EP3238905B1 - Method of manufacturing housing structure and housing structure - Google Patents
Method of manufacturing housing structure and housing structure Download PDFInfo
- Publication number
- EP3238905B1 EP3238905B1 EP17167593.7A EP17167593A EP3238905B1 EP 3238905 B1 EP3238905 B1 EP 3238905B1 EP 17167593 A EP17167593 A EP 17167593A EP 3238905 B1 EP3238905 B1 EP 3238905B1
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- EP
- European Patent Office
- Prior art keywords
- circuit portion
- mold
- electronic unit
- circuit
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000011347 resin Substances 0.000 claims description 74
- 229920005989 resin Polymers 0.000 claims description 74
- 238000000465 moulding Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 12
- 239000000758 substrate Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0046—Details relating to the filling pattern or flow paths or flow characteristics of moulding material in the mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L3/00—Measuring torque, work, mechanical power, or mechanical efficiency, in general
- G01L3/02—Rotary-transmission dynamometers
- G01L3/04—Rotary-transmission dynamometers wherein the torque-transmitting element comprises a torsionally-flexible shaft
- G01L3/10—Rotary-transmission dynamometers wherein the torque-transmitting element comprises a torsionally-flexible shaft involving electric or magnetic means for indicating
- G01L3/101—Rotary-transmission dynamometers wherein the torque-transmitting element comprises a torsionally-flexible shaft involving electric or magnetic means for indicating involving magnetic or electromagnetic means
- G01L3/104—Rotary-transmission dynamometers wherein the torque-transmitting element comprises a torsionally-flexible shaft involving electric or magnetic means for indicating involving magnetic or electromagnetic means involving permanent magnets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/22—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring the force applied to control members, e.g. control members of vehicles, triggers
- G01L5/221—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring the force applied to control members, e.g. control members of vehicles, triggers to steering wheels, e.g. for power assisted steering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C2045/14122—Positioning or centering articles in the mould using fixed mould wall projections for centering the insert
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C2045/2683—Plurality of independent mould cavities in a single mould
- B29C2045/2691—Plurality of independent mould cavities in a single mould sequentially filled
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
Definitions
- the invention relates to a method of manufacturing a housing structure, and relates also to a housing structure.
- Insert molding is widely known as a method of integrally molding a member and a housing that houses the member. Insert molding is a process in which a resin is injected into a mold with the member placed in the mold, and the member and the housing are integrally molded into a single component.
- Japanese Patent Application Publication No. 2015-031600 JP 2015-031600 A
- JP 2015-031600 A with the features of the preamble of claim 1 describes a torque detecting device including an outer housing.
- the outer housing is molded by injecting a molding material into a mold in which a sensor unit has been placed.
- the sensor unit and the outer housing that houses the sensor unit are integrally molded into a single component.
- the sensor unit includes a magnetic convergence ring holder having a cylindrical shape and a case.
- the magnetic convergence ring holder is integrated with magnetic convergence rings.
- the case extends radially outward from the magnetic convergence ring holder.
- the case of the sensor unit extending radially outward from the magnetic convergence ring holder may be deformed by a force (resin pressure) applied from a resin flowing in the mold along an upper surface of the case.
- One object of the invention is to provide a housing structure configured to suppress deformation of an electronic unit during insert molding, and a method of manufacturing the housing structure.
- An aspect of the invention relates to a method of manufacturing a housing structure in accordance with the subject-matter of independent claim 1.
- the invention further concerns a housing structure in accordance with independent claim 8. Further embodiments of the invention are defined by the features of the dependent claims.
- FIG. 1 is a schematic diagram illustrating the schematic configuration of an electric power steering system 5 including a housing structure 1 according to an embodiment of the invention.
- the housing structure 1 includes an electronic unit 2 and a housing 3 that houses the electronic unit 2.
- the electronic unit 2 and the housing 3 are integrated with each other.
- the electronic unit 2 is a sensor unit used, for example, as a torque sensor 4 mounted in a vehicle.
- the housing 3 is, for example, a sensor housing that houses the torque sensor 4.
- the electric power steering system 5 provided with the torque sensor 4 is, for example, a dual-pinion electric power steering system.
- the electric power steering system 5 includes a first pinion shaft 7 and a second pinion shaft 8.
- the first pinion shaft 7 has a first pinion 7a that meshes with a first rack 6a of a rack shaft 6.
- the first pinion shaft 7 is used to transmit a steering assist force.
- the second pinion shaft 8 has a second pinion 8a that meshes with a second rack 6b of the rack shaft 6.
- the second pinion shaft 8 is used to transmit a manual steering force.
- the housing 3 is attached to, for example, a rack housing 10 in which the rack shaft 6 is housed.
- the torque sensor 4 is attached to, for example, the second pinion shaft 8.
- the second pinion shaft 8 includes an input shaft 15, an output shaft 16, and a torsion bar 17.
- the input shaft 15 is coupled to a steering wheel 13 via a steering shaft 11 and an intermediate shaft 12.
- the output shaft 16 has the second pinion 8a.
- the torsion bar 17 couples the input shaft 15 and the output shaft 16 to each other such that the input shaft 15 and the output shaft 16 are coaxial with each other.
- the input shaft 15 and the output shaft 16 are rotatable relative to each other within a prescribed angular range.
- Steered wheels 20 are coupled to respective ends of the rack shaft 6 via tie rods 18 and knuckle arms 19.
- the steered wheels 20 are steered via the steering shaft 11, the intermediate shaft 12, the second pinion shaft 8, the rack shaft 6, the tie rods 18, and the knuckle arms 19.
- the input shaft 15 and the output shaft 16 of the second pinion shaft 8 rotate relative to each other, so that the torsion bar 17 is twisted.
- the torque sensor 4 detects a torsion amount of the torsion bar 17 of the second pinion shaft 8.
- a detection signal from the torque sensor 4 is provided to an electronic control unit (ECU) 25.
- the ECU 25 controls driving of an electric motor 26 using an embedded driving circuit, based on, for example, a detected torque signal, and a detected vehicle speed signal from a vehicle speed sensor (not illustrated).
- the speed of rotation output from the electric motor 26 is reduced by a speed reducer 27. Then, the rotation having a reduced speed is transmitted to the first pinion shaft 7, and is converted into a linear motion of the rack shaft 6. In this way, a driver's steering operation is assisted.
- FIG. 2 is a schematic sectional view of the housing structure 1 and its surroundings.
- FIG. 3 is an exploded perspective view of the electronic unit 2.
- the torque sensor 4, which is the electronic unit 2 of the housing structure 1, further includes a permanent magnet 40 and a pair of magnetic yokes 41.
- the magnetic yokes 41 are magnetically coupled to the permanent magnet 40.
- the permanent magnet 40 is concentrically fixed to the input shaft 15 so as to rotate together with the input shaft 15 in an integrated manner.
- the magnetic yokes 41 are concentrically fixed to the output shaft 16 so as to rotate together with the output shaft 16 in an integrated manner. As the input shaft 15 and the output shaft 16 rotate relative to each other, the positions of the magnetic yokes 41 relative to the permanent magnet 40 vary, resulting in magnetic flux variations.
- the electronic unit 2 is electrically connected to the ECU 25, and detects magnetic fluxes from the magnetic yokes 41.
- the electronic unit 2 includes a first circuit portion 51 having an annular shape.
- the first circuit portion 51 has a central axis C1 that coincides with a central axis of the input shaft 15.
- a radial direction centered at the central axis C1 will be referred to as "radial direction r".
- a direction included in the radial direction r and extending toward the central axis C1 will be referred to as "radially inward direction”.
- a direction included in the radial direction r and extending away from the central axis C1 will be referred to as "radially outward direction”.
- the electronic unit 2 further includes a second circuit portion 52 having a block shape and protruding radially outward from an outer periphery of the first circuit portion 51.
- the second circuit portion 52 is supported, as a cantilever portion, by the first circuit portion 51.
- the first circuit portion 51 includes a pair of magnetic convergence rings 53, a pair of magnetic convergence ring holders 55 having an annular shape, and a magnetic shield 57 having a C-shape.
- Each of the magnetic convergence rings 53 is magnetically coupled to a corresponding one of the magnetic yokes 41.
- Each of the magnetic convergence ring holders 55 holds a corresponding one of the magnetic convergence rings 53.
- the magnetic shield 57 reduces the impact that the external magnetic fields exert on a magnetic circuit 56 formed by the magnetic convergence rings 53, the magnetic yokes 41, and the permanent magnet 40.
- the magnetic shield 57 is disposed around the magnetic convergence ring holders 55.
- the second circuit portion 52 is an electronic circuit portion including an electronic component 60.
- the second circuit portion 52 includes a first magnetic element 61, a second magnetic element 62, the electronic component 60, and a holder 63.
- the first magnetic element 61 and the second magnetic element 62 output signals corresponding to magnetic fluxes of the magnetic circuit 56.
- the electronic component 60 is electrically connected to the magnetic elements 61, 62.
- the holder 63 houses and holds the magnetic elements 61, 62 and the electronic component 60.
- the magnetic elements 61, 62 are, for example, Hall ICs. In the sectional view in FIG. 2 , the magnetic elements 61, 62 are indicated by dashed lines for convenience of description, but the magnetic elements 61, 62 are not supposed to appear in the drawing.
- the magnetic fluxes that are varied depending on the variations in the positions of the magnetic yokes 41 relative to the permanent magnet 40 are guided to the magnetic elements 61, 62 by the magnetic convergence rings 53.
- Each of the magnetic convergence rings 53 includes an annular portion 53a, a first element facing portion 53b, and a second element facing portion 53c.
- the first element facing portion 53b protrudes radially outward from the annular portion 53a so as to face the first magnetic element 61.
- the second element facing portion 53c protrudes radially outward from the annular portion 53a so as to face the second magnetic element 62.
- Each magnetic convergence ring 53 is integrated with the corresponding magnetic convergence ring holder 55, by molding a resin of the magnetic convergence ring holder 55 around the magnetic convergence ring 53.
- the magnetic convergence ring 53 and the magnetic convergence ring holder 55 form an annular shape as a whole.
- the magnetic convergence ring 53 is generally annular.
- Each magnetic convergence ring holder 55 and each magnetic convergence ring 53 concentrically surround the outer periphery of the corresponding magnetic yoke 41 in a noncontact manner.
- the first magnetic element 61 is disposed between the first element facing portions 53b of the magnetic convergence rings 53.
- the second magnetic element 62 is disposed between the second element facing portions 53c of the magnetic convergence rings 53.
- the electronic component 60 includes a substrate 70 and a capacitor 71 mounted on the substrate 70.
- Terminals 72 made of metal are electrically connected to the substrate 70.
- Each of the terminals 72 includes a first portion 72a and a second portion 72b.
- the first portion 72a is coupled to the substrate 70 so as to extend in the radial direction r.
- the second portion 72b extends downward from a distal end portion of the first portion 72a.
- a part of each terminal 72 (a distal end portion of the first portion 72a and the second portion 72b) are disposed outside the holder 63 in the radial direction.
- the electronic component 60 further includes pins 73 that couple the magnetic elements 61, 62 and the substrate 70 together, and a cover 74 with which the capacitor 71 is covered.
- the holder 63 is made of a resin, and is in the form of a block (a generally rectangular parallelepiped) extending outward in the radial direction.
- the holder 63 includes a pair of halves 63a engaged with each other with the electronic component 60 disposed therebetween. Each of the halves 63a is formed so as to be integral with the corresponding magnetic convergence ring holder 55.
- the housing 3 surrounds the input shaft 15 of the second pinion shaft 8.
- the housing 3 includes a main body portion 80, a holder holding portion 82, and a connector portion 83 that are made of a single material and that are formed so as to be integral with each other.
- the main body portion 80 has an internal space 80a in which the magnetic convergence rings 53 and the magnetic convergence ring holders 55 are housed.
- the holder holding portion 82 protrudes radially outward from the outer peripheral surface of the main body portion 80, and holds the holder 63.
- the connector portion 83 extends from a protruding end of the holder holding portion 82.
- a connector 30 having a waterproof property is fitted to the connector portion 83.
- the connector portion 83 has an internal space 83a in which distal end portions of the second portions 72b of the terminals 72 are disposed. When the connector 30 is connected to the connector portion 83, the second portions 72b of the terminals 72 are electrically connected to the ECU 25.
- the housing 3 is kept watertight by a seal member 31, a seal member 32, a bearing 33, and a seal member 34, so that entry of liquid into the housing 3 is prevented.
- the seal member 31 is provided between the main body portion 80 and the input shaft 15.
- the seal member 32 is provided between the main body portion 80 and the rack housing 10.
- the bearing 33 is provided between the rack housing 10 and the output shaft 16.
- the seal member 34 is provided between the connector 30 and the connector portion 83.
- FIG. 4 is a schematic sectional view taken along line IV-IV in FIG. 2 .
- the holder 63 having a block shape has an upper surface 67, a pair of side surfaces 68, and a lower surface 69.
- the upper surface 67 of the holder 63 serves also as an upper surface of the second circuit portion 52.
- the side surfaces 68 of the holder 63 serve also as side surfaces of the second circuit portion 52.
- the lower surface 69 of the holder 63 serves also as a lower surface of the second circuit portion 52.
- the holder holding portion 82 includes an upper wall portion 87 with which the upper surface 67 of the holder 63 is covered, side wall portions 88 with which the side surfaces 68 of the holder 63 are covered, and a lower wall portion 89 with which the lower surface 69 of the holder 63 is covered.
- a width of each side wall portion 88 in a direction perpendicular to the side surfaces 68 (a thickness D1 of the side wall portion 88) is larger than a width of the upper wall portion 87 in a direction perpendicular to the upper surface 67 (a thickness D2 of the upper wall portion 87).
- the thickness D1 of the side wall portion 88 is preferably equal to or larger than 1.1 times of the thickness D2 of the upper wall portion 87.
- FIG. 5A is a schematic diagram illustrating a step of the method of manufacturing the housing structure 1.
- FIG. 5B is a schematic sectional view taken along line Vb-Vb in FIG. 5A .
- a mold 90 for insert molding in which the electronic unit 2 is to be housed, is prepared (preparing step).
- the electronic unit 2 housed in the mold 90 is indicated by a long dashed double-short dashed line.
- the electronic unit 2 is illustrated with the configuration thereof omitted (this also applies to FIGs. 6 to 8B described later) for the sake of convenience.
- illustration of the magnetic convergence rings 53 and the magnetic shield 57 of the first circuit portion 51 and the magnetic elements 61, 62 and the electronic component 60 of the second circuit portion 52 is omitted, and the holder 63 and the magnetic convergence ring holders 55 are illustrated in the form of a single component.
- the mold 90 includes an upper mold 91 and a lower mold 92 that face each other in an up-down direction Z.
- a lower surface of the upper mold 91 and an upper surface of the lower mold 92 face each other in the up-down direction Z.
- the mold 90 is closed when a part of the lower surface of the upper mold 91 and a part of the upper surface of the lower mold 92 come into contact with each other.
- the mold 90 is opened when the lower surface of the upper mold 91 and the upper surface of the lower mold 92 are separated from each other.
- the mold 90 has an internal space 95 that is defined by the lower surface of the upper mold 91 and the upper surface of the lower mold 92 while the mold 90 is closed.
- the lower surface of the upper mold 91 has a first uneven portion 91a that defines the internal space 95 from above.
- the upper surface of the lower mold 92 has a second uneven portion 92a that defines the internal space 95 from below.
- the mold 90 includes a support portion 94 having a pillar shape and an internal-space forming portion 98.
- the support portion 94 protrudes upward from the upper surface of the lower mold 92, and can support the first circuit portion 51 of the electronic unit 2.
- the internal-space forming portion 98 protrudes upward from the upper surface of the lower mold 92 to form the internal space 83a (see FIG. 2 ) of the connector portion 83.
- the support portion 94 and the internal-space forming portion 98 protrude toward the upper mold 91.
- a surface 94a of the support portion 94, a surface 98a of the internal-space forming portion 98, the first uneven portion 91a, and the second uneven portion 92a constitute an inner wall surface 90a of the mold 90.
- the internal space 95 is defined by the inner wall surface 90a.
- the internal space 95 includes a first chamber 96 and a second chamber 97.
- the first circuit portion 51 is housed in the first chamber 96.
- the second circuit portion 52 is housed in the second chamber 97 and the second chamber 97 is communicated with the first chamber 96.
- the state where the electronic unit 2 is placed in the mold 90 means a state where the first circuit portion 51 of the electronic unit 2 is supported by the support portion 94 and the mold 90 is closed.
- the support portion 94 supports the first circuit portion 51 from below.
- the mold 90 includes a plurality of gates 93 through which a resin is injected into the first chamber 96.
- the gates 93 may be provided in positions at an uppermost portion of the first uneven portion 91a of the upper mold 91.
- the gates 93 are provided at such positions as to surround the support portion 94.
- the gates 93 are communicated with the first chamber 96.
- the second chamber 97 includes a holder forming portion 97a and a connector forming portion 97b.
- the second circuit portion 52 is housed in the holder forming portion 97a having a rectangular shape as viewed from the horizontal direction.
- the distal end portions of the second portions 72b of the terminals 72 extending from the holder 63 are housed in the connector forming portion 97b.
- the upper mold 91 may include a protruding portion (not illustrated) that protrudes downward and comes into contact with an upper end portion of the support portion 94, and the gates 93 may be provided in a portion of the protruding portion, which comes into contact with the support portion 94.
- the inner wall surface 90a of the mold 90 includes an upper wall surface 100, a pair of side wall surfaces 101, and a lower wall surface 102.
- the upper wall surface 100 the holder forming portion 97a from above.
- the side wall surfaces 101 define the holder forming portion 97a from lateral sides.
- the lower wall surface 102 defines the holder forming portion 97a from below.
- the upper wall surface 100 faces the upper surface 67 of the second circuit portion 52 with a space left between the upper wall surface 100 and the upper surface 67
- each side wall surface 101 faces the corresponding side surface 68 of the second circuit portion 52 with a space left between the side wall surface 101 and the side surface 68
- the lower wall surface 102 faces the lower surface 69 of the second circuit portion 52 with a space left between the lower wall surface 102 and the lower surface 69.
- the space between the upper wall surface 100 and the upper surface 67 of the second circuit portion 52 will be referred to as an upper flow channel 110.
- the space between each side wall surface 101 and the corresponding side surface 68 will be referred to as a side flow channel 111.
- the space between the lower wall surface 102 and the lower surface 69 of the second circuit portion 52 will be referred to as a lower flow channel 112.
- FIG. 6 is a schematic diagram illustrating a step subsequent to the step illustrated in FIG. 5 .
- the electronic unit 2 is placed in the mold 90 (placing step).
- the upper mold 91 and the lower mold 92 in a state where the mold 90 is open are indicated by long dashed double-short dashed lines.
- the electronic unit 2 is placed between the upper mold 91 and the lower mold 92, and the upper mold 91 and the lower mold 92 are moved to be closer to each other to close the mold 90. Consequently, the electronic unit 2 is placed in the mold 90 such that the inner peripheral surfaces of the magnetic convergence ring holders 55 of the first circuit portion 51 are supported by the support portion 94. In the state where the electronic unit 2 is placed in the mold 90, the second circuit portion 52 is not in contact with the inner wall surface 90a of the mold 90.
- FIG. 7A is a schematic diagram illustrating a step subsequent to the step illustrated in FIG. 6 .
- FIG. 7B is a schematic sectional view taken along line VIIb-VIIb in FIG. 7A .
- a resin 120 in a molten state is injected into the mold 90 in which the electronic unit 2 has been placed (injecting step).
- the resin 120 is injected into the first chamber 96 from the gates 93 (see thick arrows in FIG. 7A ).
- the resin 120 injected into the first chamber 96 flows into the second chamber 97 from an upper portion of the second circuit portion 52, and then flows through the upper flow channel 110, the side flow channels 111, and the lower flow channel 112.
- FIG. 7A and FIG. 7B illustrate a state where the resin 120 is being injected into the mold 90. Specifically, FIG. 7A and FIG. 7B illustrate a state where the resin 120 is flowing into the second chamber 97. The resin 120 that has been introduced into the second chamber 97 is indicated by a long dashed double-short dashed line.
- the volumetric flow rate of the resin 120 flowing through the second chamber 97 is denoted by Q
- the viscosity of the resin 120 is denoted by ⁇
- half the width (flow channel width) of the flow channel through which the resin 120 flows is denoted by b
- the pressure of the resin 120 is denoted by P
- the volumetric flow rate Q can be expressed by Equation (1) based on the two-dimensional Poiseuille flow.
- Q ⁇ 2 b 3 / 3 ⁇ ⁇ ⁇ P
- Equation (1) a flow resistance R of the resin 120 flowing through the second chamber 97 is denoted by 3 ⁇ /2b 3 (see Equation (2) below).
- Equation (2) the volumetric flow rate Q can be expressed by Equation (3) using the flow resistance R.
- R 3 ⁇ ⁇ / 2 b 3
- Q ⁇ ⁇ ⁇ P / R
- the absolute value of the volumetric flow rate Q decreases with an increase in the flow resistance R, and the absolute value of the volumetric flow rate Q increases with a decrease in the flow resistance R.
- the flow resistance R decreases with an increase in the flow channel width, and the flow resistance R increases with a decrease in the flow channel width.
- each of the distance d1 and the distance d2 in the present embodiment is used as the flow channel width, and a flow resistance R1 of the resin 120 flowing through each of the side flow channels 111 and a flow resistance R2 of the resin 120 flowing through the upper flow channels 110 will be compared with each other.
- the flow resistance R1 is expressed by Equation (4)
- the flow resistance R2 is expressed by Equation (5).
- R 1 12 ⁇ ⁇ / d 1 3
- R 2 12 ⁇ ⁇ / d 2 3
- the distance d1 is longer than the distance d2.
- the flow resistance R1 of the resin 120 flowing through each of the side flow channels 111 is lower than the flow resistance R2 of the resin 120 flowing through the upper flow channel 110 (R1 ⁇ R2).
- FIG. 8A is a schematic diagram illustrating a step subsequent to the step illustrated in FIG. 7A and FIG. 7B .
- FIG. 8B is a schematic sectional view taken along line VIIIb-VIIIb in FIG. 8A .
- the resin 120 is cooled via the mold 90 to be solidified (cooling step). Consequently, the housing 3 is formed so as to be integral with the electronic unit 2.
- the main body portion 80 of the housing 3 is formed.
- the holder holding portion 82 of the housing 3 is formed.
- the connector portion 83 of the housing 3 is formed.
- the upper wall portion 87 of the holder holding portion 82 of the housing 3 is formed.
- the side wall portions 88 of the holder holding portion 82 are formed.
- the lower wall portion 89 of the holder holding portion 82 is formed.
- the mold 90 is opened in the up-down direction Z, and the housing 3 and the electronic unit 2, which are molded integrally as a single component, are taken out from the mold 90 (taking-out step). Consequently, the housing structure 1 including the electronic unit 2 and the housing 3, in which the electronic unit 2 is housed, is completed.
- the electronic unit 2 and the housing 3 are integrally molded into a single component.
- the mold 90 for insert molding in which the electronic unit 2 is housed, is configured such that the flow resistance R1 of the resin 120 flowing through the space between each side surface 68 of the second circuit portion 52 and the corresponding side wall surface 101 (i.e., each side flow channel 111) is lower than the flow resistance R2 of the resin 120 flowing through the space between the upper surface 67 of the second circuit portion 52 and the upper wall surface 100 (i.e., the upper flow channel 110).
- the resin 120 injected into the mold 90 in which the electronic unit 2 has been placed, flows into the space between each side surface 68 of the second circuit portion 52 and the corresponding side wall surface 101 before the space between the upper surface 67 of the second circuit portion 52 and the upper wall surface 100 is filled with the resin 120.
- the mold 90 is prepared such that the distance d1 between each side surface 68 of the second circuit portion 52 and the corresponding side wall surface 101 is longer than the distance d2 between the upper surface 67 of the second circuit portion 52 and the upper wall surface 100. Consequently, the flow resistance R1 of the resin 120 flowing through the space between each side surface 68 of the second circuit portion 52 and the corresponding side wall surface 101 can be made lower than the flow resistance R2 of the resin 120 flowing through the space between the upper surface 67 of the second circuit portion 52 and the upper wall surface 100.
- the resin 120 injected into the first chamber 96 through the gates 93 flows into the second chamber 97 from the upper portion of the second circuit portion 52.
- the resin 120 flowing into the space between the upper surface 67 of the second circuit portion 52 and the upper wall surface 100 flows into the space between each side surface 68 of the second circuit portion 52 and the corresponding side wall surface 101 before the space between the upper surface 67 of the second circuit portion 52 and the upper wall surface 100 is filled with the resin 120.
- the gates are usually provided in the upper portion of the upper mold of the mold, and it is difficult to change the positions of the gates.
- the gates 93 are provided in the first uneven portion 91a of the upper mold 91.
- the mold 90 can be prepared without any significant change in the structure of a commonly-used mold. In the state where the electronic unit 2 is placed in the mold 90, the second circuit portion 52 is not in contact with the inner wall surface 90a of the mold 90.
- the resin 120 injected into the mold 90, in which the electronic unit 2 has been placed passes through the space between each side surface 68 of the second circuit portion 52 and the corresponding side wall surface 101 and then flows into a space below the second circuit portion 52 to fill the space between the second circuit portion 52 and the inner wall surface 90a (the lower wall surface 102) positioned below the second circuit portion 52, before the space between the upper surface 67 of the second circuit portion 52 and the upper wall surface 100 is filled with the resin 120.
- the resin 120 that has flowed into the space below the second circuit portion 52 supports the second circuit portion 52, thereby suppressing downward deformation of the second circuit portion 52.
- the electronic unit 2 is disposed such that the inner peripheral surfaces of the magnetic convergence ring holders 55 are supported by the support portion 94 protruding into the mold 90. This facilitates positioning of the electronic unit 2 with respect to the mold 90. Therefore, it is possible to easily place the electronic unit 2 in the mold 90 such that the distance d1 between each side surface 68 of the second circuit portion 52 of the electronic unit 2 and the corresponding side wall surface 101 is longer than the distance d2 between the upper surface 67 of the second circuit portion 52 and the upper wall surface 100.
- the holder 63 can be made more compact and thus the amount of resin used to form the holder 63 can be made smaller, than in the configuration in which the thickness of the holder 63 is increased to improve the rigidity thereof, thereby suppressing deformation of the second circuit portion 52.
- the invention is not limited to the above-described embodiment, but various changes may be made to the above-described embodiment within the scope of claims.
- the second circuit portion 52 may include a tapered portion 64 in addition to the holder 63, as illustrated in FIG. 9 .
- the holder 63 extends radially outward from the first circuit portion 51 and serves as a main body portion.
- the tapered portion 64 protrudes from the holder 63 in a direction in which the central axis C1 of the first circuit portion 51 extends (axial direction X).
- the tapered portion 64 has a triangle shape as viewed from the radial direction r.
- the tapered portion 64 includes a pair of slanted surfaces 64a slanted in opposite directions with respect to an opposing direction F in which the side surfaces 68 are opposed to each other.
- the slanted surfaces 64a are slanted with respect to the opposing direction F such that the slanted surfaces 64a extend to the corresponding side surfaces 68 from the vertex of the triangle shape of the tapered portion 64.
- the tapered portion 64 is provided in the entire region of the holder 63 in a direction in which the holder 63 extends (the radial direction r).
- the slanted surfaces 64a of the tapered portion 64 serve also as the upper surface of the second circuit portion 52.
- the side surfaces 68 of the holder 63 also serve as the side surfaces of the second circuit portion 52.
- the lower surface 69 of the holder 63 also serves as the lower surface of the second circuit portion 52.
- the slanted surfaces 64a of the tapered portion 64 are covered with the upper wall portion 87 of the holder holding portion 82.
- the thickness D1 of each side wall portion 88 is larger than the thickness D2 of the upper wall portion 87.
- the thickness D2 of the upper wall portion 87 means a dimension of the upper wall portion 87 in a direction (the axial direction X) perpendicular to the opposing direction F.
- the thickness D2 of the upper wall portion 87 is largest at both end portions of the upper wall portion 87 in the opposing direction F.
- the thickness D1 of each side wall portion 88 is larger than the thickness D2 of the upper wall portion 87 at the both end portions thereof in the opposing direction F.
- the electronic unit 2 is placed in the mold 90 with the tapered portion 64 facing upward. Consequently, the upper wall surface 100 of the mold 90 and the tapered portion 64 that is tapered upward face each other (see FIG. 10 ).
- the distance d1 between each side surface 68 of the second circuit portion 52 and the corresponding side wall surface 101 is longer than the distance d2 between each slanted surface 64a of the tapered portion 64 and the upper wall surface 100.
- the distance d2 is a distance between each slanted surface 64a and the upper wall surface 100 in the direction perpendicular to the opposing direction F.
- the distance d2 is largest at the both end portions of the tapered portion 64 in the opposing direction F.
- the distance d1 is longer than the distance d2 between each of the both end portions of the tapered portion 64 in the opposing direction F and the upper wall surface 100.
- the electronic unit 2 is housed in the mold 90 with the tapered portion 64 facing upward. Consequently, the upper wall surface 100 of the mold 90 faces the upper surface of the second circuit portion 52, which is constituted by the tapered portion 64.
- the resin 120 having flowed into a space between the upper wall surface 100 of the mold 90 and the tapered portion 64 (the upper surface of the second circuit portion 52) flows along the tapered portion 64 in directions slanted with respect to the horizontal direction (the opposing direction F) (see thick arrows in FIG. 10 ).
- the tapered portion 64 need not be formed in the entire region of the holder 63 in the opposing direction F, and may be formed near the center of the holder 63 in the opposing direction F.
- the upper surface of the second circuit portion 52 may be constituted by a pair of slanted surfaces 64a of the tapered portion 64 and flat surfaces provided outward of the slanted surfaces 64a in the opposing direction F.
- the tapered portion 64 may be provided on a part of the holder 63 in the direction in which the holder 63 extends (the radial direction r).
- the tapered portion 64 may have a trapezoidal shape with its shorter base located above its longer base in the up-down direction the holder 63 as viewed from the radial direction r.
- the second circuit portion 52 may be supported by the lower mold 92 (circuit support portion) of the mold 90 by coming into contact with the lower wall surface 102 of the mold 90.
- a distal end of the second circuit portion 52 which is on the opposite side of the second circuit portion 52 from the first circuit portion 51, may be partially in contact with the lower wall surface 102 of the mold 90.
- a central portion of the second circuit portion 52 in the radial direction r (in the direction in which the second circuit portion 52 extends) is not supported by the lower mold 92.
- the mold 90 is designed such that the distance d1 between each side surface 68 of the second circuit portion 52 and the corresponding side wall surface 101 is larger than the distance d2 between the upper surface 67 of the second circuit portion 52 and the upper wall surface 100, the central portion of the second circuit portion 52 in the radial direction r can be suppressed from being deformed downward.
- the resin is injected into the mold 90 with the second circuit portion 52 supported by the lower mold 92 (circuit support portion) of the mold 90 from below. According to this manufacturing method, downward deformation of the second circuit portion 52 can be further suppressed.
- the housing 3 needs to be formed such that entry of a liquid into a gap between the electronic unit 2 and the housing 3 is prevented.
- the second circuit portion 52 is preferably not in contact with the inner wall surface 90a of the mold 90.
- the second circuit portion 52 is supported by the mold 90. Therefore, a circuit support portion, such as a pin that is movable in the mold 90 (not illustrated), may be used.
- the second circuit portion 52 may be supported by the circuit support portion from below, and the position of the circuit support portion may be controlled such that the circuit support portion moves away from the second circuit portion 52 after the mold 90 is filled with the resin 120 and before the resin 120 is solidified. Consequently, the resin flows into an area in the mold 90 (in the internal space 95), in which the circuit support portion was placed. Therefore, the housing 3 can be formed without providing a hole in the holder holding portion 82.
- a housing structure 1 according to a modified example illustrated in FIG. 11 and FIG. 12 is an example of the housing structure 1 configured to suppress downward deformation of the second circuit portion 52 and prevent entry of a liquid into a gap between the electronic unit 2 and the housing 3, that is, the housing structure 1 having a sufficient waterproof property.
- the second circuit portion 52 of the electronic unit 2 of the housing structure 1 according to this modified example includes, in addition to the terminals 72, an extending portion 58 exposed into the internal space 83a in the connector portion 83, as a portion supported by the internal-space forming portion 98 (see FIG. 12 ).
- the extending portion 58 is molded so as to be integral with at least one of the halves 63a of the holder 63.
- the extending portion 58 extends radially outward from a radially outer end of the holder 63.
- the extending portion 58 extends to a position radially outward of the terminals 72 (toward a position on the opposite side of the second circuit portion 52 from the first circuit portion 51).
- the extending portion 58 is a distal end portion of the second circuit portion 52.
- the extending portion 58 need not be entirely exposed into the internal space 83a, as long as the extending portion 58 has a surface that can be seen, as viewed from an opening side of the internal space 83a of the connector portion 83.
- the internal space 83a includes a terminal housing chamber 83b and an exposure portion 83c.
- the exposure portion 83c extends from an upper end of the terminal housing chamber 83b to the extending portion 58 of the second circuit portion 52.
- the exposure portion 83c allows the extending portion 58 to be exposed to the outside via the internal space 83a.
- the internal-space forming portion 98 for forming the internal space 83a of the connector portion 83 serves as a circuit support portion that can support the second circuit portion 52 from below.
- the internal-space forming portion 98 of the mold 90 used in this manufacturing method includes a housing chamber forming portion 122 and a contact portion 121.
- the housing chamber forming portion 122 is used to form the terminal housing chamber 83b, in which the distal end portions of the second portions 72b of the terminals 72 are housed, in the internal space 83a of the connector portion 83.
- the contact portion 121 extends upward from an upper end of the housing chamber forming portion 122 and comes into contact with the second circuit portion 52.
- the mold 90 including the internal-space forming portion 98 that can support the second circuit portion 52 from below is prepared.
- the resin 120 is injected into the mold 90 with the extending portion 58 supported by the internal-space forming portion 98.
- the second circuit portion 52 is just exposed to the outside via the connector portion 83 as illustrated in FIG. 11 .
- the connector portion 83 and the connector 30 having a waterproof property are fitted together to close the opening of the connector portion 83. With this configuration, the housing structure 1 is easily kept watertight. Therefore, the externally exposed portion of the second circuit portion 52 need not be subjected to a waterproof treatment other than the fitting of the connector 30 and the connector portion 83.
- the internal-space forming portion 98 may be separated from the second circuit portion 52, so that an area in the mold 90 in which the contact portion 121 of the internal-space forming portion 98 was placed can be filled with the resin.
- the internal-space forming portion 98 need not be separated from the second circuit portion 52.
- the internal-space forming portion 98 includes the housing chamber forming portion 122 and the contact portion 121.
- the contact portion 121 is formed so as to be smaller than the housing chamber forming portion 122 with respect to the horizontal direction. This makes it possible to easily keep the housing structure 1 watertight without enlarging the internal space 83a of the connector portion 83 more than necessary.
- the electronic unit 2 need not be used as the torque sensor 4 attached to the second pinion shaft 8.
- the electronic unit 2 may be used as a torque sensor attached to the steering shaft 11 or as another in-vehicle device.
- the electronic unit may be used as a device other than an in-vehicle device, and is applicable to any housing structures including the electronic unit and a housing, in which the electronic unit is housed, that are integrally molded as a single component.
- the viscosity ⁇ of the resin 120 flowing through the mold 90 can be partially changed. This allows the flow resistance R1 of the resin 120 flowing through each of the side flow channels 111 to be made lower than the flow resistance R2 of the resin 120 flowing through the upper flow channel 110. Specifically, the temperature of the vicinity of the side flow channels 111 (particularly, the side wall surfaces 101 defining the side flow channels 111) may be increased to reduce the viscosity ⁇ of the resin 120 flowing through the side flow channels 111, so that the flow resistance R1 is reduced.
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- General Physics & Mathematics (AREA)
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Description
- The invention relates to a method of manufacturing a housing structure, and relates also to a housing structure.
- Insert molding is widely known as a method of integrally molding a member and a housing that houses the member. Insert molding is a process in which a resin is injected into a mold with the member placed in the mold, and the member and the housing are integrally molded into a single component. Japanese Patent Application Publication No.
2015-031600 JP 2015-031600 A claim 1 describes a torque detecting device including an outer housing. The outer housing is molded by injecting a molding material into a mold in which a sensor unit has been placed. Thus, the sensor unit and the outer housing that houses the sensor unit are integrally molded into a single component. The sensor unit includes a magnetic convergence ring holder having a cylindrical shape and a case. The magnetic convergence ring holder is integrated with magnetic convergence rings. The case extends radially outward from the magnetic convergence ring holder. - Under the technology described in
JP 2015-031600 A US2015/0033877 A1 , during a process of molding the outer housing with the sensor unit placed in the mold, that is, during insert molding, the case of the sensor unit extending radially outward from the magnetic convergence ring holder may be deformed by a force (resin pressure) applied from a resin flowing in the mold along an upper surface of the case. - One object of the invention is to provide a housing structure configured to suppress deformation of an electronic unit during insert molding, and a method of manufacturing the housing structure.
- An aspect of the invention relates to a method of manufacturing a housing structure in accordance with the subject-matter of
independent claim 1. The invention further concerns a housing structure in accordance withindependent claim 8. Further embodiments of the invention are defined by the features of the dependent claims. - The foregoing and further features and advantages of the invention will become apparent from the following description of example embodiments with reference to the accompanying drawings, wherein like numerals are used to represent like elements and wherein:
-
FIG. 1 is a schematic diagram illustrating the schematic configuration of an electric power steering system including a housing structure according to an embodiment of the invention; -
FIG. 2 is a schematic sectional view of the housing structure and its surroundings; -
FIG. 3 is an exploded perspective view of an electronic unit; -
FIG. 4 is a schematic sectional view taken along line IV-IV inFIG. 2 ; -
FIG. 5A is a schematic diagram illustrating a step of a method of manufacturing a housing structure; -
FIG. 5B is a schematic sectional view taken along line Vb-Vb inFIG. 5A ; -
FIG. 6 is a schematic diagram illustrating a step subsequent to the step illustrated inFIG. 5A and FIG. 5B ; -
FIG. 7A is a schematic diagram illustrating a step subsequent to the step illustrated inFIG. 6 ; -
FIG. 7B is a schematic sectional view taken along line VIIb-VIIb inFIG. 7A ; -
FIG. 8A is a schematic diagram illustrating a step subsequent to the step illustrated inFIG. 7A and FIG. 7B ; -
FIG. 8B is a schematic sectional view taken along line VIIIb-VIIIb inFIG. 8A ; -
FIG. 9 is a sectional view of a second circuit portion of an electronic unit of a housing structure and its surroundings according to a modified example; -
FIG. 10 is a schematic diagram illustrating a step of a method of manufacturing the housing structure according to the modified example illustrated inFIG. 9 , the step being a step of injecting a resin into a mold in which the electronic unit has been placed; -
FIG. 11 is a sectional view of a second circuit portion of an electronic unit of a housing structure according to a modified example other than the modified example illustrated inFIG. 9 ; and -
FIG. 12 is a schematic diagram illustrating a step of a method of manufacturing the housing structure according to the modified example illustrated inFIG. 11 , the step being a step of injecting a resin into a mold in which the electronic unit has been placed. - Hereinafter, example embodiments of the invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a schematic diagram illustrating the schematic configuration of an electric power steering system 5 including ahousing structure 1 according to an embodiment of the invention. Thehousing structure 1 includes anelectronic unit 2 and ahousing 3 that houses theelectronic unit 2. Theelectronic unit 2 and thehousing 3 are integrated with each other. Theelectronic unit 2 is a sensor unit used, for example, as atorque sensor 4 mounted in a vehicle. Thehousing 3 is, for example, a sensor housing that houses thetorque sensor 4. - The electric power steering system 5 provided with the
torque sensor 4 is, for example, a dual-pinion electric power steering system. The electric power steering system 5 includes a first pinion shaft 7 and asecond pinion shaft 8. The first pinion shaft 7 has afirst pinion 7a that meshes with afirst rack 6a of arack shaft 6. The first pinion shaft 7 is used to transmit a steering assist force. Thesecond pinion shaft 8 has asecond pinion 8a that meshes with asecond rack 6b of therack shaft 6. Thesecond pinion shaft 8 is used to transmit a manual steering force. - The
housing 3 is attached to, for example, a rack housing 10 in which therack shaft 6 is housed. Thetorque sensor 4 is attached to, for example, thesecond pinion shaft 8. Thesecond pinion shaft 8 includes aninput shaft 15, anoutput shaft 16, and atorsion bar 17. Theinput shaft 15 is coupled to asteering wheel 13 via asteering shaft 11 and anintermediate shaft 12. Theoutput shaft 16 has thesecond pinion 8a. Thetorsion bar 17 couples theinput shaft 15 and theoutput shaft 16 to each other such that theinput shaft 15 and theoutput shaft 16 are coaxial with each other. Theinput shaft 15 and theoutput shaft 16 are rotatable relative to each other within a prescribed angular range. - Steered
wheels 20 are coupled to respective ends of therack shaft 6 viatie rods 18 and knucklearms 19. In response to a driver's operation of thesteering wheel 13, the steeredwheels 20 are steered via the steeringshaft 11, theintermediate shaft 12, thesecond pinion shaft 8, therack shaft 6, thetie rods 18, and theknuckle arms 19. As the driver operates thesteering wheel 13 in order to steer the steeredwheels 20, theinput shaft 15 and theoutput shaft 16 of thesecond pinion shaft 8 rotate relative to each other, so that thetorsion bar 17 is twisted. - The
torque sensor 4 detects a torsion amount of thetorsion bar 17 of thesecond pinion shaft 8. A detection signal from thetorque sensor 4 is provided to an electronic control unit (ECU) 25. TheECU 25 controls driving of anelectric motor 26 using an embedded driving circuit, based on, for example, a detected torque signal, and a detected vehicle speed signal from a vehicle speed sensor (not illustrated). The speed of rotation output from theelectric motor 26 is reduced by aspeed reducer 27. Then, the rotation having a reduced speed is transmitted to the first pinion shaft 7, and is converted into a linear motion of therack shaft 6. In this way, a driver's steering operation is assisted. - The configuration of the
housing structure 1 will be described below in detail.FIG. 2 is a schematic sectional view of thehousing structure 1 and its surroundings.FIG. 3 is an exploded perspective view of theelectronic unit 2. Thetorque sensor 4, which is theelectronic unit 2 of thehousing structure 1, further includes apermanent magnet 40 and a pair ofmagnetic yokes 41. Themagnetic yokes 41 are magnetically coupled to thepermanent magnet 40. Thepermanent magnet 40 is concentrically fixed to theinput shaft 15 so as to rotate together with theinput shaft 15 in an integrated manner. Themagnetic yokes 41 are concentrically fixed to theoutput shaft 16 so as to rotate together with theoutput shaft 16 in an integrated manner. As theinput shaft 15 and theoutput shaft 16 rotate relative to each other, the positions of themagnetic yokes 41 relative to thepermanent magnet 40 vary, resulting in magnetic flux variations. - The
electronic unit 2 is electrically connected to theECU 25, and detects magnetic fluxes from the magnetic yokes 41. Theelectronic unit 2 includes afirst circuit portion 51 having an annular shape. Thefirst circuit portion 51 has a central axis C1 that coincides with a central axis of theinput shaft 15. A radial direction centered at the central axis C1 will be referred to as "radial direction r". A direction included in the radial direction r and extending toward the central axis C1 will be referred to as "radially inward direction". A direction included in the radial direction r and extending away from the central axis C1 will be referred to as "radially outward direction". A direction along which the central axis C1 extends will be referred to as "axial direction X". Theelectronic unit 2 further includes asecond circuit portion 52 having a block shape and protruding radially outward from an outer periphery of thefirst circuit portion 51. Thesecond circuit portion 52 is supported, as a cantilever portion, by thefirst circuit portion 51. - The
first circuit portion 51 includes a pair of magnetic convergence rings 53, a pair of magneticconvergence ring holders 55 having an annular shape, and amagnetic shield 57 having a C-shape. Each of the magnetic convergence rings 53 is magnetically coupled to a corresponding one of the magnetic yokes 41. Each of the magneticconvergence ring holders 55 holds a corresponding one of the magnetic convergence rings 53. Themagnetic shield 57 reduces the impact that the external magnetic fields exert on amagnetic circuit 56 formed by the magnetic convergence rings 53, themagnetic yokes 41, and thepermanent magnet 40. Themagnetic shield 57 is disposed around the magneticconvergence ring holders 55. - The
second circuit portion 52 is an electronic circuit portion including anelectronic component 60. Specifically, thesecond circuit portion 52 includes a firstmagnetic element 61, a secondmagnetic element 62, theelectronic component 60, and aholder 63. The firstmagnetic element 61 and the secondmagnetic element 62 output signals corresponding to magnetic fluxes of themagnetic circuit 56. Theelectronic component 60 is electrically connected to themagnetic elements holder 63 houses and holds themagnetic elements electronic component 60. Themagnetic elements FIG. 2 , themagnetic elements magnetic elements magnetic yokes 41 relative to thepermanent magnet 40 are guided to themagnetic elements - Each of the magnetic convergence rings 53 includes an
annular portion 53a, a firstelement facing portion 53b, and a secondelement facing portion 53c. The firstelement facing portion 53b protrudes radially outward from theannular portion 53a so as to face the firstmagnetic element 61. The secondelement facing portion 53c protrudes radially outward from theannular portion 53a so as to face the secondmagnetic element 62. Eachmagnetic convergence ring 53 is integrated with the corresponding magneticconvergence ring holder 55, by molding a resin of the magneticconvergence ring holder 55 around themagnetic convergence ring 53. Themagnetic convergence ring 53 and the magneticconvergence ring holder 55 form an annular shape as a whole. Themagnetic convergence ring 53 is generally annular. Each magneticconvergence ring holder 55 and eachmagnetic convergence ring 53 concentrically surround the outer periphery of the correspondingmagnetic yoke 41 in a noncontact manner. The firstmagnetic element 61 is disposed between the firstelement facing portions 53b of the magnetic convergence rings 53. The secondmagnetic element 62 is disposed between the secondelement facing portions 53c of the magnetic convergence rings 53. - The
electronic component 60 includes asubstrate 70 and acapacitor 71 mounted on thesubstrate 70.Terminals 72 made of metal are electrically connected to thesubstrate 70. Each of theterminals 72 includes afirst portion 72a and asecond portion 72b. Thefirst portion 72a is coupled to thesubstrate 70 so as to extend in the radial direction r. Thesecond portion 72b extends downward from a distal end portion of thefirst portion 72a. A part of each terminal 72 (a distal end portion of thefirst portion 72a and thesecond portion 72b) are disposed outside theholder 63 in the radial direction. Theelectronic component 60 further includespins 73 that couple themagnetic elements substrate 70 together, and acover 74 with which thecapacitor 71 is covered. - The
holder 63 is made of a resin, and is in the form of a block (a generally rectangular parallelepiped) extending outward in the radial direction. Theholder 63 includes a pair ofhalves 63a engaged with each other with theelectronic component 60 disposed therebetween. Each of thehalves 63a is formed so as to be integral with the corresponding magneticconvergence ring holder 55. Thehousing 3 surrounds theinput shaft 15 of thesecond pinion shaft 8. Thehousing 3 includes amain body portion 80, aholder holding portion 82, and aconnector portion 83 that are made of a single material and that are formed so as to be integral with each other. Themain body portion 80 has aninternal space 80a in which the magnetic convergence rings 53 and the magneticconvergence ring holders 55 are housed. Theholder holding portion 82 protrudes radially outward from the outer peripheral surface of themain body portion 80, and holds theholder 63. Theconnector portion 83 extends from a protruding end of theholder holding portion 82. Aconnector 30 having a waterproof property is fitted to theconnector portion 83. Theconnector portion 83 has aninternal space 83a in which distal end portions of thesecond portions 72b of theterminals 72 are disposed. When theconnector 30 is connected to theconnector portion 83, thesecond portions 72b of theterminals 72 are electrically connected to theECU 25. - The
housing 3 is kept watertight by aseal member 31, aseal member 32, abearing 33, and aseal member 34, so that entry of liquid into thehousing 3 is prevented. Theseal member 31 is provided between themain body portion 80 and theinput shaft 15. Theseal member 32 is provided between themain body portion 80 and therack housing 10. Thebearing 33 is provided between therack housing 10 and theoutput shaft 16. Theseal member 34 is provided between theconnector 30 and theconnector portion 83. -
FIG. 4 is a schematic sectional view taken along line IV-IV inFIG. 2 . Theholder 63 having a block shape has anupper surface 67, a pair of side surfaces 68, and alower surface 69. Theupper surface 67 of theholder 63 serves also as an upper surface of thesecond circuit portion 52. The side surfaces 68 of theholder 63 serve also as side surfaces of thesecond circuit portion 52. Thelower surface 69 of theholder 63 serves also as a lower surface of thesecond circuit portion 52. Theholder holding portion 82 includes anupper wall portion 87 with which theupper surface 67 of theholder 63 is covered,side wall portions 88 with which the side surfaces 68 of theholder 63 are covered, and alower wall portion 89 with which thelower surface 69 of theholder 63 is covered. A width of eachside wall portion 88 in a direction perpendicular to the side surfaces 68 (a thickness D1 of the side wall portion 88) is larger than a width of theupper wall portion 87 in a direction perpendicular to the upper surface 67 (a thickness D2 of the upper wall portion 87). The thickness D1 of theside wall portion 88 is preferably equal to or larger than 1.1 times of the thickness D2 of theupper wall portion 87. - A method of manufacturing the
housing structure 1 will be described below with reference toFIGs. 5A to 8B .FIG. 5A is a schematic diagram illustrating a step of the method of manufacturing thehousing structure 1.FIG. 5B is a schematic sectional view taken along line Vb-Vb inFIG. 5A . First, as illustrated inFIG. 5A and FIG. 5B , amold 90 for insert molding, in which theelectronic unit 2 is to be housed, is prepared (preparing step). InFIG. 5A and FIG. 5B , theelectronic unit 2 housed in themold 90 is indicated by a long dashed double-short dashed line. - In
FIG. 5A and FIG. 5B , theelectronic unit 2 is illustrated with the configuration thereof omitted (this also applies toFIGs. 6 to 8B described later) for the sake of convenience. Specifically, inFIG. 5A and FIG. 5B , illustration of the magnetic convergence rings 53 and themagnetic shield 57 of thefirst circuit portion 51 and themagnetic elements electronic component 60 of thesecond circuit portion 52 is omitted, and theholder 63 and the magneticconvergence ring holders 55 are illustrated in the form of a single component. - As illustrated in
FIG. 5A , themold 90 includes anupper mold 91 and alower mold 92 that face each other in an up-down direction Z. A lower surface of theupper mold 91 and an upper surface of thelower mold 92 face each other in the up-down direction Z. Themold 90 is closed when a part of the lower surface of theupper mold 91 and a part of the upper surface of thelower mold 92 come into contact with each other. Themold 90 is opened when the lower surface of theupper mold 91 and the upper surface of thelower mold 92 are separated from each other. Themold 90 has aninternal space 95 that is defined by the lower surface of theupper mold 91 and the upper surface of thelower mold 92 while themold 90 is closed. The lower surface of theupper mold 91 has a firstuneven portion 91a that defines theinternal space 95 from above. The upper surface of thelower mold 92 has a seconduneven portion 92a that defines theinternal space 95 from below. - The
mold 90 includes asupport portion 94 having a pillar shape and an internal-space forming portion 98. Thesupport portion 94 protrudes upward from the upper surface of thelower mold 92, and can support thefirst circuit portion 51 of theelectronic unit 2. The internal-space forming portion 98 protrudes upward from the upper surface of thelower mold 92 to form theinternal space 83a (seeFIG. 2 ) of theconnector portion 83. When themold 90 is closed, thesupport portion 94 and the internal-space forming portion 98 protrude toward theupper mold 91. When themold 90 is closed, asurface 94a of thesupport portion 94, asurface 98a of the internal-space forming portion 98, the firstuneven portion 91a, and the seconduneven portion 92a constitute aninner wall surface 90a of themold 90. Theinternal space 95 is defined by theinner wall surface 90a. - The
internal space 95 includes afirst chamber 96 and asecond chamber 97. In a state where theelectronic unit 2 is placed in themold 90, thefirst circuit portion 51 is housed in thefirst chamber 96. In the state where theelectronic unit 2 is placed in themold 90, thesecond circuit portion 52 is housed in thesecond chamber 97 and thesecond chamber 97 is communicated with thefirst chamber 96. The state where theelectronic unit 2 is placed in themold 90 means a state where thefirst circuit portion 51 of theelectronic unit 2 is supported by thesupport portion 94 and themold 90 is closed. Thesupport portion 94 supports thefirst circuit portion 51 from below. - The
mold 90 includes a plurality ofgates 93 through which a resin is injected into thefirst chamber 96. Thegates 93 may be provided in positions at an uppermost portion of the firstuneven portion 91a of theupper mold 91. Thegates 93 are provided at such positions as to surround thesupport portion 94. Thegates 93 are communicated with thefirst chamber 96. Thesecond chamber 97 includes aholder forming portion 97a and aconnector forming portion 97b. Thesecond circuit portion 52 is housed in theholder forming portion 97a having a rectangular shape as viewed from the horizontal direction. The distal end portions of thesecond portions 72b of theterminals 72 extending from theholder 63 are housed in theconnector forming portion 97b. - Unlike in the present embodiment, the
upper mold 91 may include a protruding portion (not illustrated) that protrudes downward and comes into contact with an upper end portion of thesupport portion 94, and thegates 93 may be provided in a portion of the protruding portion, which comes into contact with thesupport portion 94. As illustrated inFIG. 5B , theinner wall surface 90a of themold 90 includes anupper wall surface 100, a pair of side wall surfaces 101, and alower wall surface 102. Theupper wall surface 100 theholder forming portion 97a from above. The side wall surfaces 101 define theholder forming portion 97a from lateral sides. Thelower wall surface 102 defines theholder forming portion 97a from below. - In the state where the
electronic unit 2 is placed in themold 90, theupper wall surface 100 faces theupper surface 67 of thesecond circuit portion 52 with a space left between theupper wall surface 100 and theupper surface 67, eachside wall surface 101 faces thecorresponding side surface 68 of thesecond circuit portion 52 with a space left between theside wall surface 101 and theside surface 68, and thelower wall surface 102 faces thelower surface 69 of thesecond circuit portion 52 with a space left between thelower wall surface 102 and thelower surface 69. The space between theupper wall surface 100 and theupper surface 67 of thesecond circuit portion 52 will be referred to as anupper flow channel 110. The space between eachside wall surface 101 and thecorresponding side surface 68 will be referred to as aside flow channel 111. The space between thelower wall surface 102 and thelower surface 69 of thesecond circuit portion 52 will be referred to as alower flow channel 112. - The
mold 90 is designed such that, in the state where theelectronic unit 2 is placed in themold 90, a distance d1 between eachside surface 68 of thesecond circuit portion 52 and the correspondingside wall surface 101 is longer than a distance d2 between theupper surface 67 of thesecond circuit portion 52 and theupper wall surface 100.FIG. 6 is a schematic diagram illustrating a step subsequent to the step illustrated inFIG. 5 . As illustrated inFIG. 6 , theelectronic unit 2 is placed in the mold 90 (placing step). InFIG. 6 , theupper mold 91 and thelower mold 92 in a state where themold 90 is open are indicated by long dashed double-short dashed lines. - The
electronic unit 2 is placed between theupper mold 91 and thelower mold 92, and theupper mold 91 and thelower mold 92 are moved to be closer to each other to close themold 90. Consequently, theelectronic unit 2 is placed in themold 90 such that the inner peripheral surfaces of the magneticconvergence ring holders 55 of thefirst circuit portion 51 are supported by thesupport portion 94. In the state where theelectronic unit 2 is placed in themold 90, thesecond circuit portion 52 is not in contact with theinner wall surface 90a of themold 90. -
FIG. 7A is a schematic diagram illustrating a step subsequent to the step illustrated inFIG. 6 .FIG. 7B is a schematic sectional view taken along line VIIb-VIIb inFIG. 7A . As illustrated inFIG. 7A and FIG. 7B , aresin 120 in a molten state is injected into themold 90 in which theelectronic unit 2 has been placed (injecting step). Theresin 120 is injected into thefirst chamber 96 from the gates 93 (see thick arrows inFIG. 7A ). Theresin 120 injected into thefirst chamber 96 flows into thesecond chamber 97 from an upper portion of thesecond circuit portion 52, and then flows through theupper flow channel 110, theside flow channels 111, and thelower flow channel 112. A space between themold 90 and theelectronic unit 2 is filled with theresin 120.FIG. 7A and FIG. 7B illustrate a state where theresin 120 is being injected into themold 90. Specifically,FIG. 7A and FIG. 7B illustrate a state where theresin 120 is flowing into thesecond chamber 97. Theresin 120 that has been introduced into thesecond chamber 97 is indicated by a long dashed double-short dashed line. - Where the volumetric flow rate of the
resin 120 flowing through thesecond chamber 97 is denoted by Q, the viscosity of theresin 120 is denoted by µ, half the width (flow channel width) of the flow channel through which theresin 120 flows is denoted by b, and the pressure of theresin 120 is denoted by P, the volumetric flow rate Q can be expressed by Equation (1) based on the two-dimensional Poiseuille flow. -
- As indicated by Equation (3), the absolute value of the volumetric flow rate Q decreases with an increase in the flow resistance R, and the absolute value of the volumetric flow rate Q increases with a decrease in the flow resistance R. As indicated by Equation (2), the flow resistance R decreases with an increase in the flow channel width, and the flow resistance R increases with a decrease in the flow channel width.
- Next, each of the distance d1 and the distance d2 in the present embodiment is used as the flow channel width, and a flow resistance R1 of the
resin 120 flowing through each of theside flow channels 111 and a flow resistance R2 of theresin 120 flowing through theupper flow channels 110 will be compared with each other. The flow resistance R1 is expressed by Equation (4), and the flow resistance R2 is expressed by Equation (5). - As described above, the distance d1 is longer than the distance d2. Thus, the flow resistance R1 of the
resin 120 flowing through each of theside flow channels 111 is lower than the flow resistance R2 of theresin 120 flowing through the upper flow channel 110 (R1 < R2). With this configuration, when the injectedresin 120 flows from thefirst chamber 96 into thesecond chamber 97, the injectedresin 120 flows into theside flow channels 111 before theupper flow channel 110 is filled with theresin 120. -
FIG. 8A is a schematic diagram illustrating a step subsequent to the step illustrated inFIG. 7A and FIG. 7B .FIG. 8B is a schematic sectional view taken along line VIIIb-VIIIb inFIG. 8A . As illustrated inFIG. 8A and FIG. 8B , in a state where themold 90 is filled with theresin 120, theresin 120 is cooled via themold 90 to be solidified (cooling step). Consequently, thehousing 3 is formed so as to be integral with theelectronic unit 2. - Specifically, as illustrated in
FIG. 8A , when theresin 120 supplied into the first chamber is solidified, themain body portion 80 of thehousing 3 is formed. When theresin 120 supplied into theholder forming portion 97a of thesecond chamber 97 is solidified, theholder holding portion 82 of thehousing 3 is formed. When theresin 120 supplied into theconnector forming portion 97b of thesecond chamber 97 is solidified, theconnector portion 83 of thehousing 3 is formed. - Specifically, as illustrated in
FIG. 8B , when theresin 120 supplied into theupper flow channel 110 is solidified, theupper wall portion 87 of theholder holding portion 82 of thehousing 3 is formed. When theresin 120 supplied into theside flow channels 111 is solidified, theside wall portions 88 of theholder holding portion 82 are formed. When theresin 120 supplied into thelower flow channel 112 is solidified, thelower wall portion 89 of theholder holding portion 82 is formed. Themold 90 is opened in the up-down direction Z, and thehousing 3 and theelectronic unit 2, which are molded integrally as a single component, are taken out from the mold 90 (taking-out step). Consequently, thehousing structure 1 including theelectronic unit 2 and thehousing 3, in which theelectronic unit 2 is housed, is completed. Theelectronic unit 2 and thehousing 3 are integrally molded into a single component. - In the present embodiment, the
mold 90 for insert molding, in which theelectronic unit 2 is housed, is configured such that the flow resistance R1 of theresin 120 flowing through the space between eachside surface 68 of thesecond circuit portion 52 and the corresponding side wall surface 101 (i.e., each side flow channel 111) is lower than the flow resistance R2 of theresin 120 flowing through the space between theupper surface 67 of thesecond circuit portion 52 and the upper wall surface 100 (i.e., the upper flow channel 110). Thus, theresin 120 injected into themold 90, in which theelectronic unit 2 has been placed, flows into the space between eachside surface 68 of thesecond circuit portion 52 and the correspondingside wall surface 101 before the space between theupper surface 67 of thesecond circuit portion 52 and theupper wall surface 100 is filled with theresin 120. This enables a reduction in the force (resin pressure) to be applied to thesecond circuit portion 52 protruding from thefirst circuit portion 51, from theresin 120 introduced into the space between theupper surface 67 of thesecond circuit portion 52 and theupper wall surface 100. Consequently, deformation of thesecond circuit portion 52 can be suppressed. That is, it is possible to integrally mold theelectronic unit 2 and thehousing 3, in which theelectronic unit 2 is housed, into a single component, while suppressing deformation of theelectronic unit 2 during the insert molding. - As described in the present embodiment, the
mold 90 is prepared such that the distance d1 between eachside surface 68 of thesecond circuit portion 52 and the correspondingside wall surface 101 is longer than the distance d2 between theupper surface 67 of thesecond circuit portion 52 and theupper wall surface 100. Consequently, the flow resistance R1 of theresin 120 flowing through the space between eachside surface 68 of thesecond circuit portion 52 and the correspondingside wall surface 101 can be made lower than the flow resistance R2 of theresin 120 flowing through the space between theupper surface 67 of thesecond circuit portion 52 and theupper wall surface 100. - In the present embodiment, the
resin 120 injected into thefirst chamber 96 through thegates 93 flows into thesecond chamber 97 from the upper portion of thesecond circuit portion 52. Thus, theresin 120 flowing into the space between theupper surface 67 of thesecond circuit portion 52 and theupper wall surface 100 flows into the space between eachside surface 68 of thesecond circuit portion 52 and the correspondingside wall surface 101 before the space between theupper surface 67 of thesecond circuit portion 52 and theupper wall surface 100 is filled with theresin 120. As a result, in the configuration in which theresin 120 flows into thesecond chamber 97 from the upper portion of thesecond circuit portion 52, it is possible to suppress deformation of thesecond circuit portion 52 due to a force applied to thesecond circuit portion 52 from theresin 120 supplied to the space between theupper surface 67 of thesecond circuit portion 52 and theupper wall surface 100. - The gates are usually provided in the upper portion of the upper mold of the mold, and it is difficult to change the positions of the gates. However, in the present embodiment, the
gates 93 are provided in the firstuneven portion 91a of theupper mold 91. Thus, themold 90 can be prepared without any significant change in the structure of a commonly-used mold. In the state where theelectronic unit 2 is placed in themold 90, thesecond circuit portion 52 is not in contact with theinner wall surface 90a of themold 90. Thus, theresin 120 injected into themold 90, in which theelectronic unit 2 has been placed, passes through the space between eachside surface 68 of thesecond circuit portion 52 and the correspondingside wall surface 101 and then flows into a space below thesecond circuit portion 52 to fill the space between thesecond circuit portion 52 and theinner wall surface 90a (the lower wall surface 102) positioned below thesecond circuit portion 52, before the space between theupper surface 67 of thesecond circuit portion 52 and theupper wall surface 100 is filled with theresin 120. Thus, theresin 120 that has flowed into the space below thesecond circuit portion 52 supports thesecond circuit portion 52, thereby suppressing downward deformation of thesecond circuit portion 52. - The
electronic unit 2 is disposed such that the inner peripheral surfaces of the magneticconvergence ring holders 55 are supported by thesupport portion 94 protruding into themold 90. This facilitates positioning of theelectronic unit 2 with respect to themold 90. Therefore, it is possible to easily place theelectronic unit 2 in themold 90 such that the distance d1 between eachside surface 68 of thesecond circuit portion 52 of theelectronic unit 2 and the correspondingside wall surface 101 is longer than the distance d2 between theupper surface 67 of thesecond circuit portion 52 and theupper wall surface 100. - According to the present configuration, the
holder 63 can be made more compact and thus the amount of resin used to form theholder 63 can be made smaller, than in the configuration in which the thickness of theholder 63 is increased to improve the rigidity thereof, thereby suppressing deformation of thesecond circuit portion 52. The invention is not limited to the above-described embodiment, but various changes may be made to the above-described embodiment within the scope of claims. - For example, unlike in the above-described embodiment, the
second circuit portion 52 may include a taperedportion 64 in addition to theholder 63, as illustrated inFIG. 9 . Theholder 63 extends radially outward from thefirst circuit portion 51 and serves as a main body portion. The taperedportion 64 protrudes from theholder 63 in a direction in which the central axis C1 of thefirst circuit portion 51 extends (axial direction X). The taperedportion 64 has a triangle shape as viewed from the radial direction r. The taperedportion 64 includes a pair of slantedsurfaces 64a slanted in opposite directions with respect to an opposing direction F in which the side surfaces 68 are opposed to each other. The slanted surfaces 64a are slanted with respect to the opposing direction F such that theslanted surfaces 64a extend to the corresponding side surfaces 68 from the vertex of the triangle shape of the taperedportion 64. The taperedportion 64 is provided in the entire region of theholder 63 in a direction in which theholder 63 extends (the radial direction r). - The slanted surfaces 64a of the tapered
portion 64 serve also as the upper surface of thesecond circuit portion 52. The side surfaces 68 of theholder 63 also serve as the side surfaces of thesecond circuit portion 52. Thelower surface 69 of theholder 63 also serves as the lower surface of thesecond circuit portion 52. The slanted surfaces 64a of the taperedportion 64 are covered with theupper wall portion 87 of theholder holding portion 82. The thickness D1 of eachside wall portion 88 is larger than the thickness D2 of theupper wall portion 87. In this modified example, the thickness D2 of theupper wall portion 87 means a dimension of theupper wall portion 87 in a direction (the axial direction X) perpendicular to the opposing direction F. The thickness D2 of theupper wall portion 87 is largest at both end portions of theupper wall portion 87 in the opposing direction F. The thickness D1 of eachside wall portion 88 is larger than the thickness D2 of theupper wall portion 87 at the both end portions thereof in the opposing direction F. - In a method of manufacturing the
housing structure 1 according to this modified example, theelectronic unit 2 is placed in themold 90 with the taperedportion 64 facing upward. Consequently, theupper wall surface 100 of themold 90 and the taperedportion 64 that is tapered upward face each other (seeFIG. 10 ). In a state where theelectronic unit 2 is placed in themold 90, the distance d1 between eachside surface 68 of thesecond circuit portion 52 and the correspondingside wall surface 101 is longer than the distance d2 between eachslanted surface 64a of the taperedportion 64 and theupper wall surface 100. The distance d2 is a distance between eachslanted surface 64a and theupper wall surface 100 in the direction perpendicular to the opposing direction F. The distance d2 is largest at the both end portions of the taperedportion 64 in the opposing direction F. The distance d1 is longer than the distance d2 between each of the both end portions of the taperedportion 64 in the opposing direction F and theupper wall surface 100. - According to this manufacturing method, the
electronic unit 2 is housed in themold 90 with the taperedportion 64 facing upward. Consequently, theupper wall surface 100 of themold 90 faces the upper surface of thesecond circuit portion 52, which is constituted by the taperedportion 64. Thus, in the injecting step, theresin 120 having flowed into a space between theupper wall surface 100 of themold 90 and the tapered portion 64 (the upper surface of the second circuit portion 52) flows along the taperedportion 64 in directions slanted with respect to the horizontal direction (the opposing direction F) (see thick arrows inFIG. 10 ). With this configuration, it is possible to disperse the force applied to thesecond circuit portion 52 protruding from thefirst circuit portion 51, from the resin supplied into the space between the tapered portion 64 (the upper surface of the second circuit portion 52) and theupper wall surface 100. Thus, deformation of thesecond circuit portion 52 can be suppressed. - The tapered
portion 64 need not be formed in the entire region of theholder 63 in the opposing direction F, and may be formed near the center of theholder 63 in the opposing direction F. For example, unlike in the above-described modified example, the upper surface of thesecond circuit portion 52 may be constituted by a pair of slantedsurfaces 64a of the taperedportion 64 and flat surfaces provided outward of theslanted surfaces 64a in the opposing direction F. The taperedportion 64 may be provided on a part of theholder 63 in the direction in which theholder 63 extends (the radial direction r). The taperedportion 64 may have a trapezoidal shape with its shorter base located above its longer base in the up-down direction theholder 63 as viewed from the radial direction r. - Unlike in the above-described embodiment, in the state where the
electronic unit 2 is placed in themold 90, thesecond circuit portion 52 may be supported by the lower mold 92 (circuit support portion) of themold 90 by coming into contact with thelower wall surface 102 of themold 90. For example, a distal end of thesecond circuit portion 52, which is on the opposite side of thesecond circuit portion 52 from thefirst circuit portion 51, may be partially in contact with thelower wall surface 102 of themold 90. In this case, a central portion of thesecond circuit portion 52 in the radial direction r (in the direction in which thesecond circuit portion 52 extends) is not supported by thelower mold 92. However, even in this case, when themold 90 is designed such that the distance d1 between eachside surface 68 of thesecond circuit portion 52 and the correspondingside wall surface 101 is larger than the distance d2 between theupper surface 67 of thesecond circuit portion 52 and theupper wall surface 100, the central portion of thesecond circuit portion 52 in the radial direction r can be suppressed from being deformed downward. - As described above, in the injecting step, the resin is injected into the
mold 90 with thesecond circuit portion 52 supported by the lower mold 92 (circuit support portion) of themold 90 from below. According to this manufacturing method, downward deformation of thesecond circuit portion 52 can be further suppressed. However, when theelectronic unit 2 is used as thetorque sensor 4 as in the above-described embodiment, thehousing 3 needs to be formed such that entry of a liquid into a gap between theelectronic unit 2 and thehousing 3 is prevented. Thus, in the state where theelectronic unit 2 is placed in themold 90, thesecond circuit portion 52 is preferably not in contact with theinner wall surface 90a of themold 90. - Thus, in the state where the
electronic unit 2 used as thetorque sensor 4 is placed in themold 90, thesecond circuit portion 52 is supported by themold 90. Therefore, a circuit support portion, such as a pin that is movable in the mold 90 (not illustrated), may be used. Thesecond circuit portion 52 may be supported by the circuit support portion from below, and the position of the circuit support portion may be controlled such that the circuit support portion moves away from thesecond circuit portion 52 after themold 90 is filled with theresin 120 and before theresin 120 is solidified. Consequently, the resin flows into an area in the mold 90 (in the internal space 95), in which the circuit support portion was placed. Therefore, thehousing 3 can be formed without providing a hole in theholder holding portion 82. - A
housing structure 1 according to a modified example illustrated inFIG. 11 andFIG. 12 is an example of thehousing structure 1 configured to suppress downward deformation of thesecond circuit portion 52 and prevent entry of a liquid into a gap between theelectronic unit 2 and thehousing 3, that is, thehousing structure 1 having a sufficient waterproof property. As illustrated inFIG. 11 , thesecond circuit portion 52 of theelectronic unit 2 of thehousing structure 1 according to this modified example includes, in addition to theterminals 72, an extendingportion 58 exposed into theinternal space 83a in theconnector portion 83, as a portion supported by the internal-space forming portion 98 (seeFIG. 12 ). The extendingportion 58 is molded so as to be integral with at least one of thehalves 63a of theholder 63. The extendingportion 58 extends radially outward from a radially outer end of theholder 63. The extendingportion 58 extends to a position radially outward of the terminals 72 (toward a position on the opposite side of thesecond circuit portion 52 from the first circuit portion 51). In other words, the extendingportion 58 is a distal end portion of thesecond circuit portion 52. The extendingportion 58 need not be entirely exposed into theinternal space 83a, as long as the extendingportion 58 has a surface that can be seen, as viewed from an opening side of theinternal space 83a of theconnector portion 83. Theinternal space 83a includes aterminal housing chamber 83b and anexposure portion 83c. Theexposure portion 83c extends from an upper end of theterminal housing chamber 83b to the extendingportion 58 of thesecond circuit portion 52. Theexposure portion 83c allows the extendingportion 58 to be exposed to the outside via theinternal space 83a. - As illustrated in
FIG. 12 , in a method of manufacturing thehousing structure 1 according to this modified example, the internal-space forming portion 98 for forming theinternal space 83a of theconnector portion 83 serves as a circuit support portion that can support thesecond circuit portion 52 from below. The internal-space forming portion 98 of themold 90 used in this manufacturing method includes a housingchamber forming portion 122 and acontact portion 121. The housingchamber forming portion 122 is used to form theterminal housing chamber 83b, in which the distal end portions of thesecond portions 72b of theterminals 72 are housed, in theinternal space 83a of theconnector portion 83. Thecontact portion 121 extends upward from an upper end of the housingchamber forming portion 122 and comes into contact with thesecond circuit portion 52. - In a preparing step of the method of manufacturing the
housing structure 1 according to this modified example, themold 90 including the internal-space forming portion 98 that can support thesecond circuit portion 52 from below is prepared. In an injecting step, theresin 120 is injected into themold 90 with the extendingportion 58 supported by the internal-space forming portion 98. Thus, even when the resin in themold 90 is solidified with thesecond circuit portion 52 supported by the internal-space forming portion 98 as illustrated inFIG. 12 , thesecond circuit portion 52 is just exposed to the outside via theconnector portion 83 as illustrated inFIG. 11 . After thehousing structure 1 is manufactured, theconnector portion 83 and theconnector 30 having a waterproof property are fitted together to close the opening of theconnector portion 83. With this configuration, thehousing structure 1 is easily kept watertight. Therefore, the externally exposed portion of thesecond circuit portion 52 need not be subjected to a waterproof treatment other than the fitting of theconnector 30 and theconnector portion 83. - After the resin is injected into the
mold 90 and before the resin is solidified, the internal-space forming portion 98 may be separated from thesecond circuit portion 52, so that an area in themold 90 in which thecontact portion 121 of the internal-space forming portion 98 was placed can be filled with the resin. However, because the water-tightness can be ensured by fitting theconnector 30 and theconnector portion 83 together, the internal-space forming portion 98 need not be separated from thesecond circuit portion 52. - As described above, deformation of the
electronic unit 2 during insert molding can be suppressed, and thehousing structure 1 can be easily kept watertight. The internal-space forming portion 98 includes the housingchamber forming portion 122 and thecontact portion 121. Thus, thecontact portion 121 is formed so as to be smaller than the housingchamber forming portion 122 with respect to the horizontal direction. This makes it possible to easily keep thehousing structure 1 watertight without enlarging theinternal space 83a of theconnector portion 83 more than necessary. - Unlike in the present embodiment, the
electronic unit 2 need not be used as thetorque sensor 4 attached to thesecond pinion shaft 8. For example, theelectronic unit 2 may be used as a torque sensor attached to the steeringshaft 11 or as another in-vehicle device. The electronic unit may be used as a device other than an in-vehicle device, and is applicable to any housing structures including the electronic unit and a housing, in which the electronic unit is housed, that are integrally molded as a single component. - As expressed by Equation (4) and Equation (5) described above, the viscosity µ of the
resin 120 flowing through themold 90 can be partially changed. This allows the flow resistance R1 of theresin 120 flowing through each of theside flow channels 111 to be made lower than the flow resistance R2 of theresin 120 flowing through theupper flow channel 110. Specifically, the temperature of the vicinity of the side flow channels 111 (particularly, the side wall surfaces 101 defining the side flow channels 111) may be increased to reduce the viscosity µ of theresin 120 flowing through theside flow channels 111, so that the flow resistance R1 is reduced.
Claims (8)
- A method of manufacturing a housing structure (1) that includes an electronic unit (2) including a first circuit portion (51) and a second circuit portion (52) protruding from the first circuit portion (51), and a housing (3) in which the electronic unit (2) is housed, the electronic unit (2) and the housing (3) being integral with each other, the method comprising:preparing a mold (90) for insert molding in which the electronic unit (2) is housed, the mold (90) including an upper wall surface (100) facing an upper surface (67) of the second circuit portion (52) and side wall surfaces (101) facing side surfaces (68) of the second circuit portion (52);placing the electronic unit (2) in the mold (90); andinjecting the resin (120) into the mold (90) in which the electronic unit (2) has been placed, whereinthe mold (90) includes:a first chamber (96) in which the first circuit portion (51) of the electronic unit (2) is housed;a second chamber (97) in which the second circuit portion (52) of the electronic unit (2) is housed, the second chamber (97) being communicated with the first chamber (96); anda gate (93) through which the resin (120) is injected into the first chamber (96), andthe resin (120) injected into the first chamber (96) through the gate (93) flows into the second chamber (97) from an upper portion of the second circuit portion (52), characterized in thatthe mold (90) is configured such that a flow resistance of a resin flowing through a space between each of the side surfaces of the second circuit portion and the corresponding side wall surface is lower than a flow resistance of the resin flowing through a space between the upper surface of the second circuit portion and the upper wall surface;the second circuit portion (52) is supported, as a cantilever portion, by the first circuit portion (51), andthe second circuit portion (52) is not in contact with an inner wall surface (90a) of the mold (90) in a state where the electronic unit (2) is placed in the mold (90).
- The method according to claim 1, wherein a distance between each of the side surfaces of the second circuit portion and the corresponding side wall surface is longer than a distance between the upper surface of the second circuit portion and the upper wall surface.
- The method according to claim 1 or 2, wherein
the electronic unit (2) is used as a torque sensor (4) mounted in a vehicle,
the first circuit portion (51) of the electronic unit (2) includes a magnetic convergence ring (53) having an annular shape and a magnetic convergence ring holder (55) surrounding the magnetic convergence ring (53), and
the second circuit portion (52) of the electronic unit (2) includes an electronic circuit portion including an electronic component (60). - The method according to claim 3, wherein the electronic unit (2) is placed in the mold (90) such that an inner peripheral surface of the magnetic convergence ring holder (55) is supported by a support portion (94) protruding in the mold (90).
- The method according to any one of claims 1 to 4, wherein the mold (90) that is prepared includes the upper wall surface (100) facing the upper surface (67) of the second circuit portion (52), the upper surface (100) being constituted by a tapered portion (64) tapered upward.
- The method according to any one of claims 1 to 5, wherein
the mold includes a circuit support portion configured to support the second circuit portion, and
the resin is injected into the mold in a state where the second circuit portion is supported by the circuit support portion from below. - The method according to claim 6, wherein
the circuit support portion includes an internal-space forming portion configured to form, in the housing, an internal space of a connector portion configured to be fitted to a connector having a waterproof property, and
the resin injected into the mold is solidified in a state where the second circuit portion is supported by the internal-space forming portion. - A housing structure that includes an electronic unit (2) including a first circuit portion (51) having an annular shape and a second circuit portion (52) protruding radially outward from the first circuit portion (51), and a housing (3) in which the electronic unit (2) is housed, the housing (3) being integral with the electronic unit (2) and obtained by the method in accordance with claim 5, wherein
the second circuit portion (52) comprises:a main body portion extending radially outward from the first circuit portion (51); anda tapered portion (64) protruding from the main body portion in a direction in which a central axis (C1) of the first circuit portion (51) extends.
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JP2016089447 | 2016-04-27 | ||
JP2016226217A JP6886612B2 (en) | 2016-04-27 | 2016-11-21 | Manufacturing method of housing structure and housing structure |
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EP3238905A2 EP3238905A2 (en) | 2017-11-01 |
EP3238905A3 EP3238905A3 (en) | 2018-02-21 |
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JP6683055B2 (en) * | 2016-07-27 | 2020-04-15 | 株式会社ジェイテクト | Torque detection device and electric power steering device |
JP6938181B2 (en) * | 2017-03-21 | 2021-09-22 | キヤノン株式会社 | Molding method and manufacturing method |
FR3105706B1 (en) * | 2019-12-18 | 2022-01-07 | Leoni Wiring Systems France | Deformation template of an electronic component |
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JPS5981126A (en) | 1983-08-24 | 1984-05-10 | Hitachi Ltd | Manufacture of resin mold product |
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US10166705B2 (en) | 2019-01-01 |
EP3238905A3 (en) | 2018-02-21 |
EP3238905A2 (en) | 2017-11-01 |
US20170312955A1 (en) | 2017-11-02 |
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