EP3167696A1 - Dispositif de détection comprenant une structure conductrice électrique flexible - Google Patents

Dispositif de détection comprenant une structure conductrice électrique flexible

Info

Publication number
EP3167696A1
EP3167696A1 EP15748165.6A EP15748165A EP3167696A1 EP 3167696 A1 EP3167696 A1 EP 3167696A1 EP 15748165 A EP15748165 A EP 15748165A EP 3167696 A1 EP3167696 A1 EP 3167696A1
Authority
EP
European Patent Office
Prior art keywords
layer
conductor structure
sensor device
flexible
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP15748165.6A
Other languages
German (de)
English (en)
Inventor
Peter Seidl
Sebastian Gepp
Thomas Weik
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schreiner Group GmbH and Co KG
Original Assignee
Dgsw Senso KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dgsw Senso KG filed Critical Dgsw Senso KG
Publication of EP3167696A1 publication Critical patent/EP3167696A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets

Definitions

  • the invention relates to a sensor device with a flexible electrical conductor structure for integration into an electrical circuit having an insulation layer on which an electrical conductor structure is applied.
  • Such devices are known in practice in many ways and can be integrated into a more complex electrical circuit by connecting them to other components, for example to a measuring circuit, a voltage source, a sensor or the like.
  • a substrate has been used as the insulating layer on which the printed circuit pattern can be printed.
  • the substrate may be a printed circuit board or even a flexible film, such as those under the brand names Flexfoil, Kapton, Ito-Film and Melinex products.
  • the substrate is printed to form the conductive pattern with an electrically conductive ink, which may include conductive components such as silver, copper, conductive polymers, graphite, graphene or the like.
  • the conductor structures can also be produced by an etching method, by a vapor deposition method or by a stamping method.
  • the insulating layer is made of a foil or of paper, an adhesive layer can additionally be provided, so that the device provided with the electrical conductor structure is self-adhesive and, for example an RFID label, on a substrate, in particular a device, a loan book or the like, can be fixed.
  • a printed electrical circuit which contains a consisting of a flexible, sheet-like and electrically insulating material print carrier which is printed on both sides with electrical conductor tracks, wherein the conductor tracks of the two sides by at least one opening in the print carrier can be electrically connected to each other.
  • the printed on the support medium electrical conductors serve only as a conductor, without having any sensor properties.
  • EP 2 267 218 AI a multilayer label or label is treated, which can be pressed or ironed on a garment under heat.
  • this label can be integrated as a security device RFID (Radio Frequency Identification Device).
  • RFID Radio Frequency Identification Device
  • This RFID has no sensor properties.
  • the invention has for its object to provide a sensor device for integration into an electrical circuit having a flexible electrical conductor structure and can be transferred to a variety of substrates formed.
  • the invention thus proposes a device for integration into an electrical circuit, comprising
  • At least one flexible electrical conductor structure which is applied to the insulating layer according to a printing method
  • the insulating layer and the conductor structure form a unit which is non-destructively removable from the carrier layer.
  • a unit which is detachable from the carrier layer and which can be connected via corresponding connection points with other electrical components. Due to the flexible design of the insulating layer and the conductor structure, this unit can be adapted in terms of their shape to a variety of substrates formed. Thus, even substrates that are unsuitable for a direct printing process can be provided with a conductive structure, without the substrate to which the unit of the insulating layer and the conductor structure has been transferred, would be affected.
  • a device for integration into an electrical circuit comprising
  • At least one flexible electrical conductor structure which is applied to the insulating layer according to a printing method, wherein the insulating layer and the conductor structure form a substrate-free and strapless, flexible unit.
  • This device can be used directly after its manufacture, i. it no longer needs to be removed from a carrier layer.
  • the device to which the electrical conductor structure can be connected may be a complex electrical circuit or just a simple electrical component, such as a voltage source.
  • the electrical conductor structure can be connected to an evaluation unit, in which case the electrical conductor structure can be a sensor structure with which specific measured variables can be determined, for example a degree of humidity or a temperature.
  • the carrier layer is an interim print carrier, which is important only in the manufacture of the device.
  • the unit of the insulation layer and the conductor structure can be detached from the carrier layer for integration into the electrical circuit.
  • the carrier layer is formed with the release layer, which adjoins the pressure layer applied to the carrier layer. The adhesion between the print layer and the release layer is therefore low.
  • the insulating layer is printed on the carrier layer (downcoat).
  • the flexible insulation layer consists of an electrically insulating varnish, which has a film-forming character, which can be adjusted by screen printing parameters (screen strength, mesh size) and the coating composition (chemistry).
  • the shape or the floor plan of the insulation layer can be chosen freely, that is, the insulation layer may be flat, strip-shaped and / or lattice-shaped or have any other pressure technically producible shapes.
  • the insulating layer is formed from a varnish, which may be a modified varnish.
  • the insulating layer is not limited to such paints. Rather, it is generally possible to use lacquers which have a sufficient thickness can be printed and are self-printable. Paints that are modified can be cured using, for example, UV light.
  • the insulation layer may have a high mechanical strength or be formed fragile.
  • the insulation layer may be formed at least partially multi-layered. This means that several layers of pressure are formed one above the other in the multi-layered areas.
  • the flexible conductor structure may comprise active and / or passive electrical or electronic components.
  • the components can be connected after printing of the conductor structure with this, for example, be glued, or even produced during the printing process itself.
  • the insulating layer and the electrical conductor structure are each preferably produced by a screen printing process.
  • the electrical conductor structure can take any conceivable form of printing technology.
  • a conductive printing material is preferably used, which contains silver, copper, carbon compounds, in particular carbon, a conductive polymer ink, graphene and / or conductive nanoscale paint.
  • the device according to the invention may comprise a plurality of flexible electrical conductor structures, which are separated from each other by a flexible insulation layer.
  • the separate electrical conductor structures can therefore represent crossing lines in a projection perpendicular to the separation insulation layer (crossover). This can be realized on both sides of the flexible insulation layer functionality.
  • a respective wetness detector can be realized by the two electrical conductor structures, which are separated from one another.
  • the electrical conductor structures which thus form a multilayer conductor structure, can be electrically separated from one another or can also be connected to one another electrically.
  • a so-called via can be realized.
  • the insulation layer is provided with at least one recess, which as tiny hole can be considered and which is filled by the pressure mass of at least one of the conductor structures.
  • at least one point is recessed, which is filled in a subsequent printing process for the conductor structure with the pressure mass of the conductor pattern, so that an electrical connection to the arranged on the other side of the insulating layer conductor structure is prepared. There is no need for a separate process for making the recess, since this is created during the printing of the insulation layer in the process.
  • the device according to the invention can be, for example, a strip which can be used for the detection of moisture.
  • a short circuit is generated due to the moisture on the conductor structure, which can be further processed by a corresponding evaluation unit.
  • the strip which may have an electrical conductor structure on both sides, is connected, for example, in regions with an absorbent material (fleece, tissue or the like), for example via an adhesive layer applied or otherwise applied.
  • a wetness sensor can be used, for example, as a detector for detecting incontinence.
  • a strain sensor sensitive to two spatial directions can be provided electrical resistance of a line with its geometry, ie with their length, their height and their width changes.
  • the indicator or sensor formed by the device can be connected to an evaluation unit.
  • a connection area for the evaluation unit can be reinforced by multilayer construction of the insulation layer (s). It is also conceivable that the device according to the invention is connected to a component which can communicate wirelessly with an evaluation unit.
  • the actual end product of the device according to the invention merely consists of at least one flexible insulation layer and at least one flexible electrical conductor structure. It is thus no separate printable substrate required to be provided with a conductor pattern. Rather, the assembly can be operated independently or in conjunction with any substrate.
  • the geometry of the conductor pattern and the insulating layer is determined by the printing method according to which the device according to the invention is manufactured.
  • the total pressure build-up during production is from bottom to top, i. Location on location.
  • the pressure build-up is also suitable for an endless process in which the printing web is not turned.
  • the electrical conductor structure may be covered by an additional pressure layer or may be open. Due to the individual pressure layers, the flexibility of the device can be influenced in a targeted manner.
  • the unit of the conductor structure and the insulating layer can be designed to be very fragile if necessary and in particular to be self-destructive during a manipulation.
  • the carrier layer forms a reinforcement.
  • Embodiments of the sensor device according to the invention are shown schematically simplified in the drawing and are explained in more detail in the following description. It shows:
  • Figure 1 is a plan view of a sensor device according to the invention, as
  • Incontinence sensor is formed
  • Figure 2 shows a section through the device of Figure 1 along the line II-II in
  • FIG. 1 A first figure.
  • Figure 3 is a plan view of an alternative embodiment of a device according to the invention, which is designed as a strain sensor, and Figure 4 shows a section through the device of Figure 3 along the line IV-IV in
  • FIGS. 1 and 2 show a moisture or wetness sensor 10 for monitoring the incontinence of a person.
  • the sensor 10 is formed as a flexible strip, which can be glued, for example, on a specially designed pants of the person.
  • the sensor 10, shown in the drawing in its post-fabrication condition, comprises a backing layer 12 which may be used as a release film, i. is formed as a film with a release layer and is an interim print carrier.
  • an insulating layer 14 is applied by a screen printing process, which consists of polyurethane-based lacquer, which is cured by means of UV radiation.
  • the insulation layer 14 has a high flexibility.
  • a conductor structure 20 formed from two electrical conductors 16 and 18 is printed, which is also flexible.
  • the conductor structure 20 is formed from a copper-based conductive printing material.
  • an adhesive layer 22 is formed on the conductor structure 20 and can also be applied by a printing process.
  • a cover layer 24 may be provided, which is also formed as a so-called release film.
  • FIGS. 3 and 4 show a strain sensor 30 which, according to the embodiment according to FIGS. 1 and 2, has a carrier layer 12 'which serves as an interim print carrier to which an insulating layer 14' is initially arranged during production.
  • the insulating layer 14 ' is formed from a polyurethane-based lacquer and applied to the carrier layer 12' by a screen printing process.
  • an electrical conductor structure 20' is applied by a screen printing method, which consists of a plurality of parallel, strip-shaped conductors, which are formed from a silver-containing printing material. Also, the conductor structure 20 'has a high flexibility.
  • a second insulating layer 32 is printed, also after a screen printing process and by applying a polyurethane printing material.
  • a second flexible electrical conductor structure 34 is printed, which consists of strip-shaped electrical conductors which run at right angles to the strips of the electrical conductor structure 20'.
  • a recess 36 is formed in the insulation layer 32, which is produced by omitting the corresponding location during the printing of the insulating layer 32.
  • the recess 36 is filled with the pressure mass of the second electrical conductor structure 34, so that the electrical connection between the two conductor structures 34 and 20 'is realized.
  • the strain sensor 30 has an adhesive layer 22 ', which is likewise applied by a screen-printing method and which is protected by means of a cover 24'.
  • a cover 24' which is designed as a release film, peeled off, so that the strain sensor 30 via the adhesive layer 22' can be attached to a substrate.
  • Both the electrical conductor structures 20 'and 34 of the strain sensor 30 and the conductors 16 and 18 of the electrical conductor structure 20 of the wetness detector according to FIGS. 1 and 2 can be connected to a corresponding, suitable evaluation unit.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Dispersion Chemistry (AREA)
  • Structure Of Printed Boards (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

L'invention concerne un dispositif de détection destiné à être intégré dans un circuit électrique. Ledit dispositif comprend une couche de support (12') qui est formée avec une couche antiadhésive, au moins une couche isolante flexible (14', 32), qui est produite au moyen d'un procédé d'impression, au moins une couche conductrice électrique flexible (20', 34), qui est appliquée au moyen d'un procédé d'impression sur la couche isolante (14), la couche isolante (14', 32) et la structure conductrice (20', 34) formant une unité flexible qui peut être détachée de manière non destructive de la couche de support (12').
EP15748165.6A 2014-07-09 2015-07-06 Dispositif de détection comprenant une structure conductrice électrique flexible Pending EP3167696A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014109621 2014-07-09
DE202014103821.3U DE202014103821U1 (de) 2014-07-09 2014-08-18 Flexible elektrische Leiterstruktur
PCT/DE2015/100281 WO2016004921A1 (fr) 2014-07-09 2015-07-06 Dispositif de détection comprenant une structure conductrice électrique flexible

Publications (1)

Publication Number Publication Date
EP3167696A1 true EP3167696A1 (fr) 2017-05-17

Family

ID=51618848

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15748165.6A Pending EP3167696A1 (fr) 2014-07-09 2015-07-06 Dispositif de détection comprenant une structure conductrice électrique flexible

Country Status (5)

Country Link
US (1) US10098223B2 (fr)
EP (1) EP3167696A1 (fr)
AU (1) AU2015285996B2 (fr)
DE (3) DE202014103821U1 (fr)
WO (1) WO2016004921A1 (fr)

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DE102018102734A1 (de) 2018-01-18 2019-07-18 Schreiner Group Gmbh & Co. Kg Flexible elektrische Schaltung mit Verbindung zwischen elektrisch leitfähigen Strukturelementen
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AU2015285996A1 (en) 2017-01-05
DE202014103821U1 (de) 2014-09-09
DE112015003190A5 (de) 2017-03-23
WO2016004921A1 (fr) 2016-01-14
DE102015100297A1 (de) 2016-01-14
AU2015285996B2 (en) 2019-07-11
US20160014884A1 (en) 2016-01-14

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