EP3167224A1 - Semiconductor lamp - Google Patents

Semiconductor lamp

Info

Publication number
EP3167224A1
EP3167224A1 EP15721647.4A EP15721647A EP3167224A1 EP 3167224 A1 EP3167224 A1 EP 3167224A1 EP 15721647 A EP15721647 A EP 15721647A EP 3167224 A1 EP3167224 A1 EP 3167224A1
Authority
EP
European Patent Office
Prior art keywords
substrate
semiconductor
lamp
semiconductor lamp
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP15721647.4A
Other languages
German (de)
French (fr)
Other versions
EP3167224B1 (en
Inventor
Thomas Weng
Stefan Ringler
Thomas Klafta
Marianne Auernhammer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ledvance GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP3167224A1 publication Critical patent/EP3167224A1/en
Application granted granted Critical
Publication of EP3167224B1 publication Critical patent/EP3167224B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/69—Details of refractors forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/508—Cooling arrangements characterised by the adaptation for cooling of specific components of electrical circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/002—Refractors for light sources using microoptical elements for redirecting or diffusing light
    • F21V5/004—Refractors for light sources using microoptical elements for redirecting or diffusing light using microlenses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a semiconductor lamp, comprising at least one semiconductor light source arranged on one side of a substrate and a driver circuit for driving the at least one semiconductor light source.
  • the invention is particularly applicable to retrofit lamps, in particular
  • Incandescent or halogen lamp retrofit lamps Incandescent or halogen lamp retrofit lamps.
  • a driver board is housed in a front open driver cavity of a housing.
  • the front is closed by means of serving as a heat sink metallic lid.
  • a carrier (“LED carrier”) equipped with light-emitting diodes (“LEDs”) is mounted on an outside of the heat sink.
  • Driver board and the LED carrier are thus designed as two separate components, which by means of various
  • Heatsink are electrically connected.
  • current connection methods there are hardly any simple or inexpensive methods for mechanical implementation of the electrical
  • FR4 boards can be used which also add cost and reduce thermal resistance from the LEDs to the heat sink only to a limited extent.
  • Driver circuit with associated semiconductor light sources in particular LEDs to provide a semiconductor lamp. It is still a specific object to provide a possibility for inexpensive heat dissipation of semiconductor light sources, in particular LEDs, a semiconductor lamp in a structurally simple and cost-effective manner. This object is achieved according to the characteristics of the independent
  • the object is achieved by a semiconductor lamp
  • the driver circuit is no longer on a separate from the substrate of the semiconductor light sources
  • Printed circuit board is fixed, the need for electrical connection between two carriers is eliminated, which significantly facilitates production. Also, a reduction of components for contacting (plug, cable, etc.) and thus a saving in the
  • the manufacturing process e.g., a combination of wave soldering and SMD soldering for such a populated
  • Substrate is comparable to manufacturing processes for all common two-sided boards and thus known, available and inexpensive. This in turn enables a saving of investment costs in special machines for eg laser soldering and / or a saving of manual workstations.
  • the previous contacting the driver board and the LED carrier is often a mechanical and
  • the driver circuit may have multiple electrical and / or
  • driver circuit All components of the driver circuit may be present, but some of the components may also be present on the front, in particular small and / or flat
  • resistors e.g. Thick film resistors.
  • Large components such as integrated circuits, capacitors,
  • Coils, electronic switches, etc. are preferably attached only to the back of the substrate.
  • Embodiment that all components of the driver circuit are present on the back.
  • LED light emitting diode
  • a color can be monochrome (e.g., red, green, blue, etc.) or
  • the multichromic e.g., white
  • the light emitted by the at least one light emitting diode an infrared light
  • IR-LED infrared light
  • UV-LED ultraviolet light
  • Several light emitting diodes can produce a mixed light; eg a white mixed light.
  • the at least one light-emitting diode can at least contain a wavelength-converting phosphor
  • the phosphor may alternatively or additionally be arranged away from the light-emitting diode
  • the at least one light-emitting diode can be in the form of at least one individually housed light-emitting diode or in the form of at least one LED chip. Several LED chips can be mounted on a common substrate (“submount").
  • the at least one light emitting diode may be equipped with at least one own and / or common optics for beam guidance, e.g. at least one Fresnel lens,
  • organic LEDs can generally also be used.
  • the at least one semiconductor light source may be e.g. have at least one diode laser.
  • the semiconductor lamp has, in particular at its rear end, a socket for the mechanical and electrical connection to a socket.
  • the socket may be inserted
  • the back side of the substrate may face toward the socket (face back) and the front face away from the socket (face forwards).
  • backward or “backward” may refer to a direction or orientation toward the socket.
  • front or “forward” may analogously be understood a direction or orientation away from the pedestal.
  • front or “forward” may mean a direction or orientation to a light emitting area. It is a continuing education that the
  • Semiconductor lamp has a longitudinal axis, which from a rear base area to a front
  • the substrate may be any suitable electrically insulating material.
  • base material e.g. conventional base material for circuit boards such as FR4, other plastic or ceramic.
  • a metal core board may be used.
  • the substrate may be at its front and / or on its back one
  • Conductive structure e.g., comprising at least one conductive trace and / or at least one contact patch.
  • components attached to the substrate may be attached by means of a bonding wire or the like. be electrically connected.
  • connection methods can be used. It is an embodiment that a heat sink or a
  • Heat sink rests flat on the front of the substrate. This is now possible because the heat sink is not more than
  • Partition wall between the driver board and the LED support needs to be provided. This refinement affords the advantage that the substrate on the side on which the semiconductor light sources are located is cooled by the heat sink, eliminates a thermal resistance through the substrate and binds the heat sink to the semiconductor light sources in a particularly effective manner.
  • Improved cooling connection also enables reduction of material (e.g., aluminum) in the lamp, thereby optimizing costs.
  • the improved cooling connection may also increase the service life, allow the use of less expensive components and / or waiving a
  • the heat sink may for example consist of ceramic or metal, for example aluminum. It is still a design that the heat sink
  • the heat sink may have further recesses, e.g. for other components, solder points and / or for the implementation of structural components such as legs etc.
  • the recesses generally allow a direct or with a very small gap connected support of the heat sink and thus a particularly low thermal resistance.
  • the heat sink is a shell-like heat sink with a plate-shaped bottom and an edge thereof angled outgoing edge, wherein the at least one recess for the at least one
  • Semiconductor light source is placed in the ground. Such a heat sink can be easily produced.
  • the heat sink is attached to the substrate by means of an adhesive heat-conducting layer, in particular adhered thereto.
  • the adhesive thermal conductive layer may e.g. a TIM ("Thermal Interface Material”) film.
  • the heat sink rests on a thermally good conductive gap filler on the front of the substrate. This may eliminate the need for recesses in the bottom (e.g., solder points) because the gap filler allows for a greater clearance between the heat sink and the front of the substrate.
  • the gap filler has a significantly higher thermal conductivity than conventional substrate materials. He likes e.g. consist of thermal grease.
  • the substrate is housed in a housing. This allows a Touch resistance and protection against mechanical and chemical stress.
  • the substrate may be non-positively fixed (e.g., by means of a press fit or interference fit) in the housing, positively and / or materially (e.g. It may be e.g. rest on the inside of the housing existing retaining tabs or on a stage of the housing.
  • the housing consists in particular of an electric
  • the housing may be formed in one or more parts.
  • the housing may in particular have a rearward base region, which together with at least one electrical contact element can form a base of the semiconductor lamp.
  • the socket may be, for example, an Edison socket or a bipin socket. It is also an embodiment that the housing
  • the side edge especially likes between retaining tabs and a rigid
  • Housing wall inserted, e.g. be trapped.
  • Holding tabs may carry the substrate on the top.
  • Side edge extends in particular to the rear. He may have one or more breaks to one
  • the driver circuit is surrounded in the housing by potting material. This improves heat dissipation to the housing since potting material has lower thermal resistance than air.
  • the driver circuit (and possibly outgoing lines, eg to the base) is so specially protected, for example against mechanical stress.
  • the potting material may be filled, for example, after the insertion of the loaded substrate into the housing. It is preferably filled to a maximum height of the substrate in order not to damage or cover the LED chips.
  • Feedthroughs are electrically connected by the substrate.
  • a substrate is particularly inexpensive.
  • a substrate provided with a conductive structure on both sides may be used.
  • the electrically conductive feedthrough may be a self-contained feedthrough, e.g. in the form of at least one
  • a conductive feedthrough may additionally or alternatively be referred to as a through-hole (also referred to as through-hole technology, THT, or pin-in-hole technology, PIH) pin.
  • THT through-hole technology
  • PIH pin-in-hole technology
  • an electrical or electronic component of the driver circuit may be formed. So the components of the driver circuit like
  • THT components whose pins or connecting pins, for example, through the substrate
  • the heat sink is followed by at least one optical element having rearwardly projecting legs or feet that extend through a respective recess in the bottom of the heat sink to the substrate. The legs allow a simple way of accurate positioning of the optical
  • Semiconductor light source may be e.g. serve as spacers.
  • the recesses may serve as alignment aids and as lateral guides.
  • the semiconductor lamp is a retrofit lamp. Such may be used instead of a conventional lamp without semiconductor light sources and therefore has in particular a base for
  • the retrofit lamp may e.g. an incandescent retrofit lamp, e.g. with an Edison base, e.g. Type E14 or E27. It may also be a halogen lamp retrofit lamp, e.g. with a biped base, e.g. of the type GU, e.g. GU10 or GU5.3.
  • Fig.l shows an exploded view in an oblique view of a semiconductor lamp according to a first
  • Figure 2 shows an exploded view in an oblique view of selected parts of the semiconductor lamp according to the first embodiment; 3 shows as a partial sectional view in
  • FIG. 4 shows a partial sectional view in FIG
  • Fig.l shows an exploded view in an oblique view of a semiconductor lamp 1 in the form of a halogen retrofit lamp.
  • Semiconductor lamp 1 has a housing 2 with a cup-like basic shape, which at its rear end a
  • Base area 3 has.
  • the housing 2 is shown here partially cut away.
  • the semiconductor lamp 1 has a front (the base area 3) forward (a
  • the base region 3 is used for mechanical attachment of the semiconductor lamp 1 in a conventional bipin socket
  • Semiconductor lamp 1 protrude from a rear end surface of the base portion 3, two metallic pins 4 backward, which together with the base portion 3 form a biped base of the semiconductor lamp 1, for example, of the type "GU", e.g. GU10.
  • the housing 2 is open at the front, wherein a substrate 6 can be inserted through a front opening 5.
  • the substrate 6 is here as a circular disk-shaped FR4 or CEM
  • Substrate formed as shown in more detail in Figure 2. At a front side 7 of the substrate 6 are more
  • LED chips 8 Semiconductor light sources arranged in the form of LED chips 8.
  • the LED chips 8 are connected to one another via contact fields 9 present on the front side 7.
  • the contact fields 9 consist of metallic layers, for example of copper, and together form a line structure.
  • On a rear side 10 of the substrate 6 are components 11 of a driver circuit for driving the LED chips 8
  • the substrate 6 is therefore a common substrate both for the LED chips 8 and for the components 11 of the driver circuit.
  • the front 6 and the back 10 of the substrate 6 are basically electrically isolated from each other.
  • An electrical connection of the components 11 of the driver circuit and the LED chips 8 is achieved by at least one electrically conductive passage (not shown) between the front 6 and the back 10 of the substrate 6.
  • the substrate 6 is provided on both sides with a respective line structure, which may each have one or more conductor tracks and / or contact pads.
  • the line structure here has four
  • LED chips 8 interconnect electrically in series. It is a particularly inexpensive variant that the substrate 6 only one-sided, e.g. here at the front 7, is provided with a respective line structure. An electrical connection of the components 11 of the back 10 may then be e.g. by means of the conductive bushing (s) with the
  • Line structure of the front 7 to be implemented This may be e.g. be done by the fact that the components 11 are configured as through-hole components,
  • the heat sink 12 has a shell-like basic shape surface, which is shown in more detail in Figure 2.
  • the heat sink 12 has a
  • the bottom 13 has recesses 15 for the LED chips 8 and further recesses 16, e.g. for by conductive
  • Feedthroughs produced projections on the front side 7 of the substrate 6.
  • 13 recesses 23 in the bottom for legs 22 available, as will be explained in more detail below.
  • the heat sink 12 is by means of an adhesive
  • Heat conducting layer 17 adhered to the substrate 6. This is a strong attachment at the same time low
  • the heat-conducting layer 17 has analogous holes or recesses 15a, 16a or 23a to the recesses 15, 16 and 23 of the bottom 13, as shown in more detail in FIG.
  • the heat conducting layer 17 may be e.g. when
  • a so-called gap filing may also be used, e.g. a so-called "gap pad", so that it is possible to dispense with recesses 16a for projections produced by conductive feedthroughs without too much increasing a thermal resistance.
  • the housing 2 is filled to the substrate 6 with a potting material 20, which thus surrounds the components 11.
  • the heat sink 12 is front of an optical
  • Lens element 21 is a common optic for the LED chips 8 and has a plurality of rear sides (here: three)
  • the legs 22 pass through recesses 23 in the bottom 13 of the heat sink
  • the lens element 21 is pressed by means of a retaining ring 24 in a rearward direction, so that it does not detach from the substrate 6.
  • the retaining ring 24 is in front of the
  • Lens element 21 is arranged and latched to an inner side of the housing 2 via latching hooks 25.
  • 3 shows the assembled semiconductor lamp 1 with a laterally cut housing 2.
  • Fig.4 shows the
  • the side edge 14 of the heat sink 12 is located with his
  • the heat sink 12 may be so clamped in the housing 2 are held.
  • the substrate 6 rests with an edge region of its rear side 10 on retaining tabs 26, which protrude from an inner side of the housing 2 to the front.
  • the retaining ring 24 closes the front practically
  • the lens element 21 has above each LED chip 8 on a rearwardly projecting lens-like light-collecting region 27.
  • the light-collecting region 27 may, for example, have a return with a convex bottom over a respective LED chip 8.
  • Lens element 21 on a field 28 of microlenses which further equalize the light emission.
  • the microlenses may in particular be convex, e.g. spherical, aspherical or pillow-shaped.
  • This semiconductor lamp 1 has only one joining direction, which keeps the manufacturing complexity of the entire platform at a low level.
  • the driver circuit with the Driver components 11 with an electrical supply signal (eg a mains voltage) supplied.
  • the driver circuit converts the electrical supply signal into an electrical operating signal suitable for operating the series-connected LED chips 8. This may for example be clocked and / or be adjustable in terms of its current level.
  • Operating signal may allow a dimmed operation of the LED chips 8.
  • Driver components 11 of the driver circuit are passed through the substrate 6 and are electrically connected to the local contact pads 9, the operating signal can be readily fed into the LED chips 8. The light then emitted by the LED chips 8 passes through the

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Abstract

A semiconductor lamp (1) has at least one semiconductor light source (8) arranged on a front face (7) of a substrate (6) and a driver circuit (11) for activating the at least one semiconductor light source (8), at least part of the driver circuit (11) being secured on a rear face (10) of the substrate (6), facing away from the at least one semiconductor light source (8). The invention can be used, in particular, for retrofit lamps, in particular incandescent- or halogen retrofit lamps.

Description

Beschreibung description
Halbleiterlampe Die Erfindung betrifft eine Halbleiterlampe, aufweisend mindestens eine an einer Seite eines Substrats angeordnete Halbleiterlichtquelle und eine Treiberschaltung zum Ansteuern der mindestens einen Halbleiterlichtquelle. Die Erfindung ist insbesondere anwendbar auf Retrofitlampen, insbesondere The invention relates to a semiconductor lamp, comprising at least one semiconductor light source arranged on one side of a substrate and a driver circuit for driving the at least one semiconductor light source. The invention is particularly applicable to retrofit lamps, in particular
Glühlampen- oder Halogenlampen-Retrofitlampen . Incandescent or halogen lamp retrofit lamps.
Es sind Retrofitlampen bekannt, bei denen eine Treiberplatine in einer vorderseitig offenen Treiberkavität eines Gehäuses untergebracht ist. Die Vorderseite ist mittels eines als Kühlkörper dienenden metallischen Deckels verschlossen. Ein mit Leuchtdioden ("LEDs") bestückter Träger ("LED-Träger") ist an einer Außenseite des Kühlkörpers angebracht. Die There are retrofit lamps are known in which a driver board is housed in a front open driver cavity of a housing. The front is closed by means of serving as a heat sink metallic lid. A carrier ("LED carrier") equipped with light-emitting diodes ("LEDs") is mounted on an outside of the heat sink. The
Treiberplatine und der LED-Träger sind also als zwei separate Komponenten ausgeführt, welche mittels verschiedenster Driver board and the LED carrier are thus designed as two separate components, which by means of various
Kontaktierungen (Stecker, Löten, Kabel, etc.) durch den Contacting (plug, soldering, cable, etc.) through the
Kühlkörper hindurch elektrisch verbunden werden. Für aktuelle Verbindungsmethoden gibt es kaum einfache oder preiswerte Methoden zur maschinellen Durchführung der elektrischen  Heatsink are electrically connected. For current connection methods, there are hardly any simple or inexpensive methods for mechanical implementation of the electrical
Verbindungsleitungen durch den Kühlkörper. Dieser Connecting cables through the heat sink. This
Produktionsschritt geschieht vielmehr meist per Hand. Production step happens rather by hand.
Ein weiterer Nachteil besteht darin, dass der Wärmetransport von den LEDs zu dem Kühlkörper durch den dazwischenliegenden Träger nicht effektiv ist. Um den Wärmetransport zu Another disadvantage is that the heat transfer from the LEDs to the heat sink is not effective by the intervening carrier. To the heat transport too
verbessern, werden teilweise Metallkern-Platinen als LED- Träger eingesetzt, welche jedoch teuer sind. Alternativ können dünne (z.B. 0,5 mm dicke) FR4-Platinen verwendet werden, welche ebenfalls erhöhte Kosten verursachen und einen Wärmewiderstand von den LEDs zu dem Kühlkörper nur bedingt reduzieren. improve, some metal core boards are used as LED support, which are expensive. Alternatively, thin (e.g., 0.5 mm thick) FR4 boards can be used which also add cost and reduce thermal resistance from the LEDs to the heat sink only to a limited extent.
Es ist die Aufgabe der vorliegenden Erfindung, die Nachteile des Standes der Technik zumindest teilweise zu überwinden. Es ist insbesondere eine Aufgabe, eine Möglichkeit zur It is the object of the present invention to at least partially overcome the disadvantages of the prior art. It is in particular a task, a way to
vereinfachten elektrischen Kontaktierung einer simplified electrical contacting of a
Treiberschaltung mit zugehörigen Halbleiterlichtquellen, insbesondere LEDs, einer Halbleiterlampe bereitzustellen. Es ist noch eine spezielle Aufgabe, eine Möglichkeit zur preisgünstigen Wärmeableitung von Halbleiterlichtquellen, insbesondere LEDs, einer Halbleiterlampe auf konstruktiv einfache und kostengünstige Weise bereitzustellen. Diese Aufgabe wird gemäß den Merkmalen der unabhängigen Driver circuit with associated semiconductor light sources, in particular LEDs to provide a semiconductor lamp. It is still a specific object to provide a possibility for inexpensive heat dissipation of semiconductor light sources, in particular LEDs, a semiconductor lamp in a structurally simple and cost-effective manner. This object is achieved according to the characteristics of the independent
Ansprüche gelöst. Bevorzugte Ausführungsformen sind Claims solved. Preferred embodiments are
insbesondere den abhängigen Ansprüchen entnehmbar. in particular the dependent claims.
Die Aufgabe wird gelöst durch eine Halbleiterlampe, The object is achieved by a semiconductor lamp,
aufweisend mindestens eine an einer ersten Seite (im having at least one on a first side (im
Folgenden ohne Beschränkung der Allgemeinheit als The following without limitation of the general public
"Vorderseite" bezeichnet) eines Substrats angeordnete "Front side") of a substrate
Halbleiterlichtquelle und eine Treiberschaltung zum Ansteuern der mindestens einen Halbleiterlichtquelle, wobei zumindest ein Teil der Treiberschaltung an einer der mindestens einenSemiconductor light source and a driver circuit for driving the at least one semiconductor light source, wherein at least a part of the driver circuit at one of the at least one
Halbleiterlichtquelle abgewandten zweiten Seite (im Folgenden ohne Beschränkung der Allgemeinheit als "Rückseite" Semiconductor light source facing away from the second side (hereinafter without limitation of generality as a "back"
bezeichnet) des Substrats befestigt ist. Dadurch, dass die Treiberschaltung nicht mehr auf einer von dem Substrat der Halbleiterlichtquellen getrennten designated) of the substrate is attached. Characterized in that the driver circuit is no longer on a separate from the substrate of the semiconductor light sources
Leiterplatte befestigt ist, wird die Notwendigkeit einer elektrischen Verbindung zweier Träger eliminiert, was eine Herstellung erheblich erleichtert. Auch lässt sich so eine Reduzierung von Komponenten für die Kontaktierung (Stecker, Kabel, etc.) und damit eine Ersparnis bei den Printed circuit board is fixed, the need for electrical connection between two carriers is eliminated, which significantly facilitates production. Also, a reduction of components for contacting (plug, cable, etc.) and thus a saving in the
Komponentenkosten erreichen. Zudem wird ein Träger Achieve component costs. In addition, a carrier
eingespart. Der Fertigungsprozess (z.B. eine Kombination aus Wellen-Löten und SMD-Löten) für ein solches bestücktes saved. The manufacturing process (e.g., a combination of wave soldering and SMD soldering) for such a populated
Substrat ist vergleichbar mit Fertigungsprozessen für alle gängigen zweiseitigen Platinen und somit bekannt, verfügbar und kostengünstig. Dies wiederum ermöglicht eine Einsparung von Investitionskosten in Sondermaschinen für z.B. Laserlöten und/oder eine Einsparung von Handarbeitsplätzen. Darüber hinaus ist die bisherige Kontaktierung der Treiberplatine und des LED-Trägers oftmals ein mechanischer und Substrate is comparable to manufacturing processes for all common two-sided boards and thus known, available and inexpensive. This in turn enables a saving of investment costs in special machines for eg laser soldering and / or a saving of manual workstations. In addition, the previous contacting the driver board and the LED carrier is often a mechanical and
herstellungstechnischer Schwachpunkt und somit häufig ein Problem für eine Qualitätssicherung und eine Erreichung einer hohen Lebensdauer. Da diese Kontaktierung bei der Manufacturing weak point and thus often a problem for quality assurance and achieving a long service life. Since this contact in the
vorliegenden Erfindung nicht mehr nötig ist, können die The present invention is no longer necessary, the
Qualität und die Lebensdauer gesteigert bzw. ein Quality and life increased or a
Ausfallrisiko minimiert werden. Default risk can be minimized.
Die Treiberschaltung mag mehrere elektrische und/oder The driver circuit may have multiple electrical and / or
elektronische Bauteile aufweisen, um in den Sockel have electronic components in place in the socket
eingespeiste elektrische Signale in für den Betrieb der mindestens einen Halbleiterlichtquelle geeignete elektrische Signale umzuwandeln. An der Rückseite brauchen nicht to convert fed electrical signals into suitable for the operation of the at least one semiconductor light source electrical signals. At the back do not need
sämtliche Bauteile der Treiberschaltung vorhanden sein, sondern einige der Bauteile mögen auch an der Vorderseite vorhanden sein, insbesondere kleine und/oder flache All components of the driver circuit may be present, but some of the components may also be present on the front, in particular small and / or flat
Bauelemente wie Widerstände, z.B. Dickschicht-Widerstände. Große Bauteile wie integrierte Schaltungen, Kondensatoren,Components such as resistors, e.g. Thick film resistors. Large components such as integrated circuits, capacitors,
Spulen, elektronische Schalter usw. sind vorzugsweise nur an der Rückseite des Substrats befestigt. Coils, electronic switches, etc. are preferably attached only to the back of the substrate.
Jedoch ist es eine für eine gering gelegte und flache However, it is one for a low-lying and flat
Ausgestaltung der Vorderseite vorteilhafterweise Design of the front advantageously
Ausgestaltung, dass sämtliche Bauteile der Treiberschaltung an der Rückseite vorhanden sind.  Embodiment, that all components of the driver circuit are present on the back.
Insbesondere umfasst die mindestens eine In particular, the at least one
Halbleiterlichtquelle mindestens eine Leuchtdiode ("LED"). Bei Vorliegen mehrerer Leuchtdioden können diese in der gleichen Farbe oder in verschiedenen Farben leuchten. Eine Farbe kann monochrom (z.B. rot, grün, blau usw.) oder Semiconductor light source at least one light emitting diode ("LED"). If several LEDs are present, they can be lit in the same color or in different colors. A color can be monochrome (e.g., red, green, blue, etc.) or
multichrom (z.B. weiß) sein. Auch kann das von der mindestens einen Leuchtdiode abgestrahlte Licht ein infrarotes Lichtmultichromic (e.g., white). Also, the light emitted by the at least one light emitting diode, an infrared light
(IR-LED) oder ein ultraviolettes Licht (UV-LED) sein. Mehrere Leuchtdioden können ein Mischlicht erzeugen; z.B. ein weißes Mischlicht. Die mindestens eine Leuchtdiode kann mindestens einen wellenlängenumwandelnden Leuchtstoff enthalten (IR-LED) or an ultraviolet light (UV-LED). Several light emitting diodes can produce a mixed light; eg a white mixed light. The at least one light-emitting diode can at least contain a wavelength-converting phosphor
(Konversions-LED) . Der Leuchtstoff kann alternativ oder zusätzlich entfernt von der Leuchtdiode angeordnet sein (Conversion LED). The phosphor may alternatively or additionally be arranged away from the light-emitting diode
("Remote Phosphor") . Die mindestens eine Leuchtdiode kann in Form mindestens einer einzeln gehäusten Leuchtdiode oder in Form mindestens eines LED-Chips vorliegen. Mehrere LED-Chips können auf einem gemeinsamen Substrat ("Submount") montiert sein. Die mindestens eine Leuchtdiode kann mit mindestens einer eigenen und/oder gemeinsamen Optik zur Strahlführung ausgerüstet sein, z.B. mindestens einer Fresnel-Linse, ("Remote Phosphor"). The at least one light-emitting diode can be in the form of at least one individually housed light-emitting diode or in the form of at least one LED chip. Several LED chips can be mounted on a common substrate ("submount"). The at least one light emitting diode may be equipped with at least one own and / or common optics for beam guidance, e.g. at least one Fresnel lens,
Kollimator, und so weiter. Anstelle oder zusätzlich zu anorganischen Leuchtdioden, z.B. auf Basis von InGaN oder AlInGaP, sind allgemein auch organische LEDs (OLEDs, z.B. Polymer-OLEDs ) einsetzbar. Alternativ kann die mindestens eine Halbleiterlichtquelle z.B. mindestens einen Diodenlaser aufweisen . Collimator, and so on. Instead of or in addition to inorganic light emitting diodes, e.g. based on InGaN or AlInGaP, organic LEDs (OLEDs, for example polymer OLEDs) can generally also be used. Alternatively, the at least one semiconductor light source may be e.g. have at least one diode laser.
Die Halbleiterlampe weist insbesondere an ihrem rückwärtigen Ende einen Sockel zum mechanischen und elektrischen Anschluss an eine Fassung auf. Der Sockel mag beispielsweise ein The semiconductor lamp has, in particular at its rear end, a socket for the mechanical and electrical connection to a socket. For example, the socket may be inserted
Edison-Sockel oder ein Bipin-Sockel sein. Insbesondere mag die Rückseite des Substrats in Richtung des Sockels weisen (nach hinten weisen) und die Vorderseite von dem Sockel abgewandt sein (nach vorne weisen) .  Edison socket or a bipin socket. In particular, the back side of the substrate may face toward the socket (face back) and the front face away from the socket (face forwards).
Allgemein mag unter "rückwärtig" oder "nach hinten" eine Richtung oder Ausrichtung zu dem Sockel hin verstanden werden. Unter "vorderseitig" oder "nach vorne" mag analog eine Richtung oder Ausrichtung von dem Sockel weg verstanden werden. Auch mag unter "vorderseitig" oder "nach vorne" eine Richtung oder Ausrichtung zu einem Lichtabstrahlbereich verstanden werden. Es ist eine Weiterbildung, dass die Generally, "backward" or "backward" may refer to a direction or orientation toward the socket. By "front" or "forward" may analogously be understood a direction or orientation away from the pedestal. Also, "front" or "forward" may mean a direction or orientation to a light emitting area. It is a continuing education that the
Halbleiterlampe eine Längsachse aufweist, welche von einem rückwärtigen Sockelbereich zu einem vorderen Semiconductor lamp has a longitudinal axis, which from a rear base area to a front
Lichtabstrahlbereich verläuft. Dann mag unter vorderseitig" oder "nach vorne" eine Anordnung oder Ausrichtung in Richtung der Längsachse und unter "rückwärtig" oder "nach hinten eine Anordnung oder Ausrichtung gegen Richtung der Längsachse verstanden werden. Lichtabstrahlbereich runs. Then under "front" or "forward" an arrangement or orientation in the direction of the longitudinal axis and under "backwards" or "to the rear a Arrangement or orientation against the direction of the longitudinal axis to be understood.
Das Substrat mag jedes geeignete elektrisch isolierende The substrate may be any suitable electrically insulating
Basismaterial aufweisen, z.B. herkömmliches Basismaterial für Platinen wie FR4, anderen Kunststoff oder Keramik. Auch mag eine Metallkernplatine verwendet werden. Das Substrat mag an seiner Vorderseite und/oder an seiner Rückseite eine Have base material, e.g. conventional base material for circuit boards such as FR4, other plastic or ceramic. Also, a metal core board may be used. The substrate may be at its front and / or on its back one
Leitungsstruktur (z.B. umfassend mindestens eine Leiterbahn und/oder mindestens ein Kontaktfeld) aufweisen. Alternativ oder zusätzlich mögen an dem Substrat befestigte Bauelemente mittels eines Bonddrahts o.ä. elektrisch verbunden sein. Conductive structure (e.g., comprising at least one conductive trace and / or at least one contact patch). Alternatively or additionally, components attached to the substrate may be attached by means of a bonding wire or the like. be electrically connected.
Jedoch sind auch andere Verbindungsmethoden einsetzbar. Es ist eine Ausgestaltung, dass ein Kühlkörper oder eineHowever, other connection methods can be used. It is an embodiment that a heat sink or a
Wärmesenke an der Vorderseite des Substrats flächig aufliegt. Dies ist nun möglich, da der Kühlkörper nicht mehr als Heat sink rests flat on the front of the substrate. This is now possible because the heat sink is not more than
Trennwand zwischen der Treiberplatine und dem LED-Träger vorgesehen zu sein braucht. Diese Ausgestaltung ergibt den Vorteil, dass das Substrat an der Seite, an welcher sich auch die Halbleiterlichtquellen befinden, durch den Kühlkörper gekühlt wird, einen Wärmewiderstand durch das Substrat hindurch eliminiert und den Kühlkörper besonders effektiv thermisch an die Halbleiterlichtquellen anbindet. Die Partition wall between the driver board and the LED support needs to be provided. This refinement affords the advantage that the substrate on the side on which the semiconductor light sources are located is cooled by the heat sink, eliminates a thermal resistance through the substrate and binds the heat sink to the semiconductor light sources in a particularly effective manner. The
verbesserte Kühlanbindung ermöglicht auch eine Reduzierung von Material (z.B. Aluminium) in der Lampe und optimiert dadurch die Kosten. Die verbesserte Kühlanbindung mag zudem die Lebensdauer erhöhen, einen Einsatz von kostengünstigeren Komponenten ermöglichen und/oder einen Verzicht auf ein Improved cooling connection also enables reduction of material (e.g., aluminum) in the lamp, thereby optimizing costs. The improved cooling connection may also increase the service life, allow the use of less expensive components and / or waiving a
Pottingmaterial (siehe weiter unten) erleichtern. Jedoch mag, insbesondere bei einer nur geringen Leistung der mindestens einen Halbleiterlichtquelle, auch auf den Kühlkörper Facilitate potting material (see below). However, especially at a low power of the at least one semiconductor light source, also on the heat sink
verzichtet werden. Der Kühlkörper mag beispielsweise aus Keramik oder Metall bestehen, z.B. aus Aluminium. Es ist noch eine Ausgestaltung, dass der Kühlkörper be waived. The heat sink may for example consist of ceramic or metal, for example aluminum. It is still a design that the heat sink
mindestens eine Aussparung für die mindestens eine at least one recess for the at least one
Halbleiterlichtquelle aufweist, so dass das Licht der Semiconductor light source, so that the light of
Halbleiterlichtquelle (n) praktisch ungehindert durchtreten kann. Auch mag der Kühlkörper weitere Aussparungen aufweisen, z.B. für andere Bauteile, Lötpunkte und/oder zur Durchführung von Strukturkomponenten wie Standbeinen usw. Die Aussparungen ermöglichen allgemein eine direkte oder mit einem nur sehr geringen Spalt verbundene Auflage des Kühlkörpers und damit einen besonders geringen Wärmewiderstand. Semiconductor light source (s) can pass through virtually unhindered. Also, the heat sink may have further recesses, e.g. for other components, solder points and / or for the implementation of structural components such as legs etc. The recesses generally allow a direct or with a very small gap connected support of the heat sink and thus a particularly low thermal resistance.
Es ist eine weitere Ausgestaltung, dass der Kühlkörper ein schalenartiger Kühlkörper mit einem plattenförmigen Boden und einem davon angewinkelt abgehenden Seitenrand ist, wobei die mindestens eine Aussparung für die mindestens eine It is a further embodiment that the heat sink is a shell-like heat sink with a plate-shaped bottom and an edge thereof angled outgoing edge, wherein the at least one recess for the at least one
Halbleiterlichtquelle in dem Boden eingebracht ist. Ein solcher Kühlkörper lässt sich einfach herstellen.  Semiconductor light source is placed in the ground. Such a heat sink can be easily produced.
Es ist noch eine weitere Ausgestaltung, dass der Kühlkörper mittels einer adhäsiven Wärmeleitschicht an dem Substrat befestigt ist, insbesondere daran angeklebt ist. Dies It is yet another embodiment that the heat sink is attached to the substrate by means of an adhesive heat-conducting layer, in particular adhered thereto. This
ermöglicht eine feste Verbindung mit einem nur sehr geringen Wärmewiderstand. Die adhäsive Wärmeleitschicht mag z.B. eine TIM ("Thermal Interface Material ") -Folie sein. Die allows a firm connection with only a very low thermal resistance. The adhesive thermal conductive layer may e.g. a TIM ("Thermal Interface Material") film. The
Wärmeleitschicht mag auch aus einer Wärmeleitpaste bestehen. Wärmeleitschicht may also consist of a thermal paste.
Es ist eine Weiterbildung, dass der Kühlkörper über einen thermisch gut leitfähigen Gap-Filler an der Vorderseite des Substrats aufliegt. Dadurch mag auf Aussparungen in dem Boden verzichtet werden (z.B. für Lötpunkte), da sich durch den Gap-Filler ein höherer Abstand zwischen dem Kühlkörper und der Vorderseite des Substrat einstellen lässt. Der Gap-Filler weist eine erheblich höhere thermische Leitfähigkeit auf als übliche Substratmaterialien. Er mag z.B. aus Wärmeleitpaste bestehen. It is a development that the heat sink rests on a thermally good conductive gap filler on the front of the substrate. This may eliminate the need for recesses in the bottom (e.g., solder points) because the gap filler allows for a greater clearance between the heat sink and the front of the substrate. The gap filler has a significantly higher thermal conductivity than conventional substrate materials. He likes e.g. consist of thermal grease.
Es ist ferner eine Ausgestaltung, dass das Substrat in einem Gehäuse untergebracht ist. Dies ermöglicht eine Berührsicherheit und einen Schutz vor mechanischen und chemischen Beanspruchungen. It is also an embodiment that the substrate is housed in a housing. This allows a Touch resistance and protection against mechanical and chemical stress.
Das Substrat mag in dem Gehäuse kraftschlüssig (z.B. mittels einer Presspassung oder einer Klemmpassung) , formschlüssig und/oder Stoffschlüssig (z.B. mittels Klebstoffs) fixiert sein. Es mag z.B. auf innenseitig in dem Gehäuse vorhandenen Haltelaschen oder auf einer Stufe des Gehäuses aufliegen. Das Gehäuse besteht insbesondere aus einem elektrisch The substrate may be non-positively fixed (e.g., by means of a press fit or interference fit) in the housing, positively and / or materially (e.g. It may be e.g. rest on the inside of the housing existing retaining tabs or on a stage of the housing. The housing consists in particular of an electric
isolierenden Material, insbesondere Kunststoff. Das Gehäuse mag einteilig oder mehrteilig ausgebildet sein. insulating material, in particular plastic. The housing may be formed in one or more parts.
Das Gehäuse mag insbesondere einen rückwärtigen Sockelbereich aufweisen, welcher zusammen mit mindestens einem elektrischen Kontaktelement einen Sockel des Halbleiterlampe bilden kann. Der Sockel mag beispielsweise ein Edison-Sockel oder ein Bipin-Sockel sein. Es ist außerdem eine Ausgestaltung, dass das Gehäuse The housing may in particular have a rearward base region, which together with at least one electrical contact element can form a base of the semiconductor lamp. The socket may be, for example, an Edison socket or a bipin socket. It is also an embodiment that the housing
vorderseitig offen ist. Dies erlaubt einen Einsatz von front is open. This allows a use of
Komponenten der Halbleiterlampe. Zudem wird so eine Components of the semiconductor lamp. In addition, such a
Fügerichtung festgelegt, was eine Fertigungskomplexität auf einem geringen Niveau hält. Joining direction, which keeps a manufacturing complexity at a low level.
Es ist auch noch eine Ausgestaltung, dass der Seitenrand des Kühlkörpers flächig an einer Innenseite des Gehäuses It is also an embodiment that the side edge of the heat sink surface on an inner side of the housing
aufliegt. Die ermöglicht eine effektive Wärmeabfuhr auf und durch das Gehäuse als auch einen sicheren Sitz in dem rests. This allows effective heat dissipation on and through the housing as well as a secure fit in the
Gehäuse, z.B. in einer Klemmpassung. Dazu mag der Seitenrand insbesondere zwischen Haltelaschen und eine starre Housing, e.g. in a tight fit. In addition, the side edge especially likes between retaining tabs and a rigid
Gehäusewand eingesteckt, z.B. eingeklemmt, sein. Die Housing wall inserted, e.g. be trapped. The
Haltelaschen mögen oberseitig das Substrat tragen. Der Holding tabs may carry the substrate on the top. Of the
Seitenrand erstreckt sich insbesondere nach hinten. Er mag eine oder mehrere Unterbrechungen aufweisen, um eine Side edge extends in particular to the rear. He may have one or more breaks to one
elastische Verformbarkeit bereitstellen zu können. Es ist zudem eine Ausgestaltung, dass die Treiberschaltung in dem Gehäuse von Pottingmaterial umgeben ist. Dies verbessert eine Wärmeableitung auf das Gehäuse, da Pottingmaterial einen geringeren Wärmewiderstand aufweist als Luft. Zudem ist die Treiberschaltung (und ggf. davon ausgehende Leitungen, z.B. zum Sockel) so besonders geschützt, z.B. gegen mechanische Beanspruchungen. Das Pottingmaterial mag beispielsweise nach Einbringen des bestückten Substrats in das Gehäuse eingefüllt werden. Es wird vorzugsweise maximal bis auf eine Höhe des Substrats aufgefüllt, um die LED-Chips nicht zu schädigen oder abzudecken. To provide elastic deformability. It is also an embodiment that the driver circuit is surrounded in the housing by potting material. This improves heat dissipation to the housing since potting material has lower thermal resistance than air. In addition, the driver circuit (and possibly outgoing lines, eg to the base) is so specially protected, for example against mechanical stress. The potting material may be filled, for example, after the insertion of the loaded substrate into the housing. It is preferably filled to a maximum height of the substrate in order not to damage or cover the LED chips.
Es ist noch eine Ausgestaltung, dass das Substrat nur an einer Seite eine Leitungsstrukturierung aufweist und an der anderen Seite des Substrats befestigte Bauelemente mit der Leitungsstrukturierung über elektrisch leitfähige It is yet an embodiment that the substrate has a line structuring on only one side and components attached to the other side of the substrate with the line structuring via electrically conductive
Durchführungen durch das Substrat elektrisch verbunden sind. Ein solches Substrat ist besonders preiswert. Alternativ mag ein beidseitig mit einer Leitungsstruktur versehenes Substrat verwendet werden. Feedthroughs are electrically connected by the substrate. Such a substrate is particularly inexpensive. Alternatively, a substrate provided with a conductive structure on both sides may be used.
Die elektrisch leitfähige Durchführung mag eine eigenständige Durchführung sein, z.B. in Form mindestens einer The electrically conductive feedthrough may be a self-contained feedthrough, e.g. in the form of at least one
Durchkontaktierung oder mindestens eines Vias (Vertical Interconnect Access) . Eine leitfähige Durchführung mag zusätzlich oder alternativ als ein Anschlussstift eines für eine Durchsteckmontage (auch als ' through-hole technology', THT, oder 'pin-in-hole technology', PIH, bezeichnet) Through-connection or at least one vias (Vertical Interconnect Access). A conductive feedthrough may additionally or alternatively be referred to as a through-hole (also referred to as through-hole technology, THT, or pin-in-hole technology, PIH) pin.
ausgebildeten Bauelements, z.B. eines elektrischen oder elektronischen Bauelements der Treiberschaltung, ausgebildet sein. Die Bauelemente der Treiberschaltung mögen also formed component, e.g. an electrical or electronic component of the driver circuit may be formed. So the components of the driver circuit like
insbesondere THT-Bauelemente sein, deren Anschlussstifte oder Anschlussbeinchen beispielsweise durch das Substrat in particular THT components whose pins or connecting pins, for example, through the substrate
hindurchgeführt sind und an der Vorderseite elektrisch angeschlossen sind, z.B. dort verlötet sind. Alternativ oder zusätzlich mag beispielsweise mindestens ein Bauelement an der Rückseite mit einem Via elektrisch verbunden sein, z.B. ein SMD-Bauteil an einem Via angelötet sein. Es ist noch eine weitere Ausgestaltung, dass dem Kühlkörper mindestens ein optisches Element nachgeschaltet ist, welches rückwärtig vorspringende Standbeine oder Füße aufweist, die durch eine jeweilige Aussparung in dem Boden des Kühlkörpers bis zu dem Substrat reichen. Die Standbeine ermöglichen auf einfache Weise eine genaue Positionierung des optischen passed through and are electrically connected to the front, for example, are soldered there. Alternatively or additionally, for example, at least one component may be electrically connected to a via at the rear, for example an SMD component may be soldered to a via. It is yet another embodiment that the heat sink is followed by at least one optical element having rearwardly projecting legs or feet that extend through a respective recess in the bottom of the heat sink to the substrate. The legs allow a simple way of accurate positioning of the optical
Elements in Bezug auf die mindestens eine Elements in relation to the at least one
Halbleiterlichtquelle. Sie mögen z.B. als Abstandshalter dienen. Die Aussparungen mögen als Ausrichtungshilfen und als seitliche Führungen dienen.  Semiconductor light source. They may be e.g. serve as spacers. The recesses may serve as alignment aids and as lateral guides.
Es ist ferner eine Ausgestaltung, dass die Halbleiterlampe eine Retrofitlampe ist. Eine solche mag anstelle einer herkömmlichen Lampe ohne Halbleiterlichtquellen eingesetzt werden und weist daher insbesondere einen Sockel zum It is also an embodiment that the semiconductor lamp is a retrofit lamp. Such may be used instead of a conventional lamp without semiconductor light sources and therefore has in particular a base for
Anschluss an eine herkömmliche Fassung auf. Die Retrofitlampe mag z.B. eine Glühlampen-Retrofitlampe sein, z.B. mit einem Edisonsockel , z.B. vom Typ E14 oder E27. Sie mag auch eine Halogenlampen-Retrofitlampe sein, z.B. mit einem Bipin- Sockel, z.B. vom Typ GU, z.B. GU10 oder GU5.3. Connection to a conventional version. The retrofit lamp may e.g. an incandescent retrofit lamp, e.g. with an Edison base, e.g. Type E14 or E27. It may also be a halogen lamp retrofit lamp, e.g. with a biped base, e.g. of the type GU, e.g. GU10 or GU5.3.
Die oben beschriebenen Eigenschaften, Merkmale und Vorteile dieser Erfindung sowie die Art und Weise, wie diese erreicht werden, werden klarer und deutlicher verständlich im The above-described characteristics, features and advantages of this invention as well as the manner in which they are achieved will become clearer and more clearly understood
Zusammenhang mit der folgenden schematischen Beschreibung eines Ausführungsbeispiels, das im Zusammenhang mit den  In connection with the following schematic description of an embodiment that is related to the
Zeichnungen näher erläutert wird. Dabei können zur Drawings will be explained in more detail. It can to
Übersichtlichkeit gleiche oder gleichwirkende Elemente mit gleichen Bezugszeichen versehen sein. Clarity identical or equivalent elements must be provided with the same reference numerals.
Fig.l zeigt als Explosionsdarstellung in Schrägansicht eine Halbleiterlampe gemäß einem ersten Fig.l shows an exploded view in an oblique view of a semiconductor lamp according to a first
Ausführungsbeispiel ;  Embodiment;
Fig.2 zeigt als Explosionsdarstellung in Schrägansicht ausgewählte Teile der Halbleiterlampe gemäß dem ersten Ausführungsbeispiel; Fig.3 zeigt als teilweise Schnittdarstellung inFigure 2 shows an exploded view in an oblique view of selected parts of the semiconductor lamp according to the first embodiment; 3 shows as a partial sectional view in
Schrägansicht die zusammengebaute Halbleiterlampe gemäß dem ersten Ausführungsbeispiel; undAn oblique view of the assembled semiconductor lamp according to the first embodiment; and
Fig.4 zeigt als teilweise Schnittdarstellung in FIG. 4 shows a partial sectional view in FIG
Schrägansicht einen Ausschnitt aus der  An oblique view of a section of the
Halbleiterlampe gemäß dem ersten  Semiconductor lamp according to the first
Ausführungsbeispiel .  Embodiment.
Fig.l zeigt als Explosionsdarstellung in Schrägansicht eine Halbleiterlampe 1 in Form einer Halogen-Retrofitlampe . DieFig.l shows an exploded view in an oblique view of a semiconductor lamp 1 in the form of a halogen retrofit lamp. The
Halbleiterlampe 1 weist ein Gehäuse 2 mit einer becherartigen Grundform auf, das an seinem rückwärtigen Ende einen Semiconductor lamp 1 has a housing 2 with a cup-like basic shape, which at its rear end a
Sockelbereich 3 aufweist. Das Gehäuse 2 ist hier teilweise aufgeschnitten dargestellt. Die Halbleiterlampe 1 weist eine von hinten (dem Sockelbereich 3) nach vorne (einem Base area 3 has. The housing 2 is shown here partially cut away. The semiconductor lamp 1 has a front (the base area 3) forward (a
Lichtabstrahlbereich) verlaufende Längsachse A auf. Lichtabstrahlbereich) extending longitudinal axis A.
Der Sockelbereich 3 dient einer mechanischen Befestigung der Halbleiterlampe 1 in einer herkömmlichen Bipin-Fassung The base region 3 is used for mechanical attachment of the semiconductor lamp 1 in a conventional bipin socket
(o. Abb.), z.B. für Halogenlampen. Zur weiteren mechanischen Befestigung und zum elektrischen Anschluss der (not shown), e.g. for halogen lamps. For further mechanical fastening and electrical connection of the
Halbleiterlampe 1 stehen von einer rückwärtigen Stirnfläche des Sockelbereichs 3 zwei metallische Anschlussstifte 4 nach hinten vor, die zusammen mit dem Sockelbereich 3 einen Bipin- Sockel der Halbleiterlampe 1 bilden, beispielsweise vom Typ "GU", z.B. GU10. Semiconductor lamp 1 protrude from a rear end surface of the base portion 3, two metallic pins 4 backward, which together with the base portion 3 form a biped base of the semiconductor lamp 1, for example, of the type "GU", e.g. GU10.
Das Gehäuse 2 ist vorderseitig offen, wobei durch eine vordere Öffnung 5 ein Substrat 6 einsetzbar ist. Das Substrat 6 ist hier als ein kreisscheibenförmiges FR4- oder CEM-The housing 2 is open at the front, wherein a substrate 6 can be inserted through a front opening 5. The substrate 6 is here as a circular disk-shaped FR4 or CEM
Substrat ausgebildet, wie auch genauer in Fig.2 gezeigt. An einer Vorderseite 7 des Substrats 6 sind mehrere Substrate formed, as shown in more detail in Figure 2. At a front side 7 of the substrate 6 are more
Halbleiterlichtquellen in Form von LED-Chips 8 angeordnet. Die LED-Chips 8 sind über an der Vorderseite 7 vorhandene Kontaktfelder 9 miteinander verbunden. Die Kontaktfelder 9 bestehen aus metallischen Schichten, z.B. aus Kupfer, und bilden zusammen eine Leitungsstruktur. An einer Rückseite 10 des Substrats 6 sind Bauelemente 11 einer Treiberschaltung zum Ansteuern der LED-Chips 8 Semiconductor light sources arranged in the form of LED chips 8. The LED chips 8 are connected to one another via contact fields 9 present on the front side 7. The contact fields 9 consist of metallic layers, for example of copper, and together form a line structure. On a rear side 10 of the substrate 6 are components 11 of a driver circuit for driving the LED chips 8
befestigt. Das Substrat 6 ist also ein gemeinsames Substrat sowohl für die LED-Chips 8 als auch für die Bauelemente 11 der Treiberschaltung. Die Vorderseite 6 und die Rückseite 10 des Substrats 6 sind grundsätzlich voneinander elektrisch isoliert. Eine elektrische Verbindung der Bauelemente 11 der Treiberschaltung und der LED-Chips 8 wird durch mindestens eine elektrisch leitfähige Durchführung (o. Abb.) zwischen der Vorderseite 6 und der Rückseite 10 des Substrats 6 erreicht . attached. The substrate 6 is therefore a common substrate both for the LED chips 8 and for the components 11 of the driver circuit. The front 6 and the back 10 of the substrate 6 are basically electrically isolated from each other. An electrical connection of the components 11 of the driver circuit and the LED chips 8 is achieved by at least one electrically conductive passage (not shown) between the front 6 and the back 10 of the substrate 6.
Es ist eine Variante, dass das Substrat 6 beidseitig mit einer jeweiligen Leitungsstruktur versehen ist, welche jeweils ein oder mehrere Leiterbahnen und/oder Kontaktfelder aufweisen mag. Die Leitungsstruktur weist hier vier It is a variant that the substrate 6 is provided on both sides with a respective line structure, which may each have one or more conductor tracks and / or contact pads. The line structure here has four
Kontaktfelder 9 auf, welche die räumlich ringförmig Contact fields 9 on which the spatially annular
angeordneten LED-Chips 8 elektrisch in Reihe verschalten. Es ist eine besonders preisgünstige Variante, dass das Substrat 6 nur einseitig, z.B. hier an der Vorderseite 7, mit einer jeweiligen Leitungsstruktur versehen ist. Ein elektrischer Anschluss der Bauelemente 11 der Rückseite 10 mag dann z.B. mittels der leitfähigen Durchführung (en) mit der arranged LED chips 8 interconnect electrically in series. It is a particularly inexpensive variant that the substrate 6 only one-sided, e.g. here at the front 7, is provided with a respective line structure. An electrical connection of the components 11 of the back 10 may then be e.g. by means of the conductive bushing (s) with the
Leitungsstruktur der Vorderseite 7 umgesetzt sein. Dies mag z.B. dadurch geschehen, dass die Bauelemente 11 als für die Durchsteckmontage eingerichtete Bauelemente sind, Line structure of the front 7 to be implemented. This may be e.g. be done by the fact that the components 11 are configured as through-hole components,
beispielsweise indem sie durch das Substrat 6 geführte for example, by passing through the substrate 6
Anschlussstifte (o. Abb.) aufweisen. An der Vorderseite 7 des Substrats 6 liegt ein Kühlkörper 12 mit einer schalenartigen Grundform flächig auf, der genauer in Fig.2 gezeigt ist. Der Kühlkörper 12 weist einen Have pins (not shown). On the front side 7 of the substrate 6 is a heat sink 12 with a shell-like basic shape surface, which is shown in more detail in Figure 2. The heat sink 12 has a
plattenförmigen Boden 13 und einen davon randseitig nach hinten abgehenden, mehrfach durchbrochenen Seitenrand 14 auf. Der Boden 13 weist Aussparungen 15 für die LED-Chips 8 sowie weitere Aussparungen 16 z.B. für durch leitfähige plate-shaped bottom 13 and one of these edge-outgoing to the rear, multiply perforated side edge 14. The bottom 13 has recesses 15 for the LED chips 8 and further recesses 16, e.g. for by conductive
Durchführungen erzeugte Vorsprünge an der Vorderseite 7 des Substrats 6 auf. Zudem sind in dem Boden 13 Aussparungen 23 für Standbeine 22 vorhanden, wie weiter unten näher ausgeführt wird. Feedthroughs produced projections on the front side 7 of the substrate 6. In addition, 13 recesses 23 in the bottom for legs 22 available, as will be explained in more detail below.
Der Kühlkörper 12 ist mittels einer adhäsiven The heat sink 12 is by means of an adhesive
Wärmeleitschicht 17 an dem Substrat 6 angeklebt. Dadurch wird eine starke Befestigung bei gleichzeitig geringem Heat conducting layer 17 adhered to the substrate 6. This is a strong attachment at the same time low
Wärmewiderstand ermöglicht. Die Wärmeleitschicht 17 weist zu den Aussparungen 15, 16 und 23 des Bodens 13 analoge Löcher oder Aussparungen 15a, 16a bzw. 23a auf, wie auch genauer in Fig.2 gezeigt. Die Wärmeleitschicht 17 mag z.B. als Thermal resistance allows. The heat-conducting layer 17 has analogous holes or recesses 15a, 16a or 23a to the recesses 15, 16 and 23 of the bottom 13, as shown in more detail in FIG. The heat conducting layer 17 may be e.g. when
Wärmeleitfolie vorliegen. Alternativ zu einem TIM-Material mag auch ein sog. "Gap Filier" verwendet werden, z.B. ein sog. "Gap-Pad", so dass auf Aussparungen 16a für durch leitfähige Durchführungen erzeugte Vorsprünge verzichtet werden kann, ohne einen Wärmewiderstand zu sehr zu erhöhen.  Wärmeleitfolie present. Alternatively to a TIM material, a so-called gap filing may also be used, e.g. a so-called "gap pad", so that it is possible to dispense with recesses 16a for projections produced by conductive feedthroughs without too much increasing a thermal resistance.
Um eine mechanische und thermische Anbindung der BauelementeTo a mechanical and thermal connection of the components
11 mit dem Gehäuse 2 zu verbessern, ist das Gehäuse 2 bis zum Substrat 6 mit einem Pottingmaterial 20 verfüllt, welches also die Bauelemente 11 umgibt. 11 to improve the housing 2, the housing 2 is filled to the substrate 6 with a potting material 20, which thus surrounds the components 11.
Der Kühlkörper 12 ist vorderseitig von einem optischen The heat sink 12 is front of an optical
Element in Form eines Linsenelements 21 überdeckt. Das Element in the form of a lens element 21 covered. The
Linsenelement 21 ist eine gemeinsame Optik für die LED-Chips 8 und weist rückseitig mehrere (hier: drei) vorspringendeLens element 21 is a common optic for the LED chips 8 and has a plurality of rear sides (here: three)
Auflagebereiche in Form stiftförmiger Füße oder Standbeine 22 auf, wie auch genauer in Fig.2 gezeigt. Die Standbeine 22 führen durch Aussparungen 23 in dem Boden 13 des KühlkörpersSupport areas in the form of pin-shaped feet or legs 22, as shown in more detail in Figure 2. The legs 22 pass through recesses 23 in the bottom 13 of the heat sink
12 und analoge Aussparungen 23a in der Wärmeleitschicht 17. Sie kontaktieren die Vorderseite 7 des Substrats 6 und wirken so als Positionierungshilfe, insbesondere als Abstandshalter. 12 and analog recesses 23a in the heat conducting layer 17. They contact the front side 7 of the substrate 6 and thus act as a positioning aid, in particular as a spacer.
Das Linsenelement 21 wird mittels eines Halterings 24 in eine rückwärtige Richtung gedrückt, so dass es sich nicht von dem Substrat 6 löst. Der Haltering 24 ist dazu vor dem The lens element 21 is pressed by means of a retaining ring 24 in a rearward direction, so that it does not detach from the substrate 6. The retaining ring 24 is in front of the
Linsenelement 21 angeordnet und mit einer Innenseite des Gehäuses 2 über Rasthaken 25 verrastbar. Fig.3 zeigt die zusammengebaute Halbleiterlampe 1 mit einem seitlich aufgeschnittenen Gehäuse 2. Fig.4 zeigt die Lens element 21 is arranged and latched to an inner side of the housing 2 via latching hooks 25. 3 shows the assembled semiconductor lamp 1 with a laterally cut housing 2. Fig.4 shows the
zusammengebaute Halbleiterlampe 1 als Schnittdarstellung durch einen vorderen Bereich auf Höhe des Substrats 6. Das Pottingmaterial 20 ist in diesen beiden Figuren nicht eingezeichnet . assembled semiconductor lamp 1 as a sectional view through a front region at the level of the substrate 6. The potting material 20 is not shown in these two figures.
Der Seitenrand 14 des Kühlkörpers 12 liegt mit seiner The side edge 14 of the heat sink 12 is located with his
Außenseite flächig an dem Gehäuse 2 an und ermöglicht so eine effektive Wärmeübertragung auf das Gehäuse 2. Zudem mag der Kühlkörper 12 so klemmend in dem Gehäuse 2 gehalten werden. Outside surface on the housing 2 and thus enables effective heat transfer to the housing 2. In addition, the heat sink 12 may be so clamped in the housing 2 are held.
Das Substrat 6 liegt mit einem Randbereich seiner Rückseite 10 auf Haltelaschen 26 auf, die von einer Innenseite des Gehäuses 2 nach vorne vorstehen. The substrate 6 rests with an edge region of its rear side 10 on retaining tabs 26, which protrude from an inner side of the housing 2 to the front.
Der Haltering 24 schließt vorderseitig praktisch The retaining ring 24 closes the front practically
flächenbündig mit dem Gehäuse 2 ab. Das Linsenelement 21 weist oberhalb jedes LED-Chips 8 einen rückwärtig vorspringenden, linsenartigen Lichtsammelbereich 27 auf. Der Lichtsammelbereich 27 mag beispielsweise über einem jeweiligen LED-Chip 8 einen Rücksprung mit einem konvex ausgebildeten Boden aufweist. Dadurch wird praktisch das ganze von einem LED-Chip 8 abgestrahlte Licht aufgefangen und in dem Linsenelement 21 breitflächig nach vorne geleitet. An seiner grundsätzlich planen Vorderseite weist das flush with the housing 2 from. The lens element 21 has above each LED chip 8 on a rearwardly projecting lens-like light-collecting region 27. The light-collecting region 27 may, for example, have a return with a convex bottom over a respective LED chip 8. As a result, virtually all of the light emitted by an LED chip 8 is collected and guided in the lens element 21 over a wide area to the front. At its basically plan front side that points
Linsenelement 21 ein Feld 28 von Mikrolinsen auf, welche die Lichtabstrahlung weiter vergleichmäßigen. Die Mikrolinsen mögen insbesondere konvex geformt sein, z.B. sphärisch, asphärisch oder kissenförmig . Lens element 21 on a field 28 of microlenses, which further equalize the light emission. The microlenses may in particular be convex, e.g. spherical, aspherical or pillow-shaped.
Diese Halbleiterlampe 1 weist nur eine Fügerichtung auf, was die Fertigungskomplexität der gesamten Plattform auf einem geringen Niveau hält. This semiconductor lamp 1 has only one joining direction, which keeps the manufacturing complexity of the entire platform at a low level.
Bei einem Betrieb der Halbleiterlampe 1 wird über die In an operation of the semiconductor lamp 1 is over the
elektrischen Anschlussstifte 4 die Treiberschaltung mit den Treiberbauteilen 11 mit einem elektrischen Versorgungssignal (z.B. einer Netzspannung) versorgt. Die Treiberschaltung wandelt das elektrische Versorgungssignal in eine zum Betrieb der in Reihe geschalteten LED-Chips 8 geeignetes elektrisches Betriebssignal um. Dieses mag z.B. getaktet sein und/oder in Bezug auf seine Stromhöhe einstellbar sein. Das electrical connection pins 4, the driver circuit with the Driver components 11 with an electrical supply signal (eg a mains voltage) supplied. The driver circuit converts the electrical supply signal into an electrical operating signal suitable for operating the series-connected LED chips 8. This may for example be clocked and / or be adjustable in terms of its current level. The
Betriebssignal mag einen gedimmten Betrieb der LED-Chips 8 erlauben. Das zumindest einige der Anschlussstifte der Operating signal may allow a dimmed operation of the LED chips 8. The at least some of the pins of the
Treiberbauteile 11 der Treiberschaltung durch das Substrat 6 hindurchgeführt sind und mit den dortigen Kontaktfeldern 9 elektrisch verbunden sind, kann das Betriebssignal ohne weiteres in die LED-Chips 8 eingespeist werden. Das daraufhin von den LED-Chips 8 abgegebene Licht läuft durch die Driver components 11 of the driver circuit are passed through the substrate 6 and are electrically connected to the local contact pads 9, the operating signal can be readily fed into the LED chips 8. The light then emitted by the LED chips 8 passes through the
Aussparungen 15 des Bodens 13 des Kühlkörpers 12 und in jeweilige Lichtsammelbereiche 27 des Linsenelements 21. Das rückwärtig in das Linsenelement 21 eingekoppelte Licht wird folgend an der Vorderseite durch das Feld 28 der Mikrolinsen von der Halbleiterlampe 1 abgestrahlt. Von den LED-Chips 8 erzeugte Abwärme wird auf den Boden 13 des Kühlkörpers 12 übertragen und folgend vor allem von dessen Seitenwand 14 auf das Gehäuse 2 und durch das Gehäuse 2 nach außen abgegeben. Recesses 15 of the bottom 13 of the heat sink 12 and into respective light-collecting regions 27 of the lens element 21. The light injected back into the lens element 21 is emitted from the semiconductor lamp 1 through the field 28 of the microlenses following at the front. Waste heat generated by the LED chips 8 is transferred to the bottom 13 of the heat sink 12 and, in the following, emitted mainly from the side wall 14 of the housing 2 and through the housing 2 to the outside.
Obwohl die Erfindung im Detail durch das gezeigte Although the invention in detail by the shown
Ausführungsbeispiel näher illustriert und beschrieben wurde, so ist die Erfindung nicht darauf eingeschränkt und andere Variationen können vom Fachmann hieraus abgeleitet werden, ohne den Schutzumfang der Erfindung zu verlassen. The exemplary embodiment has been illustrated and described in more detail, the invention is not limited thereto and other variations can be derived by the person skilled in the art without departing from the scope of the invention.
Allgemein kann unter "ein", "eine" usw. eine Einzahl oder eine Mehrzahl verstanden werden, insbesondere im Sinne von "mindestens ein" oder "ein oder mehrere" usw., solange dies nicht explizit ausgeschlossen ist, z.B. durch den Ausdruck "genau ein" usw. Auch kann eine Zahlenangabe genau die angegebene Zahl als auch einen üblichen Toleranzbereich umfassen, solange dies nicht explizit ausgeschlossen ist. . c Generally, "on", "an", etc. may be taken to mean a singular or a plurality, in particular in the sense of "at least one" or "one or more", etc., as long as this is not explicitly excluded, eg by the expression "exactly a ", etc. Also, a number can include exactly the specified number as well as a usual tolerance range, as long as this is not explicitly excluded. , c
Bezugszeichen reference numeral
1 Halbleiterlampe 1 semiconductor lamp
2 Gehäuse  2 housings
3 Sockelbereich  3 base area
4 Anschlussstift  4 pin
5 Vordere Öffnung  5 Front opening
6 Substrat  6 substrate
7 Vorderseite  7 front side
8 LED-Chip  8 LED chip
9 Kontaktfeld  9 contact field
10 Rückseite  10 back side
11 Bauelement  11 component
12 Kühlkörper  12 heat sinks
13 Boden  13 floor
14 Seitenrand  14 page margin
15 Aussparung  15 recess
15a Aussparung  15a recess
16 Aussparung  16 recess
16a Aussparung  16a recess
17 WärmeleitSchicht  17 thermal conductivity layer
20 Pottingmaterial  20 potting material
21 Linsenelement  21 lens element
22 Standbein  22 pillar
23 Aussparung  23 recess
23a Aussparung  23a recess
24 Haltering  24 retaining ring
25 Rasthaken  25 snap hooks
26 Haltelasche  26 holding tab
27 Lichtsammelbereich  27 Light collecting area
28 Feld von Mikrolinsen  28 field of microlenses
A Längsachse  A longitudinal axis

Claims

Halbleiterlampe (1), aufweisend  Semiconductor lamp (1) comprising
- mindestens eine an einer Vorderseite (7) eines  - At least one on a front side (7) of a
Substrats (6) angeordnete Halbleiterlichtquelle (8) und  Substrate (6) arranged semiconductor light source (8) and
- eine Treiberschaltung (11) zum Ansteuern der  - A driver circuit (11) for driving the
mindestens einen Halbleiterlichtquelle (8),  at least one semiconductor light source (8),
wobei  in which
- zumindest ein Teil der Treiberschaltung (11) an einer der mindestens einen Halbleiterlichtquelle (8) abgewandten Rückseite (10) des Substrats (6) befestigt ist.  - At least a portion of the driver circuit (11) on one of the at least one semiconductor light source (8) facing away from back (10) of the substrate (6) is fixed.
Halbleiterlampe (1) nach Anspruch 1, wobei ein A semiconductor lamp (1) according to claim 1, wherein a
Kühlkörper (12) an der Vorderseite (7) des Substrats (6) flächig aufliegt.  Heatsink (12) on the front side (7) of the substrate (6) rests flat.
Halbleiterlampe (1) nach Anspruch 2, wobei der A semiconductor lamp (1) according to claim 2, wherein said
Kühlkörper (12) mindestens eine Aussparung (15) für die mindestens eine Halbleiterlichtquelle (8) aufweist.  Heatsink (12) has at least one recess (15) for the at least one semiconductor light source (8).
Halbleiterlampe (1) nach einem der Ansprüche 2 bis 3, wobei der Kühlkörper (12) ein schalenartiger Kühlkörper (12) mit einem plattenförmigen Boden (13) und einem davon angewinkelt abgehenden Seitenrand (14) ist, wobei die mindestens eine Aussparung (15) für die mindestens eine Halbleiterlichtquelle (8) in dem Boden (13) Semiconductor lamp (1) according to one of claims 2 to 3, wherein the heat sink (12) is a shell-like heat sink (12) having a plate-shaped bottom (13) and an angle of the outgoing side edge (14), wherein the at least one recess (15). for the at least one semiconductor light source (8) in the bottom (13)
eingebracht ist.  is introduced.
Halbleiterlampe (1) nach einem der Ansprüche 2 bis 4, wobei der Kühlkörper (12) mittels einer adhäsiven Semiconductor lamp (1) according to one of claims 2 to 4, wherein the heat sink (12) by means of an adhesive
Wärmeleitschicht (17) an dem Substrat (6) befestigt ist 6. Halbleiterlampe (1) nach einem der vorhergehenden  Heat conducting layer (17) is attached to the substrate (6) 6. Semiconductor lamp (1) according to one of the preceding
Ansprüche, wobei das Substrat (6) in einem Gehäuse untergebracht ist. Halbleiterlampe (1) nach Anspruch 6, wobei das Gehäuse (2) einen rückwärtigen Sockelbereich (3) aufweist und vorderseitig offen ist. Claims, wherein the substrate (6) is housed in a housing. A semiconductor lamp (1) according to claim 6, wherein the housing (2) has a rear socket portion (3) and is open on the front side.
Halbleiterlampe (1) nach einem der Ansprüche 4 bis 5 in Kombination mit einem der Ansprüche 6 oder 7, wobei der Seitenrand (14) des Kühlkörpers (12) flächig an einer Innenseite des Gehäuses (2) aufliegt. Semiconductor lamp (1) according to one of claims 4 to 5 in combination with one of claims 6 or 7, wherein the side edge (14) of the heat sink (12) rests flat against an inner side of the housing (2).
Halbleiterlampe (1) nach einem der Ansprüche 6 bis 8, wobei die Treiberschaltung (11) in dem Gehäuse (2) von Pottingmaterial (20) umgeben ist. A semiconductor lamp (1) according to any one of claims 6 to 8, wherein the drive circuit (11) in the housing (2) is surrounded by potting material (20).
Halbleiterlampe (1) nach einem der vorhergehenden Semiconductor lamp (1) according to one of the preceding
Ansprüche, wobei das Substrat nur an einer Seite (7) eine Leitungsstrukturierung (9) aufweist und an der anderen Seite (10) des Substrats (6) befestigte Claims, wherein the substrate has a line structure (9) on only one side (7) and fixed on the other side (10) of the substrate (6)
Bauelemente (11) mit der Leitungsstrukturierung (9) über elektrisch leitfähige Durchführungen durch das Substrat (6) elektrisch verbunden sind. Components (11) with the line structuring (9) via electrically conductive passages through the substrate (6) are electrically connected.
Halbleiterlampe (1) nach einem der Ansprüche 4 bis 10, wobei dem Kühlkörper (12) mindestens ein optisches Element (21) nachgeschaltet ist, welches rückwärtig vorspringende Standbeine (22) aufweist, die durch eine jeweilige Aussparung (23) in dem Boden (13) des Semiconductor lamp (1) according to one of claims 4 to 10, wherein the heat sink (12) is followed by at least one optical element (21) having rearwardly projecting legs (22) through a respective recess (23) in the bottom (13 ) of
Kühlkörpers (12) bis zu dem Substrat (6) reichen. Heatsink (12) to the substrate (6) range.
Halbleiterlampe (1) nach einem der vorhergehenden Semiconductor lamp (1) according to one of the preceding
Ansprüche, wobei die Halbleiterlampe (1) eine Claims, wherein the semiconductor lamp (1) a
Retrofitlampe ist. Retrofit lamp is.
EP15721647.4A 2014-07-09 2015-04-29 Semiconductor lamp Active EP3167224B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014213388.2A DE102014213388A1 (en) 2014-07-09 2014-07-09 Semiconductor lamp
PCT/EP2015/059410 WO2016005069A1 (en) 2014-07-09 2015-04-29 Semiconductor lamp

Publications (2)

Publication Number Publication Date
EP3167224A1 true EP3167224A1 (en) 2017-05-17
EP3167224B1 EP3167224B1 (en) 2018-07-25

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EP15721647.4A Active EP3167224B1 (en) 2014-07-09 2015-04-29 Semiconductor lamp

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US (1) US10197223B2 (en)
EP (1) EP3167224B1 (en)
KR (1) KR101920480B1 (en)
CN (1) CN106537024B (en)
DE (1) DE102014213388A1 (en)
WO (1) WO2016005069A1 (en)

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DE102014213388A1 (en) 2016-01-14
KR101920480B1 (en) 2018-11-21
US10197223B2 (en) 2019-02-05
CN106537024B (en) 2019-09-13
US20170146199A1 (en) 2017-05-25
WO2016005069A1 (en) 2016-01-14
CN106537024A (en) 2017-03-22
EP3167224B1 (en) 2018-07-25
KR20170037603A (en) 2017-04-04

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