EP3025397A1 - System consisting of a printed circuit board and tubular casing - Google Patents

System consisting of a printed circuit board and tubular casing

Info

Publication number
EP3025397A1
EP3025397A1 EP14742152.3A EP14742152A EP3025397A1 EP 3025397 A1 EP3025397 A1 EP 3025397A1 EP 14742152 A EP14742152 A EP 14742152A EP 3025397 A1 EP3025397 A1 EP 3025397A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
printed circuit
jacket
contact surface
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP14742152.3A
Other languages
German (de)
French (fr)
Other versions
EP3025397B1 (en
Inventor
Martin Zebhauser
Rainer BIPPUS
Holger BROSCH
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rosenberger Hochfrequenztechnik GmbH and Co KG
Original Assignee
Rosenberger Hochfrequenztechnik GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rosenberger Hochfrequenztechnik GmbH and Co KG filed Critical Rosenberger Hochfrequenztechnik GmbH and Co KG
Publication of EP3025397A1 publication Critical patent/EP3025397A1/en
Application granted granted Critical
Publication of EP3025397B1 publication Critical patent/EP3025397B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/03—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections
    • H01R9/05—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections for coaxial cables
    • H01R9/0515—Connection to a rigid planar substrate, e.g. printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
    • H01R24/50—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2107/00—Four or more poles

Definitions

  • the invention relates to a system comprising a printed circuit board and a tubular jacket connected to the printed circuit board, in particular conductors.
  • the invention relates to such a system in which the jacket, in particular as outer conductor, surrounds one or more inner conductors of a sheathed and in particular shielded single or multiple line (for example coaxial line).
  • Such systems are part of a variety of devices in which radio frequency signals are transmitted and processed (eg, multimedia devices).
  • the one or more provided for the high-frequency signal transmission inner conductor of the shielded single or multiple lines are electrically conductive with defined " traces of the circuit board, while the outer conductor (sheath) serves as a shield for the inner conductor and to regularly electrically connected to a grounded contact region of the circuit board.
  • the connections between the inner and outer conductors and the corresponding contact regions of the printed circuit board can be made in a positive, cohesive or materially bonded manner , For certain applications, it may be necessary to seal the connection between the printed circuit board and the coaxial line, in particular a penetration of moisture to the inner conductors and their contact points with the conductor tracks of the circuit board or moisture through the contact points in a surrounding the outer conductor Avoid housing.
  • a separate sealing element for example, a conventional O-ring is used regularly, which is arranged in the contact region between the circuit board and the outer conductor.
  • This type of sealing is associated with relatively high costs, which are not only due to the component costs for the sealing element, but also result from the relatively complex assembly of the system.
  • the present invention seeks to provide a way to inexpensively seal the connection of a circuit board with a sheathed and especially shielded cable.
  • the invention is based on the idea to form the connection between the printed circuit board and a rohi-shaped shell, in particular an outer conductor of a shielded single or multiple line, by soldering and form the solder joint such that it can simultaneously serve to seal the connection area.
  • soldered connection region it is necessary for the soldered connection region to be provided completely with respect to the cross section of the jacket and, moreover, to be of such a large surface area that a sufficient sealing effect can be achieved by means of the solder introduced into the contact gap between the printed circuit board and the jacket.
  • a system comprising a printed circuit board and a tubular (and preferably electrically conductive) sheath, in particular a conductor, which is preferably electrically conductively connected to the printed circuit board is inventively characterized in that the sheath has the face side with a flat, closed annular (eg annular, square , rectangular, etc.) contacted contact surface and the circuit board with the jacket is fully (preferably full surface) soldered along the contact surface.
  • a flat, closed annular eg annular, square , rectangular, etc.
  • the thickness of the contact surface may be greater than the wall thickness of the jacket in a section spaced from the contact surface.
  • the thickness of the contact surface is greater than the normal wall thickness, i. that wall thickness that the shell has along most of its length is.
  • the jacket is formed at its contact-side end with a thickening, which can be formed, for example, as a circumferential paragraph t.
  • the heel does not have to be formed integrally with the (residual) jacket.
  • the jacket at its contact-side end e.g.
  • the thickness of the annular contact surface is at least 0.3 mm.
  • a sufficiently good sealing effect can be realized by increasing the contact surface and an increase in the strength of the achieved by soldering mechanical connection between the circuit board and the jacket.
  • the inventive type for sealing the connection between a printed circuit board and a tubular jacket can be used advantageously in particular when the jacket (at least) surrounds an inner conductor.
  • the jacket may in particular be electrically conductive and furthermore preferably designed as a conductor.
  • the jacket can thus serve as a shield and in particular as an outer conductor for the inner conductor.
  • the jacket may preferably be formed entirely from a suitable metal. As a result, it can easily have the preferably provided electrical conductivity and, moreover, can also be soldered without difficulty.
  • the coat can also consist of other materials.
  • the jacket may be at least partially made of plastic. The solderability and optionally the conductivity can then be achieved, for example, by means of a metallic (partial) coating.
  • Fig. 1 an inventive system in a first perspective
  • FIG. 3 shows the system in a perspective longitudinal section.
  • the system according to the invention shown in FIGS. 1 to 3 comprises a printed circuit board 1 and a shielded multiple line connected to the printed circuit board 1.
  • the multiple line comprises an (electrically conductive) tubular outer conductor 2 with an annular cross-sectional area.
  • a plurality of, specifically four (electrically conductive) inner conductor 3 are positioned in a square arrangement.
  • the inner conductors 3 are each held in a receiving opening of an insulating element 4.
  • the inner conductors 3 are fixed in position both within the outer conductor 2 and also electrically isolated from the outer conductor 2 and the respective other inner conductors 3.
  • the inner conductors 3 protrude with their contact-side end portions through through holes of the printed circuit board 1 and contact on the multi-line spaced side with respectively associated contact areas of printed conductors of the printed circuit board 1. It can also be provided to solder the inner conductor 3 to the contact areas.
  • the outer conductor 2 contacts a contact region of the printed circuit board 1 provided for this purpose with a flat, closed annular contact surface.
  • the mechanical connection between the outer conductor 2 and the associated contact region of the printed circuit board 1 is achieved by soldering, for which, in a known manner, molten solder is introduced into the contact gap formed between the contact surface of the outer conductor 2 and the contact region of the printed circuit board 1.
  • the solder joint serves as a seal to prevent ingress of moisture into the space formed by the outer conductor 2 cavity.
  • the wall thickness in the area of the contact surface is chosen to be greater than the normal wall thickness of the outer conductor 2.
  • the contact-side end portion of the outer conductor 2 is provided on the outside with a peripheral shoulder 5, by which an increase in diameter is achieved with concomitant enlargement of the cross-sectional area.

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connector Housings Or Holding Contact Members (AREA)

Abstract

The invention concerns a system consisting of a printed circuit board and a tubular casing which is connected to the printed circuit board, the casing contacting the printed circuit board at the front end with a flat, closed, annular contact surface, and the printed circuit board being fully soldered to the casing along the contact surface.

Description

System aus Leiterplatte und rohrförmigem Mantel  System of circuit board and tubular jacket
Die Erfindung betrifft ein System aus einer Leiterplatte und einem mit der Leiterplatte verbundenen, rohrförmigen Mantel, insbesondere Leiter. Insbesondere betrifft die Erfindung ein solches System, bei dem der Mantel, insbesondere als Außenleiter, einen oder mehrere Innenleiter einer gemantelten und insbesondere geschirmten Einfach- oder Mehrfachleitung (z.B. Koaxialleitung) umgibt. The invention relates to a system comprising a printed circuit board and a tubular jacket connected to the printed circuit board, in particular conductors. In particular, the invention relates to such a system in which the jacket, in particular as outer conductor, surrounds one or more inner conductors of a sheathed and in particular shielded single or multiple line (for example coaxial line).
Derartige Systeme sind Teil einer Vielzahl von Vorrichtungen, in denen Hochfrequenzsignale übertragen und verarbeitet werden (z.B. Multimediageräte). Der oder die für die Hochfrequenzsignalübertragung vorgesehenen Innenleiter der geschirmten Einfach- oder Mehrfachleitungen sind mit definierten " Leiterbahnen der Leiterplatte elektrisch leitend verbunden, während der Außenleiter (Mantel) als Schirmung für die Innenleiter dient und dazu regelmäßig mit einem an Masse angeschlossenen Kontaktbereich der Leiterplatte elektrisch leitend verbunden ist. Die Verbindungen zwischen den Innen- und Außenleitern und den entsprechenden Kontaktbereichen der Leiterplatte kann dabei form-, kraft- oder stoffschlüssig erfolgen. Für eine stoffschlüssige Verbindung wird vielfach gelötet, wobei bei dem Verlöten großflächiger Kontaktflächen aus Kostengründen punktuelle oder abschnittsweise Lötstellen realisiert werden. Für bestimmte Anwendungen kann es erforderlich sein, die Verbindung zwischen der Leiterplatte und der Koaxialleitung abzudichten, um insbesondere ein Vordringen von Feuchtigkeit bis zu den Innenleitern und deren Kontaktstellen mit den Leiterbahnen der Leiterplatte oder auch ein Eindringen von Feuchtigkeit über die Kontaktstellen in ein den Außenleiter umgebendes Gehäuse zu vermeiden. Hierzu wird regelmäßig ein separates Dichtelement, beispielsweise ein herkömmlicher O-Ring eingesetzt, der im Kontaktbereich zwischen der Leiterplatte und dem Außenleiter angeordnet wird. Diese Art der Abdichtung ist mit relativ hohen Kosten verbunden, die nicht nur in den Bauteilkosten für das Dichtelement begründet sind, sondern auch aus der relativ aufwändigen Montage des Systems resultieren. Such systems are part of a variety of devices in which radio frequency signals are transmitted and processed (eg, multimedia devices). The one or more provided for the high-frequency signal transmission inner conductor of the shielded single or multiple lines are electrically conductive with defined " traces of the circuit board, while the outer conductor (sheath) serves as a shield for the inner conductor and to regularly electrically connected to a grounded contact region of the circuit board The connections between the inner and outer conductors and the corresponding contact regions of the printed circuit board can be made in a positive, cohesive or materially bonded manner , For certain applications, it may be necessary to seal the connection between the printed circuit board and the coaxial line, in particular a penetration of moisture to the inner conductors and their contact points with the conductor tracks of the circuit board or moisture through the contact points in a surrounding the outer conductor Avoid housing. For this purpose, a separate sealing element, for example, a conventional O-ring is used regularly, which is arranged in the contact region between the circuit board and the outer conductor. This type of sealing is associated with relatively high costs, which are not only due to the component costs for the sealing element, but also result from the relatively complex assembly of the system.
Ausgehend von diesem Stand der Technik lag der Erfindung die Aufgabe zugrunde, eine Möglichkeit zur kostengünstigen Abdichtung der Verbindung einer Leiterplatte mit einer ummantelten und insbesondere geschirmten Leitung anzugeben. Based on this prior art, the present invention seeks to provide a way to inexpensively seal the connection of a circuit board with a sheathed and especially shielded cable.
Diese Aufgabe wird durch ein System gemäß dem unabhängigen Anspruch 1 gelöst. Vorteilhafte Ausgestaltungen des erfindungsgemäßen Systems sind Gegenstand der abhängigen Ansprüche und ergeben sich aus der nachfolgenden Beschreibung der Erfindung. This object is achieved by a system according to independent claim 1. Advantageous embodiments of the system according to the invention are the subject of the dependent claims and will become apparent from the following description of the invention.
Der Erfindung liegt der Gedanke zugrunde, die Verbindung zwischen der Leiterplatte und einem rohi-förmigen Mantel, insbesondere einem Außenleiter einer geschirmten Einfach- oder Mehrfachleitung, durch Löten auszubilden und die Lötverbindung derart auszubilden, dass diese gleichzeitig zur Abdichtung des Verbindungsbereichs dienen kann. Dazu ist erforderlich, dass der verlötete Verbindungsbereich vollumfänglich bezüglich des Querschnitts des Mantels vorgesehen und zudem so großflächig ausgebildet ist, dass mittels des in den Kontaktzwischenraum zwischen der Leiterplatte und dem Mantel eingebrachten Lots ein ausreichende Dichtwirkung erzielt werden kann. Dementsprechend ist ein System aus einer Leiterplatte und einem vorzugsweise mit der Leiterplatte elektrisch leitend verbundenen, rohrförmigen (und vorzugsweise elektrisch leitfähigem) Mantel, insbesondere Leiter, erfindungsgemäß dadurch gekennzeichnet, dass der Mantel die Leiterplatte stirnseitig mit einer flächigen, geschlossen ringförmigen (z.B. kreisringförmigen, quadratischen, rechteckigen, etc.) Kontaktfläche kontaktiert und die Leiterplatte mit dem Mantel vollumfänglich (bevorzugt vollflächig) entlang der Kontaktfläche verlötet ist. The invention is based on the idea to form the connection between the printed circuit board and a rohi-shaped shell, in particular an outer conductor of a shielded single or multiple line, by soldering and form the solder joint such that it can simultaneously serve to seal the connection area. For this purpose, it is necessary for the soldered connection region to be provided completely with respect to the cross section of the jacket and, moreover, to be of such a large surface area that a sufficient sealing effect can be achieved by means of the solder introduced into the contact gap between the printed circuit board and the jacket. Accordingly, a system comprising a printed circuit board and a tubular (and preferably electrically conductive) sheath, in particular a conductor, which is preferably electrically conductively connected to the printed circuit board is inventively characterized in that the sheath has the face side with a flat, closed annular (eg annular, square , rectangular, etc.) contacted contact surface and the circuit board with the jacket is fully (preferably full surface) soldered along the contact surface.
Um eine für eine gute Dichtwirkung ausreichend große Kontaktfläche zu erhalten kann es vorteilhaft sein, dass die Stärke der Kontaktfläche größer als die Wandstärke des Mantels in einem von der Kontaktfläche beabstandeten Abschnitt ist. Insbesondere kann vorgesehen sein, dass die Stärke der Kontaktfläche größer als die Normalwandstärke, d.h. diejenige Wandstärke, die der Mantel entlang des größten Teils seiner Länge aufweist, ist. Um dies zu erreichen kann beispielsweise vorgesehen sein, dass der Mantel an seinem kontaktseitigen Ende mit einer Verdickung ausgebildet ist, die beispielsweise als umlaufender Absatz ausgebilde t sein kann. Dabei muss der Absatz nicht einteilig mit dem (Rest-)Mantel ausgebildet sein. Alternativ kann auch vorgesehen sein, dass der Mantel an seinem kontaktseitigen Ende z.B. die Normalwandstärke aufweist und zur Vergrößerung der Kontaktfläche ein Endabschnitt radial nach außen weisend (insbesondere um 90°) umgebogen wird. Für eine ausreichende gute Dichtwirkung kann vorzugsweise vorgesehen sein, dass die Stärke der ringförmigen Kontaktfläche mindestens 0,3 mm beträgt. Neben einer ausreichend guten Dichtwirkung kann durch eine Vergrößerung der Kontaktfläche auch eine Erhöhung der Festigkeit der durch das Verlöten erzielten mechanischen Verbindung zwischen der Leiterplatte und dem Mantel realisiert werden. In order to obtain a sufficiently large contact surface for a good sealing effect, it may be advantageous for the thickness of the contact surface to be greater than the wall thickness of the jacket in a section spaced from the contact surface. In particular, it may be provided that the thickness of the contact surface is greater than the normal wall thickness, i. that wall thickness that the shell has along most of its length is. To achieve this, for example, be provided that the jacket is formed at its contact-side end with a thickening, which can be formed, for example, as a circumferential paragraph t. The heel does not have to be formed integrally with the (residual) jacket. Alternatively, it can also be provided that the jacket at its contact-side end, e.g. has the normal wall thickness and to increase the contact surface an end portion facing radially outward (in particular by 90 °) is bent. For a sufficient good sealing effect can preferably be provided that the thickness of the annular contact surface is at least 0.3 mm. In addition to a sufficiently good sealing effect can be realized by increasing the contact surface and an increase in the strength of the achieved by soldering mechanical connection between the circuit board and the jacket.
Die erfindungsgemäße Art zur Abdichtung der Verbindung zwischen einer Leiterplatte und einem rohrförmigen Mantel kann insbesondere dann vorteilhaft eingesetzt werden, wenn der Mantel (mindestens) einen Innenleiter umgibt. Dies kann insbesondere gelten, wenn der oder die Innenleiter zur Übertragung von Hochfrequenzsignalen vorgesehen sind und daher besondere Anforderungen, insbesondere hinsichtlich des Korrosionsschutzes, an die Kontaktstellen zwischen den Innenleiter und den dazugehörigen Kontaktbereichen der Leiterplatte gestellt werden. Dabei kann der Mantel insbesondere elektrisch leitfähig und weiterhin bevorzugt als Leiter ausgebildet sein. Der Mantel kann somit als Schirmung und insbesondere als Außenleiter für die Innenleiter dienen. The inventive type for sealing the connection between a printed circuit board and a tubular jacket can be used advantageously in particular when the jacket (at least) surrounds an inner conductor. This may apply in particular if the one or more Inner conductor for the transmission of high-frequency signals are provided and therefore special requirements, in particular with regard to the corrosion protection, are made to the contact points between the inner conductor and the associated contact areas of the circuit board. In this case, the sheath may in particular be electrically conductive and furthermore preferably designed as a conductor. The jacket can thus serve as a shield and in particular as an outer conductor for the inner conductor.
Der Mantel kann vorzugsweise vollständig aus einem geeigneten Metall ausgebildet sein. Dadurch kann dieser ohne weiteres die vorzugsweise vorgesehene elektrisch Leitfähigkeit aufweisen und zudem auch problemlos verlötbar sein. Der Mantel kann aber auch aus anderen Materialien bestehen. Beispielsweise kann der Mantel zumindest teilweise aus Kunststoff ausgebildet sein. Die Lötfähigkeit und gegebenenfalls die Leitfähigkeit kann dann beispielsweise mittels einer metallischen (Teil- )Beschichtung erzielt werden. The jacket may preferably be formed entirely from a suitable metal. As a result, it can easily have the preferably provided electrical conductivity and, moreover, can also be soldered without difficulty. The coat can also consist of other materials. For example, the jacket may be at least partially made of plastic. The solderability and optionally the conductivity can then be achieved, for example, by means of a metallic (partial) coating.
Die Erfindung wird nachfolgend anhand eines in den Zeichnungen dargestellten Ausführungsbeispiels näher erläutert. In den Zeichnungen zeigt: The invention will be explained in more detail with reference to an embodiment shown in the drawings. In the drawings shows:
Fig. 1 : ein erfindungsgemäßes System in einer ersten perspektivischen Fig. 1: an inventive system in a first perspective
Ansicht; Fig. 2: das System in einer zweiten perspektivischen Ansicht; und  View; 2 shows the system in a second perspective view; and
Fig. 3: das System in einem perspektivischen Längsschnitt. 3 shows the system in a perspective longitudinal section.
Das in den Fig. 1 bis 3 dargestellte erfindungsgemäße System umfasst eine Leiterplatte 1 und eine mit der Leiterplatte 1 verbundene, geschirmte Mehrfachleitung. Die Mehrfachleitung umfasst einen (elektrisch leitfähigen) rohrförmigen Außenleiter 2 mit kreisringförmiger Querschnittsfläche. Innerhalb des Außenleiters 2 sind mehrere, konkret vier (elektrisch leitfähige) Innenleiter 3 in quadratischer Anordnung positioniert. Die Innenleiter 3 sind dabei jeweils in einer Aufnahmeöffnung eines Isolationselements 4 gehalten. Dadurch werden die Innenleiter 3 sowohl innerhalb des Außenleiters 2 lagefixiert als auch elektrisch von dem Außenleiter 2 und den jeweils anderen Innenleitern 3 isoliert. The system according to the invention shown in FIGS. 1 to 3 comprises a printed circuit board 1 and a shielded multiple line connected to the printed circuit board 1. The multiple line comprises an (electrically conductive) tubular outer conductor 2 with an annular cross-sectional area. Within the outer conductor 2, a plurality of, specifically four (electrically conductive) inner conductor 3 are positioned in a square arrangement. The inner conductors 3 are each held in a receiving opening of an insulating element 4. As a result, the inner conductors 3 are fixed in position both within the outer conductor 2 and also electrically isolated from the outer conductor 2 and the respective other inner conductors 3.
Die Innenleiter 3 ragen mit ihren kontaktseitigen Endabschnitten durch Durchgangsöffnungen der Leiterplatte 1 und kontaktieren auf der der Mehrfachleitung beabstandeten Seite mit jeweils zugeordneten Kontaktbereichen von Leiterbahnen der Leiterplatte 1. Dabei kann auch vorgesehen sein, die Innenleiter 3 mit den Kontaktbereichen zu verlöten. The inner conductors 3 protrude with their contact-side end portions through through holes of the printed circuit board 1 and contact on the multi-line spaced side with respectively associated contact areas of printed conductors of the printed circuit board 1. It can also be provided to solder the inner conductor 3 to the contact areas.
Der Außenleiter 2 kontaktiert einen hierfür vorgesehenen Kontaktbereich der Leiterplatte 1 stirnseitig mit einer flächigen, geschlossen kreisringförmigen Kontaktfläche. Die mechanische Verbindung zwischen dem Außenleiter 2 und dem dazugehörigen Kontaktbereich der Leiterplatte 1 wird durch Verlöten erreicht, wozu in bekannter Weise aufgeschmolzenes Lot in den zwischen der Kontaktfläche des Außenleiters 2 und dem Kontaktbereich der Leiterplatte 1 ausgebildeten Kontaktspalt eingebracht wird. The outer conductor 2 contacts a contact region of the printed circuit board 1 provided for this purpose with a flat, closed annular contact surface. The mechanical connection between the outer conductor 2 and the associated contact region of the printed circuit board 1 is achieved by soldering, for which, in a known manner, molten solder is introduced into the contact gap formed between the contact surface of the outer conductor 2 and the contact region of the printed circuit board 1.
Die Lötverbindung dient gleichzeitig als Abdichtung, um ein Eindringen von Feuchtigkeit in den von dem Außenleiter 2 ausgebildeten Hohlraum zu vermeiden. Um eine ausreichende Dichtwirkung zu erreichen ist vorgesehen, das Verlöten vollumfänglich entlang der geschlossen kreisringförmigen Kontaktfläche vorzunehmen. Zudem ist die Wandstärke im Bereich der Kontaktfläche größer gewählt, als die Normalwandstärke des Außenleiters 2. Hierzu ist der kontaktseitige Endabschnitt des Außenleiters 2 außenseitig mit einem umlaufenden Absatz 5 versehen, durch den eine Durchmesservergrößerung mit damit einhergehender Vergrößerung der Querschnittsfläche erzielt wird. The solder joint serves as a seal to prevent ingress of moisture into the space formed by the outer conductor 2 cavity. In order to achieve a sufficient sealing effect is provided to carry out the soldering fully along the closed annular contact surface. In addition, the wall thickness in the area of the contact surface is chosen to be greater than the normal wall thickness of the outer conductor 2. For this purpose, the contact-side end portion of the outer conductor 2 is provided on the outside with a peripheral shoulder 5, by which an increase in diameter is achieved with concomitant enlargement of the cross-sectional area.

Claims

Patentansprüche:  claims:
System aus einer Leiterplatte (1) und einem mit der Leiterplatte verbundenen rohrförmigen Mantel, dadurch gekennzeichnet, dass der Mantel die Leiterplatte (1) stirnseitig mit einer flächigen, geschlossen ringförmigen Kontaktfläche kontaktiert und die Leiterplatte (1) mit dem Mantel vollumfänglich entlang der Kontaktfläche verlötet ist. System comprising a printed circuit board (1) and a tubular jacket connected to the printed circuit board, characterized in that the jacket contacts the printed circuit board (1) with a flat, closed annular contact surface and soldered the printed circuit board (1) completely to the jacket along the contact surface is.
System gemäß Anspruch 1 , dadurch gekennzeichnet, dass der Mantel als Leiter ausgebildet ist, der mit der Leiterplatte elektrisch leitend verbunden ist. System according to claim 1, characterized in that the jacket is formed as a conductor which is electrically conductively connected to the circuit board.
System gemäß Anspruch 1 oder 2, dadurch gekennzeichnet, dass die Wandstärke des Mantels im Bereich der Kontaktfläche größer als in einem von der Kontaktfläche beabstandeten Abschnitt ist. System according to claim 1 or 2, characterized in that the wall thickness of the jacket is greater in the region of the contact surface than in a portion spaced from the contact surface.
System gemäß einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass der Mantel mindestens einen Innenleiter (3) umgibt. System according to one of the preceding claims, characterized in that the jacket surrounds at least one inner conductor (3).
EP14742152.3A 2013-07-24 2014-07-15 System consisting of a printed circuit board and tubular casing Active EP3025397B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE202013006662U DE202013006662U1 (en) 2013-07-24 2013-07-24 System of circuit board and tubular jacket
PCT/EP2014/001934 WO2015010776A1 (en) 2013-07-24 2014-07-15 System consisting of a printed circuit board and tubular casing

Publications (2)

Publication Number Publication Date
EP3025397A1 true EP3025397A1 (en) 2016-06-01
EP3025397B1 EP3025397B1 (en) 2018-03-07

Family

ID=49112598

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14742152.3A Active EP3025397B1 (en) 2013-07-24 2014-07-15 System consisting of a printed circuit board and tubular casing

Country Status (9)

Country Link
US (1) US20160285179A1 (en)
EP (1) EP3025397B1 (en)
JP (1) JP2016525777A (en)
KR (1) KR20160034941A (en)
CN (1) CN105409063A (en)
CA (1) CA2917354A1 (en)
DE (1) DE202013006662U1 (en)
TW (1) TWM491977U (en)
WO (1) WO2015010776A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014118175A1 (en) * 2014-12-09 2016-06-09 Connaught Electronics Ltd. Camera for a motor vehicle with a connecting device, which is designed as a surface-mounted component, and motor vehicle
DE102017115914B3 (en) 2017-07-14 2018-10-31 HARTING Electronics GmbH Printed circuit board connector with a screen element

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Publication number Priority date Publication date Assignee Title
DE3505616C1 (en) * 1985-02-19 1986-09-04 Philips Patentverwaltung Gmbh, 2000 Hamburg Method for soldering the outer conductor contact sleeve of a coaxial cable connector or a coaxial cable connector
KR890004248Y1 (en) * 1986-10-11 1989-06-26 송재찬 Plug for coaxial cables
JP2704305B2 (en) * 1990-03-15 1998-01-26 日本エー・エム・ピー株式会社 High frequency connector and method of manufacturing the same
JPH0475271A (en) * 1990-07-17 1992-03-10 Shinko Electric Ind Co Ltd Receptacle of coaxial connector
GB9019540D0 (en) * 1990-09-07 1990-10-24 Amp Great Britain Coaxial electrical connectors and their manufacture
JP3049952B2 (en) * 1992-07-10 2000-06-05 安藤電気株式会社 How to attach a coaxial airtight connector to an airtight package
US5842872A (en) * 1995-06-30 1998-12-01 The Whitaker Corporation Modular right angle board mountable coaxial connector
US5645454A (en) * 1995-11-24 1997-07-08 Itt Corporation Right angle coaxial connector and method of assembling same
GB9706155D0 (en) * 1997-03-25 1997-05-14 Decolletage Sa Saint Maurice Coaxial connector for circuit board
US6305947B1 (en) * 1998-11-19 2001-10-23 Berg Technology, Inc. Angled coaxial connector module
US6575761B1 (en) * 2000-08-30 2003-06-10 Molex Incorporated Coaxial connector module and method of fabricating same
TW555194U (en) * 2002-11-29 2003-09-21 Hon Hai Prec Ind Co Ltd Electrical connector
DE102010016578B3 (en) * 2010-04-22 2011-10-27 Ept Gmbh Device for sealing printed circuit board plug connector opposite to printed circuit board surface area, has two gaskets arranged at side of frame and sealingly connected with printed circuit board surface area
JP5705062B2 (en) * 2011-08-08 2015-04-22 タイコエレクトロニクスジャパン合同会社 connector

Also Published As

Publication number Publication date
CN105409063A (en) 2016-03-16
JP2016525777A (en) 2016-08-25
TWM491977U (en) 2014-12-11
KR20160034941A (en) 2016-03-30
CA2917354A1 (en) 2015-01-29
US20160285179A1 (en) 2016-09-29
DE202013006662U1 (en) 2013-08-08
WO2015010776A1 (en) 2015-01-29
EP3025397B1 (en) 2018-03-07

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