EP2940376A1 - Optique thermoconductrice - Google Patents

Optique thermoconductrice Download PDF

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Publication number
EP2940376A1
EP2940376A1 EP15166275.6A EP15166275A EP2940376A1 EP 2940376 A1 EP2940376 A1 EP 2940376A1 EP 15166275 A EP15166275 A EP 15166275A EP 2940376 A1 EP2940376 A1 EP 2940376A1
Authority
EP
European Patent Office
Prior art keywords
light module
circuit board
module according
led
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP15166275.6A
Other languages
German (de)
English (en)
Other versions
EP2940376B1 (fr
Inventor
Frank Drees
Alexander Drölle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ITZ Innovations und Technologiezentrum GmbH
Original Assignee
ITZ Innovations und Technologiezentrum GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ITZ Innovations und Technologiezentrum GmbH filed Critical ITZ Innovations und Technologiezentrum GmbH
Publication of EP2940376A1 publication Critical patent/EP2940376A1/fr
Application granted granted Critical
Publication of EP2940376B1 publication Critical patent/EP2940376B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/504—Cooling arrangements characterised by the adaptation for cooling of specific components of refractors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a light module for installation in a luminaire, comprising a printed circuit board having at least one conductor track, at least one connected to the conductor LED to generate a luminous flux, an optic with a light guide unit for directing the light flux and a holding unit for attaching the optics to the conductive Surface.
  • the conductor tracks are formed on printed circuit boards.
  • Printed circuit boards are made of electrically insulating material with conductive tracks (connections) arranged thereon.
  • the printed conductors are usually etched from a top-side, thin copper layer. Individual LEDs are then soldered to pads or pads so that they are simultaneously mechanically held and electrically connected.
  • As an insulating material is preferably fiber reinforced plastic, z. B. CEM or FR4 used, which are rather poor heat conducting materials and thus the majority of the heat generated during operation over the upper side copper surfaces and the surfaces of the tracks to the lamp or the environment submitted.
  • the light-generating LED or the plurality preferably in a grid arranged LEDs together with the necessary for your operation equipment, such as an electronic ballast (ECG), driver, sensor or the like, an LED module, which is often referred to as a light engine.
  • ECG electronic ballast
  • sensor sensor
  • an LED module which is often referred to as a light engine.
  • the optics usually sits on the top side of the printed circuit board and thus forms the top of the light module, which covers the electrically conductive surface or the circuit board more or less over the entire surface, so that a heat exchange between the conductive surface or the circuit board and the environment through the covering optics is prevented.
  • heat build-up develops underneath the optics, which is usually designed as a transparent plastic injection-molded part, which adversely affect the service life of the LEDs of the LED module.
  • the invention is based on a light module of the type mentioned initially with the object of at least partially avoiding the aforementioned disadvantages and, in particular, of providing a light module which avoids as much as possible heat buildup.
  • this object is essentially already achieved in that the holding region is formed-at least partially-as a cooling surface or comprises a cooling surface.
  • the invention is based on the recognition that the circuit board or the conductive surface of the light module in installation position covering and thus causing the heat accumulation holding areas of the optics used as a cooling element, namely by the optics with its primary light-guiding unit is reduced to its optical function and the On the optics otherwise provided holding areas is not only used for the fixation of the optics, but now also for the cooling.
  • Measure is the appearance of a component that causes heat build-up and thus negative for the life of the LEDs, transformed into a component that acts as a heat sink and thus increases the life of the LEDs and thus the light module.
  • the invention is used in conjunction with printed circuit boards which are made of electrically insulating material having thereon conductive traces (interconnects) and constitute a component which is incorporated into larger assemblies, e.g. in a luminaire housing a lamp or the like.
  • the electrically conductive surface may also be formed as a conductive surface applied to a nonconducting support (plastic, ceramic) by surface metallization.
  • a three-dimensional array of LEDs has been realized by means of the laser direct structuring (LDS) of 3D circuit carriers (3D-MID).
  • LDS laser direct structuring
  • 3D-MID 3D circuit carriers
  • the one component e.g. the luminaire housing or the luminaire cover, electronic functions.
  • the LDS components thus reduce space requirements and weight, can be quickly adapted to new requirements and also save on separate components.
  • This support surface can either be on a separate component or the surface of a component itself, e.g. a light housing made of plastic, ceramic, metal or combinations thereof.
  • the optics is combined with a thermally conductive Be executed element, which either the use of thermally conductive plastics, ie with thermally conductive fillers, eg. As aluminum oxide, graphite, boron nitride, enriched carrier plastics, such as PC, PC, PBT, whereby the thermal conductivity of these carrier plastics is increased by at least 3 times.
  • thermally conductive plastics ie with thermally conductive fillers
  • thermally conductive fillers eg. As aluminum oxide, graphite, boron nitride, enriched carrier plastics, such as PC, PC, PBT, whereby the thermal conductivity of these carrier plastics is increased by at least 3 times.
  • the composite can also be realized with a heat-conducting metal, in particular copper.
  • metal used for increased heat absorption or delivery on an enlarged surface for example in the form of a sawtooth, ribs or wave structure.
  • the optics comprise raster-like or mutually spaced webs, in which a plurality of heat sinks facet-like for attachment to the optics can be used or fastened with this.
  • an optic also includes a holding or fastening area, which may be e.g. as arranged laterally next to the optics retaining strip may be formed which rests in the installed position usually flat on the circuit board of the light module.
  • a metal surface can be applied to the holding region, which acts as a cooling surface and is preferably formed with a wave or a sawtooth profile for enlarging the surface area.
  • the preferred embodiment provides to provide a plurality of surfaces of a bar with such cooling surfaces;
  • a particularly high cooling capacity is realized if, in addition to the upper and lower side horizontal surface, the lateral vertical surface also comprises a cooling metal surface or such a metal element, ie the retaining strip is enclosed by the cooling surfaces. This can also be done by one on the retaining strip be pushed laterally and in installation position enclosing this cover or coat, which encloses the retaining strip on the outside.
  • the holding portion of the optics, webs, z. B several rod-shaped webs to form a kind of grid.
  • the holding area z. Example, a grid structure with a longitudinally extending longitudinal web and at certain intervals along this longitudinal web transversely extending transverse webs, which thus define a check grid.
  • Insert elements functioning as cooling surfaces can be inserted into the grid thus produced, wherein these insert elements thus formed preferably comprise metal or consist of metal so as to form, in the installed position, a sort of tile structure consisting of the insert elements, which are enclosed by the webs of the holding unit.
  • These insert elements can also consist of thermally conductive plastics.
  • the inserts are made of metal, at least the resting on the underlying tracks metal areas with a heat-conducting insulation with a material thickness preferably between 0.02 and 0.2mm are provided.
  • Epoxy resin is preferably used, ie typical thermoplastics (PC, PBT, PA etc.), preferably provided with electrically non-conductive fillers to increase the thermal conductivity.
  • FIG. 1 shows a perspective view of the light module itself, so expanded from a light.
  • This light module essentially consists of a plate-shaped LED module 2, which is formed from a plate-shaped printed circuit board 2A and along the central longitudinal axis collinear at uniform intervals extending toward each other mounted LEDs 2B.
  • this LED module 2 extends formed as a one-piece injection molded plastic part of transparent plastic optics 4, which includes a dome-like over the LEDs 2B arching middle section, which simultaneously forms the actual optics for focusing the emitted light from the LEDs 2B, and each side to this central portion 4A integrally molded sidebars 4B, 4C comprises, which lie flat with their lower mounting surfaces on the top of the circuit board 2A and is fixed in position by means of fastening screws 6 to an underlying element.
  • the side strips 4B, 4C are bordered on the top, bottom and side surfaces with a circumferentially comprehensive metal shell, the contact surfaces of the side strips 4B, 4C are designed smooth and their faces facing away from the contact surface outer surfaces to increase the effective surface and the cooling capacity are provided with a sawtooth.
  • the inventive design, the side strips 4B, 4C act along the entire surface as a heat sink and thus improve the efficiency of the LED module or the light module, but prevent in any case for the life of the LEDs 2B detrimental heat accumulation between the circuit board 2A and the Optics 4.
  • FIG. 4 shows an alternative embodiment of a light module in a perspective view, in which adjoin the central portion 4A of the optics 4 no sidebars, but in certain, equidistant distances from each other transverse webs 4D to 4F are formed, which extend transversely to the longitudinal axis of the optic 4 and a kind Define grid structure, in which made of copper heatsink 8 are inserted laterally so that they rest in the installed position on the circuit board 2A.
  • a variant of this second embodiment provides for injecting a thermally conductive plastic in the 2-component process into the spaces between the transverse webs 4D-4F.
  • optical plastics PC, PMMA and SAN are particularly preferably used, and as thermally conductive plastics with heat-conductive fillers, such as aluminum oxide, graphite, boron nitride, filled carrier plastics, eg PC, PC, PBT and other suitable plastics.
  • thermally conductive plastics with heat-conductive fillers such as aluminum oxide, graphite, boron nitride, filled carrier plastics, eg PC, PC, PBT and other suitable plastics.
  • FIG. 5 shows an enlarged, perspective detail view of a third embodiment of a light module 10 according to the invention, in which the cooling of a printed circuit board 10A takes place primarily via convection.
  • a printed circuit board 10A On the surface of the circuit board 10A are spaced apart in a grid a plurality of LEDs 10B - 10E attached.
  • a heat-conducting carrier 10G Via a lateral edge 10F extending transversely to the plane of the printed circuit board, a heat-conducting carrier 10G is applied to the printed circuit board 10A enclosing.
  • edge 10F Since the edge 10F is provided only at the edge of the carrier 10G, there exists between the circuit board 10A and the carrier 10G a cavity acting as a cooling space through which heat radiated from the circuit board 10A can rise and be cooled by the heat-conductive material of the carrier 10G. The resulting heat thus rises from the circuit board 10A upwards, cools on the carrier 10G designed as a heat sink and flows down to cool the circuit board 10A. Thus, the air circulates in the space formed between the top of the circuit board 10A and the bottom of the carrier 10G, and the metal-made carrier 10G 10G functions as a heat sink.
  • the carrier 10G has, corresponding to the arrangement of the LEDs 10B-10E spaced from each other on a plurality of circular openings, on the underside of the LEDs 10B - 10E associated lenses 10H are provided, which have on the inside a cylindrical recess and on the outer surface approximately the shape of a rotation parabola have, so symmetrical rotation body are formed.
  • FIG. 1 shows a further enlarged, detailed perspective view of a light module according to the invention, which is fundamentally of a similar construction to the embodiment according to FIG. 5 , but with the difference that in the cooling space between the underside of the carrier 12G and the top of the circuit board 12A, a body made of a heat-transmitting plastic is used.
  • this heat transferring plastic which is the heat transfer here by means of heat conduction and not by convection as in the embodiment according to FIG. 5 realized, provided with a hole structure having openings for enclosing the LEDs 12B - 12E, and those at the bottom of the carrier 12G arranged to accommodate lenses 12H.
  • this arrangement is not necessarily and represents only a preferred embodiment.
  • the fundamental solution of the invention is therefore to make the holding areas for attaching the optics to a printed circuit board as cooling surfaces by either have these enclosures made of metal or bordered by metal.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
EP15166275.6A 2014-05-02 2015-05-04 Optique thermoconductrice Active EP2940376B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102014106164.0A DE102014106164A1 (de) 2014-05-02 2014-05-02 Wärmeleitende Optik

Publications (2)

Publication Number Publication Date
EP2940376A1 true EP2940376A1 (fr) 2015-11-04
EP2940376B1 EP2940376B1 (fr) 2018-12-19

Family

ID=53040425

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15166275.6A Active EP2940376B1 (fr) 2014-05-02 2015-05-04 Optique thermoconductrice

Country Status (2)

Country Link
EP (1) EP2940376B1 (fr)
DE (1) DE102014106164A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100133556A1 (en) * 2009-06-18 2010-06-03 Bridgelux, Inc. Led array package covered with a highly thermal conductive plate
US20100140655A1 (en) * 2009-02-26 2010-06-10 Wei Shi Transparent heat spreader for leds
US20110156584A1 (en) * 2008-08-08 2011-06-30 Solarkor Company Ltd. Led lighting device
DE102011076613A1 (de) * 2011-05-27 2012-11-29 Osram Ag LED-Leuchte
WO2012167798A1 (fr) * 2011-06-10 2012-12-13 Martin Professional A/S Dispositif d'éclairage à puits thermique multicouche
WO2013132446A1 (fr) * 2012-03-08 2013-09-12 Koninklijke Philips N.V. Dispositif électroluminescent et procédé de fabrication correspondant

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101680620B (zh) * 2007-10-23 2013-05-01 Lsi工业公司 光学器件保持和定位设备以及照明组件
JP5227674B2 (ja) * 2008-06-18 2013-07-03 スタンレー電気株式会社 車両用灯具
DE102009007430A1 (de) * 2009-02-04 2010-08-12 Osram Gesellschaft mit beschränkter Haftung Leuchtmodul
JP5146356B2 (ja) * 2009-02-24 2013-02-20 豊田合成株式会社 発光装置及びその製造方法
DE202012103902U1 (de) * 2012-10-12 2012-11-29 GK Concept GmbH LED-Leuchtvorrichtung

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110156584A1 (en) * 2008-08-08 2011-06-30 Solarkor Company Ltd. Led lighting device
US20100140655A1 (en) * 2009-02-26 2010-06-10 Wei Shi Transparent heat spreader for leds
US20100133556A1 (en) * 2009-06-18 2010-06-03 Bridgelux, Inc. Led array package covered with a highly thermal conductive plate
DE102011076613A1 (de) * 2011-05-27 2012-11-29 Osram Ag LED-Leuchte
WO2012167798A1 (fr) * 2011-06-10 2012-12-13 Martin Professional A/S Dispositif d'éclairage à puits thermique multicouche
WO2013132446A1 (fr) * 2012-03-08 2013-09-12 Koninklijke Philips N.V. Dispositif électroluminescent et procédé de fabrication correspondant

Also Published As

Publication number Publication date
EP2940376B1 (fr) 2018-12-19
DE102014106164A1 (de) 2015-11-05

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