EP2963387B1 - Mikroelektromechanische vorrichtung mit kompensierung von fehlern auf grundlage von störkräften, wie etwa quadraturkomponenten - Google Patents

Mikroelektromechanische vorrichtung mit kompensierung von fehlern auf grundlage von störkräften, wie etwa quadraturkomponenten Download PDF

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EP2963387B1
EP2963387B1 EP15172600.7A EP15172600A EP2963387B1 EP 2963387 B1 EP2963387 B1 EP 2963387B1 EP 15172600 A EP15172600 A EP 15172600A EP 2963387 B1 EP2963387 B1 EP 2963387B1
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Prior art keywords
driving
mass
suspended
sensing
suspended mass
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French (fr)
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EP2963387A1 (de
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Luca Giuseppe Falorni
Carlo Valzasina
Roberto Carminati
Alessandro TOCCHIO
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STMicroelectronics SRL
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STMicroelectronics SRL
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5705Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis
    • G01C19/5712Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5776Signal processing not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • G01C19/5733Structural details or topology
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0086Electrical characteristics, e.g. reducing driving voltage, improving resistance to peak voltage
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • G01C19/5733Structural details or topology
    • G01C19/574Structural details or topology the devices having two sensing masses in anti-phase motion
    • G01C19/5747Structural details or topology the devices having two sensing masses in anti-phase motion each sensing mass being connected to a driving mass, e.g. driving frames
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/02Sensors
    • B81B2201/0228Inertial sensors
    • B81B2201/025Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/01Suspended structures, i.e. structures allowing a movement
    • B81B2203/0145Flexible holders
    • B81B2203/0163Spring holders

Definitions

  • the present invention relates to a micro-electro-mechanical device with compensation of errors due to disturbance forces, such as quadrature components.
  • MEMSs Micro-Electro-Mechanical Systems
  • inertial sensors are manufactured, such as microintegrated gyroscopes and electro-mechanical oscillators.
  • MEMSs of this type are generally based upon micro-electro-mechanical structures comprising a supporting body and at least one mobile mass, coupled to the supporting body through springs or "flexures".
  • the springs are configured for enabling the mobile mass to oscillate with respect to the supporting body according to one or more freedom degrees.
  • the mobile mass is capacitively coupled to a plurality of fixed electrodes on the supporting body, thus forming variable capacitance capacitors.
  • the movement of the mobile mass with respect to the fixed electrodes on the supporting body modifies the capacitance of the capacitors; thus, it is possible to detect the displacement of the mobile mass with respect to the supporting body and the external force.
  • suitable biasing voltages are supplied, for example through a separate set of driving electrodes, the mobile mass may be subjected to an electrostatic force that causes movement thereof.
  • the frequency response of the MEMS structures is usually exploited, which is of a second-order low-pass type, and has a resonance frequency.
  • MEMS gyroscopes in particular, have a complex electro-mechanical structure, which typically comprises at least two masses that are mobile with respect to the supporting body, coupled to each other so as to have a number of degrees of freedom depending upon the architecture of the system. In the majority of cases, each mobile mass has one or at the most two degrees of freedom.
  • the mobile masses are capacitively coupled to the supporting body through fixed and mobile sensing and driving electrodes.
  • a first mobile mass is dedicated to driving and is kept in oscillation at the resonance frequency at a controlled oscillation amplitude.
  • the second mobile mass is driven with oscillatory (translational or rotational) motion and, in case of rotation of the microstructure about a gyroscope axis at an angular velocity, is subjected to a Coriolis force proportional to the angular velocity itself.
  • the second (driven) mobile mass acts as an accelerometer that enables detection of the Coriolis force and detection of the angular velocity.
  • a single suspended mass is coupled to the supporting body to be mobile with respect to the latter with two independent degrees of freedom, and precisely one driving degree of freedom and one sensing degree of freedom.
  • the latter may include a movement of the mobile mass in the plane ("in-plane movement”) or perpendicular thereto ("out-of-plane movement").
  • a driving device keeps the suspended mass in controlled oscillation according to one of the two degrees of freedom.
  • the suspended mass moves on basis of the other degree of freedom in response to rotation of the supporting body about a sensing axis, because of the Coriolis force.
  • a driving force is applied that keeps the suspended mass in oscillation at the resonance frequency.
  • a reading device detects the displacements of the suspended mass. These displacements represent the Coriolis force and the angular velocity and may be detected using electrical reading signals correlated to variations of the capacitance between the second (driven) mass and the fixed electrodes.
  • MEMS gyroscopes have a complex structure and frequently have non-ideal electro-mechanical interactions between the suspended mass and the supporting body. Consequently, the useful signal components are mixed with spurious components, which do not contribute to the measurement of the angular velocity.
  • the spurious components may depend upon various causes. For instance, manufacturing defects and process spread are potentially inevitable sources of noise, the effect whereof is unforeseeable.
  • a common defect depends upon the fact that the oscillation direction of the driving mass does not perfectly matches the degrees of freedom desired in the design stage. This defect is normally due to imperfections in the elastic connections between the suspended mass and the supporting body and causes onset of a force directed along the detection degree of freedom of the angular velocity. This force in turn generates an error, referred to as "quadrature error", due to a signal component of unknown amplitude, at the same frequency as the carrier and with a phase shift of 90°.
  • the quadrature components are so large that they may not simply be neglected without introducing significant errors. Normally, at the end of the manufacturing process, calibration factors are used in order to reduce the errors within acceptable margins. However, in many cases, the problem is not completely solved, since the amplitude of the quadrature oscillations may vary during the life of the device.
  • the supporting body may be subject to deformations due to mechanical stresses or temperature variations. In turn, the deformations of the supporting body may cause unforeseeable variations in the movements of the masses and, consequently, in the quadrature components, which are no longer effectively compensated.
  • US 2007/0034005 discloses a three-degrees of freedom gyroscope having a two-DOF sense-mode oscillator and providing a frequency response with two resonant peaks and a flat therebetween.
  • the gyroscope is operated in the flat region, with dynamic amplification of the oscillation of the sense-mode oscillator.
  • the sense-mode oscillator has a first mass that is driven and a second mass whose oscillation is sensed by sense electrodes. This solution entails a difficult setting and may require a large integration areas.
  • US2005/199061 discloses a four-degree-of-freedom gyroscope using a two-mass system, wherein the driven mass oscillates in the drive direction and is constrained from movement in the sense direction, and sensing masses oscillate independently from each other in the sense direction.
  • the third mass also acts as a vibration absorber.
  • the aim of the present invention is to solve the problem referred to above and reduce the incidence of the quadrature oscillations in MEMS gyroscopes.
  • a MEMS gyroscope is provided, as defined in claim 1.
  • the present gyroscope uses a dynamic absorber that is able to compensate undesired forces, such as quadrature components of inertial systems, which may cause undesired displacements on a suspended mass.
  • the dynamic absorber comprises a tuned damping mass, fixed to the suspended mass or system of suspended masses and configured to have a natural frequency tuned to the undesired forces to be compensated. In this way, the damping mass reduces the dynamic response of the suspended mass and stabilizes it.
  • An embodiment of the present device uses two masses, one whereof is mobile with respect to the supporting body and is elastically connected thereto.
  • This mobile mass is coupled to the substrate so as to have two degrees of freedom, dedicated, respectively, to driving and movement sensing, here out of the plane, as a result of the Coriolis force.
  • Another mass works as a dynamic absorber.
  • FIG. 1 showing a block diagram of a MEMS device 1, such as a gyroscope, having two degrees of freedom (even though the following considerations also apply to systems having N degrees of freedom).
  • Figure 1 schematically shows a MEMS device 1 represented schematically in its basic elements as regards the dynamic behaviour according to one degree of freedom (displacement along an axis Z in presence of undesired components, for example, quadrature components, along this axis), thus neglecting any movements in other directions.
  • the considerations hereinafter are thus aimed at highlighting the conditions whereby the effect of the undesired force in the considered direction is cancelled out.
  • the MEMS device 1 comprises a suspended mass 2 and a damping mass 3.
  • the suspended mass 2 is constrained to a supporting body 4 through a first system of springs 5 having elastic constant k 1 and to the damping mass 3 through a second system of springs 6 having elastic constant k 2 .
  • the damping mass 3 operates as notch filter or dynamic absorber, analogously to the known solutions for stabilizing skyscrapers and antiseismic buildings.
  • This behaviour may be exploited in a MEMS device when it is desired to prevent spurious displacements in the sensing direction.
  • Figures 3 and 4 show a possible embodiment of the quadrature component damping solution in a generic MEMS device 10.
  • the suspended mass 2 surrounds the damping mass 3 and is anchored to a supporting body 11 ( Figure 4 ) via anchorage regions 12 and the first springs 5.
  • the suspended mass 2 is elastically coupled to the damping mass 3 through the second springs (coupling springs) 6.
  • the second springs 6 are also comprised within the overall dimensions of the suspended mass 2 and are arranged between the latter and the damping mass 3.
  • the suspended mass 2 and the damping mass 3 are formed in the same structural layer 14, for example of semiconductor material, such as mono- or polycrystalline silicon, and are suspended over the supporting body 11, for example a substrate of semiconductor material, such as monocrystalline silicon.
  • the suspended mass 2 is driven in the direction of the arrow 7 (direction X) and, thanks to the springs 5, may move in the direction Z (sensing direction).
  • fixed electrodes (not shown) are formed over the supporting body 11 and capacitively coupled to the suspended mass 2, in a known manner.
  • an undesired force acts on the masses 2 and 3 in a direction Z perpendicular to the plane of the masses 2, 3. Due to the presence of the damping mass 3 and by driving the suspended mass 2 at the natural frequency ⁇ 22 of the damping mass 3, this force is compensated for on the suspended mass 2 and does not cause, to a first approximation, a displacement thereof in the direction Z. Instead, the damping mass 3 undergoes a movement having a component along the axis Z, as shown in Figure 4 . In this way, any movements in the direction Z of the suspended mass 2 are due only to different external forces and may thus be detected without substantial errors.
  • Figure 5 shows a gyroscope 20 having four sensing masses 21-24 supported by first, second, and third anchorage regions 25A, 25B and 25C.
  • the support regions 25A, 25B and 25C may be connected to a semiconductor substrate, for example of monocrystalline silicon, not shown in the figures, similar to the supporting body 11 of Figure 4 .
  • the mobile masses 21-24 are defined by respective plates having a substantially trapezoidal shape, arranged symmetrically in pairs with respect to a centre C of the gyroscope 20 and parallel, in rest condition, to the drawing plane (plane XY).
  • a first sensing mass 21 and a second sensing mass 23 are driven along a first driving axis D1 and are arranged symmetrically to each other with respect to a second driving axis D2, perpendicular to D1.
  • a third sensing mass 22 and a fourth sensing mass 24 are arranged symmetrically to each other with respect to the first driving axis D1 and are driven along the second driving axis D2.
  • the first and second sensing masses 21, 23 are connected to the first anchorage regions 25A through first elastic springs 30.
  • the third and fourth sensing masses 22, 24 are connected to the first and second anchorage regions 25A, 25B through two driving structures 27 arranged laterally and externally (with respect to the centre C) to the third and fourth sensing masses 22, 24.
  • the third and fourth sensing masses 22, 24 are connected to the driving structures 27 through second elastic springs 31, and the driving structures 27 are connected to the first and second anchorage regions 25A, 25B through third and fourth elastic springs 32, 33.
  • the first and second sensing masses 21, 23 are further connected to the driving structures 27 through fifth elastic springs 35.
  • the sensing masses 21-24 are coupled to a central bridge 26, with a square annular shape, through sixth elastic springs 36.
  • the central bridge 26 is in turn coupled to the third anchorage region 25C through seventh elastic springs 37.
  • the elastic springs 30-37 are configured to provide the sensing masses 21-24 with two degrees of freedom with respect to the support regions 25A-25C. More precisely, the fifth elastic springs 35 are configured to cause the first and second sensing masses 21 and 23 to translate along the first driving axis D1, whereas the third elastic springs 33 are configured to cause the third and fourth sensing masses 22 and 24 to translate along the second driving axis D2.
  • the first, fifth, and sixth springs 30, 35 36 further enable the first and second sensing masses 21 and 23 to tilt about respective sensing axes A1, A2 parallel to each other and perpendicular to the first driving axis D1.
  • the second and sixth springs 32, 36 further enable the second and fourth sensing masses 22 and 24 to tilt about respective sensing axes A3, A4 parallel to each other and perpendicular to the second driving axis D2.
  • the driving axes D1, D2 and the sensing axes A1-A4 are all parallel to plane XY.
  • the central bridge 26 is defined by a rigid semiconductor element, having a substantially hollow quadrangular shape, and is in turn independently tiltable about the first and second driving axes D1, D2.
  • first and second sensing masses 21, 23 both rotate clockwise or both counterclockwise about the respective sensing axes A1, A2.
  • the third and fourth sensing masses 22, 24 both rotate clockwise or both rotate counterclockwise about the respective sensing axes A3, A4.
  • the driving structures 27 are here each formed by two driving units 47 and by a drive detection unit 38.
  • the units 38, 39 are formed by sets of fixed electrodes 40 and mobile electrodes 41, mutually comb-fingered.
  • the fixed electrodes 40 are connected to the substrate in a way not shown.
  • the mobile electrodes 41 are connected to a mobile frame 43 for each driving structure 27, the frame being connected to the sensing masses 21-14 in the way described above.
  • the electrodes 40, 41 of the driving units 47 are biased so as to generate electrostatic, attraction or repulsion forces between the fixed and mobile electrodes 40, 41. These forces cause a movement of the mobile frames 43 in the direction of the second driving axis D2. As referred to above, this movement of the mobile frames 43 is transferred directly and parallel to the second and fourth sensing masses 22, 24 and, as a result of the configuration of the sixth elastic springs 35, perpendicularly to the first and third sensing masses 21, 23.
  • the drive detection unit 38 detects, through its own fixed electrodes 55 and mobile electrodes 56, the effective movement imparted by the driving units 47 in order to ensure a precise control.
  • sensing electrodes are formed on the substrate, under the sensing masses 21-24, to detect the movement thereof in the direction Z.
  • Each sensing mass 21-24 further carries a respective damping mass 45.
  • each damping mass 45 is formed within the perimeter of the respective sensing mass 21-24 and is elastically coupled thereto through bilateral springs 46, corresponding to the second springs 6 of Figure 3 .
  • the damping masses 45 are equal, are provided in a same structural layer, for example a polysilicon layer, and are all supported in the same way, so as to have the same natural frequency ⁇ 22 .
  • the sensing masses 21-24 do not undergo a displacement in the respective sensing direction along axis Z due to the quadrature forces. It follows that the reading is not affected by quadrature components.
  • the drive detection unit 38 is connected to a control circuit (not shown), for example, formed together with the control and reading algorithms of the gyroscope 20 in an ASIC (Application-Specific Integrated Circuit), which enables, in closed loop, a precise control of the driving frequency for keeping it equal to the notch frequency or within a preset range of variability.
  • a control circuit not shown
  • ASIC Application-Specific Integrated Circuit
  • the implementation of the mechanical filter does not entail variations in the manufacture steps of the microstructure, but an appropriate design and modification of the layout thereof are sufficient.
  • Control of the driving frequency is simple. In some cases, no additional component is required since at times MEMS structures already have a driving control system. In any case, insertion of the drive detection unit 38 does not entail any re-design of the MEMS structure, and the routine for controlling the oscillation frequency may be integrated in the ASIC.
  • Figure 6 illustrates a portion of an electronic system 100 according to an embodiment of the present invention.
  • the system 100 incorporates the gyroscope 20 and may be used in devices such as, for example, a tablet, a laptop, or a portable computer, for example with wireless capacity, a smartphone, a messaging device, a digital music player, a digital photo or video camera, or other device designed for processing, storing, transmitting, or receiving information.
  • the gyroscope 20 may be used in a digital videocamera to detect movements and carrying out image stabilization.
  • the gyroscope 20 may be included in a portable computer, a PDA, or a smartphone for detecting a free-fall condition and activating a safety configuration or for activating or controlling functions based upon motion of the device.
  • the gyroscope 20 may be included in a motion-activated user interface for computers or consoles for videogames.
  • the gyroscope 20 may be incorporated in a satellite-navigation device and be used for temporarily tracking of the position in case of loss of the satellite-positioning signal.
  • the electronic system 100 may comprise a controller 110, an input/output device 120, for example, a keyboard or a display, the MEMS device 1, a wireless interface 140, and a memory 160, of a volatile or non-volatile type, coupled together through a bus 150.
  • a battery 180 may supply the system 100. It should be noted that the scope of the present invention is not limited to embodiments that necessarily have one or all of the mentioned devices.
  • the controller 110 may comprise one or more microprocessors, microcontrollers, and the like.
  • the controller 110 may, for example, be formed in an ASIC and include the components and algorithms for controlling the drive frequency on the basis of the signals supplied by the drive detection unit 38.
  • the input/output device 120 may be used for generating a message.
  • the system 100 may use the wireless interface 140 for transmitting and receiving messages to and from a wireless communication network with radiofrequency signal.
  • wireless interface may comprise an antenna, a wireless transceiver, such as a dipole antenna, even though the invention is not limited thereto.
  • the input/output device 120 may supply a voltage representing what is stored in digital or analogue form.
  • a mechanical filter of the described type may be implemented in various types of MEMS microstructures of an inertial type.
  • this solution may be applied to microstructures with a different number of degrees of freedom by providing each degree of freedom with an appropriate tuned damper.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
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  • Gyroscopes (AREA)

Claims (8)

  1. MEMS-Gyroskop (1; 20), umfassend ein Massesystem (2; 4; 11, 12; 21 bis 24; 25A bis 25C), einen dynamischen Absorber (3, 6; 45, 46) und eine Antriebsstruktur (27), wobei:
    das Massesystem eine Trägerregion (4; 11, 12; 25A bis 25C) und eine aufgehängte Masse (2; 21 bis 24) umfasst, wobei die aufgehängte Masse durch die Trägerregion über erste elastische Elemente (5; 30 bis 37) elastisch getragen wird und Störkräften entlang einer Vibrationsrichtung ausgesetzt ist;
    der dynamische Absorber (3, 6; 45, 46) konfiguriert ist, Bewegungen der aufgehängten Masse durch Störkräfte zu verringern, wobei der dynamische Absorber eine Dämpfungsmasse (3; 45) umfasst, die mit der aufgehängten Masse (2; 21 bis 24) durch zweite elastische Elemente (6; 46) gekoppelt ist und eine natürliche Oszillationsfrequenz (ω22) aufweist;
    die ersten und zweiten elastischen Elemente konfiguriert sind, die aufgehängte Masse und die Dämpfungsmasse in die Lage zu versetzen, sich in der Schwingungsrichtung zu bewegen;
    die Antriebsstruktur (27) mit der aufgehängten Masse (2; 21 bis 24) durch dritte elastische Elemente (33, 35) verbunden ist und konfiguriert ist, die aufgehängte Masse (2; 21 bis 24) in einer Antriebsrichtung orthogonal zu der Schwingungsrichtung mit der natürlichen Oszillationsfrequenz (ω22) der Dämpfungsmasse (3; 45) anzutreiben; und
    die aufgehängte Masse kapazitiv mit feststehenden Sensorelektroden gekoppelt ist.
  2. MEMS-Gyroskop nach Anspruch 1, wobei die Störkräfte Quadraturkräfte sind, die auf die Masse in der Schwingungsrichtung mit der natürlichen Oszillationsfrequenz der Dämpfungsmasse (3; 45) einwirken.
  3. MEMS-Gyroskop nach Anspruch 1 oder 2, wobei die Dämpfungsmasse (3; 45) durch die aufgehängte Masse (2; 21 bis 24) umgeben ist.
  4. MEMS-Gyroskop nach Anspruch 3, umfassend eine strukturelle Lage (14) von Halbleitermaterial wie einem mono- oder polykristallinen Silizium, wobei die Dämpfungsmasse (3; 45) und die aufgehängte Masse (2; 21 bis 24) in der strukturellen Lage geformt sind.
  5. MEMS-Gyroskop nach Anspruch 4, wobei die strukturelle Lage (14) über einem Substrat (11) aufgehängt ist, wobei das Substrat aus einem Halbleitermaterial wie mono- oder polykristallinem Silizium besteht.
  6. MEMS-Gyroskop nach einem der Ansprüche 1 bis 5, wobei das Gyroskop (20) ein biaxiales Gyroskop ist, die aufgehängte Masse zwei Paar Sensormassen (21 bis 24) umfasst, die symmetrisch paarweise um eine erste und eine zweite Antriebsachsen (D1, D2) angeordnet sind; wobei die Sensormassen paarweise symmetrisch bezüglich einer Mittelachse (C) angeordnet sind und elastisch mit einer mittleren Ankerregion (25C) verbunden sind; wobei die Antriebsachsen rechtwinklig zueinander stehen, die Sensormassen (21, 23) eines ersten Paars symmetrisch zu der zweiten Antriebsachse (D2) sind und parallel zu der ersten Antriebsachse (D1) betätigt werden, und die Sensormassen (22, 24) eines zweiten Paars symmetrisch bezüglich der ersten Antriebsachse (D1) sind und parallel zu der zweiten Antriebsachse (D2) betätigt werden; wobei jede Sensormasse (21 bis 24) eine jeweilige Dämpfungsmasse (45) umgibt und elastisch damit gekoppelt ist.
  7. MEMS-Gyroskop nach Anspruch 6, wobei die Antriebsstruktur (27) einen ersten Antriebsrahmen (43) und einen zweiten Antriebsrahmen (43) umfasst, die elastisch mit der Trägerregion (25A, 25B) gekoppelt sind, wobei jeder Antriebsrahmen durch vierte elastische Elemente (35), die entworfen sind, um eine Antriebsbewegung entlang der ersten Antriebsachse (D1) zu übertragen, elastisch mit dem ersten Paar Sensormassen (21, 23) verbunden sind und durch fünfte elastische Elemente (33), die entworfen sind, eine Antriebsbewegung entlang der weiten Antriebsachse (D2) zu übertragen, elastisch mit dem zweiten Paar Sensormassen (22, 24) verbunden sind.
  8. MEMS-Gyroskop nach Anspruch 7, wobei die ersten und zweiten Antriebsrahmen (43) jeweils mindestens eine elektrostatische Antriebseinheit (47) tragen, die konfiguriert ist, eine Antriebsbewegung für den jeweiligen Antriebsrahmen mit der natürlichen Oszillationsfrequenz zu erzeugen, wobei mindestens einer der ersten und zweiten Antriebsrahmen (43) eine Frequenzerkennungseinheit (38) trägt, die konfiguriert ist, eine effektive Antriebsfrequenz der Sensormassen (21 bis 24) zu erkennen.
EP15172600.7A 2014-06-30 2015-06-17 Mikroelektromechanische vorrichtung mit kompensierung von fehlern auf grundlage von störkräften, wie etwa quadraturkomponenten Active EP2963387B1 (de)

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Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2963387B1 (de) * 2014-06-30 2019-07-31 STMicroelectronics Srl Mikroelektromechanische vorrichtung mit kompensierung von fehlern auf grundlage von störkräften, wie etwa quadraturkomponenten
US9885577B2 (en) * 2015-07-30 2018-02-06 Invensense, Inc. Reducing resonance peaks and drive tones from a micro-electro-mechanical system gyroscope response
WO2017075413A1 (en) * 2015-10-28 2017-05-04 Georgia Tech Research Corporation Comb-driven substrate decoupled annulus pitch/roll baw gyroscope with slanted quadrature tuning electrode
ITUA20162172A1 (it) * 2016-03-31 2017-10-01 St Microelectronics Srl Sensore accelerometrico realizzato in tecnologia mems avente elevata accuratezza e ridotta sensibilita' nei confronti della temperatura e dell'invecchiamento
US20180231090A1 (en) * 2016-05-26 2018-08-16 Honeywell International Inc. Systems and methods for a tuned mass damper in mems resonators
US10921123B2 (en) 2016-06-07 2021-02-16 Georgia Tech Research Corporation Pitch/roll annulus gyroscope with slanted quadrature tuning electrodes and related fabrication methods
IT201600081227A1 (it) 2016-08-02 2018-02-02 St Microelectronics Srl Giroscopio mems con regolazione di frequenza e cancellazione elettrostatica dell'errore di quadratura
CN107782299B (zh) * 2016-08-27 2023-09-29 深迪半导体(绍兴)有限公司 一种两轴mems陀螺仪
JP2018122391A (ja) * 2017-01-31 2018-08-09 株式会社リコー Mems素子
IT201700043012A1 (it) * 2017-04-19 2018-10-19 St Microelectronics Srl Giroscopio mems con migliorata reiezione di un errore di quadratura
IT201700099412A1 (it) * 2017-09-05 2019-03-05 St Microelectronics Srl Giroscopio mems con regolazione del mismatch fra la frequenza di pilotaggio e la frequenza di rilevamento
DE102017219929B4 (de) * 2017-11-09 2019-05-23 Robert Bosch Gmbh Mikromechanischer z-Inertialsensor
CN108535969B (zh) * 2018-04-11 2020-06-26 天津商业大学 一种摇摆振动装置
US11333499B2 (en) 2018-09-14 2022-05-17 Honeywell International Inc. Vibratory error compensation in a tuning fork gyroscope such as a Coriolis Vibratory Gyroscope (CVG)
EP3671118B1 (de) 2018-12-19 2021-08-25 Murata Manufacturing Co., Ltd. Vibrationsrobuster mehrachsiger kreisel
EP3671116B1 (de) * 2018-12-19 2021-11-17 Murata Manufacturing Co., Ltd. Synchronisiertes gyroskop mit mehreren achsen
US20220034380A1 (en) * 2019-01-18 2022-02-03 Siemens Medical Solutions Usa, Inc. Single Axis Harmonic Absorber for Cantilever Structure
US11193770B2 (en) * 2019-09-10 2021-12-07 Sensortek Technology Corp. Microelectromechanical systems gyroscope
CN111246336B (zh) 2020-02-27 2022-03-08 深迪半导体(绍兴)有限公司 耳机和电子设备
DE102020205369A1 (de) * 2020-04-28 2021-10-28 Robert Bosch Gesellschaft mit beschränkter Haftung Mikromechanisches Bauteil für einen Drehratensensor und entsprechendes Herstellungsverfahren
EP4054206B1 (de) * 2021-03-01 2023-09-13 Infineon Technologies AG Mems-vorrichtung mit tmd-struktur
FR3140423A1 (fr) * 2022-09-30 2024-04-05 Commissariat A L' Energie Atomique Et Aux Energies Alternatives Capteur inertiel de type MEMS à liaison mécanique spécifique

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050199061A1 (en) * 2004-02-27 2005-09-15 Cenk Acar Nonresonant micromachined gyroscopes with structural mode-decoupling

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5205171A (en) * 1991-01-11 1993-04-27 Northrop Corporation Miniature silicon accelerometer and method
US5456341A (en) * 1993-04-23 1995-10-10 Moog Inc. Method and apparatus for actively adjusting and controlling a resonant mass-spring system
DE4414237A1 (de) * 1994-04-23 1995-10-26 Bosch Gmbh Robert Mikromechanischer Schwinger eines Schwingungsgyrometers
US5992233A (en) * 1996-05-31 1999-11-30 The Regents Of The University Of California Micromachined Z-axis vibratory rate gyroscope
US6006875A (en) * 1998-03-31 1999-12-28 Motran Industries Inc Electrically-tunable vibration absorbers
SG77677A1 (en) * 1999-04-30 2001-01-16 Inst Of Microelectronics A novel structural design for improving the sensitivity of a surface-micromachined vibratory gyroscope
US6367786B1 (en) * 1999-06-07 2002-04-09 California Institute Of Technology Micromachined double resonator
US6516666B1 (en) * 2000-09-19 2003-02-11 Motorola, Inc. Yaw rate motion sensor
GB2377494B (en) * 2001-07-09 2004-07-28 Autoliv Dev "Improvements in or relating to an off-set elimination system for a vibrating gyroscope"
US6928874B2 (en) * 2002-11-15 2005-08-16 The Regents Of The University Of California Dynamically amplified micromachined vibratory angle measuring gyroscopes, micromachined inertial sensors and method of operation for the same
US7034393B2 (en) * 2003-12-15 2006-04-25 Analog Devices, Inc. Semiconductor assembly with conductive rim and method of producing the same
US7193492B2 (en) * 2004-09-29 2007-03-20 Lucent Technologies Inc. Monolithic MEMS device having a balanced cantilever plate
EP1677073B1 (de) * 2004-12-29 2013-06-19 STMicroelectronics Srl Mems-Kreisel mit elektrisch isolierten Bereiche
US7284430B2 (en) * 2005-08-15 2007-10-23 The Regents Of The University Of California Robust micromachined gyroscopes with two degrees of freedom sense-mode oscillator
US8113050B2 (en) * 2006-01-25 2012-02-14 The Regents Of The University Of California Robust six degree-of-freedom micromachined gyroscope with anti-phase drive scheme and method of operation of the same
US8020441B2 (en) * 2008-02-05 2011-09-20 Invensense, Inc. Dual mode sensing for vibratory gyroscope
DE102007030120B4 (de) * 2007-06-29 2010-04-08 Litef Gmbh Drehratensensor
DE102007030119A1 (de) * 2007-06-29 2009-01-02 Litef Gmbh Corioliskreisel
IT1392741B1 (it) * 2008-12-23 2012-03-16 St Microelectronics Rousset Giroscopio microelettromeccanico con migliorata reiezione di disturbi di accelerazione
US8210038B2 (en) * 2009-02-17 2012-07-03 Robert Bosch Gmbh Drive frequency tunable MEMS gyroscope
IT1394007B1 (it) * 2009-05-11 2012-05-17 St Microelectronics Rousset Struttura microelettromeccanica con reiezione migliorata di disturbi di accelerazione
CN102473034B (zh) * 2009-07-22 2015-04-01 意美森公司 用于在输入控制手势以及关于虚拟设备的控制期间提供复杂触觉激励的***和方法
US8534127B2 (en) * 2009-09-11 2013-09-17 Invensense, Inc. Extension-mode angular velocity sensor
US8549915B2 (en) * 2009-10-23 2013-10-08 The Regents Of The University Of California Micromachined gyroscopes with 2-DOF sense modes allowing interchangeable robust and precision operation
ITTO20091042A1 (it) * 2009-12-24 2011-06-25 St Microelectronics Srl Giroscopio integrato microelettromeccanico con migliorata struttura di azionamento
EP2527788A1 (de) 2011-05-26 2012-11-28 Maxim Integrated Products, Inc. Quadraturfehlerkompensation
US8833162B2 (en) * 2011-09-16 2014-09-16 Invensense, Inc. Micromachined gyroscope including a guided mass system
US9170107B2 (en) * 2011-09-16 2015-10-27 Invensense, Inc. Micromachined gyroscope including a guided mass system
US20140144232A1 (en) * 2012-11-28 2014-05-29 Yizhen Lin Spring for microelectromechanical systems (mems) device
JP2014108501A (ja) * 2012-12-04 2014-06-12 Toyota Central R&D Labs Inc Mems装置
US9404747B2 (en) 2013-10-30 2016-08-02 Stmicroelectroncs S.R.L. Microelectromechanical gyroscope with compensation of quadrature error drift
CN103867636B (zh) * 2014-03-27 2015-11-11 北京航空航天大学 一种调谐式两自由度被动阻尼器
EP2963387B1 (de) * 2014-06-30 2019-07-31 STMicroelectronics Srl Mikroelektromechanische vorrichtung mit kompensierung von fehlern auf grundlage von störkräften, wie etwa quadraturkomponenten

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050199061A1 (en) * 2004-02-27 2005-09-15 Cenk Acar Nonresonant micromachined gyroscopes with structural mode-decoupling

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
SANG WON YOON ED - SANG WON YOON: "Vibration Isolation and Shock Protection for MEMS", 1 January 2009, VIBRATION ISOLATION AND SHOCK PROTECTION FOR MEMS, PROQUEST, UNIVERSITY OF MICHIGAN, PAGE(S) I,I-XVIII, ISBN: 1-109-12049-4, XP002682168 *

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