EP3301354A2 - Led lamp - Google Patents
Led lamp Download PDFInfo
- Publication number
- EP3301354A2 EP3301354A2 EP18150711.2A EP18150711A EP3301354A2 EP 3301354 A2 EP3301354 A2 EP 3301354A2 EP 18150711 A EP18150711 A EP 18150711A EP 3301354 A2 EP3301354 A2 EP 3301354A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- packaging layer
- led
- light
- conductive substrates
- led lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 91
- 238000004806 packaging method and process Methods 0.000 claims abstract description 70
- 230000001681 protective effect Effects 0.000 claims abstract description 43
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000001125 extrusion Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 8
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 239000000463 material Substances 0.000 description 6
- 238000005286 illumination Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 235000001674 Agaricus brunnescens Nutrition 0.000 description 1
- 206010014357 Electric shock Diseases 0.000 description 1
- 235000014443 Pyrus communis Nutrition 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the present invention relates to lighting fixtures, and more particularly to an LED lamp.
- a conventional LED bulb lamp 80 comprises an LED light bar 81, a supporting base 82, a lamp base 85, and a lamp housing 86.
- the LED light bar 81 is mounted on the supporting base 82 and is fixed to the supporting base 82 by a plurality of fixed blocks 83.
- the supporting base 82 is held in the lamp base 85.
- the lamp housing 86 is connected to the supporting base 82, so that the LED light bar 81 and the supporting base 82 are covered in the lamp housing 86.
- the lamp housing 86 is made of glass so the lamp housing 86 easily cracks or is even broken under collision or pressure. Further, there is a distance between the LED light bar 81 and the lamp housing 86, so the heat generated by the LED light bar 81 easily accumulates in the lamp housing 86 and is difficult to dissipate.
- FIG. 17 shows a conventional LED light bar 90 which comprises a substrate 91, multiple LED chips 92 and multiple resistors 93.
- These resistors 93 are current limiting resistors, used to reduce the current flowing through the LED chips 92 and to avoid the large load current causing high temperature, even burning of the LED chips 92.
- These LED chips 92 and resistors 93 are mounted on one surface of the substrate 91 and are staggered with each other, wherein the LED chips 92 and the resistors 93 are electrically connected.
- each of the LED chips 92 belongs to the point light source and the resistors 93 are interposed between the LED chips 92, the distance between the respective LED chips 92 is too long.
- the illumination ranges of the two adjacent LED chips 92 are adjacent but not intersecting, and the LED light bar 90 presents an illumination effect of multiple point light sources, causing a problem of light discontinuity.
- the present invention provides an LED lamp to mitigate or obviate the aforementioned problems.
- the present invention provides an LED lamp that uses a protective cover as the lamp housing so that the heat generated by the light bar can be effectively dissipated, thereby improving heat dissipation.
- the LED lamp is beneficial to heat dissipation and energy saving, while achieving a continuous and uniform light illumination effect.
- the LED lamp comprises:
- An LED lamp comprises:
- the LED devices belong to the point light source, the distance between two adjacent LED chips is controlled to be less than twice the length of each LED chip to ensure that the light bar shows continuous light.
- the LED device can be manufactured in any specific shape, thereby providing a variety of options.
- the upper packaging layer is in the shape of a semi-elliptical arc, so the light is emitted from the upper package uniformly, thereby achieving a continuous uniform lighting effect.
- the distance between the light bar and the protective cover is so close that the heat generated by the light bar can be dissipated into the air quickly and is not accumulated in the protective cover easily, thereby improving a heat-dissipating effect.
- the present invention relates to an LED lamp, comprising an LED device 10, a fixing block 20, a circuit board 30, and a lamp base 50.
- the LED device 10 comprises a light bar 14 and a protective cover 16.
- the light bar 14 has multiple light emitting diode chips 11 (LED chips), multiple conductive substrates 12 and a packaging layer 13.
- the packaging layer 13 has an upper packaging layer 131.
- the LED chips 11 may be LEDs with top and bottom surfaces, or may have at least one top light-emitting surface 111.
- the LED chips 11 can project the emitted light through the top light-emitting surface 111 outwardly, wherein the top light-emitting surface 111 is at the top of each LED chip 11.
- Each of the conductive substrates 12 is a metal conductive sheet.
- the conductive substrates 12 are arranged in a sequence with an interval between each two adjacent conductive substrates 12.
- Each of the LED chips 11 is mounted between two adjacent conductive substrates 12 and electrically connected to the two adjacent conductive substrates 12, thereby forming the light bar 14.
- one conductive substrate 12, one LED chip 11, one conductive substrate 12, one LED chip 11, etc. are alternately arranged in series.
- the light bar 14 has flexibility.
- a first conductive portion 121 is formed on and extends from the conductive substrate 12 at one end of the light bar 14, and a second conductive portion 122 is formed on and extends from the conductive substrate 12 at the other end of the light bar 14, wherein the first conductive portion 121 and the second conductive portion 122 are two opposite electrodes.
- each of the LED chips 11 is supported by two adjacent conductive substrates 12 and forms an electrical connection, wherein each LED chip 11 has a length W1, the distance between two adjacent LED chips 11 is W2, wherein the distance W2 is less than twice the length W1 (W2 ⁇ 2W1). So the number of the plurality of LED chips 11 can be sufficiently increased, and the effect of continuous light emission can be achieved.
- FIG. 5A shows another embodiment of the light bar 14 which has a lower packaging layer 132 and a lower light-transmitting plate 15.
- the lower light-transmitting plate 15 is mounted on a bottom surface of each conductive substrate 12.
- the lower light-transmitting plate 15 has a bottom light-emitting surface 151 through which light can be emitted outwardly.
- the area of the lower light-transmitting plate 15 is equal to or larger than the area of each conductive substrate 12.
- the upper packaging layer 131 is semi-elliptical and is disposed on a top surface of the conductive substrate 12 and completely covers the plurality of LED chips 11.
- the lower packaging layer 132 is semi-elliptical and is disposed on a bottom surface of the lower light-transmitting plate 15, wherein both edges of each conductive substrate 12 are exposed to the packaging layers 131,132 and are not covered by the packaging layers 131, 132.
- the protection to the LED chips 11 and the conductive substrates 12 can be improved by the combination of the upper packaging layer 131 and the lower packaging layer 132.
- the bonding strength between each LED chip 11 and each conductive substrate 12 is also enhanced so that the light bar 14 is not easily broken.
- a central axis C1 is defined and extends from the center point of the conductive substrate 12 perpendicularly through the top light-emitting surface 111 and the bottom light-emitting surface 151.
- the thickness of the upper packaging layer 131 is defined as a first length L1.
- Three times the first length L1 is larger than the second length L2 (i.e., 3 * L1> L2).
- the lower packaging layer 132 also has the similar configuration.
- the light can be emitted outwardly along the radial direction of the packaging layers 131 and 132, and then the light reflected by the packaging layers 131, 132 is reduced and the light transmission is increased and uniform, thereby achieving a uniform lighting effect.
- a high-density coating material is applied to cover the surfaces of the LED chips 11 and portions of the conductive substrates 12 to cover each LED chip 11 completely, and then the flow condition and the hardening time of the coating material are controlled to form the upper packaging layer 131 and the lower packaging layer 132.
- the coating material for the upper packaging layer 131 and the lower packaging layer 132 may be a transparent resin material, a transparent silicone material, or a light-transmitting polymer material.
- the protective cover 16 may be formed as an elongated transparent structure.
- the inner diameter of the protective cover 16 is between 3mm and 15mm, and the outer diameter of the protective cover 16 is between 4mm to 16mm.
- the protective cover 16 is a light-transmitting hollow tube for covering the light bar 14.
- the protective cover 16 can match the shape of the light bar 14, so that the light bar 14 is not easily broken.
- the protective cover 16 is an insulator that avoids the risk of electric shock when the user is in contact with the light bar 14.
- each conductive substrate 12 has two opposite edges respectively adjacent to the preceding conductive substrate 12 and the subsequent conductive substrate 12, and a distance measured between the two opposite edges is defined as a width D1 of the conductive substrate 12.
- the inner diameter of the protective cover 16 is D3, wherein 0.3 ⁇ (D1/D3) ⁇ 1.
- the ratio of the width D1 of the conductive substrate 12 to the inner diameter D3 of the protective cover 16 is between 0.3 and 1, the maximum light output can be achieved.
- the protective cover 16 can be made into a tube by extrusion molding, and then shaped by heating through the thermoplastic or other heating methods and molded. When the light bar 14 is placed in the protective cover 16, the friction between the protective cover 16 and the packaging layers 131, 132 can be reduced because the two edges of each of the conductive substrates 12 are exposed from the packaging layers 131 and 132.
- the resistance is reduced when the light bar 14 is being placed into the protective cover 16. Furthermore, as the two edges of each of the conductive substrates 12 are in contact with the inner wall of the protective cover 16, the two edges of each of the conductive substrates 12 can be used as the supporting structure for the protective cover 16, which allows the protective cover16 to be formed in a substantially circular shape or an oval shape viewed in cross section and reduces the pressure exerted by the protective cover 16 on each LED chip 11. Furthermore, in the present embodiment, the protective cover 16 is made of a transparent or translucent material, which can also ensure a good light transmission effect while protecting the light bar 14.
- each of the conductive substrates 12 are exposed outside the packaging layer 13 so as to be in contact with the inner wall of the protective cover 16. Moreover, as the friction between the conductive substrate 12 and the protective cover 16 is smaller than the friction between the packaging layer 13 and the protective cover 16, when the light bar 14 is mounted in the protective cover 16, the installation process can be smooth with the small friction between each conductive substrate 12 and the protective cover 16, thereby reducing the time and difficulty of operation.
- the fixing block 20 is a circular block made of an insulating material, and a plurality of holes 22 are formed through the fixing block 20.
- the fixing block 20 has two holes 22, and in a preferred embodiment, each hole 22 is a circular hole.
- the diameter of each hole 22 corresponds to the LED device 10.
- the first conductive portion 121 and the second conductive portion 122 at both ends of the LED device 10 can be respectively inserted into the two holes 22 and fixed in the two holes 22, for example, fixed by adhesive bonding. So the LED device 10 is firmly mounted on the fixing block 20.
- a flange 24 is formed around an outer edge of the fixing block 20.
- the circuit board 30 is provided with a plurality of electrode terminals.
- two electrode terminals 311a, 311b are formed on the circuit board 30.
- the electrode terminals 311a, 311b are opposite electrodes to each other, for example, a positive electrode terminal and a negative electrode terminal.
- the positive electrode terminal is electrically connected to the first conductive portion 121
- the negative electrode terminal is electrically connected to the second conductive portion 122.
- a control circuit is formed on the circuit board 30 by electronic components, such as capacitors, resistors and so on.
- the lamp base 50 may be a so called Edison's lamp base.
- the bottom of the lamp base 50 has a first electrical connection portion 51.
- a side of the lamp base 50 has a second electrical connection portion 53.
- the first electrical connection portion 51 and the second electrical connection portion 53 are for connecting to opposite polarities of an external power source.
- the second electrical connection portion 53 has a threaded surface.
- a stepped portion 55 is formed in an inner wall of the top of the lamp base 50 for supporting the flange 24 of the fixing block 20.
- the first electrical connection portion 51 and the second electrical connection portion 53 are respectively and electrically connected to electrode connection terminals 33a, 33b in the lamp base 50.
- another preferred embodiment of the LED lamp differs from the previous embodiment in that only one end of the LED device 10 is inserted into the fixing block 20.
- the light bar 14 in FIG. 9 is used in the present embodiment.
- the light bar 14 has multiple LED chips 11, multiple conductive substrates 12 and a packaging layer 13.
- the packaging layer 13 at least has an upper packaging layer 131.
- the multiple conductive substrates 12 further has a first conductive portion 125 and a second conductive portion 126.
- the first conductive portion 125 is at one distal end of the light bar 14 and is electrically connected to the conductive substrate 12 that is at the distal end.
- Each of the LED chips 11 is mounted and connected electrically between two adjacent conductive substrates 12, thereby forming a light bar 14.
- a conductive substrate 12, an LED chip 11, a conductive substrate 12, an LED chip 11, etc are alternately and repeatedly arranged in series.
- the second conductive portion 126 is an elongated conductive plate, which is disposed beside the first conductive portion 125 but not connected to the first conductive portion 125.
- One end of the second conductive portion 126 is electrically connected to the LED chip 11 at the other distal end of the light bar 14, and a portion of the second conductive portion 126 is covered by the upper packaging layer 131 to be fixed.
- the conductive substrates 12 and the second conductive portion 126 are separate from each other, and current flows from the first conductive portion 125 through the plurality of LED chips 11.
- the current flows from the first conductive portion 125, passes through the LED chips 11 and finally flows through the second conductive portion 126 to form a current loop. So the light bar 14 still can emit light after one end of the light bar 14 is inserted into the fixing block 20 and connected to the circuit board 30.
- another preferred embodiment of the LED lamp differs from the previous embodiment in that the LED lamp has two LED devices 10.
- the number of holes in the fixing block 20 is increased to four, so that both ends of each LED device 10 are inserted into the fixing block 20.
- the LED device 10 can be manufactured into different shapes. As shown in FIG. 12 , the LED device 10 is in a circular shape like a normal bulb light. As shown in FIG. 13 , the LED device 10 is in a mushroom shape. As shown in FIG. 14 , the LED device 10 is in a heart shape. As shown in FIG. 15 , the LED device 10 is in a pear shape. By forming the LED device 10 into different shapes, a variety of modeling options is provided to the user.
- the LED chips 11 belong to the point light source, the distance between two adjacent LED chips 11 is controlled to be less than twice the length of each LED chip 11 to ensure that the light bar 14 shows continuous light.
- the light bar 14 which is formed by connecting a plurality of LED chips 11 to the conductive substrates 12 in sequence, has flexibility, the LED device 10 is allowed to be manufactured in any specific shape, thereby providing a variety of options.
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
- The present invention relates to lighting fixtures, and more particularly to an LED lamp.
- Referring to
FIG.16 , a conventionalLED bulb lamp 80 comprises anLED light bar 81, a supportingbase 82, alamp base 85, and alamp housing 86. TheLED light bar 81 is mounted on the supportingbase 82 and is fixed to the supportingbase 82 by a plurality of fixed blocks 83. The supportingbase 82 is held in thelamp base 85. Thelamp housing 86 is connected to the supportingbase 82, so that theLED light bar 81 and the supportingbase 82 are covered in thelamp housing 86. - In general, the
lamp housing 86 is made of glass so thelamp housing 86 easily cracks or is even broken under collision or pressure. Further, there is a distance between theLED light bar 81 and thelamp housing 86, so the heat generated by theLED light bar 81 easily accumulates in thelamp housing 86 and is difficult to dissipate. -
FIG. 17 shows a conventionalLED light bar 90 which comprises asubstrate 91,multiple LED chips 92 andmultiple resistors 93. Theseresistors 93 are current limiting resistors, used to reduce the current flowing through the LED chips 92 and to avoid the large load current causing high temperature, even burning of the LED chips 92. These LED chips 92 andresistors 93 are mounted on one surface of thesubstrate 91 and are staggered with each other, wherein the LED chips 92 and theresistors 93 are electrically connected. - Since each of the LED chips 92 belongs to the point light source and the
resistors 93 are interposed between the LED chips 92, the distance between therespective LED chips 92 is too long. The illumination ranges of the twoadjacent LED chips 92 are adjacent but not intersecting, and theLED light bar 90 presents an illumination effect of multiple point light sources, causing a problem of light discontinuity. - To overcome the shortcomings, the present invention provides an LED lamp to mitigate or obviate the aforementioned problems.
- To overcome the problems of poor heat dissipation and discontinuous illumination of the conventional LED bulbs, the present invention provides an LED lamp that uses a protective cover as the lamp housing so that the heat generated by the light bar can be effectively dissipated, thereby improving heat dissipation. By using a packaging layer and arranging the LED chips in a specific way, the LED lamp is beneficial to heat dissipation and energy saving, while achieving a continuous and uniform light illumination effect.
- To achieve the foregoing objective, the LED lamp comprises:
- an LED device having
- multiple LED chips;
- multiple conductive substrates, wherein each of the multiple conductive substrates is a metal foil, the multiple conductive substrates are arranged at intervals, and each of the LED chips is supported by and electrically connected between two adjacent conductive substrates, wherein a length of each LED chip is W1, a distance between two adjacent LED chips is W2, and W2 <2W1;
- a packaging layer including an upper packaging layer, wherein the upper packaging layer is pervious to light and covers the LED chips and top surfaces of the conductive substrates, wherein the packaging layer, the LED chips and the conductive substrates form a light bar; and a protective cover being a curved tube mounted around the light bar, wherein the protective cover is pervious to light and is insulative;
- a fixing block having at least one hole for allowing at least one end of the light bar to pass through so as to mount the LED device to the fixing block;
- a circuit board electrically connected to at least one end of the light bar for controlling the LED device; and
- a lamp base for holding and mounting the fixing block and the circuit board therein.
- An LED lamp comprises:
- an LED device having
- multiple LED chips;
- multiple conductive substrates having a plurality of positive electrode conductive substrates and a negative electrode conductive substrate, wherein the positive electrode conductive substrates are arranged at intervals, each of the LED chips is supported by and electrically connected between two adjacent positive conductive substrates and the negative electrode conductive substrate, wherein a length of each LED chip is W1, a distance between two adjacent LED chips is W2, and W2 <2W1; the negative electrode conductive substrate is provided on one side of the positive electrode conductive substrates;
- a packaging layer including an upper packaging layer, wherein the upper packaging layer is pervious to light and covers the LED chips and top surfaces of the conductive substrates, at least one side of each positive electrode conductive substrate and the negative electrode conductive substrate extend beyond the packaging layer, and the packaging layer, the LED chips and the conductive substrates form a light bar; and
- a protective cover being a curved tube mounted around the light bar, wherein the protective cover is pervious to light and is insulative;
- a fixing block having at least one hole for allowing at least one end of the light bar to pass through so as to mount the LED device to the fixing block;
- a circuit board electrically connected to at least one end of the light bar for controlling the LED device;
- a lamp base for holding and mounting the fixing block and the circuit board therein.
- Since the LED chips belong to the point light source, the distance between two adjacent LED chips is controlled to be less than twice the length of each LED chip to ensure that the light bar shows continuous light. As the light bar, which is formed by connecting a plurality of the LED chips to a plurality of the conductive substrates in sequence, has flexibility, the LED device can be manufactured in any specific shape, thereby providing a variety of options. The upper packaging layer is in the shape of a semi-elliptical arc, so the light is emitted from the upper package uniformly, thereby achieving a continuous uniform lighting effect. Furthermore, as the protective cover covers the light bar, the distance between the light bar and the protective cover is so close that the heat generated by the light bar can be dissipated into the air quickly and is not accumulated in the protective cover easily, thereby improving a heat-dissipating effect.
- Other objectives, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
-
-
FIG. 1 is an exploded view of the LED lamp in accordance with the present invention; -
FIG. 2 is a schematic view of the light bar in accordance with the present invention; -
FIG. 3 is a side view of the light bar in accordance with the present invention; -
FIG. 4 is a perspective schematic view of the light bar in accordance with the present invention; -
FIG. 5A is a sectional view of the light bar in accordance with the present invention; -
FIG. 5B is a sectional view of the LED device in accordance with the present invention; -
FIG. 6 is a schematic view of the present invention; -
FIG. 7 is an exploded view of the LED lamp of another embodiment in accordance with the present invention; -
FIG. 8 is a schematic view of the LED lamp of another embodiment in accordance with the present invention; -
FIG. 9 is a schematic view of the light bar applied to the embodiment ofFIG. 7 andFIG. 8 in accordance with the present invention; -
FIG. 10 is an exploded view of the LED lamp of another embodiment in accordance with the present invention; -
FIG. 11 is a schematic view of the LED lamp of another embodiment in accordance with the present invention; -
FIG. 12∼ FIG. 15 are schematic views of the LED lamps in different shapes in accordance with the present invention; -
FIG. 16 is a schematic view of a conventional LED lamp in accordance with the prior art; -
FIG. 17 is a schematic view of a conventional LED light bar in accordance with the prior art. - Referring to
FIGS. 1 and6 , the present invention relates to an LED lamp, comprising anLED device 10, afixing block 20, acircuit board 30, and alamp base 50. - Further referring to
FIG. 2 ,FIG. 3 andFIG.5B , theLED device 10 comprises alight bar 14 and a protective cover 16.Thelight bar 14 has multiple light emitting diode chips 11 (LED chips), multipleconductive substrates 12 and apackaging layer 13. In an embodiment, thepackaging layer 13 has anupper packaging layer 131. TheLED chips 11 may be LEDs with top and bottom surfaces, or may have at least one top light-emittingsurface 111. TheLED chips 11 can project the emitted light through the top light-emittingsurface 111 outwardly, wherein the top light-emittingsurface 111 is at the top of eachLED chip 11. Each of theconductive substrates 12 is a metal conductive sheet. Theconductive substrates 12 are arranged in a sequence with an interval between each two adjacentconductive substrates 12. Each of the LED chips 11 is mounted between two adjacentconductive substrates 12 and electrically connected to the two adjacentconductive substrates 12, thereby forming thelight bar 14. In particular, oneconductive substrate 12, oneLED chip 11, oneconductive substrate 12, oneLED chip 11, etc. are alternately arranged in series. In the present embodiment, thelight bar 14 has flexibility. In the embodiment, a firstconductive portion 121 is formed on and extends from theconductive substrate 12 at one end of thelight bar 14, and a secondconductive portion 122 is formed on and extends from theconductive substrate 12 at the other end of thelight bar 14, wherein the firstconductive portion 121 and the secondconductive portion 122 are two opposite electrodes. - Referring to
FIG. 4 , in the present embodiment, each of the LED chips 11 is supported by two adjacentconductive substrates 12 and forms an electrical connection, wherein eachLED chip 11 has a length W1, the distance between twoadjacent LED chips 11 is W2, wherein the distance W2 is less than twice the length W1 (W2<2W1). So the number of the plurality ofLED chips 11 can be sufficiently increased, and the effect of continuous light emission can be achieved. -
FIG. 5A shows another embodiment of thelight bar 14 which has alower packaging layer 132 and a lower light-transmittingplate 15. The lower light-transmittingplate 15 is mounted on a bottom surface of eachconductive substrate 12. The lower light-transmittingplate 15 has a bottom light-emittingsurface 151 through which light can be emitted outwardly. The area of the lower light-transmittingplate 15 is equal to or larger than the area of eachconductive substrate 12. Theupper packaging layer 131 is semi-elliptical and is disposed on a top surface of theconductive substrate 12 and completely covers the plurality ofLED chips 11. Thelower packaging layer 132 is semi-elliptical and is disposed on a bottom surface of the lower light-transmittingplate 15, wherein both edges of eachconductive substrate 12 are exposed to the packaging layers 131,132 and are not covered by the packaging layers 131, 132. The protection to the LED chips 11 and theconductive substrates 12 can be improved by the combination of theupper packaging layer 131 and thelower packaging layer 132. The bonding strength between eachLED chip 11 and eachconductive substrate 12 is also enhanced so that thelight bar 14 is not easily broken. In addition, a central axis C1 is defined and extends from the center point of theconductive substrate 12 perpendicularly through the top light-emittingsurface 111 and the bottom light-emittingsurface 151. As theupper packaging layer 131 has a semi-elliptical shape viewed from the side, the thickness of theupper packaging layer 131, measured along a direction from the top surface of eachconductive substrate 12 towards the light-emitting surface of eachLED chip 11, is defined as a first length L1. The thickness, laterally measured from the center axis C1 of eachconductive substrate 12 to a side surface of theupper packaging layer 131, is defined as a second length L2. Three times the first length L1 is larger than the second length L2 (i.e., 3 * L1> L2). Thelower packaging layer 132 also has the similar configuration. When the plurality ofLED chips 11 are emitting light, the light can be emitted outwardly along the radial direction of the packaging layers 131 and 132, and then the light reflected by the packaging layers 131, 132 is reduced and the light transmission is increased and uniform, thereby achieving a uniform lighting effect. - In the present embodiment, after the plurality of
LED chips 11 and the plurality ofconductive substrates 12 are electrically connected and fixed, a high-density coating material is applied to cover the surfaces of the LED chips 11 and portions of theconductive substrates 12 to cover eachLED chip 11 completely, and then the flow condition and the hardening time of the coating material are controlled to form theupper packaging layer 131 and thelower packaging layer 132. The coating material for theupper packaging layer 131 and thelower packaging layer 132 may be a transparent resin material, a transparent silicone material, or a light-transmitting polymer material. - As shown in
FIG. 5B , theprotective cover 16 may be formed as an elongated transparent structure. In this embodiment, the inner diameter of theprotective cover 16 is between 3mm and 15mm, and the outer diameter of theprotective cover 16 is between 4mm to 16mm. Theprotective cover 16 is a light-transmitting hollow tube for covering thelight bar 14. Theprotective cover 16 can match the shape of thelight bar 14, so that thelight bar 14 is not easily broken. In the present embodiment, theprotective cover 16 is an insulator that avoids the risk of electric shock when the user is in contact with thelight bar 14. In addition, eachconductive substrate 12 has two opposite edges respectively adjacent to the precedingconductive substrate 12 and the subsequentconductive substrate 12, and a distance measured between the two opposite edges is defined as a width D1 of theconductive substrate 12. The inner diameter of theprotective cover 16 is D3, wherein 0.3 <(D1/D3)< 1. When the ratio of the width D1 of theconductive substrate 12 to the inner diameter D3 of theprotective cover 16 is between 0.3 and 1, the maximum light output can be achieved. In addition, theprotective cover 16 can be made into a tube by extrusion molding, and then shaped by heating through the thermoplastic or other heating methods and molded. When thelight bar 14 is placed in theprotective cover 16, the friction between theprotective cover 16 and the packaging layers 131, 132 can be reduced because the two edges of each of theconductive substrates 12 are exposed from the packaging layers 131 and 132. By the contact between the two edges of each of theconductive substrates 12 and the inner wall of theprotective cover 16, the resistance is reduced when thelight bar 14 is being placed into theprotective cover 16. Furthermore, as the two edges of each of theconductive substrates 12 are in contact with the inner wall of theprotective cover 16, the two edges of each of theconductive substrates 12 can be used as the supporting structure for theprotective cover 16, which allows the protective cover16 to be formed in a substantially circular shape or an oval shape viewed in cross section and reduces the pressure exerted by theprotective cover 16 on eachLED chip 11. Furthermore, in the present embodiment, theprotective cover 16 is made of a transparent or translucent material, which can also ensure a good light transmission effect while protecting thelight bar 14. - In this embodiment, two edges of each of the
conductive substrates 12 are exposed outside thepackaging layer 13 so as to be in contact with the inner wall of theprotective cover 16. Moreover, as the friction between theconductive substrate 12 and theprotective cover 16 is smaller than the friction between thepackaging layer 13 and theprotective cover 16, when thelight bar 14 is mounted in theprotective cover 16, the installation process can be smooth with the small friction between eachconductive substrate 12 and theprotective cover 16, thereby reducing the time and difficulty of operation. - Referring to
FIG. 1 , in the present embodiment, the fixingblock 20 is a circular block made of an insulating material, and a plurality ofholes 22 are formed through the fixingblock 20. In the present embodiment, the fixingblock 20 has twoholes 22, and in a preferred embodiment, eachhole 22 is a circular hole. The diameter of eachhole 22 corresponds to theLED device 10. The firstconductive portion 121 and the secondconductive portion 122 at both ends of theLED device 10 can be respectively inserted into the twoholes 22 and fixed in the twoholes 22, for example, fixed by adhesive bonding. So theLED device 10 is firmly mounted on the fixingblock 20. Aflange 24 is formed around an outer edge of the fixingblock 20. - The
circuit board 30 is provided with a plurality of electrode terminals. In this embodiment, twoelectrode terminals circuit board 30. Theelectrode terminals conductive portion 121, and the negative electrode terminal is electrically connected to the secondconductive portion 122. A control circuit is formed on thecircuit board 30 by electronic components, such as capacitors, resistors and so on. - In one embodiment, the
lamp base 50 may be a so called Edison's lamp base. The bottom of thelamp base 50 has a firstelectrical connection portion 51. A side of thelamp base 50 has a secondelectrical connection portion 53. The firstelectrical connection portion 51 and the secondelectrical connection portion 53 are for connecting to opposite polarities of an external power source. In the present embodiment, the secondelectrical connection portion 53 has a threaded surface. A steppedportion 55 is formed in an inner wall of the top of thelamp base 50 for supporting theflange 24 of the fixingblock 20. In addition, the firstelectrical connection portion 51 and the secondelectrical connection portion 53 are respectively and electrically connected toelectrode connection terminals lamp base 50. - Referring to
FIG. 7 to FIG. 8 , another preferred embodiment of the LED lamp differs from the previous embodiment in that only one end of theLED device 10 is inserted into the fixingblock 20. - In order to implement the LED lamp in
FIG. 7 andFIG. 8 , thelight bar 14 inFIG. 9 is used in the present embodiment. Thelight bar 14 has multiple LEDchips 11, multipleconductive substrates 12 and apackaging layer 13. Thepackaging layer 13 at least has an upper packaging layer 131.In this embodiment, the multipleconductive substrates 12 further has a firstconductive portion 125 and a secondconductive portion 126. The firstconductive portion 125 is at one distal end of thelight bar 14 and is electrically connected to theconductive substrate 12 that is at the distal end. Each of the LED chips 11 is mounted and connected electrically between two adjacentconductive substrates 12, thereby forming alight bar 14. In particular, aconductive substrate 12, anLED chip 11, aconductive substrate 12, anLED chip 11, etc are alternately and repeatedly arranged in series. The secondconductive portion 126 is an elongated conductive plate, which is disposed beside the firstconductive portion 125 but not connected to the firstconductive portion 125. One end of the secondconductive portion 126 is electrically connected to theLED chip 11 at the other distal end of thelight bar 14, and a portion of the secondconductive portion 126 is covered by theupper packaging layer 131 to be fixed. In this embodiment, theconductive substrates 12 and the secondconductive portion 126 are separate from each other, and current flows from the firstconductive portion 125 through the plurality ofLED chips 11. The current flows from the firstconductive portion 125, passes through the LED chips 11 and finally flows through the secondconductive portion 126 to form a current loop. So thelight bar 14 still can emit light after one end of thelight bar 14 is inserted into the fixingblock 20 and connected to thecircuit board 30. - Referring to
FIG. 10 to FIG. 11 , another preferred embodiment of the LED lamp differs from the previous embodiment in that the LED lamp has two LEDdevices 10. To implement this embodiment, the number of holes in the fixingblock 20 is increased to four, so that both ends of eachLED device 10 are inserted into the fixingblock 20. - Referring to
FIG.12 to FIG.15 , theLED device 10 can be manufactured into different shapes. As shown inFIG. 12 , theLED device 10 is in a circular shape like a normal bulb light. As shown inFIG. 13 , theLED device 10 is in a mushroom shape. As shown inFIG. 14 , theLED device 10 is in a heart shape. As shown inFIG. 15 , theLED device 10 is in a pear shape. By forming theLED device 10 into different shapes, a variety of modeling options is provided to the user. - Since the LED chips 11 belong to the point light source, the distance between two
adjacent LED chips 11 is controlled to be less than twice the length of eachLED chip 11 to ensure that thelight bar 14 shows continuous light. As thelight bar 14, which is formed by connecting a plurality ofLED chips 11 to theconductive substrates 12 in sequence, has flexibility, theLED device 10 is allowed to be manufactured in any specific shape, thereby providing a variety of options.
Claims (18)
- An LED lamp, characterized in that the LED lamp comprises:an LED device (10) havingmultiple LED chips (11);multiple conductive substrates (12), wherein each of the multiple conductive substrates (12) is a metal foil, the multiple conductive substrates (12) are arranged at intervals, and each of the LED chips (11) is supported by and electrically connected between two adjacent conductive substrates (12), wherein a length of each LED chip (11) is W1, a distance between two adjacent LED chips (11) is W2, and W2 <2W1;a packaging layer (13) including an upper packaging layer (131), wherein the upper packaging layer (131) is pervious to light and covers the LED chips (11) and top surfaces of the conductive substrates (12), wherein the packaging layer (13), the LED chips (11) and the conductive substrates (12) form a light bar (14); and a protective cover (16) being a curved tube mounted around the light bar (14), wherein the protective cover (16) is pervious to light and is insulative;a fixing block (20) having at least one hole (22) for allowing at least one end of the light bar (14) to pass through so as to mount the LED device (10) to the fixing block (20);a circuit board (30) electrically connected to at least one end of the light bar (14) for controlling the LED device (10); anda lamp base (50) for holding and mounting the fixing block (20) and the circuit board (30) therein.
- The LED lamp as claimed in claim 1, wherein the protective cover is made into a tube by extrusion molding, heating to soften the tube, and then putting the tube into a mold to be shaped into the curved tube.
- The LED lamp as claimed in claim 1, wherein both sides of each conductive substrate (12) extend out of the upper packaging layer (131).
- The LED lamp as claimed in claim 1, wherein top surfaces and bottom surfaces of the LED chips (11) emit light.
- The LED lamp as claimed in claim 1, wherein a width of the conductive substrates (12) is D1, and an inner diameter of the protective cover (16) is D3;
wherein 0.3 < (D1 / D3) < 1. - The LED lamp as claimed in claim 1, wherein the upper packaging layer (131) has a first length L1, which is a thickness of the upper packaging layer (131) measured along a direction from the top surface of the conductive substrate (12) toward a light-emitting surface of the LED chip (11) ;
the upper packaging layer (131) has a second length L2, which is a thickness of the upper packaging layer (131) laterally measured from a center of the conductive substrate (12) to a side surface of the upper packaging layer (131);
wherein 3L1 > L2. - The LED lamp as claimed in claim 6, wherein the packaging layer (13) further includes a lower packaging layer (132) covering bottom surfaces of the LED chips (11) and the conductive substrates (12).
- The LED lamp as claimed in claim 7, wherein the upper packaging layer (131) and the lower packaging layer (132) both are semi-elliptical arcs in shape.
- The LED lamp as claimed in claim 1, wherein the light bar (14) further comprises a lower light-transmitting plate (15), which is insulated, transparent and disposed on bottom surfaces of the conductive substrates (12).
- An LED lamp, characterized in that the LED lamp comprising:an LED device (10) havingmultiple LED chips (11);multiple conductive substrates (12),wherein each of the LED chips (11) is supported by and electrically connected between two adjacent conductive substrates (12), wherein a length of each LED chip (11) is W1, a distance between two adjacent LED chips is W2, and W2 <2W1;a packaging layer (13) including an upper packaging layer (131), wherein the upper packaging layer (131) is pervious to light and covers the LED chips (11) and top surfaces of the conductive substrates (12), and at least one side of each conductive substrate (12) extends beyond the packaging layer (13), wherein the packaging layer (13), the LED chips (11) and the multiple conductive substrates (12) form a light bar (14); anda protective cover (16) being a curved tube mounted around the light bar (14), wherein the protective cover (16) is pervious to light and is insulative;a fixing block (20) having at least one hole (22) for allowing at least one end of the light bar (14) to pass through so as to mount the LED device (10) to the fixing block (20);a circuit board (30) electrically connected to at least one end of the light bar (14) for controlling the LED device (10);a lamp base (50) for holding and mounting the fixing block (20) and the circuit board (30) therein.
- The LED lamp as claimed in claim 10, wherein the protective cover is made into a tube by extrusion molding, heating to soften the tube, and then putting the tube into a mold to be shaped into the curved tube.
- The LED lamp as claimed in claim 10, wherein both sides of each conductive substrate (12) extend out of the upper packaging layer (131).
- The LED lamp as claimed in claim 10, wherein top surfaces and bottom surfaces of the LED chips (11) emit light.
- The LED lamp as claimed in claim 10, wherein a width of the conductive substrates (12) is D1, and an inner diameter of the protective cover (16) is D3;
wherein 0.3 < (D1 / D3) < 1. - The LED lamp as claimed in claim 10, wherein the upper packaging layer (131) has a first length L1, which is a thickness of the upper packaging layer (131) measured along a direction from the top surface of the conductive substrate (12) toward a light-emitting surface of the LED chip (11); the upper packaging layer (131) has a second length L2, which is a thickness of the upper packaging layer (131) laterally measured from a center of the conductive substrate (12) to a side surface of the upper packaging layer (131);
wherein 3L1 > L2. - The LED lamp as claimed in claim 15, wherein the packaging layer (13) further includes a lower packaging layer (132) covering bottom surfaces of the LED chips (11) and the conductive substrates (12).
- The LED lamp as claimed in claim 16, wherein the upper packaging layer (131) and the lower packaging layer (132) each have a thickness and are semi-elliptical arcs in shape, through which light is emitted uniformly outwards.
- The LED lamp as claimed in claim 10, wherein the light bar (14) further comprises a lower light-transmitting plate (15), which is insulated, transparent and disposed on bottom surfaces of the conductive substrates (12).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US201762479327P | 2017-03-31 | 2017-03-31 | |
TW106136278A TWI678495B (en) | 2017-03-31 | 2017-10-23 | LED light fixture |
Publications (3)
Publication Number | Publication Date |
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EP3301354A2 true EP3301354A2 (en) | 2018-04-04 |
EP3301354A3 EP3301354A3 (en) | 2018-07-04 |
EP3301354B1 EP3301354B1 (en) | 2020-02-19 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP18150711.2A Active EP3301354B1 (en) | 2017-03-31 | 2018-01-09 | Led lamp |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3660383A2 (en) | 2019-10-25 | 2020-06-03 | Liquidleds Lighting Corp. | Lighting device |
WO2021099201A1 (en) * | 2019-11-21 | 2021-05-27 | Signify Holding B.V. | A light emitting device |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM376709U (en) * | 2009-09-02 | 2010-03-21 | Liquidleds Lighting Corp | Curved tubular LED lamp |
TW201705557A (en) * | 2016-10-26 | 2017-02-01 | Liquidleds Lighting Corp | LED filament having heat sink structure and LED bulb using the LED filament characterized in that electricity-conductive carrying elements of the LED filament are exposed outside a packaging layer, so as to allow LED chips to dissipate heat to the outside |
-
2018
- 2018-01-09 EP EP18150711.2A patent/EP3301354B1/en active Active
Non-Patent Citations (1)
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3660383A2 (en) | 2019-10-25 | 2020-06-03 | Liquidleds Lighting Corp. | Lighting device |
US11131449B2 (en) | 2019-10-25 | 2021-09-28 | Liquidleds Lighting Corp. | Lighting device |
WO2021099201A1 (en) * | 2019-11-21 | 2021-05-27 | Signify Holding B.V. | A light emitting device |
Also Published As
Publication number | Publication date |
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EP3301354B1 (en) | 2020-02-19 |
EP3301354A3 (en) | 2018-07-04 |
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