EP3146536A1 - Electronic component and method for the production thereof - Google Patents
Electronic component and method for the production thereofInfo
- Publication number
- EP3146536A1 EP3146536A1 EP15727321.0A EP15727321A EP3146536A1 EP 3146536 A1 EP3146536 A1 EP 3146536A1 EP 15727321 A EP15727321 A EP 15727321A EP 3146536 A1 EP3146536 A1 EP 3146536A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- functional body
- electronic component
- body portion
- functional
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/102—Varistor boundary, e.g. surface layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/105—Varistor cores
Definitions
- the present invention relates to an electronic component
- a varistor device for example, a varistor device, and a method for producing the same.
- An object to be solved is to provide means for an improved electronic component, in particular a flexible one
- a proposed electronic component comprises a functional body.
- the functional body expediently represents the functional element of the electronic component.
- the electronic component comprises a contact which is electrically connected to a first surface of the electronic component
- the contact may be an electrical contact layer and / or a metallization or another
- the surface is preferably a first surface, for example a first main surface of the functional body.
- the contact has a marginal area and a central area.
- the functional body is designed such that the electrical resistance of the
- first and second functional body sections are preferably radial sections of the functional body.
- the central region of the contact preferably designates an inner and / or middle region of the contact, while the edge region preferably designates or defines an outer edge of the contact.
- the contact is electrically connected both to the first and to the second functional body portion.
- the first functional body section preferably designates an outer or edge section of the functional body.
- the second functional body section designates
- the second functional body portion and the central area are - in supervision of the electronic
- said contact is a first contact.
- the electronic component also includes a second contact which is electrically connected to the second surface of the functional body or contacted.
- the second contact is preferably formed analogous to the first contact and arranged with respect to the second surface as the first contact with respect to the first surface.
- the first and the second contact may, for example, be arranged symmetrically with respect to a longitudinal axis of the electronic component.
- Component is preferably each a contact on an upper side and on an underside of the disc for the electrical
- Connection or contacting provided or arranged.
- the functional body is preferably arranged directly or directly between the contacts.
- the electronic component is a varistor component.
- Varistor components are preferably used as overvoltage protection.
- the functional body is expediently designed such that it represents the functional element of the varistor component.
- the Functional body comprise a polycrystalline, sintered, material.
- the electronic component is a disk or block varistor.
- the second functional body portion in view of the electronic component viewed at least partially.
- the first functional body portion encloses or surrounds the second
- the functional body is such
- Function body portion in particular at a contact point of the first functional body portion and the edge region of the contact or between the first functional body portion and the edge region, during operation of the electronic component and / or reduced in a flow of current in the functional body or reduced.
- the electrical current density is preferably reduced or reduced in comparison to a conventional electronic component or a component of the prior art.
- Temperature stress for example, be particularly high during operation of the electronic device.
- the cause of this can be an edge effect that occurs during operation of the electronic component.
- the proposed electronic component can advantageously be reduced or reduced during operation, the heat generation, for example, by resulting Joule heat in the first functional body portion, as a result of increased electrical resistance and thus reduced electrical current density usually less heat.
- the electronic component is temperature-resistant and versatile
- the life of the electronic component can be advantageously increased.
- Embodiment of the functional body to the effect that the first functional body portion has a greater electrical resistance than the second functional body portion are counteracted, since characterized the described
- the surface area of the second functional body portion is in plan view of the
- Varistor voltage essentially unchanged.
- the surface area of the second functional body portion is twice as large, three times or ten times as large as the area of the first functional body portion.
- the functional body in the first functional body portion on a non-contact area is preferably an outer radial section of the functional body.
- Functional body preferably arranged at the edge. In the non-contact area is preferably no contact
- kink-free embodiment in turn, in turn, reduces or minimizes an edge length or edge surface of the contacting and thus the emergence of "hotspots"
- the thickness of the first layer is a preferred embodiment.
- Functional body in the first functional body portion greater than the thickness of the functional body in the second functional body portion.
- the thickness of the first functional body portion and the thickness of the second functional body portion at least predominantly constant or approximately constant.
- Functional body section can be specified, whereby the electrical current density and thus the temperature load in the first functional body portion can be reduced during operation of the electronic component.
- the electrical resistance of the first functional body portion is due to the greater spacing of the contacts or surfaces in the first
- the thickness described herein preferably extends along the above-mentioned longitudinal axis of the electronic component.
- the thickness of the functional body is only on one side or main surface of the electronic
- Functional body are flat and / or lie in a plane.
- the functional body may be configured such that, for example, a top and a bottom of the first Functional body section opposite an upper ⁇ or a bottom of the second
- Functional body section is not arranged in a plane.
- the thickness of the first layer is the same as that of the second layer.
- Functional body in the first functional body portion 5% to 15% greater than the thickness of the functional body in the second functional body portion. Particularly preferred is the thickness of the functional body in the first
- Functional body portion at least 10% greater than the thickness of the second functional body portion.
- said thickness may for example be increased more than 15%.
- the effect of increasing the thickness in terms of electrical resistance is qualitatively the same.
- the functional body is designed such that the first functional body portion in comparison to the second functional body portion a has greater specific electrical resistance.
- Functional body portion is increased, the current density in the first functional body portion during operation of the electronic component can be reduced or reduced.
- Corresponding differences in the material properties may preferably be generated or formed during the manufacturing process of the electronic component and / or during sintering of the functional body (see below). Due to the larger specific electrical
- the functional body has a sintered material.
- the contact is a first contact
- the electronic component additionally has a second contact, which is electrically connected to the second surface of the functional body, and wherein the functional body is formed such that the electrical current or current density distribution at a current flow is homogenized in the functional body between the contacts in the first and the second functional body portion. This may mean that discrepancies or the dispersion of the
- the second contact has an edge region and a central region analogously to the first contact.
- the functional body preferably substantially polycrystalline.
- the functional body for example, as a main component have a polycrystalline material.
- the functional body for example as a main component, a ceramic.
- the ceramic is preferably a sintered ceramic.
- the varistor voltage between the first and the second surface consistently electrically conducts, without the
- Functional body has electrically insulating regions.
- Functional body specified for the electronic component described above The functional body and / or the electronic component can preferably be produced or manufactured by means of the method described here.
- Obtained features also relate to the functional body and / or the electronic component, and vice versa.
- the method comprises providing a base material for the functional body for the electronic component and forming the functional body using the Base material such that the electrical resistance of the functional body, between two opposite
- this comprises the provision of the functional body to the
- each contact for example, the above-mentioned first and second contact, is electrically connected to the first and the second functional body portion.
- the base material has a more homogeneous material composition than the functional body.
- Base material is preferably substantially homogeneous
- This embodiment advantageously makes it possible to increase the electrical resistance of the first functional body section in comparison to the second functional body section.
- the base material is sintered to the functional body, such that the specific electrical resistance of the functional body in the first functional body portion is greater than in the second functional body portion.
- the base material is sintered in such a way that crystal grains or corresponding particle sizes in the first
- Functional body portion of the functional body are smaller or formed than in the second
- the material composition of the base material in a first portion thereof is changed during sintering to form the first functional body portion.
- the first functional body portion is preferably formed by sintering.
- the base material is subjected to a temperature gradient during sintering, wherein the base material during sintering, and preferably also before sintering not with
- the base material is no further
- the base material prior to sintering, is provided with a dopant which diffuses into the base material during sintering to form the first functional body portion.
- the dopant or additive material is preferably applied to the base material or the base material is dipped in the dopant or a solution containing it prior to sintering.
- the dopant may be yttrium oxide,
- the first functional body portion is formed such that the maximum temperature, which in the first
- Functional body section under an electrical test pulse with a current of 30 A of the pulse shape 8/20 occurs, for example, compared to a conventional
- Production of the functional body comprises.
- FIG. 1 shows a schematic perspective view of an electronic component.
- FIG. 2 shows a schematic sectional view of a
- FIG. 3 shows a schematic sectional view of a
- inventive electronic component according to an alternative embodiment.
- FIG. 4 shows an exemplary voltage-current characteristic of the electronic component embodied as a varistor component.
- FIGS 5A to 5D show simulation results of
- FIG. 6 shows a table with values for the simulation of the operation of the electronic component.
- the same, similar and equally acting elements are provided in the figures with the same reference numerals.
- the figures and the proportions of the elements shown in the figures with each other are not to scale
- FIG. 1 shows a schematic perspective view of an electronic component 100.
- the electronic component 100 is preferably a varistor component, in particular a disk or block varistor. Particularly preferably, the electronic component 100 is a disc varistor.
- the electronic component 100 is configured disc-shaped according to Figure 1 and has a longitudinal axis or axis of symmetry X, which extends through the center of the disc. With regard to the longitudinal axis X, the electronic component is preferably at least approximately
- the electronic component according to FIG. 1 furthermore has a disc-shaped
- the functional body 1 comprises in the case of
- Varistorbauelements preferably a semiconductor material and / or an example sintered ceramic. Accordingly, the functional body 1 further preferably comprises
- a functional component of a varistor component of the functional body 1 is preferably formed such that it can be switched after the application of an electrical voltage above the varistor voltage, from the electrically insulating to the electrically conductive state.
- the functional body 1 comprises a first
- Function body section 3 rotates or surrounds the
- the second functional body section 2 is preferably viewed at its outer edge and is preferably integrally and / or integrally connected to it
- the electronic component, or the discs ⁇ or block varistor for example, has a diameter of about 30 mm and a thickness of about 3 mm. Said thickness preferably refers to the thickness of the second
- the electronic component may be, for example, an angular block varistor.
- Figure 2 shows a schematic sectional view of a
- FIG. 2 preferably shows a section through the electronic component 100 according to FIG. 1 along the longitudinal axis X. It can also be seen that the
- Functional body 1 in its first functional body portion 3 has a thickness Dl.
- the functional body 1 has a thickness D2.
- the thickness D2 is smaller than the thickness D1.
- the thickness D1 may be 5% 10% or 15% larger or even greater than the second thickness.
- the functional body 1 furthermore has a first surface 5 and a second one remote from the first surface 5
- the second surface 6 is planar according to FIG. 1, while the first surface 5 is not plane due to the increase in the thickness D1 in the first functional body section 3 in comparison to D2.
- the larger thickness Dl of the first functional body portion 3 compared to the second functional body portion 2 can also be realized such that both surfaces 5, 6 in the first functional body portion 3 relative to the second Functional body section 2 sublime, so overall are not flat.
- Functional body 1 for example, from the first to the second functional body portion (from inside to outside) on an oblique course increase (see also Figures 5A to 5D below).
- an abrupt change in the thickness over a step in the course of the thickness of the functional body 1 is also conceivable (not explicitly shown in the figures).
- Functional body portion 2 (see D2 in Figure 2), the electrical resistance of the functional body 1 between the first surface 5 and the second surface 6 in particular by the increased distance in the first
- the electronic component 100 further has a first contact 4a, which is electrically connected to the first surface 5.
- the first contact 4a is preferably connected both to the first functional body section 3 and to the second functional body section 2.
- the contact 4a in turn has an edge region 7 and a central region 8.
- the edge region 7 encloses the
- the electronic component has a second
- the second contact 4b preferably has an edge region 7 and a central region 8.
- the first and second contacts 4a, 4b viewed in plan view of the electronic component 100 are arranged congruent.
- the contacts 4a, 4b preferably contact the
- the contacts can, for example
- the contacts 4a, 4b for an electrical connection or contacting a
- Functional body 1 may be provided.
- the functional body 1 is suitably electrically conductive, for example, to protect a further electrical component from an overvoltage or a component damaging electrical voltage.
- the first functional body section 3 overlaps in a plan view of the electronic component 100, ie
- the second functional body portion 2 overlaps in a plan view of the electronic component 100, preferably with the central region 8.
- Functional body portion 2 may advantageously in the operation of the electronic component 100 in the second
- Functional body section 3 occurring electric power or in particular the electric current density can be reduced or reduced. Due to the reduced current load can simultaneously heat generation and thus
- Temperature load in the first functional body portion can be reduced.
- the electronic component 100 preferably has up to the thickness Dl of the first
- Functional body section 3 compared to a conventional electronic component or an electronic
- the contact surfaces that is to say the surfaces in which the contacts 4a, 4b are connected to the functional body 1, are similar in this respect or
- the edge effect can be caused by electric fields which are greater during operation of the component 100 at or in the edge region 7 than in the central region 8, for example. Although the electric current density is reduced by the greater distance of the contacts in the first functional body portion 3, further electrical properties of the
- the area of the second functional body portion 2 is preferably larger than that of the first one
- Varistorbauelements example, the varistor voltage of the electronic component, preferably independent of the configuration of the first functional body portion.
- a radial extension of the first functional body section 3 is identified in FIG. 2 by Rl. Furthermore, a radial extent, in particular the diameter of the second functional body portion 2 is indicated by R2.
- the radial extent Rl is between the single and the double thickness Dl of the functional body 1 in the first functional body section 3.
- a contact-free edge 9 of the functional body 1 is furthermore shown in the first functional body section 3, in which the contacts 4a, 4b are not electrically connected to the functional body 1.
- Region 9 preferably designates a radial outer portion of the functional body 1.
- the contacts 4a, 4b are preferably arranged and configured such that they
- Figure 3 shows a schematic sectional view of the
- Functional body portion preferably selected differently.
- the first functional body portion 3 has a greater specific electrical resistance than the second
- the functional body 1 preferably comprises a sintered, polycrystalline material. in case of a
- the first metal oxide preferably silicon carbide, zinc oxide or another metal oxide such as bismuth oxide, chromium oxide or manganese oxide.
- Functional body section 3 preferably produced or obtained by a starting material for the
- Functional body 1 for example, was sintered or the composition of the starting material for the
- the second functional body portion 2 has a greater electrical resistivity. This can in the present case by the formulation of the starting material and the sintering conditions, in particular the
- Process conditions can be achieved during sintering.
- the component itself preferably comprises providing a green body or base material 1 for the functional body 1, forming the functional body 1 using the base material 1 such that the electrical resistance of the functional body 1 in the first functional body section 3 is greater than in the second functional body section 2.
- the thickness Dl of the first becomes
- Functional body portion 3 configured larger than the thickness D2 of the second functional body portion second
- the base material 1 can be sintered to the functional body 1 such that the
- Base material 1 are exposed to a temperature gradient during sintering, for example, without the
- Base material 1 during sintering more material is added.
- the properties of the functional body 1 with respect to the specific electrical resistance are preferably formed solely by the formulation or composition, for example due to migration and / or diffusion processes of material components originally contained in the base material 1.
- Base material 1 are withdrawn, so in the functional body 1 in contrast to the main body inhomogeneous
- Functional body portion 3 of the functional body 1 are smaller or formed than in the second
- the base material 1 may be provided with a dopant before sintering, which diffuses into the base material 1 during sintering, for example, to form the first functional body portion 3.
- the dopant may include or consist of, for example, yttrium oxide, in particular Y 2 O 3 , or other rare earth metals or their oxides.
- the dopant or additive is preferably applied to the base material or the base material is dipped into the dopant prior to sintering or, for example, a solution or compound contained therein.
- FIG. 4 shows an exemplary voltage-current characteristic of an electronic component according to the invention
- the electric field strength is plotted as a function of the electric current density in logarithmic scales.
- the Characteristics preferably describe a working range of the relevant components (compare, in particular, the range above 10 A / mm 2 ).
- the dashed voltage-current characteristic describes
- Varistor component according to the invention in which the thickness of the above-mentioned first functional body portion 3 (see.
- Conventional varistor component is here preferably identical or similar to the component according to the invention, except for the greater thickness described. It can be seen, for example, in FIG. 4 that, given a given electric field strength, the electrical current density of the component according to the invention is taken into account in view of FIG. 4
- logarithmic scale on the X-axis, at least in the middle, flat-running characteristic region is significantly smaller than in the conventional varistor device.
- FIGS 5A to 5D show simulation results of
- FEM finite element
- FIGS. 5A to 5D each describe four different geometries or partial figures of disc varistors (cf.
- Dotted lines in FIGS. 5A to 5D define the above-described first functional body portion of the respective components and optically delimit this from the second functional body portion. At least the thickness of the first contact is 10 ym. In the circled areas in each case the edge region 7 of the contacts (see FIG.
- FIGS. 5A and 5C each show results for the electrical current density in A / mm 2 .
- FIGS. 5B and 5D respectively show results for the temperature in ° C. (compare the corresponding color scales in the lower region of FIG.
- both the temperature and the electrical current density is selectively much higher than in the corresponding other functional body.
- Edge region 7 of the contact arises, according to the invention can be reduced by up to 750 ° C.
- Corresponding results of the electrical current densities at the pulse maximum of the test pulse and the maximum temperature at the end of the pulse on the basis of numerical values are shown in the table of FIG. 5 for all subfigures (1) to (4). Furthermore, the electrical voltage of the test pulse and the maximum temperature at the end of the pulse on the basis of numerical values are shown in the table of FIG. 5 for all subfigures (1) to (4). Furthermore, the electrical voltage of the
- the temperature and electric current density for the subfigures (4) that is to say for the combination of the embodiments according to the invention from FIGS. 2 and 3, in contrast to the subfigures (1), are significantly reduced (compare likewise the numerical values on the right in FIG. ,
- the invention is not limited by the description with reference to the embodiments. Rather, the includes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Thermistors And Varistors (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102014107040.2A DE102014107040A1 (en) | 2014-05-19 | 2014-05-19 | Electronic component and method for its production |
PCT/EP2015/060882 WO2015177085A1 (en) | 2014-05-19 | 2015-05-18 | Electronic component and method for the production thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3146536A1 true EP3146536A1 (en) | 2017-03-29 |
EP3146536B1 EP3146536B1 (en) | 2020-02-19 |
Family
ID=53298323
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP15727321.0A Active EP3146536B1 (en) | 2014-05-19 | 2015-05-18 | Electronic component and method for manufacturing it |
Country Status (6)
Country | Link |
---|---|
US (1) | US10204722B2 (en) |
EP (1) | EP3146536B1 (en) |
JP (1) | JP6850608B2 (en) |
CN (1) | CN106463219A (en) |
DE (1) | DE102014107040A1 (en) |
WO (1) | WO2015177085A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017105673A1 (en) * | 2017-03-16 | 2018-09-20 | Epcos Ag | Varistor component with increased surge current capacity |
DE102017210472A1 (en) * | 2017-06-22 | 2018-12-27 | Phoenix Contact Gmbh & Co. Kg | Varistor with alloy optimization |
DE102018116221B4 (en) * | 2018-07-04 | 2022-03-10 | Tdk Electronics Ag | Multilayer varistor with field-optimized microstructure and module having the multilayer varistor |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL239104A (en) * | 1958-05-26 | 1900-01-01 | Western Electric Co | |
JPS5074444U (en) | 1973-11-12 | 1975-06-30 | ||
IE47121B1 (en) * | 1977-07-29 | 1983-12-28 | Gen Electric | Stabilized varistor |
US4364021A (en) * | 1977-10-07 | 1982-12-14 | General Electric Company | Low voltage varistor configuration |
US4157527A (en) * | 1977-10-20 | 1979-06-05 | General Electric Company | Polycrystalline varistors with reduced overshoot |
JPS56115501A (en) | 1980-02-18 | 1981-09-10 | Hitachi Ltd | Voltage nonnlinear resistor |
DE3405834A1 (en) * | 1984-02-17 | 1985-08-22 | Siemens AG, 1000 Berlin und 8000 München | Varistor consisting of a wafer of zinc-oxide material, which is semiconductive as a result of doping, and a method for producing this varistor |
JPS6329902A (en) | 1986-07-23 | 1988-02-08 | 富士電機株式会社 | Manufacture of voltage nonlinear resistor |
JPH05335114A (en) | 1992-05-29 | 1993-12-17 | Taiyo Yuden Co Ltd | Capacitive porcelain varistor |
DE4221309A1 (en) * | 1992-06-29 | 1994-01-05 | Abb Research Ltd | Current limiting element |
US5594613A (en) * | 1992-10-09 | 1997-01-14 | Cooper Industries, Inc. | Surge arrester having controlled multiple current paths |
JP3114425B2 (en) | 1993-04-23 | 2000-12-04 | 富士電機株式会社 | Voltage nonlinear resistor and method of manufacturing the same |
JP3423623B2 (en) | 1998-08-10 | 2003-07-07 | 三菱電機株式会社 | Resistor |
US7772961B2 (en) | 2004-09-15 | 2010-08-10 | Panasonic Corporation | Chip-shaped electronic part |
CN101010754A (en) | 2004-09-15 | 2007-08-01 | 松下电器产业株式会社 | Chip-shaped electronic part |
JP2007173313A (en) | 2005-12-19 | 2007-07-05 | Toshiba Corp | Current-voltage nonlinear resistor |
JP2007251102A (en) | 2006-03-20 | 2007-09-27 | Matsushita Electric Ind Co Ltd | Chip type electronic component |
JP2007329178A (en) | 2006-06-06 | 2007-12-20 | Toshiba Corp | Current-voltage non-linear resistor, and lightning arrester |
-
2014
- 2014-05-19 DE DE102014107040.2A patent/DE102014107040A1/en not_active Withdrawn
-
2015
- 2015-05-18 US US15/312,503 patent/US10204722B2/en active Active
- 2015-05-18 WO PCT/EP2015/060882 patent/WO2015177085A1/en active Application Filing
- 2015-05-18 CN CN201580025620.3A patent/CN106463219A/en active Pending
- 2015-05-18 EP EP15727321.0A patent/EP3146536B1/en active Active
- 2015-05-18 JP JP2016568579A patent/JP6850608B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN106463219A (en) | 2017-02-22 |
DE102014107040A1 (en) | 2015-11-19 |
WO2015177085A1 (en) | 2015-11-26 |
JP6850608B2 (en) | 2021-03-31 |
US10204722B2 (en) | 2019-02-12 |
JP2017516315A (en) | 2017-06-15 |
US20170092394A1 (en) | 2017-03-30 |
EP3146536B1 (en) | 2020-02-19 |
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Legal Events
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