define vertical bend line 27, and is welded to side portion 8.
- rear panel portion 7 is bent about a horizontal bend line 36, which is schematically represented by dashed lines in Fig. 2 and extends between the lower edge of the two opposed rectangular tabs 19, to define a horizontal lip 32, which may support the cover piece.
- Lip 32 may have a bend precision of 10 mm, corresponding to the distance between bend line 36 and edge 21, over a length of 500 mm.
- the illustrated rectangular tab 19 is then bent about lip 32 to form a bend line 38 that is substantially coincident with upper edge 15 of side portion 8.
- the resulting vertically disposed rectangular tab 19 is welded to side portion 8 to achieve a surprisingly strong base piece made of a single piece of sheet metal.
- This arrangement of bending lip 32 about horizontal bend line 36 and then tabs 18 and 19 about a vertical bend line increases the mechanical strength of base piece 3 as a U-shaped profile characterized by a relatively large moment of inertia is produced in both the lengthwise direction between front panel 44 and rear panel 47 and in the sidewise direction between sides 46 and 48.
- the bend radius at each of bend lines 23, 24 and 38 may be 1.2 mm, although any other suitable radius is also feasible.
- rackmount chassis 10 is aluminum 6061 T651. This material has been used for airplane fuselage, automotive parts and yacht construction, but heretofore has been unknown to be used for a rackmount chassis.
- Aluminum 6061 is an aluminum alloy having magnesium and silicon as its alloying elements, and has good corrosion resistance, machinability and weldability.
- the T651 temper is carried out by stretching a plate of alloy 6061 following a heat treatment and prior to an artificial aging treatment.
- the stretching operation serves to flatten the plate and to relive the high level of stresses induced into the plate as a result of being quenched in water coolant after the heat treatment.
- Water quenching normally causes plate distortion and uneven flatness.
- a plate of alloy 6061 is thus afforded post-machining stability such that it resists distortion and buckling.
- tempers of aluminum alloy 6061 such as T6 are not subjected to the stretching operation- for example they undergo a roller leveling technique in order to achieve an acceptable flatness; however, this technique does not relieve the quenching stresses.
- Tables I and II compare the performance of the T651 temper to different tempers of aluminum 6061 with respect to various parameters of importance.
- Table I T651 vs T451 T651 T451
- Table II T651 vs T0 T651 T0
- Table III compares aluminum 6061-T651 with aluminum 5052-H32.
- Table III T651 vs 5052-H32 T651 5052-H32
- Table IV compares aluminum 6061-T651 with cold rolled AISI 1020 steel.
- Table IV T651 vs AISI 1020 T651 AISI 1020
- the yield strength of aluminum 6061-T651 is 78.9% that of AISI 1020 steel even though its density is only 34.3% of AISI 1020 steel.
- the structural strength of aluminum 6061-T651 is particularly suited for preventing buckling of a rackmount chassis having a large width of 19 inches, or more, yet such a rackmount chassis is significantly lighter than its steel counterpart.
- Aluminum 6061-T651 has low magnetic field permeability, its resistance to whisker formation and its relatively low electrical resistivity to promote good ground connections for the return path of current from the electronic devices housed within the chassis. Also, it has good corrosion resistance, machinability and weldability.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Transportation (AREA)
- Mechanical Engineering (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Description
- The present invention relates to the field of rack mounted devices. More particularly, the invention relates to a chassis providing beneficial mechanical characteristics for such devices.
- A rack is a type of frame that facilitates the stacking of electronic devices one on top of the other. For many industrial applications, a rack typically, but not necessarily, having a width of 19 inches is used for the compact stacking of each rectangular chassis that houses an electronic device, for example a power supply, memory device or network communication device.
- The chassis is traditionally made of steel as a result of its structural strength, widespread availability and relatively low cost. Since steel tends to corrode when exposed to moisture in the surrounding air, a thin zinc coating is applied to protect the steel from corrosion. However, zinc whiskers characterized by tiny hair-like filaments are known to grow from zinc-coated metal surfaces, and some experts maintain that their growth is encouraged by exposure to compressive mechanical stresses. The presence of whiskers can be very damaging to the electronic devices housed in the chassis when they break off and cause short circuits or act as miniature antennas to affect circuit impedance in fast digital circuits.
- Other disadvantages associated with the use of a steel rackmount chassis include its relatively heavy weight and high permeability that freely permits the radiated emission associated with the magnetic field generated by the circuits of the electronic device housed within the chassis to travel through the material. If the magnitude of the magnetic field is sufficiently large, it has the potential to destroy other sensitive electronic equipment.
- It is an object of the present invention to provide a rackmount chassis made of a structurally strong material of low weight.
- It is an additional object of the present invention to provide a rackmount chassis made of a material having low magnetic field permeability.
- It is an additional object of the present invention to provide a rackmount chassis made of a material that is not prone to whisker formation.
- Other objects and advantages of the invention will become apparent as the description proceeds.
- The present invention provides a rectilinear rackmount chassis, comprising a three-dimensional base piece fabricated from a single piece of sheet metal which is made of aluminum 6061 T651, and a cover piece fitted over, and mating with, said base piece.
- The structural strength of aluminum 6061-T651 is particularly suited for preventing buckling of a rackmount chassis having a large width of 19 inches, or more, yet such a rackmount chassis is significantly lighter than its steel counterpart.
- In one aspect, the base piece is configured with a central portion, a front panel portion, a rear panel portion, and two opposed side portions, said front panel portion, rear panel portion, and two opposed side portions being bendable with respect to said central portion to facilitate a fixed connection between each of said two side portions and said front and rear panel portions. The fixed connection may be a tab which is bent and welded.
- The cover piece may also be made of aluminum 6061-T651.
- In the drawings:
-
Fig. 1 is a perspective view from the top of a rackmount chassis, according to one embodiment of the invention; -
Fig. 2 is a top or bottom view of a base piece for use in conjunction with the chassis ofFig. 1 , shown in an unbent condition; -
Fig. 3 is a perspective view from the top of the base piece ofFig. 2 , shown in a fabricated condition; and -
Fig. 4 is an enlargement of Detail A ofFig. 3 . -
Fig. 1 illustratesrackmount chassis 10, according to one embodiment of the invention, which is made entirely of aluminum. The aluminum chassis is significantly lighter than a prior art carbon steel rackmount chassis to reduce transportation costs, yet is structurally strong. Since aluminum is corrosion resistant,chassis 10 does not have to be coated, and is therefore not prone to whisker formation.Rectilinear chassis 10 preferably has a width of 19 inches, although other widths are also in the scope of the invention. -
Chassis 10 may advantageously be made of two pieces of aluminum sheet material: a firstlower base piece 3 that encloses the circuitry of the electronic device and asecond cover piece 9 fitted over, and mating with,base piece 3.Base piece 3 has sufficiently bendability to allow afirst portion 4 thereof, for example a front panel, to be connected to asecond portion 6 thereof, for example a side surface. An exemplary aluminum sheet material thickness is 1.2 mm and an exemplary internal bend radius is 1.2 mm. - The sheet metal of
base piece 3 is shown in an unbent condition inFig. 2 .Central bottom portion 5 is interposed betweenfront panel portion 4 andrear panel portion 7, and is also interposed betweenside portions front panel portion 4 andrear panel portion 7.Panel portions cutouts 13 to accommodate the placement of input or display elements associated with the circuitry of the housed electronic device.Rear panel portion 7 is also formed with a plurality ofcutouts 14 to define air openings.Regions 9 ofbottom portion 5 are punched out to define corresponding rectangular, integralflexible contacts 11, and other regions are punched out to definemounting holes 16. -
Side portions upper edge 15 and by twoopposed side edges 17 that are perpendicular to the correspondingupper edge 15. An embossedregion 12, e.g. rectangular, is formed in each side portion to increase the rigidity ofbase piece 3 when fabricated. - Each
side edge 17 of a side portion is contiguous with, and protrudes from, atriangular tab 18 of the adjacent panel portion. Each panel portion is also configured with arectangular tab 19 that is contiguous withedge 21 of the corresponding panel portion.Rectangular tab 19 is shorter thantriangular tab 18, as measured from aside edge 26 of the panel portion. - The relative positional terms such as "upper", "bottom", "side", "front" and "rear" are presented relative to the disposition of
base piece 3 of the chassis when bent to a three-dimensional configuration in order to house the electronic device. -
Fig. 3 illustratesbase piece 3 when set to a three-dimensional fabricated condition, such that each side portion is connected to both panel portions. Theflexible contacts 11 are shown to be in a bent condition, for connection to an electronic component. - In order to fabricate the three-
dimensional base piece 3, as shown inFig. 4 , the illustratedrear panel portion 7 andside portion 8 are bent aboutbottom portion 5 to definehorizontal bend lines front panel portion 4 andside portion 6 are bent aboutbottom portion 5. In order to achieve the fabricated condition,triangular tab 18 is bent aboutrear panel portion 7 to definevertical bend line 27, and is welded toside portion 8. Additionally,rear panel portion 7 is bent about ahorizontal bend line 36, which is schematically represented by dashed lines inFig. 2 and extends between the lower edge of the two opposedrectangular tabs 19, to define ahorizontal lip 32, which may support the cover piece.Lip 32 may have a bend precision of 10 mm, corresponding to the distance betweenbend line 36 andedge 21, over a length of 500 mm. The illustratedrectangular tab 19 is then bent aboutlip 32 to form abend line 38 that is substantially coincident withupper edge 15 ofside portion 8. The resulting vertically disposedrectangular tab 19 is welded toside portion 8 to achieve a surprisingly strong base piece made of a single piece of sheet metal. - This arrangement of
bending lip 32 abouthorizontal bend line 36 and thentabs base piece 3 as a U-shaped profile characterized by a relatively large moment of inertia is produced in both the lengthwise direction between front panel 44 and rear panel 47 and in the sidewise direction between sides 46 and 48. - The bend radius at each of
bend lines - It has now been found that a suitable material for
rackmount chassis 10 is aluminum 6061 T651. This material has been used for airplane fuselage, automotive parts and yacht construction, but heretofore has been unknown to be used for a rackmount chassis. - Aluminum 6061 is an aluminum alloy having magnesium and silicon as its alloying elements, and has good corrosion resistance, machinability and weldability.
- The T651 temper is carried out by stretching a plate of alloy 6061 following a heat treatment and prior to an artificial aging treatment. The stretching operation serves to flatten the plate and to relive the high level of stresses induced into the plate as a result of being quenched in water coolant after the heat treatment. Water quenching normally causes plate distortion and uneven flatness. A plate of alloy 6061 is thus afforded post-machining stability such that it resists distortion and buckling.
- Other tempers of aluminum alloy 6061 such as T6 are not subjected to the stretching operation- for example they undergo a roller leveling technique in order to achieve an acceptable flatness; however, this technique does not relieve the quenching stresses.
- Tables I and II compare the performance of the T651 temper to different tempers of aluminum 6061 with respect to various parameters of importance.
Table I T651 vs T451 T651 T451 Tensile Strength (MPa) 310 241 Yield Strength (MPa) 276 145 Shear Strength (MPa) 207 165 Density (g/cm3) 2.70 2.70 Elastic Modulus (GPa) 68.9 68.9 Elongation, thickness-1.6mm (%) 12 22 Elongation, diameter-13mm (%) 17 25 Machinability Rating (%) 50 50 Electrical Resistivity (ohm-cm) 0.00000399 0.00000432 Table II T651 vs T0 T651 T0 Tensile Strength (MPa) 310 124 Yield Strength (MPa) 276 55 Shear Strength (MPa) 207 83 Density (g/cm3) 2.70 2.70 Elastic Modulus (GPa) 68.9 68.9 Elongation, thickness-1.6mm (%) 12 25 Elongation, diameter-13mm (%) 17 30 Machinability Rating (%) 50 30 Electrical Resistivity (ohm-cm) 0.00000399 0.00000366 - Table III compares aluminum 6061-T651 with aluminum 5052-H32.
Table III T651 vs 5052-H32 T651 5052-H32 Tensile Strength (MPa) 310 228 Yield Strength (MPa) 276 193 Shear Strength (MPa) 207 138 Density (g/cm3) 2.70 2.68 Elastic Modulus (GPa) 68.9 70.3 Elongation, thickness-1.6mm (%) 12 12 Elongation, diameter-13mm (%) 17 18 Electrical Resistivity (ohm-cm) 0.00000399 0.00000499 - Table IV compares aluminum 6061-T651 with cold rolled AISI 1020 steel.
Table IV T651 vs AISI 1020 T651 AISI 1020 Tensile Strength (MPa) 310 420 Yield Strength (MPa) 276 350 Density (g/cm3) 2.70 7.87 Elastic Modulus (GPa) 68.9 186 Elongation, thickness-1.6mm (%) 12 15 Machinability Rating (%) 50 65 - As can be seen, the yield strength of aluminum 6061-T651 is 78.9% that of AISI 1020 steel even though its density is only 34.3% of AISI 1020 steel. The structural strength of aluminum 6061-T651 is particularly suited for preventing buckling of a rackmount chassis having a large width of 19 inches, or more, yet such a rackmount chassis is significantly lighter than its steel counterpart.
- Other advantages of aluminum 6061-T651 include its low magnetic field permeability, its resistance to whisker formation and its relatively low electrical resistivity to promote good ground connections for the return path of current from the electronic devices housed within the chassis. Also, it has good corrosion resistance, machinability and weldability.
- While some embodiments of the invention have been described by way of illustration, it will be apparent that the invention can be carried out with many modifications, variations and adaptations, and with the use of numerous equivalents or alternative solutions that are within the scope of persons skilled in the art, without exceeding the scope of the claims.
Claims (5)
- A rectilinear rackmount chassis (10), comprising a three-dimensional base piece (3) fabricated from a single piece of sheet metal which is made of aluminum 6061 T651, and a cover piece (9) fitted over, and mating with, said base piece (3).
- The rackmount chassis (10) according to claim 1, wherein the cover piece (9) is also made of aluminum 6061 T651.
- The rackmount chassis (10) according to claim 1, wherein the base piece (3) is configured with a central portion (5), a front panel portion (4), a rear panel portion (7), and two opposed side portions (6, 8), said front panel portion (4), rear panel portion (7), and two opposed side portions (6, 8) being bendable with respect to said central portion (5) to facilitate a fixed connection between each of said two side portions (6, 8) and said front and rear panel portions (4, 7).
- The rackmount chassis (10) according to claim 3, wherein the fixed connection is a tab (18, 19) which is bent and welded.
- The rackmount chassis (10) according to claim 1, which has a width of 19 inches.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IL248166A IL248166B (en) | 2016-10-02 | 2016-10-02 | Rackmount chassis |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3302012A1 true EP3302012A1 (en) | 2018-04-04 |
EP3302012B1 EP3302012B1 (en) | 2020-09-09 |
Family
ID=57907530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP17161193.2A Active EP3302012B1 (en) | 2016-10-02 | 2017-03-15 | Rackmount chassis |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP3302012B1 (en) |
IL (1) | IL248166B (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5129594A (en) * | 1991-10-18 | 1992-07-14 | Hollingsead International, Inc. | Avionic tray and method of making same |
US5195644A (en) * | 1992-07-13 | 1993-03-23 | Glenayre Electronics Ltd. | Sealed, seamless box and method of manufacturing same |
US20040190246A1 (en) * | 2003-03-25 | 2004-09-30 | Porter Arbogast | Removable fan module and electronic device incorporating same |
US20080304228A1 (en) * | 2007-06-06 | 2008-12-11 | Dell Products L.P. | Multi-Purpose Structural Support I/O Member For A Server |
US20150216061A1 (en) * | 2014-01-29 | 2015-07-30 | David Flores | Components and methodology for producing custom-sized, small aluminum modular chassis based on a single design and production process |
-
2016
- 2016-10-02 IL IL248166A patent/IL248166B/en unknown
-
2017
- 2017-03-15 EP EP17161193.2A patent/EP3302012B1/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5129594A (en) * | 1991-10-18 | 1992-07-14 | Hollingsead International, Inc. | Avionic tray and method of making same |
US5195644A (en) * | 1992-07-13 | 1993-03-23 | Glenayre Electronics Ltd. | Sealed, seamless box and method of manufacturing same |
US20040190246A1 (en) * | 2003-03-25 | 2004-09-30 | Porter Arbogast | Removable fan module and electronic device incorporating same |
US20080304228A1 (en) * | 2007-06-06 | 2008-12-11 | Dell Products L.P. | Multi-Purpose Structural Support I/O Member For A Server |
US20150216061A1 (en) * | 2014-01-29 | 2015-07-30 | David Flores | Components and methodology for producing custom-sized, small aluminum modular chassis based on a single design and production process |
Also Published As
Publication number | Publication date |
---|---|
EP3302012B1 (en) | 2020-09-09 |
IL248166B (en) | 2021-08-31 |
IL248166A0 (en) | 2017-01-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103858529B (en) | Base plate and the manufacture method of base plate | |
US6172881B1 (en) | Method of interconnecting frame grounds in housing, and electronic equipment with structure interconnected by the method | |
CN101012519A (en) | Silver containing copper alloy | |
KR20140045920A (en) | Cu-zr-based copper alloy plate and process for manufacturing same | |
KR102470725B1 (en) | Copper foil for flexible printed circuit, and copper clad laminate, flexible printed circuit and electronic device using copper foil | |
EP3302012B1 (en) | Rackmount chassis | |
CN108682391B (en) | Display panel, display device and preparation method | |
KR100637149B1 (en) | Plasma display device | |
US20120094114A1 (en) | Metal Foil with Electric Resistance Film and Production Method Thereof | |
JP4956421B2 (en) | Metal core board reinforcement structure and electrical junction box | |
JP6328380B2 (en) | Copper alloy sheet with excellent conductivity and bending deflection coefficient | |
JP6617313B2 (en) | Copper foil for flexible printed circuit board, copper-clad laminate using the same, flexible printed circuit board, and electronic device | |
TWI545209B (en) | Copper alloy plate and its electronic components with heat dissipation | |
US20100048265A1 (en) | Antenna mounting arrangement for cell phone with a metal casing | |
JP5778460B2 (en) | Rolled copper foil, method for producing the same, and copper-clad laminate | |
JP4919770B2 (en) | Automotive window glass | |
KR100589370B1 (en) | Plasma display device | |
KR20180055927A (en) | Zinc plating steel sheet with electronic zinc plating film | |
US20070086149A1 (en) | Plasma display device | |
JP2005311171A (en) | Organic semiconductor device | |
US3402255A (en) | Composite electrical bus bar | |
CN205902322U (en) | Shielding device and electronic device | |
JP2015048519A (en) | Copper alloy sheet excellent in conductivity and bending deflection coefficient | |
JP6647253B2 (en) | Copper foil for flexible printed circuit board, copper-clad laminate using the same, flexible printed circuit board, and electronic device | |
CN219227933U (en) | Motherboard assembly and terminal equipment |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN PUBLISHED |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: BA ME |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
|
17P | Request for examination filed |
Effective date: 20180926 |
|
RBV | Designated contracting states (corrected) |
Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: GRANT OF PATENT IS INTENDED |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H05K 7/14 20060101AFI20200320BHEP |
|
INTG | Intention to grant announced |
Effective date: 20200407 |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE PATENT HAS BEEN GRANTED |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D |
|
REG | Reference to a national code |
Ref country code: AT Ref legal event code: REF Ref document number: 1313233 Country of ref document: AT Kind code of ref document: T Effective date: 20200915 Ref country code: CH Ref legal event code: EP |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: FG4D |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R096 Ref document number: 602017023101 Country of ref document: DE |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R081 Ref document number: 602017023101 Country of ref document: DE Owner name: TDK-LAMBDA LTD, IL Free format text: FORMER OWNER: TDK-LAMBDA LTD, KARMIEL, IL |
|
REG | Reference to a national code |
Ref country code: LT Ref legal event code: MG4D |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201210 Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20200909 Ref country code: LT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20200909 Ref country code: NO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201209 Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20200909 Ref country code: BG Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201209 Ref country code: HR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20200909 |
|
REG | Reference to a national code |
Ref country code: AT Ref legal event code: MK05 Ref document number: 1313233 Country of ref document: AT Kind code of ref document: T Effective date: 20200909 |
|
REG | Reference to a national code |
Ref country code: NL Ref legal event code: MP Effective date: 20200909 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: PL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20200909 Ref country code: RS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20200909 Ref country code: LV Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20200909 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: EE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20200909 Ref country code: SM Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20200909 Ref country code: PT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20210111 Ref country code: RO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20200909 Ref country code: CZ Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20200909 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20210109 Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20200909 Ref country code: AT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20200909 Ref country code: AL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20200909 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R097 Ref document number: 602017023101 Country of ref document: DE |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20200909 |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed |
Effective date: 20210610 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20200909 Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20200909 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20200909 Ref country code: MC Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20200909 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
REG | Reference to a national code |
Ref country code: BE Ref legal event code: MM Effective date: 20210331 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20210331 Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20210315 Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20210331 Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20210315 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: BE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20210331 |
|
P01 | Opt-out of the competence of the unified patent court (upc) registered |
Effective date: 20230504 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20200923 Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20200909 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: HU Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO Effective date: 20170315 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20200909 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20240229 Year of fee payment: 8 Ref country code: GB Payment date: 20240229 Year of fee payment: 8 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 20240229 Year of fee payment: 8 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: TR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20200909 |