EP3281497A1 - Baugruppe mit leiterplatte und elektrischem bauelement - Google Patents
Baugruppe mit leiterplatte und elektrischem bauelementInfo
- Publication number
- EP3281497A1 EP3281497A1 EP16714938.4A EP16714938A EP3281497A1 EP 3281497 A1 EP3281497 A1 EP 3281497A1 EP 16714938 A EP16714938 A EP 16714938A EP 3281497 A1 EP3281497 A1 EP 3281497A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- circuit board
- web
- component
- electrical
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/58—Electric connections to or between contacts; Terminals
- H01H1/5805—Connections to printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H50/00—Details of electromagnetic relays
- H01H50/02—Bases; Casings; Covers
- H01H50/04—Mounting complete relay or separate parts of relay on a base or inside a case
- H01H50/047—Details concerning mounting a relays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/046—Fuses formed as printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
- H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10053—Switch
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10962—Component not directly connected to the PCB
Definitions
- the invention relates to an electrical assembly according to the preamble of
- Such an electrical assembly can be in a battery or a
- Accumulator can be used, especially in such a battery in which large currents are to be switched.
- a circuit board can be contacted to the poles of the battery, wherein the circuit board serves as a carrier for a switching element.
- the module is particularly suitable for use in a motor vehicle.
- Such an electrical subassembly comprises a printed circuit board and a component, wherein the component is in electrical and / or mechanical connection with connection points located on and / or in the printed circuit board.
- the component may be an electromechanical component such as an electrical switch contact, an electrical switch, a relay or the like. At the joints mechanical stresses can occur, which in turn can lead to impairment of the assembly.
- the invention has for its object to design the connection point such that the mechanical stresses are reduced at the junction.
- connection point has at least one recess located in the printed circuit board.
- the connection point further comprises at least one web, wherein the connection point is formed by means of the web to the circuit board.
- the connection point is deformable in at least one spatial direction.
- the connection point can be elastically deformable. This makes it possible for forces acting between the printed circuit board and the component to be absorbed by the connection point. Such forces may arise due to tolerances and / or tolerance levels of the printed circuit board and the component, due to voltages due to heating in the printed circuit board and / or the component o. Since these forces are absorbed in the joint itself, the otherwise existing risk of impairment of the electrical and / or mechanical
- the web can be formed in a straight line, such that the connection point is approximately perpendicular to the circuit board, ie in the z-direction, deformable.
- the web can be formed spirally, so that the connection point is approximately perpendicular and approximately parallel to the circuit board, ie in the x and / or y direction and / or in the z direction, deformable.
- connection point with the component can be screwed, riveted, welded, soldered o.
- the printed circuit board may be a high current printed circuit board.
- a high-current circuit board may be provided with solid copper elements embedded in the circuit board for conducting a high current.
- Such a high-current circuit board may be provided with solid copper elements embedded in the circuit board for conducting a high current.
- connection point may have a base area for fastening the component.
- the base can be attached as an electrical contact point to an electrical connection of the device (3).
- the attachment can be done in particular by means of a screw.
- the bridge can go off in a simple way from the base to the circuit board.
- Conductor be provided on the circuit board.
- the recess by punching, milling, drilling o. The like. Be introduced into the circuit board.
- the web can be dimensioned such that heat from the component via the web can be dissipated.
- the web can be dimensioned such that the web interrupts the flow of current when exceeding a prescribed limit for the current flowing between the circuit board and the component electrical current in the manner of a fuse.
- electromechanical switching elements are to be electrically connected to a central combination board. These compounds cause mechanical forces in the X, Y and / or Z directions. These forces in turn cause mechanical stresses that are different for each manufactured part. These mechanical stresses in turn cause these forces to act statically on all the components involved. This permanent stress can then lead to the destruction of the entire assembly.
- the idea according to the invention for solving this problem is to relax the tolerance layers in a compatible manner. For all other solutions, residual power would affect the components involved. With the solution according to the invention you can
- electromechanical assemblies consisting for example of relays and printed circuit board, connected to each other. Because of the manufacturing parameters, each one has
- the degrees of freedom can be achieved in a straight and / or in a spiral execution. In the straight version, however, the degree of freedom is essentially present only in the Z direction. In the spiral version you have the degrees of freedom in the directions X, Y, and Z.
- the straight and / or spiral connecting webs are designed so that the
- Connecting webs are designed so that the heat can be optimally dissipated via the webs.
- the straight and / or spiral connecting webs are designed so that the webs can also fulfill the function of electrical fuses. If an electric current flows permanently above the permissible current limit and all other safety measures are not effective, for example in the event of an accident, these bars fulfill the function of a fuse.
- the required recesses can be milled and / or produced by stamping technology cost, ie. All recesses are made with one punch in one step.
- the printed circuit board and the electromechanical module can be connected directly to each other.
- the connecting webs can take over fuse tasks.
- Fig. 1 is an electrical assembly in side view and in plan view
- Fig. 2 is a detail of FIG. 1 according to a first embodiment
- Fig. 3 is a detail of FIG. 1 according to a second embodiment.
- FIG. 1 an electrical assembly 1 can be seen, a printed circuit board 2 and a
- Component 3 comprises.
- the component 3 is an electromechanical component, namely an electrical switching contact.
- the electrical switching contact for example, part of an electrical switch, a relay o. The like. Be.
- the Component 3 is connected to and / or located in the circuit board 2 connection points 4 in electrical and / or mechanical connection.
- the connection point 4 has at least one recess 5 located in the printed circuit board 2.
- connection point 4 is integrally formed by means of the web 6 to the circuit board 2.
- the connection point 4 is deformable in at least one spatial direction.
- connection point 4 is approximately perpendicular and approximately parallel to the printed circuit board 2, so in the x, y and z direction, deformable. However, it may also be sufficient if the connection point 4 is deformable only in one spatial direction.
- the web 6 is formed in a straight line. As a result, the connection point 4 is approximately perpendicular to the printed circuit board 2, ie in the z-direction, deformable.
- connection point 4 is a screw 7 for screwing the connection point 4 with the switching contact 3.
- a screw connection point 4 can also be riveted to the component 3, welded, soldered o. The like be designed.
- connection point 4 has a base surface 8 for fastening the component 3.
- the fastening takes place in that the
- Base 8 as electrical contact point on an electrical connection 1 1 of the
- Component 3 is fixed by means of the screw 7.
- the webs 6 go from the base 8 to the circuit board 2 from. Furthermore, an electrical connection from the base 8 via the web 6 to a not shown, associated conductor to the circuit board 2 is provided.
- the recesses 5 are by means of stamping, milling, drilling o. The like.
- the printed circuit board 2 may be a high-current printed circuit board.
- solid copper elements can be embedded in the printed circuit board 2 for conducting a high current. Due to the high current flowing creates a certain amount of heat in the switch contact 3.
- the heat flow 9 can at least partially via the junction 4 on the
- the web 6 is dimensioned such that the heat from the component 3 via the web 6 can be discharged.
- the web 6 may be dimensioned such that the web 6 interrupts the flow of current when exceeding a prescribed limit for the current flowing between the circuit board 2 and the component 3 electrical current in the manner of a fuse.
- connection point 4 according to the invention can be used in an assembly for the battery system of a motor vehicle.
- the invention is not limited to the described and illustrated embodiment. Rather, it also encompasses all expert developments within the scope of the invention defined by the claims.
- the junction 4 according to the invention can also be used in assemblies for household appliances, audio devices, video devices, telecommunication devices or the like.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Fuses (AREA)
- Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015004375 | 2015-04-10 | ||
DE102015004377 | 2015-04-10 | ||
PCT/EP2016/057703 WO2016162459A1 (de) | 2015-04-10 | 2016-04-08 | Baugruppe mit leiterplatte und elektrischem bauelement |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3281497A1 true EP3281497A1 (de) | 2018-02-14 |
Family
ID=55697214
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP16714938.4A Withdrawn EP3281497A1 (de) | 2015-04-10 | 2016-04-08 | Baugruppe mit leiterplatte und elektrischem bauelement |
EP16715516.7A Withdrawn EP3281499A1 (de) | 2015-04-10 | 2016-04-08 | Baugruppe |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP16715516.7A Withdrawn EP3281499A1 (de) | 2015-04-10 | 2016-04-08 | Baugruppe |
Country Status (3)
Country | Link |
---|---|
EP (2) | EP3281497A1 (de) |
DE (2) | DE102016003988A1 (de) |
WO (2) | WO2016162459A1 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017208147B4 (de) | 2017-05-15 | 2021-12-30 | Schweizer Electronic Ag | Elektronisches Bauteil und Leiterplatte mit diesem elektronischen Bauteil |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2351513A1 (fr) * | 1976-05-13 | 1977-12-09 | Cit Alcatel | Plaquette support de composants electriques |
TW394454U (en) * | 1990-09-14 | 2000-06-11 | Cts Corp | Piezoelectric component-mounting foil |
US5336990A (en) * | 1993-01-13 | 1994-08-09 | United Technologies Automotive, Inc. | Electrical test shunt having dual contact point mating terminals |
US5839189A (en) * | 1995-04-03 | 1998-11-24 | Emerson Electric Co. | Bracket for attaching pin-in-hole components to a surface mount board |
US7286358B2 (en) * | 2004-12-16 | 2007-10-23 | Stackpole Electronic Inc. | Surface mounted resistor with improved thermal resistance characteristics |
DE102006001188A1 (de) * | 2006-01-10 | 2007-07-12 | Robert Bosch Gmbh | Anordnung zur Kühlung von Leistungsbauelementen auf Leiterplatten und Verfahren zur Herstellung derselben |
DE102006019895A1 (de) * | 2006-04-28 | 2007-11-15 | Siemens Ag | Strommessvorrichtung mit speziell kontaktierter Leiterplatte und entsprechendes Herstellungsverfahren |
CN101524001A (zh) * | 2006-10-10 | 2009-09-02 | Tir科技公司 | 具有区域柔性的电路板 |
EP2080417A1 (de) * | 2006-10-31 | 2009-07-22 | TIR Technology LP | Lichtemittierendes element, lichtquelle und temperaturverwaltungssystem dafür |
WO2010126410A1 (en) * | 2009-04-28 | 2010-11-04 | Telefonaktiebolaget L M Ericsson (Publ) | Assembly for carrying electronic components |
US9140735B2 (en) * | 2013-05-03 | 2015-09-22 | Infineon Technologies Ag | Integration of current measurement in wiring structure of an electronic circuit |
-
2016
- 2016-04-07 DE DE102016003988.4A patent/DE102016003988A1/de not_active Withdrawn
- 2016-04-07 DE DE102016003987.6A patent/DE102016003987A1/de not_active Withdrawn
- 2016-04-08 EP EP16714938.4A patent/EP3281497A1/de not_active Withdrawn
- 2016-04-08 WO PCT/EP2016/057703 patent/WO2016162459A1/de active Application Filing
- 2016-04-08 WO PCT/EP2016/057704 patent/WO2016162460A1/de active Application Filing
- 2016-04-08 EP EP16715516.7A patent/EP3281499A1/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP3281499A1 (de) | 2018-02-14 |
DE102016003988A1 (de) | 2016-10-13 |
WO2016162459A1 (de) | 2016-10-13 |
WO2016162460A1 (de) | 2016-10-13 |
DE102016003987A1 (de) | 2016-10-13 |
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