EP3155871A1 - Planar heating element with a ptc resistance structure - Google Patents
Planar heating element with a ptc resistance structureInfo
- Publication number
- EP3155871A1 EP3155871A1 EP15728852.3A EP15728852A EP3155871A1 EP 3155871 A1 EP3155871 A1 EP 3155871A1 EP 15728852 A EP15728852 A EP 15728852A EP 3155871 A1 EP3155871 A1 EP 3155871A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- heating element
- element according
- conductor track
- resistor structure
- ptc resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 123
- 239000004020 conductor Substances 0.000 claims abstract description 93
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 238000009826 distribution Methods 0.000 claims abstract description 13
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 23
- 229910052697 platinum Inorganic materials 0.000 claims description 20
- 239000010931 gold Substances 0.000 claims description 15
- 238000002161 passivation Methods 0.000 claims description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 11
- 229910052737 gold Inorganic materials 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 10
- 239000004332 silver Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 229910000510 noble metal Inorganic materials 0.000 claims description 6
- 238000011156 evaluation Methods 0.000 claims description 5
- 239000010408 film Substances 0.000 claims description 5
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 3
- 239000010970 precious metal Substances 0.000 claims description 2
- 229910000923 precious metal alloy Inorganic materials 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 5
- 229910001928 zirconium oxide Inorganic materials 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000009529 body temperature measurement Methods 0.000 description 3
- 239000012876 carrier material Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000003716 rejuvenation Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/0014—Devices wherein the heating current flows through particular resistances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/007—Heaters using a particular layout for the resistive material or resistive elements using multiple electrically connected resistive elements or resistive zones
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/016—Heaters using particular connecting means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/02—Heaters using heating elements having a positive temperature coefficient
Definitions
- Room temperature without applied heating voltage preferably less than 3 ohms.
- the inner conductor track and the outer conductor track run substantially parallel in the middle partial area.
- the inner conductor track and the outer conductor track are also substantially parallel in the second end-side subarea.
- the inner conductor track and the outer conductor track are each connected to each of the two electrical connection contacts.
- the two interconnects in the first end-side subarea preferably have a V shape. If there are no sudden changes in the geometry of the PTC resistor structure, then a high level can be achieved in the defined surface area
- Thermal conductivity is less than 5 watts / m K.
- the thermal conductivity is less than 3 watts / m K.
- the temperature drops very quickly due to the high temperature gradient.
- the shape of the carrier substrate is adapted to the shape of the PTC resistor structure.
- the carrier material is therefore designed in the second end-side portion V-shaped or rectangular. If the second end-side sub-area forms a V-shape - that is, if it has a tip -, then the heating element can be inserted into a medium to be heated.
- the heating element according to the invention at least one substantially electrically insulating separating layer is provided on or in the carrier substrate, which is preferably made of glass.
- the carrier substrate is preferably made of zirconium oxide. Zirconia has - as also previously described - properties that predestine it for use in the heating element according to the invention. However, zirconia has the disadvantage that it becomes conductive at temperatures above 200 ° C. The application of a release layer prevents the occurrence of conductivity. Further details of this known solution can be found in EP 1 801 548 A2.
- the carrier substrate is assigned at least one passivation layer, which is preferably applied to the surface of the carrier substrate.
- connection contacts a defined overlap.
- the overlap ensures a secure electrical contact.
- the first end portion of the PTC resistor structure is designed with respect to its geometric parameters so that the physical heating properties of the PTC resistor structure at least are approximately unchanged.
- the adaptation preferably takes place by changes in the filling density or the line width of the conductor tracks or the connecting lines in the vicinity of the respective overlap.
- the overlap between the connecting lines and the conductor tracks in the first end-side portion of the PTC resistor structure is preferably V-shaped or linear; However, it can also be designed web-shaped. Below are some preferred dimensions for the individual
- Voltage source with a few volts, e.g. 3 volts, is sufficient to operate the heating element.
- Heating element specified in thick film technology It goes without saying that also other dimensions and materials for a technically qualified
- Temperature corresponds substantially to the prevailing ambient temperature) than in the region of the overlap of connecting lines and printed conductors (hot zone or heating zone: the temperature corresponds to the temperature in the defined range of the PTC resistor structure, ie the temperature of the heating zone), the properties of the PTC resistor structure less influenced.
- the invention relates to a heating arrangement, which uses the PTC resistor structure described above in a suitable, but arbitrary embodiment.
- an electrical power supply which supplies the PTC resistor structure with energy
- a control / evaluation unit the PTC resistor structure to a
- FIG. 2 shows a schematic partial view of the heating element according to the invention, which shows a first embodiment of the overlap between a connecting line and the conductor tracks,
- FIG. 3 shows a schematic partial view of the heating element according to the invention, showing a second embodiment of the overlap between a connecting line and the conductor tracks
- FIG. 4 shows a schematic partial view of the heating element according to the invention, showing a third embodiment of the overlap between a connecting line and shows the tracks
- the cold zone that is to say the area where substantially room temperature prevails, lies in the area of the connection contacts 6.
- the transition area lying between the heating zone and the cold zone, as well as in the outside area of the defined area lies in the transition area lying between the heating zone and the cold zone, as well as in the outside area of the defined area
- Carrier substrate 5 with low thermal conductivity is Carrier substrate 5 with low thermal conductivity. Further information can be found in the previous description.
- Sensitivity of the planar heating element at room temperature without applying the heating voltage is 3700ppm / K (+ - 100ppm / K). It goes without saying that the stated thicknesses of the individual layers are exemplary. Each of the explicitly mentioned values of the preferred embodiment may be arbitrarily varied up or down. How the sizing is designed in detail is at the discretion of the skilled person.
- FIGS. 2, 3, 4 schematically show partial views of FIG
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102014108356.3A DE102014108356A1 (en) | 2014-06-13 | 2014-06-13 | Planar heating element with a PTC resistor structure |
PCT/EP2015/063165 WO2015189388A1 (en) | 2014-06-13 | 2015-06-12 | Planar heating element with a ptc resistance structure |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3155871A1 true EP3155871A1 (en) | 2017-04-19 |
EP3155871B1 EP3155871B1 (en) | 2022-04-20 |
Family
ID=53396498
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP15728852.3A Active EP3155871B1 (en) | 2014-06-13 | 2015-06-12 | Planar heating element with a structure of ptc resistance |
Country Status (7)
Country | Link |
---|---|
US (2) | US10694585B2 (en) |
EP (1) | EP3155871B1 (en) |
JP (1) | JP6482654B2 (en) |
CN (1) | CN106465481B (en) |
DE (1) | DE102014108356A1 (en) |
RU (1) | RU2668087C2 (en) |
WO (1) | WO2015189388A1 (en) |
Families Citing this family (30)
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DE102014108356A1 (en) | 2014-06-13 | 2015-12-17 | Innovative Sensor Technology Ist Ag | Planar heating element with a PTC resistor structure |
JP6796358B2 (en) * | 2015-08-21 | 2020-12-09 | 日本碍子株式会社 | Ceramic heater, sensor element and gas sensor |
JP6674211B2 (en) * | 2015-08-21 | 2020-04-01 | 日本碍子株式会社 | Ceramic heater, sensor element and gas sensor |
CN106686773B (en) * | 2016-01-06 | 2019-09-10 | 黄伟聪 | A kind of thick film heating element of two-sided high thermal conductivity ability |
DE102016113815A1 (en) * | 2016-07-27 | 2018-02-01 | Heraeus Noblelight Gmbh | Infrared surface radiator and method for producing the infrared surface radiator |
DE102016118137A1 (en) | 2016-09-26 | 2018-03-29 | Heraeus Noblelight Gmbh | Infrared Panel Heaters |
JP7016642B2 (en) * | 2016-10-11 | 2022-02-07 | ローム株式会社 | Manufacturing method of thermal print head and thermal print head |
DE102016120536A1 (en) * | 2016-10-27 | 2018-05-03 | Heraeus Noblelight Gmbh | infrared Heaters |
KR20180124739A (en) | 2017-05-11 | 2018-11-21 | 주식회사 케이티앤지 | An aerosol generating device for controlling the temperature of a heater according to the type of cigarette and method thereof |
CA3063034C (en) | 2017-05-11 | 2021-04-13 | Kt&G Corporation | Vaporizer and aerosol generation device including same |
KR20190049391A (en) | 2017-10-30 | 2019-05-09 | 주식회사 케이티앤지 | Aerosol generating apparatus having heater |
KR102138245B1 (en) | 2017-10-30 | 2020-07-28 | 주식회사 케이티앤지 | Aerosol generating apparatus |
KR102057215B1 (en) | 2017-10-30 | 2019-12-18 | 주식회사 케이티앤지 | Method and apparatus for generating aerosols |
PT3750418T (en) | 2017-10-30 | 2024-03-19 | Kt & G Corp | Aerosol generating device and method for controlling same |
EP3704970A4 (en) | 2017-10-30 | 2021-09-01 | KT&G Corporation | Aerosol generating device |
CN111050579B (en) | 2017-10-30 | 2023-03-17 | 韩国烟草人参公社 | Aerosol generating device |
WO2019088587A2 (en) | 2017-10-30 | 2019-05-09 | 주식회사 케이티앤지 | Aerosol generation device and heater for aerosol generation device |
KR102180421B1 (en) | 2017-10-30 | 2020-11-18 | 주식회사 케이티앤지 | Apparatus for generating aerosols |
CN111182802A (en) | 2017-10-30 | 2020-05-19 | 韩国烟草人参公社 | Optical module and aerosol-generating device comprising the same |
KR102057216B1 (en) | 2017-10-30 | 2019-12-18 | 주식회사 케이티앤지 | An apparatus for generating aerosols and A heater assembly therein |
KR102138246B1 (en) | 2017-10-30 | 2020-07-28 | 주식회사 케이티앤지 | Vaporizer and aerosol generating apparatus comprising the same |
CN108851245A (en) * | 2018-08-02 | 2018-11-23 | 东莞市东思电子技术有限公司 | A kind of heating of built-in thermometric PTC is not burnt low temperature cigarette heater element and preparation method thereof |
LU100929B1 (en) * | 2018-09-17 | 2020-03-17 | Iee Sa | Robust Printed Heater Connections for Automotive Applications |
KR20200093718A (en) | 2019-01-28 | 2020-08-06 | 삼성디스플레이 주식회사 | Organic light emitting diode display device and method of manufacturing organic light emitting diode display device |
DE102019112238A1 (en) * | 2019-05-10 | 2020-11-12 | HELLA GmbH & Co. KGaA | Method for checking the coating of an electronic component |
WO2021177061A1 (en) * | 2020-03-03 | 2021-09-10 | 株式会社大真空 | Thin-film heater, method of producing thin-film heater, and thermostatic oven piezoelectric oscillator |
CN111657556A (en) * | 2020-05-15 | 2020-09-15 | 深圳麦克韦尔科技有限公司 | Heating assembly and heating atomization device |
DE102020134440A1 (en) | 2020-12-21 | 2022-06-23 | Innovative Sensor Technology Ist Ag | Heating element for electronic cigarette and electronic cigarette for detecting physical property of tobacco aerosol and/or user's health condition |
US11543604B2 (en) * | 2021-04-06 | 2023-01-03 | Globalfoundries U.S. Inc. | On-chip heater with a heating element that locally generates different amounts of heat and methods |
JP2023117633A (en) * | 2022-02-14 | 2023-08-24 | 東京コスモス電機株式会社 | planar heating element |
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US4970376A (en) * | 1987-12-22 | 1990-11-13 | Gte Products Corporation | Glass transparent heater |
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DE102014108356A1 (en) | 2014-06-13 | 2015-12-17 | Innovative Sensor Technology Ist Ag | Planar heating element with a PTC resistor structure |
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-
2014
- 2014-06-13 DE DE102014108356.3A patent/DE102014108356A1/en not_active Ceased
-
2015
- 2015-06-12 RU RU2017100894A patent/RU2668087C2/en active
- 2015-06-12 CN CN201580031598.3A patent/CN106465481B/en active Active
- 2015-06-12 WO PCT/EP2015/063165 patent/WO2015189388A1/en active Application Filing
- 2015-06-12 EP EP15728852.3A patent/EP3155871B1/en active Active
- 2015-06-12 US US15/316,583 patent/US10694585B2/en active Active
- 2015-06-12 JP JP2017517414A patent/JP6482654B2/en active Active
-
2020
- 2020-06-09 US US16/897,025 patent/US11382182B2/en active Active
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US4970376A (en) * | 1987-12-22 | 1990-11-13 | Gte Products Corporation | Glass transparent heater |
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Non-Patent Citations (1)
Title |
---|
See also references of WO2015189388A1 * |
Also Published As
Publication number | Publication date |
---|---|
JP6482654B2 (en) | 2019-03-13 |
CN106465481B (en) | 2022-03-11 |
CN106465481A (en) | 2017-02-22 |
US11382182B2 (en) | 2022-07-05 |
JP2017525122A (en) | 2017-08-31 |
US20180152989A1 (en) | 2018-05-31 |
RU2017100894A (en) | 2018-07-13 |
RU2017100894A3 (en) | 2018-07-13 |
US10694585B2 (en) | 2020-06-23 |
US20200305240A1 (en) | 2020-09-24 |
DE102014108356A1 (en) | 2015-12-17 |
EP3155871B1 (en) | 2022-04-20 |
WO2015189388A1 (en) | 2015-12-17 |
RU2668087C2 (en) | 2018-09-26 |
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