EP3046896A1 - Substrate for solidifying a silicon ingot - Google Patents
Substrate for solidifying a silicon ingotInfo
- Publication number
- EP3046896A1 EP3046896A1 EP14789884.5A EP14789884A EP3046896A1 EP 3046896 A1 EP3046896 A1 EP 3046896A1 EP 14789884 A EP14789884 A EP 14789884A EP 3046896 A1 EP3046896 A1 EP 3046896A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- silicon
- substrate
- silica
- total weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B11/00—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
- C30B11/002—Crucibles or containers for supporting the melt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/50—Multilayers
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
- C01B33/021—Preparation
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B35/00—Apparatus not otherwise provided for, specially adapted for the growth, production or after-treatment of single crystals or of a homogeneous polycrystalline material with defined structure
- C30B35/002—Crucibles or containers
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
- C04B2111/0087—Uses not provided for elsewhere in C04B2111/00 for metallurgical applications
- C04B2111/00879—Non-ferrous metallurgy
Definitions
- the present invention relates to a substrate, having a particular coating, and can advantageously be brought into contact with molten silicon. It also relates to a method for preparing such a substrate.
- the substrate is a crucible.
- the present invention relates more particularly to a crucible for solidifying a silicon ingot from molten silicon.
- the invention also relates to the use of such a crucible for the treatment of silicon in the molten state.
- the crucibles according to the invention are particularly useful in silicon melting and solidification processes, for example for obtaining high purity silicon for applications in the generation of photovoltaic energy.
- the photovoltaic cells are essentially made from mono- or poly-crystalline silicon, obtained from the solidification of liquid silicon in crucibles. It is the platelets cut in the ingot formed in the crucible which serve as a basis for the manufacture of the cells.
- the crucibles considered for the growth of the ingot are generally silica crucibles, coated with a porous layer of oxidized silicon nitride to avoid the reaction of the silicon with the crucible and the adhesion of the ingot to the crucible after solidification.
- this non-sticking behavior relies essentially on the presence of silicon nitride, S13N4, of weak cohesion, partially oxidized in the form of silica, on the surface of the inner walls of the crucibles to which the silicon adheres during its cooling. .
- silicon nitride S13N4
- weak cohesion partially oxidized in the form of silica
- silica gives the coated crucible on the one hand, a relative internal cohesion and a slight adhesion to the crucible, and on the other hand, a limitation of the infiltration by liquid silicon.
- the coating can easily be indented by the pieces of silicon deposited in the crucible. Thus, it must be deposited in significant thickness, the order of several hundred micrometers, to ensure the absence of any direct contact between the silicon and the crucible which would cause a bonding of the ingot on it.
- these coatings do not make it possible to prevent contamination of the silicon by the impurities present in the S13N4 powders.
- this contamination which may exist in the areas of the silicon ingot formed in direct contact with or near walls of the crucible, makes part of the ingot unfit for use in photovoltaic applications.
- US Pat. No. 7,378,128 discloses crucible coatings having high silica layers.
- the increase in the silica content leads to an increase in silicon oxygen pollution, as well as increased adhesion to the silicon ingot, compromising reuse. So far there remains a need for substrates, including solidification crucibles, suitable for the crystallization of high purity silicon ingots in reusable crucibles.
- the present invention aims precisely to provide new substrates, including crucibles, for the solidification of a silicon ingot from molten silicon, meeting these expectations.
- the inventors have in fact discovered that the abovementioned problems can be solved by at least partially covering the surface of a substrate intended to come into contact with molten silicon, a multilayer coating formed of at least two layers having contents in specific silica.
- the present invention relates, according to a first of its aspects, to a substrate, in particular dedicated to contact with liquid silicon, characterized in that it is coated at least partially at the surface with a multilayer coating formed from at least one so-called suspended layer contiguous to said substrate, having an open porosity of at least 30%, and formed of a material based on silica and silicon nitride, said material having a silica content of between 10 % and 55% by weight relative to its total weight, and a distinct layer of the layer of hooked, said anti-adherent, appearing on the surface of the layer of hooked, and formed of a material based on silica and of silicon nitride, said material having a silica content of between 2% and 10% by weight relative to its total weight.
- multilayer coating means a coating comprising at least two distinct and superposed layers.
- a layer having an "open porosity” is meant a layer whose pores communicate with one another so as to create a space internal to the layer that is accessible from outside the latter and therefore “refillable” .
- the layers of hooked and anti-adherent are two separate layers. "Separate” layers are understood to denote layers having different compositions. They are therefore distinguishable from each other.
- a substrate coated on its surface dedicated to contacting with molten silicon, a multilayer coating according to the invention pollutes only slightly silicon oxygen and thus ensures an increased level of purity to the corresponding silicon ingot.
- the substrates according to the invention make it possible to significantly reduce the pollution by the coating.
- the substrates according to the invention can thus be reused a large number of times by improving their properties and thus prove to be particularly advantageous at the industrial level.
- the presence of the multilayer coating according to the invention also makes it possible to obtain a substrate, in particular a crucible, which is reusable as such, that is to say without requiring prior processing steps before reuse.
- the hook layer is a layer that does not need to be renewed with each use and the release layer is a renewable layer.
- the hook layer of the multilayer coating is at least 80% of the total thickness of said coating.
- Such a thickness makes it possible in particular to minimize the consumption of material related to the renewal of the anti-adhesive layer.
- the hook layer has a thickness of between 100 and 500 microns, preferably between 200 and 300 microns and the release layer has a thickness of between 10 and 100 microns, preferably between 20 and 60 micrometers.
- the difference in the cohesion and adhesion properties of the two layers of hooked and nonadherent comes in particular from the difference in size of the silica bridges between the particles which constitute them and which is particularly related to a oxidation and sintering process during oxidative treatment at different temperatures.
- the present invention aims at providing a method for forming a multilayer coating with a layer of hook and a release layer, on a surface of a substrate, in particular dedicated to a contact with liquid silicon, characterized in that it comprises at least:
- step (b) the formation of a release layer, distinct from the hook layer, via: i) contacting the surface of the substrate as obtained at the end of a step (a), with a liquid suspension of silicon nitride powder and optionally silica, to form a deposit of said suspension,
- step (a) may be renewed at least once before the implementation of step (b).
- step (a) ii) is carried out for a period of between 1 and 4 hours, preferably between 2 and 3 hours and step (b) ii) is carried out for a period of time between 1 and 4 hours, preferably between 2 and 3 hours.
- the method of the invention implements the deposition of the precursor materials of the layers forming the multilayer coating, according to conventional and inexpensive techniques, and to achieve a very good surface finish.
- the substrate according to the invention in particular intended for contact with molten silicon, is a crucible for the solidification of a silicon ingot from molten silicon.
- the invention also relates to a method of renewing a so-called non-adherent layer on the inner surface of a crucible, already coated with at least one permanent, so-called hanging layer formed of a material having a content of silica between 10% and 55% by weight relative to the total weight of said hook layer, characterized in that it comprises (i) bringing the external surface of the hooked layer into contact with a suspension liquid silicon nitride powder and optionally silica, to form a deposit of said suspension, and (ii) the exposure of the deposit formed in i) to a heat treatment in an oxidizing atmosphere and under conditions sufficient to obtain a layer formed of a material having a silica content of between 2% and 10% by weight relative to its total weight.
- the present invention also relates to the use of a crucible as defined above, for the solidification of a silicon ingot from molten silicon.
- the multilayer coating considered according to the invention is formed of at least:
- a so-called hooked layer having an open porosity of at least 30% and formed of a material based on silica and silicon nitride, said material having a silica content of between 10% and 55% by weight; weight in relation to its total weight, and
- the hook layer can represent at least 80% of the total thickness of the coating according to the invention, preferably it represents between 80% and 90% of the total thickness of the coating.
- it may have a thickness ranging from 100 to 500 micrometers, preferably ranging from 200 to 300 micrometers.
- the hook layer is furthermore a cohesive layer.
- the cohesion of the hooked layer and its adhesion to the substrate is in particular ensured by a high silica content of between 10% and 55% by weight relative to its total weight.
- the hook layer has a silica content of between 25% and 50% by weight relative to its total weight.
- the silica bridges are thick, which gives it high cohesion.
- the hook layer has a silica volume fraction of between 14% and 64% by volume, based on its total volume.
- It also has an oxygen content of between 5% and 30% by weight relative to its total weight, preferably between 13% and 27% by weight.
- the hooked layer consists of one or more underlayer (s) hanging, identical or different compositions and preferably identical.
- a layer may be made in two successive deposits of the same composition with an oxidation treatment of 2 hours at 1100 ° C in air after each deposit.
- Figure 1 shows the structure of such a layer.
- the layer In the lower part which corresponds to the first deposit having a higher oxygen concentration, the layer is more sintered because it has undergone two oxidation treatments. On the contrary, in the upper part corresponding to the second deposit which has undergone only an oxidation treatment, the layer is less sintered.
- Non-stick layer In the lower part which corresponds to the first deposit having a higher oxygen concentration, the layer is more sintered because it has undergone two oxidation treatments. On the contrary, in the upper part corresponding to the second deposit which has undergone only an oxidation treatment, the layer is less sintered.
- the release layer is thin and preferably less cohesive than the hook layer. It may have a thickness ranging from 10 to 100 micrometers, preferably ranging from 20 to 60 micrometers.
- the thickness of the release layer can be chosen according to the amount of coating that is incorporated in the silicon, depending on the size of the ingot developed and the operating conditions, and the desired frequency for the renewal of this layer.
- release layer is of low cohesion. Its cohesion is lower than that of the layer of hooked.
- the low cohesion of the release layer results from its low silica content, between 2% and 10% by weight relative to its total weight.
- the release layer has a silica content of between 4% and 10% by weight relative to its total weight.
- the release layer has a silica volume fraction of between 3% and 14% by volume, based on its total volume.
- It also has an oxygen content of between 1% and 5% by weight relative to its total weight, preferably between 2% and 5% by weight.
- the release layer is prepared from materials of purity at least equal to that of the materials used to make the hook layer. Insofar as the development of the release layer consumes little material, it is also possible to use a previously purified material for the development of this layer.
- the silica bridges are thin.
- the dissolution of the surface grains in the liquid silicon allows the formation of larger crystals at the interface.
- Figure 2 which shows a diagram of the interface between the multilayer coating and silicon, these crystals then constitute anchor points for the silicon surface.
- the underlying powder grains are deoxidized by the silicon when they come in contact with it. Thus, they are detached from the coating. This results in a reduction of the contact surface of silicon with the multilayer coating.
- the two layers of hooked and anti-adhesive multilayer coating have a microstructure that does not constitute a barrier to the diffusion of metal impurities.
- the hooked and antiadherent layers each have an open porosity, especially between 30% and 80%, preferably between 50% and 70%.
- the hooked and release layers have distinct porosities.
- the open porosity targeted by the invention can be quantified by various known measurement techniques, for example by X-ray image analysis, optical microscopy or optical macroscopy.
- the layers of hooked and anti-adherent each have a specific surface area of between 5 m 2 / g and 15 m 2 / g.
- the hooked and release layers have distinct specific surfaces.
- the present invention relates to a method for forming a multilayer coating provided with a layer of hook and a release layer, on a surface of a substrate, in particular dedicated to contact with liquid silicon characterized in that it comprises at least:
- step (b) the formation of a release layer, distinct from the hook layer, via: i) contacting the surface of the substrate as obtained at the end of a step (a), with a liquid suspension of silicon nitride powder and optionally silica, to form a deposit of said suspension,
- the silica and silicon nitride particles used in the process for preparing the coating according to the invention are preferably in the form of powders, preferably having a size or an average diameter ranging from 500 nanometers to 5 microns. preferably from 0.8 microns to 2 microns.
- step (a) can be renewed at least once before the implementation of step (b).
- Steps (a) and (b) of the process according to the invention are distinct steps.
- the number of layers in the coating according to the invention will depend on the number of repetitions of steps (a) and (b).
- the contacting of the liquid suspensions with the inner surface of the substrate in steps (a) i) and (b) i) can be carried out by any conventional technique known to those skilled in the art. For example, it can be deposited by dipping, by turning, by pistoltician or with the help of a brush.
- each of the suspensions is performed by applying a brush and / or a spray gun on the internal surface, which is intended to be in contact with liquid silicon, of the substrate.
- a brush and / or a spray gun on the internal surface, which is intended to be in contact with liquid silicon, of the substrate.
- steps (a) ii) and (b) ii) are carried out under an oxidizing atmosphere, for example under air.
- step (a) ii) is carried out under conditions sufficient to obtain a layer formed of a material having a silica content of between 25% and 50% by weight, based on its total weight.
- step (a) ii) is carried out at a temperature above 900 ° C., in particular between 900 ° C. and 1100 ° C., and preferably between 900 ° C. and 1000 ° C.
- step (a) i) is brought to a fixed temperature plateau greater than 900 ° C., especially between 900 ° C. and 1100 ° C., and preferably between 900 ° C. and 1000 ° C. .
- the duration of the temperature step of step (a) ii) is between 1 and 4 hours, in particular between 2 and 3 hours.
- step (b) ii) is carried out under conditions sufficient to obtain a layer formed of a material having a silica content of between 4% and 10% by weight, relative to its total weight.
- step (b) ii) is carried out at a temperature below 900 ° C., preferably between 600 ° C. and 900 ° C., and in particular between 700 ° C. and 900 ° C.
- step (b) i) is brought to a fixed temperature plateau below 900 ° C., preferably between 600 ° C. and 900 ° C., and in particular between 700 ° C. and 900 ° C. .
- the duration of the temperature step of step (b) ii) is between 1 and 4 hours, preferably between 2 and 3 hours.
- An initial purification of the coating can be carried out by preliminary treatment under vacuum up to a temperature of 1000 ° C. to 1200 ° C. and then under gas to a temperature at least equal to the crystallization temperature, that is to say say between 1400 ° C and 1500 ° C.
- the hooked layer is then purified by extracting the impurities to the liquid silicon itself during successive crystallization cycles.
- the invention can be advantageously implemented on any type of substrate.
- the substrates according to the invention are formed of materials chosen from silicon carbide, silicon nitride, silica, graphite and composites comprising graphite and silicon carbide or comprising graphite and silicon nitride. .
- these substrates are advantageously dedicated to being used with liquid silicon.
- it may for example be formed of a dense ceramic material, for example silicon carbide (SiC), silicon nitride (Si 3 N 4 ), silica, or a porous material, for example example graphite, or a composite material comprising graphite and silicon carbide or comprising graphite and silicon nitride.
- a dense ceramic material for example silicon carbide (SiC), silicon nitride (Si 3 N 4 ), silica, or a porous material, for example example graphite, or a composite material comprising graphite and silicon carbide or comprising graphite and silicon nitride.
- the coating according to the invention can be used on all types of substrates without risks of harmful interactions between the substrate and its contents, in particular liquid silicon.
- a crucible or mold and more particularly a crucible for the solidification of a silicon ingot from molten silicon.
- the substrate may further comprise at least partially on a surface an intermediate dense layer.
- Such an intermediate insulating layer is intended to isolate said substrate from the layers of the coating.
- This intermediate insulating layer affixed to the surface of the material forming said substrate may in particular be a dense and continuous layer of ceramic capable of ensuring a barrier or even antioxidant behavior.
- the hook layer is deposited on the porous material substrate of graphite type previously coated with an impermeable layer, for example silicon carbide.
- the method according to the invention can comprise, prior to step (a), the formation of a layer of silicon carbide deposited by CVD (chemical vapor deposition) on the surface to be treated of said substrate.
- CVD chemical vapor deposition
- the invention makes it possible to limit, or even avoid, the contamination of the silicon ingot, and thus to obtain silicon ingots of greater purity by compared to those obtained to date, and this while implementing conventional and inexpensive deposition techniques.
- Figure 1 Scanning electron microscope image of a coating made in two successive deposits with an oxidation treatment of 2 hours at 1100 ° C in air after each deposit.
- Figure 2 Diagram of the interface between the multilayer coating and silicon.
- Figure 3 View from above and in section of the surface of a silicon ingot prepared in a crucible coated with an oxidized hook layer 2 hours at 900 ° C and an anti-adherent layer oxidized 2 hours at 600 ° C.
- the crucible used is a graphite crucible of size G1 previously coated with a layer of silicon carbide.
- a multilayer coating according to the invention was formed on this crucible, according to the following protocol.
- Two first layers of the multilayer coating are produced by spray-drying a S13N4 sub-micron powder, with a specific surface area of the order of 11 m 2 / g, suspended in water, on the inner surface of the crucible.
- the layers are oxidized by heating in air to confer their cohesion and their barrier function to the infiltration of liquid silicon.
- the two layers are thus oxidized in air at 1100 ° C. for 2 hours. This results in a silica fraction of 64% by volume (equivalent to an oxygen content of 29% by weight), and a thickness of the silica layer of 25 nm.
- the two successive sub-layers constituting the hooked layer each have a thickness of approximately 150 ⁇ , the final thickness of the hook layer being less than 300 ⁇ .
- the layer thus obtained is hard and adherent on the crucible.
- An anti-adherent outer layer with a thickness of 20 ⁇ is then deposited at one time and then oxidized in air at 900 ° C. for 2 hours. This results in a silica fraction of 13% by volume (equivalent to an oxygen content of 5% by weight), and a thickness of the silica layer of 5 nm.
- the new non-stick layer obtained is pulverulent.
- the silicon ingot spontaneously detaches by driving a portion of the release layer of the multilayer coating.
- the hook layer remains totally adherent to the crucible.
- a new anti-adherent layer with a thickness of 20 ⁇ is then deposited and oxidized in air for 2 hours at 900 ° C.
- a second ingot is then developed.
- the crucible coated according to the invention thus formed is tested as follows:
- the table below shows the concentrations of various metal elements measured by GDMS (glow discharge spectrometry) on a coating before crystallization, and after the first and second crystallizations of the example above.
- the crucible according to the invention is therefore reusable and suitable for depositing a new non-stick layer to undergo a new crystallization cycle of high purity silicon ingots.
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1358904A FR3010716B1 (en) | 2013-09-16 | 2013-09-16 | SUBSTRATE FOR SOLIDIFICATION OF SILICON INGOT |
PCT/IB2014/064473 WO2015036975A1 (en) | 2013-09-16 | 2014-09-12 | Substrate for solidifying a silicon ingot |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3046896A1 true EP3046896A1 (en) | 2016-07-27 |
Family
ID=49911643
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP14789884.5A Withdrawn EP3046896A1 (en) | 2013-09-16 | 2014-09-12 | Substrate for solidifying a silicon ingot |
Country Status (6)
Country | Link |
---|---|
US (1) | US10023972B2 (en) |
EP (1) | EP3046896A1 (en) |
KR (1) | KR20160057435A (en) |
CN (1) | CN105705476A (en) |
FR (1) | FR3010716B1 (en) |
WO (1) | WO2015036975A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105112996A (en) * | 2015-08-28 | 2015-12-02 | 常州天合光能有限公司 | Method for preparing efficient ingot polycrystalline silicon and special monocrystalline silicon wafer |
DE102019206489A1 (en) * | 2019-05-06 | 2020-11-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method and crucible for the production of particle-free and nitrogen-free silicon ingots by means of directional solidification, silicon ingot and the use of the crucible |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02167067A (en) * | 1988-12-21 | 1990-06-27 | Kirin Brewery Co Ltd | Sheet-like culture medium |
ATE398196T1 (en) * | 2004-04-29 | 2008-07-15 | Vesuvius Crucible Co | CRUCIAL FOR THE CRYSTALIZATION OF SILICON |
NO326797B1 (en) | 2005-06-10 | 2009-02-16 | Elkem As | Process and apparatus for refining molten material |
TWI400369B (en) * | 2005-10-06 | 2013-07-01 | Vesuvius Crucible Co | Crucible for the crystallization of silicon and process for making the same |
-
2013
- 2013-09-16 FR FR1358904A patent/FR3010716B1/en not_active Expired - Fee Related
-
2014
- 2014-09-12 US US15/022,440 patent/US10023972B2/en not_active Expired - Fee Related
- 2014-09-12 CN CN201480050809.3A patent/CN105705476A/en active Pending
- 2014-09-12 KR KR1020167009684A patent/KR20160057435A/en not_active Application Discontinuation
- 2014-09-12 EP EP14789884.5A patent/EP3046896A1/en not_active Withdrawn
- 2014-09-12 WO PCT/IB2014/064473 patent/WO2015036975A1/en active Application Filing
Non-Patent Citations (2)
Title |
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None * |
See also references of WO2015036975A1 * |
Also Published As
Publication number | Publication date |
---|---|
CN105705476A (en) | 2016-06-22 |
US10023972B2 (en) | 2018-07-17 |
KR20160057435A (en) | 2016-05-23 |
WO2015036975A1 (en) | 2015-03-19 |
FR3010716A1 (en) | 2015-03-20 |
FR3010716B1 (en) | 2015-10-09 |
US20160230305A1 (en) | 2016-08-11 |
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