EP2936955A1 - Cooling device for a printed circuit board - Google Patents

Cooling device for a printed circuit board

Info

Publication number
EP2936955A1
EP2936955A1 EP13805864.9A EP13805864A EP2936955A1 EP 2936955 A1 EP2936955 A1 EP 2936955A1 EP 13805864 A EP13805864 A EP 13805864A EP 2936955 A1 EP2936955 A1 EP 2936955A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
printed circuit
face
cooling device
grip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13805864.9A
Other languages
German (de)
French (fr)
Inventor
Karen Chauvin
Xavier Goumain
Friedbald KIEL
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Systemes Thermiques SAS
Original Assignee
Valeo Systemes Thermiques SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Systemes Thermiques SAS filed Critical Valeo Systemes Thermiques SAS
Publication of EP2936955A1 publication Critical patent/EP2936955A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H05K7/20163—Heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20863—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09545—Plated through-holes or blind vias without lands

Definitions

  • the technical field of the present invention is that of an electronic printed circuit board capable of releasing calories and a cooling device of said electronic component.
  • a printed circuit board finds its application in particular in a ventilation device for moving a flow of air inside a ventilation system, heating and / or air conditioning for a motor vehicle.
  • the cooling device is in the form of a radiator, that is to say of an element added to the printed circuit board, the function of which is to dissipate the calories emitted by electronic components.
  • This radiator is plated on one side of the printed circuit board, a thermal conductive paste being interposed between the radiator and the face of the printed circuit board so as to ensure good thermal conduction between said card and the radiator.
  • a radiator In the first place, such a radiator is a massive piece which occupies an important place, which forms a constraint which limits the possibilities of application of the printed circuit board, in particular when using the printed circuit board in a confined volume, as is the case for example for a ventilation device in an installation of ventilation, heating and / or air conditioning of a motor vehicle. Moreover, the weight of the known ventilation device is also burdened by the presence of this radiator, the latter being made of an aluminum alloy.
  • the radiator is a part that represents a significant cost in the ventilation function and whose addition requires the installation of a thermal paste, which complicates the manufacturing process of the printed circuit board. In addition, the presence of the thermal paste degrades the heat dissipation thermal performance of the radiator but is nevertheless necessary to ensure thermal diffusion between the electronic components disposed on the printed circuit board and the radiator.
  • the object of the present invention is to solve the disadvantages described above.
  • the subject of the invention is a cooling device for a printed circuit board, comprising a printed circuit board provided with at least one face or first face and at least one heat sink element soldered on said at least one a face of the printed circuit, said at least one heat sink element being able to be arranged in a refrigerant flow, î o Cooling fluid means any thermal conductive fluid and compatible with the printed circuit. This is for example air.
  • the cooling device according to the invention allows a better heat dissipation thanks to the direct physical contact of the solder between the heat sink element and the printed circuit board.
  • the heat sink element since the heat sink element is brazed, it can be secured to the printed circuit board during a brazing step of the printed circuit board, which ensures that the cooling device according to the invention is manufactured and finalized at the same time as the manufacture of the printed circuit board itself.
  • said printed circuit board 20 comprises two faces.
  • the cooling device comprises at least one hole passing through said printed circuit board from one of the two faces to the other of the two faces, said at least one conductive means of 25 calories being disposed facing said at least one through hole.
  • said at least one through hole comprises an inner surface covered with a metallic substance.
  • the cooling device comprises a plurality of holes passing through said printed circuit board.
  • This plurality of holes forms a heat sink between the present calories on the first side and generated by an electronic component, and the airflow that licks the conductive means of calories.
  • the printed circuit board is provided with an electronic component.
  • an external perimeter of the electronic component delimits a first grip on the first face
  • the plurality of holes delimits a second grip on the first face, the first grip and the second grip being separated by a non-zero distance.
  • the electronic component is not disposed above the hole, the heat sink between this electronic component and the hole then being operated by the electrically conductive track which travels at least between these two elements.
  • first right-of-way and the second right-of-way overlap at least partially.
  • the at least one heat dissipating element comprises a head forming abutment against the printed circuit board.
  • the invention also relates to a ventilation device of a ventilation installation of a passenger compartment of a motor vehicle, comprising a propeller 25 generating a flow of air and adapted to be driven by an electric motor, comprising a circuit board printed as detailed above.
  • the printed circuit board forms a control device able to control the electric motor.
  • This control device is the means that determines the speed of rotation of the propeller, according to requests issued by the motor vehicle.
  • the calorie conducting means is in direct contact with the electrically conductive track.
  • Heat sink is in direct contact with this calorie-conducting medium.
  • direct contact is meant a physical contact between the two elements, a connection of these elements can be achieved by means of a solder.
  • a very first advantage according to the invention lies in the possibility of designing a printed circuit board that is lighter, more compact and less expensive than that of the prior art, while guaranteeing reliability compatible with use in the automotive sector. providing a cooling function for components that dissipate heat. The thermal drainage is thus better ensured by virtue of the presence of the calorie conducting means which extends between the two faces of the card.
  • Such a printed circuit board finds particular application in a ventilation device for a ventilation, heating and / or air conditioning installation.
  • FIG. 1 is a partial view in section of a printed circuit board according to the invention
  • FIG. 2 is a partial sectional view illustrating a first variant embodiment of the printed circuit board according to the invention
  • FIG. 3 is a partial sectional view illustrating a second embodiment variant of the printed circuit board according to the invention.
  • FIG. 4 is a partial sectional view illustrating a third variant embodiment of the printed circuit board according to the invention.
  • FIG. 5 is a schematic view of a ventilation device implementing a printed circuit board according to any one of the variants
  • FIG. 1 illustrates an exemplary embodiment of a cooling device comprising a circuit board 1 printed and in accordance with the invention. This is partially represented, but forms a plate that extends in a plane.
  • a printed circuit board is for example a component of a control device of a ventilation device responsible for setting in motion a flow of air inside a ventilation, heating and / or air conditioning system.
  • This control device has the function of controlling the speed of rotation of a propeller constituting the ventilation device, by controlling the voltage or the current sent to an electric motor driving the propeller in rotation.
  • the printed circuit board 1 is formed by an electrically insulating substrate 10, on which is formed one or more electrically conductive tracks 2.
  • This printed circuit board 1 comprises a first face 3 and a second face 4 opposite to the first face relative to the body of the printed circuit board.
  • the printed circuit board 1 comprises at least one hole 5, such a hole being through, that is to say opening into the first face 3 and the second face 4.
  • the first face 3 of the printed circuit board 1 can carry electronic components 11, in particular power components which dissipate calories and which must be cooled to guarantee a level of reliability compatible with them. an application in the automotive field. These components that give off calories are, by
  • the first face 3 can of course receive other electronic components that participate for example in the implementation of control or protection of the electric motor.
  • the hole or holes 5 receive a calorie-conducting means 6.
  • this calorie-conducting means is produced by thermal via, preferably filled with a thermal conductive material.
  • the inner wall of the substrate 10 which borders the hole 5 is metallized, so as to form a heat sink which extends from the first face 3 to the second face 4 of the printed circuit board 1.
  • the central zone of the hole surrounded by the metallized portion 7 may be free, thereby forming a gap.
  • the central zone of the hole may be filled with a material, for example copper or the material used for brazing the electronic component January 1.
  • One end of the metallized holes extends in the plane of the second face 4 and can be licked by a flow of air.
  • the metallized portion or portions 7 form a heat sink which drives the calories generated by the electronic component to the airflow, so as to dissipate them directly or indirectly therein.
  • the calorie-conducting means 6 is a set of thermal vias formed by the metallized portion 7 of the holes 5, preferably filled with a thermally conductive material.
  • the metallized portion 7 of the hole 5 is, for example, contained in the thickness of the printed circuit board 1 and is connected to the side of the first face 3
  • the electronic component 1 1 which releases calories is not installed directly to the right of the holes 5. On the contrary, it is away from the holes and the electrically conductive track 2 drains the calories from the electronic component 1 1 to the metallized part or portions 7 of the holes 5.
  • the first grip 12 is an area of the first face 3 delimited by a projection of the electronic component 11, perpendicular to a plane in which the first face 3 of the printed circuit board 1 is inscribed.
  • the second grip 8 is an area of the first face 3 occupied by the hole 5. In the case of a plurality of holes 5, the second grip 8 is delimited by a periphery surrounding the plurality of holes 18, measured in the plane of the first face 3.
  • the metallized portion 7 of the 5 holes ends in the plane of the second face 4, and a heat sink 9 is secured to the printed circuit board 1 by brazing.
  • the heat sink 9 is preferably at least partially facing the calorie-conducting means 6. Such a heat sink 9 starts from the second face 4 and ends in a channel in which the air flow circulates.
  • this heat sink 9 is formed by a bar 14 secured by a solder on the second face 4, for example at least partially facing the calorie conducting means 6, that is to say at least partially opposite the second right of way 8.
  • the heat sink 9 may also include a base 16 on which the bar 14 is fixed.
  • the base 16 is then brazed by a solder 15 against the second face 4, at the end of the metallized portions 7 formed in the holes 5,
  • FIG. 2 shows a first variant of the invention similar to that represented in FIG. The differences will be detailed below and reference will be made to the description of FIG. 1 for the identical elements.
  • the invention also covers the case where the first grip 12 is superimposed at least partially with the second grip 8.
  • the invention covers the situation where the electronic component 11 is entirely disposed above the plurality. of holes 5, but it also covers the case where the electronic component 1 1 only partially overlaps the plurality of holes 5.
  • the variant of this figure also comprises a heat sink 9, for example, identical to that of Figure 1.
  • the second variant of the invention is shown in FIG. 3.
  • the printed circuit board 1 receives a calorie conducting means 6 identical to that of FIGS. 1 or 2.
  • the heat sink 9 has a different shape. Indeed, it passes right through the printed circuit board 15, at the calorie conducting means 6, for example in the center thereof.
  • the bar 14 then has a first free end that opens into the air flow and a second end capped by a head 17 formed unitarily with the bar 14.
  • the head 17 forms a flat which is secured to the first face 3 by a solder 18 to the right of the calorie-conducting medium 6.
  • the variant of FIG. 4 is close to that of FIG. 3. The difference will be detailed below and reference will be made to the description of FIG. 3 for the identical elements. The difference lies in the method of securing the heat sink 9 to the calorie conducting means 6.
  • the heat sink 9 comprises the bar 14 capped by the head 17 identical to the variant of FIG. 3.
  • the head 17 is not soldered on the calorie-conducting means 6 at the first face 3.
  • a solder 15 is o performed between the bar 14 and the calorie conducting means 6 at the second face 4 of the printed circuit board 1.
  • the heat sink 9 is then supported by its head 17 on a first end of the calorie-conducting means 6, and secured thereto by means of the solder 15 made at the second face 4.
  • the second variant and the third variant of the invention employ a heat sink 9 which has a head 17, the latter protruding, in other words protruding, from the plane of the first face 3 between the electronic components secured to this first face 3.
  • the head helps capture the 20 calories generated by the electronic components to drain to the bar 14 licked by the air flow.
  • the printed circuit board 1 described in the above variants may comprise a plurality of holes 5 and / or a plurality of identical calorie conducting means 6 and a plurality of identical heat sinks 9.
  • the printed circuit board 1 according to the present invention may comprise a combination of caloric conducting means 6 and heat sinks 9 made according to at least two variants exposed above.
  • heat sink 9 is advantageously made of an alloy aluminum or preferably copper.
  • the printed circuit board 1 is provided under the second face 4 and / or on the first face 3 of a copper plane so as to allow brazing of various components, and in particular
  • FIG. 5 illustrates an example of application of the printed circuit board 1 according to the invention in a ventilation device 19.
  • a ventilation device comprises a support 20 inside which an electric motor 21 is housed.
  • the electric motor 21 rotates a propeller 22 consisting of a bowl 23 shown in dotted line in this figure.
  • This bowl forms a drive means of the propeller, since a motor shaft is connected to the bowl 23.
  • a bowl is for example full, in that its wall is devoid of opening.
  • such a bowl 23 has a plurality of openings.
  • Such a bowl 23 extends a plurality of blades 24 in a direction parallel to an extension direction of the motor shaft. The end of each blade is joined by a strip 25.
  • Such a helix 22 thus forms a squirrel cage propeller, otherwise called radial turbine.
  • control device 26 Opposite the propeller 22 with respect to the electric motor 21, there is the control device 26 whose function is to control the speed of rotation of the propeller 22 by controlling the voltage or the current sent to the electric motor 21 .
  • a control device 26 is installed against the support 20 so as to be exposed to the air flow generated by the propeller 22, the control device being covered by a cover 27 so as to limit the entry of foreign body into the portion of the ventilation device in which the control device 26 is installed.
  • the support 20 comprises a recess 28 in which the flow of air set in motion by the propeller 22 can circulate, such a flow of air being represented in a manner schematic by two symbols referenced 29 and 30.
  • Such a recess 28 is laterally bordered by at least a first wall 31, and advantageously by a second wall 32, one and / or the other of these walls being integral with the printed circuit board 1. It is thus understood that the air flow 29, 30 is channeled by the support 20 and at least one and / or the other of the first and second referenced walls 31 and 32.
  • This channel is also delimited by the control device 26. More specifically, this channel is delimited by the printed circuit board 1 constituting the control device 26. The portion of the printed circuit board 1 which closes the channel the air flow 29, 30, in combination with the first wall 31 and the second wall 32, forms a part of said card in which are formed the hole or holes 5, the means or means 6 of calories and the or heat sinks 9, as detailed with reference to Figures 1 to 4.
  • the second face 4 of the printed circuit board 1 is shared on the one hand, in a portion 33 of printed circuit board 1 licked by the air flow 29, 30 circulated by the propeller 22, and of on the other hand, in a zone 34 not exposed to the air flow generated by the helix 22.
  • the one or more heat conducting means 6 and the heat dissipator (s) 9 are formed in the portion 33, and are absent from the zone 34.
  • the division between the portion 33 of the printed circuit board 1 and the zone 34 of this same card is organized by the first wall 31, and advantageously by the second wall 32. It is therefore understood that the second face 4 which is at the 1 of the circuit board 1, which comprises at least one calorie-conducting medium 6 and a heat sink 9, is licked by the air flow 29, 31, so as to cool it and correlatively, so as to to cool the electronic components 1 1 which give off calories.
  • Such a portion 33 of the printed circuit board 1 forms a support for the electrically conductive tracks.
  • a plurality of electrically conductive tracks travel on the second side 4 licked by the flow of air and they are arranged so as to limit the risk of short circuit between two electrically conductive tracks.
  • Such an arrangement is, for example, a minimum distance separating the electrically conductive tracks that run at the portion 33 licked by the air flow. According to an exemplary embodiment, such a distance is for example 1 .5 mm minimum.
  • the zone 34 may comprise at least one electronic component 35 secured to the second face 4 which extends at the zone 34.
  • This zone further comprises a plurality of electrically conductive tracks that do not require arrangement to avoid short circuits, since this zone 34 is isolated from the circulating air flow 29, 30, in particular thanks to the presence of the first wall 31 which is pressed against the second face 4, for example, perpendicular to the extension plan of the printed circuit board 1.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention relates to a cooling device for a printed circuit board, comprising a printed circuit board equipped with at least one face or first face and at least one heat sink (9) brazed to said at least one face of the printed circuit, in which said at least one heat sink (9) can be disposed in a flow of coolant. The invention is suitable for motor vehicles.

Description

DISPOSITIF DE REFROIDISSEMENT POUR CARTE DE CIRCUIT  COOLING DEVICE FOR CIRCUIT BOARD
IMPRIME  PRINTED
Le secteur technique de la présente invention est celui d'une carte de circuit imprimé électronique susceptible de dégager des calories et un dispositif de refroidissement dudit composant électronique. Une telle carte de circuit imprimé trouve son application notamment dans un dispositif de ventilation destiné à mettre en mouvement un flux d'air à l'intérieur d'une installation de ventilation, chauffage et/ou climatisation pour véhicule automobile. The technical field of the present invention is that of an electronic printed circuit board capable of releasing calories and a cooling device of said electronic component. Such a printed circuit board finds its application in particular in a ventilation device for moving a flow of air inside a ventilation system, heating and / or air conditioning for a motor vehicle.
Généralement, dans une telle carte de circuit imprimé, le dispositif de refroidissement se présente sous la forme d'un radiateur, c'est-à-dire d'un élément rapporté sur la carte de circuit imprimé, dont la fonction est de dissiper les calories émises par les composants électroniques. Ce radiateur est plaqué sur une face de la carte de circuit imprimé, une pâte conductrice thermique étant interposée entre le radiateur et la face de la carte de circuit imprimé de manière à garantir une bonne conduction thermique entre ladite carte et le radiateur. Generally, in such a printed circuit board, the cooling device is in the form of a radiator, that is to say of an element added to the printed circuit board, the function of which is to dissipate the calories emitted by electronic components. This radiator is plated on one side of the printed circuit board, a thermal conductive paste being interposed between the radiator and the face of the printed circuit board so as to ensure good thermal conduction between said card and the radiator.
La structure évoquée ci-dessus présente plusieurs inconvénients. En premier lieu, un tel radiateur est une pièce massive qui occupe une place importante, ce qui forme une contrainte qui limite les possibilités d'application de la carte de circuit imprimé, notamment en cas d'utilisation de la carte de circuit imprimé dans un volume confiné, comme c'est le cas par exemple pour un dispositif de ventilation dans une installation de installation de ventilation, chauffage et/ou climatisation de véhicule automobile. Par ailleurs, le poids du dispositif de ventilation connu est également grevé par la présence de ce radiateur, celui-ci étant fabriqué en un alliage d'aluminium. Le radiateur est une pièce qui représente un coût non négligeable dans la fonction de ventilation et dont l'ajout nécessite la pose d'une pâte thermique, ce qui complexifie le procédé de fabrication de la carte de circuit imprimé. De plus, la présence de la pâte thermique dégrade les performances thermiques de dissipation thermique du radiateur mais est néanmoins nécessaire pour assurer la diffusion thermique entre les composants électroniques disposés sur la carte de circuit imprimé et le radiateur. Le but de la présente invention est de résoudre les inconvénients décrits ci- dessus. The structure mentioned above has several disadvantages. In the first place, such a radiator is a massive piece which occupies an important place, which forms a constraint which limits the possibilities of application of the printed circuit board, in particular when using the printed circuit board in a confined volume, as is the case for example for a ventilation device in an installation of ventilation, heating and / or air conditioning of a motor vehicle. Moreover, the weight of the known ventilation device is also burdened by the presence of this radiator, the latter being made of an aluminum alloy. The radiator is a part that represents a significant cost in the ventilation function and whose addition requires the installation of a thermal paste, which complicates the manufacturing process of the printed circuit board. In addition, the presence of the thermal paste degrades the heat dissipation thermal performance of the radiator but is nevertheless necessary to ensure thermal diffusion between the electronic components disposed on the printed circuit board and the radiator. The object of the present invention is to solve the disadvantages described above.
5 A cet effet, l'invention a pour objet un dispositif de refroidissement pour une carte de circuit imprimé, comprenant une carte de circuit imprimé munie d'au moins une face ou première face et au moins un élément dissipateur thermique brasé sur ladite au moins une face du circuit imprimé, ledit au moins un élément dissipateur thermique étant apte à être disposé dans un flux de fluide réfrigérant, î o Par fluide réfrigérant, on entend tout fluide conducteur thermique et compatible avec le circuit imprimé. Il s'agit par exemple d'air. To this end, the subject of the invention is a cooling device for a printed circuit board, comprising a printed circuit board provided with at least one face or first face and at least one heat sink element soldered on said at least one a face of the printed circuit, said at least one heat sink element being able to be arranged in a refrigerant flow, î o Cooling fluid means any thermal conductive fluid and compatible with the printed circuit. This is for example air.
Ainsi, le dispositif de refroidissement selon l'invention permet une meilleure dissipation thermique grâce au contact physique direct de la brasure entre l'élément dissipateur thermique et la carte de circuit imprimé. De plus, l'élément 15 dissipateur thermique étant brasé, il peut être solidarisé à la carte de circuit imprimé au cours d'une étape de brasage de la carte de circuit imprimé, ce qui assure que le dispositif de refroidissement selon l'invention est fabriqué et finalisé en même temps que la fabrication de la carte de circuit imprimé elle-même. Thus, the cooling device according to the invention allows a better heat dissipation thanks to the direct physical contact of the solder between the heat sink element and the printed circuit board. In addition, since the heat sink element is brazed, it can be secured to the printed circuit board during a brazing step of the printed circuit board, which ensures that the cooling device according to the invention is manufactured and finalized at the same time as the manufacture of the printed circuit board itself.
Selon une autre caractéristique de l'invention, ladite carte de circuit imprimé 20 comprend deux faces. According to another characteristic of the invention, said printed circuit board 20 comprises two faces.
Selon une autre caractéristique de l'invention, le dispositif de refroidissement comprend au moins un trou traversant ladite carte de circuit imprimé depuis l'une des deux faces à l'autre des deux faces, ledit au moins un moyen conducteur de 25 calories étant disposé en regard dudit au moins un trou traversant. According to another characteristic of the invention, the cooling device comprises at least one hole passing through said printed circuit board from one of the two faces to the other of the two faces, said at least one conductive means of 25 calories being disposed facing said at least one through hole.
Selon une autre caractéristique de l'invention, ledit au moins un trou traversant comprend une surface interne recouverte d'une substance métallique. According to another characteristic of the invention, said at least one through hole comprises an inner surface covered with a metallic substance.
30 Selon une autre caractéristique de l'invention, le dispositif de refroidissement comprend une pluralité de trous traversant ladite carte de circuit imprimé. According to another characteristic of the invention, the cooling device comprises a plurality of holes passing through said printed circuit board.
Cette pluralité de trous forme un drain thermique entre les calories présentes sur la première face et générées par un composant électronique, et le flux d'air qui lèche le moyen conducteur de calories. This plurality of holes forms a heat sink between the present calories on the first side and generated by an electronic component, and the airflow that licks the conductive means of calories.
Selon une autre caractéristique de l'invention, la carte de circuit imprimé est 5 munie d'un composant électronique. According to another characteristic of the invention, the printed circuit board is provided with an electronic component.
Selon une autre caractéristique de l'invention, un périmètre externe du composant électronique délimite une première emprise sur la première face, la pluralité de trous délimite une deuxième emprise sur la première face, la première î o emprise et la deuxième emprise étant séparées par une distance non nulle. According to another characteristic of the invention, an external perimeter of the electronic component delimits a first grip on the first face, the plurality of holes delimits a second grip on the first face, the first grip and the second grip being separated by a non-zero distance.
En d'autres termes, le composant électronique n'est pas disposé au dessus du trou, le drain thermique entre ce composant électronique et le trou étant alors opéré par la piste électriquement conductrice qui chemine au moins entre ces deux éléments.  In other words, the electronic component is not disposed above the hole, the heat sink between this electronic component and the hole then being operated by the electrically conductive track which travels at least between these two elements.
15  15
Alternativement, la première emprise et la deuxième emprise se superposent au moins partiellement.  Alternatively, the first right-of-way and the second right-of-way overlap at least partially.
Selon une autre caractéristique de l'invention, le au moins un élément 20 dissipateur thermique comprend une tête formant butée d'appui contre la carte de circuit imprimé. According to another characteristic of the invention, the at least one heat dissipating element comprises a head forming abutment against the printed circuit board.
L'invention concerne aussi un dispositif de ventilation d'une installation de ventilation d'un habitacle de véhicule automobile, comprenant une hélice 25 génératrice d'un flux d'air et apte à être entraînée par un moteur électrique, comprenant une carte de circuit imprimé telle que détaillé ci-dessus. La carte de circuit imprimé forme un dispositif de commande apte à piloter le moteur électrique. Ce dispositif de commande est le moyen qui détermine la vitesse de rotation de l'hélice, en fonction de demandes émises par le véhicule automobile.The invention also relates to a ventilation device of a ventilation installation of a passenger compartment of a motor vehicle, comprising a propeller 25 generating a flow of air and adapted to be driven by an electric motor, comprising a circuit board printed as detailed above. The printed circuit board forms a control device able to control the electric motor. This control device is the means that determines the speed of rotation of the propeller, according to requests issued by the motor vehicle.
30 30
Selon une possibilité offerte par l'invention, le moyen conducteur de calories est en contact direct avec la piste électriquement conductrice. De même, le dissipateur thermique est en contact direct avec ce moyen conducteur de calories. Par contact direct, on entend un contact physique entre les deux éléments, une solidarisation de ces éléments pouvant être réalisée au moyen d'une brasure. According to a possibility offered by the invention, the calorie conducting means is in direct contact with the electrically conductive track. Similarly, Heat sink is in direct contact with this calorie-conducting medium. By direct contact is meant a physical contact between the two elements, a connection of these elements can be achieved by means of a solder.
5 Un tout premier avantage selon l'invention réside dans la possibilité de concevoir une carte de circuit imprimé plus légère, plus compacte et moins coûteuse que celle de l'art antérieur, tout en garantissant une fiabilité compatible avec l'utilisation dans le secteur automobile en assurant une fonction de refroidissement des composants qui dissipent de la chaleur. Le drainage î o thermique est ainsi mieux assuré grâce à la présence du moyen conducteur de calories qui s'étend entre les deux faces de la carte. A very first advantage according to the invention lies in the possibility of designing a printed circuit board that is lighter, more compact and less expensive than that of the prior art, while guaranteeing reliability compatible with use in the automotive sector. providing a cooling function for components that dissipate heat. The thermal drainage is thus better ensured by virtue of the presence of the calorie conducting means which extends between the two faces of the card.
Une telle carte de circuit imprimé trouve une application particulière dans un dispositif de ventilation pour une installation de ventilation, chauffage et/ou 15 climatisation. Such a printed circuit board finds particular application in a ventilation device for a ventilation, heating and / or air conditioning installation.
D'autres caractéristiques, détails et avantages de l'invention ressortiront plus clairement à la lecture de la description donnée ci-après à titre indicatif en relation avec des dessins dans lesquels : Other characteristics, details and advantages of the invention will emerge more clearly on reading the description given below as an indication in relation to drawings in which:
20 - la figure 1 est une vue partielle et en coupe d'une carte de circuit imprimé conforme à l'invention, FIG. 1 is a partial view in section of a printed circuit board according to the invention,
- la figure 2 est une vue partielle et en coupe illustrant une première variante de réalisation de la carte de circuit imprimé selon l'invention,  FIG. 2 is a partial sectional view illustrating a first variant embodiment of the printed circuit board according to the invention,
- la figure 3 est une vue partielle et en coupe illustrant une deuxième variante 25 de réalisation de la carte de circuit imprimé selon l'invention,  FIG. 3 is a partial sectional view illustrating a second embodiment variant of the printed circuit board according to the invention,
- la figure 4 est une vue partielle et en coupe illustrant une troisième variante de réalisation de la carte de circuit imprimé selon l'invention,  FIG. 4 is a partial sectional view illustrating a third variant embodiment of the printed circuit board according to the invention,
- la figure 5 est une vue schématique d'un dispositif de ventilation mettant en œuvre une carte de circuit imprimé selon l'une quelconque des variantes FIG. 5 is a schematic view of a ventilation device implementing a printed circuit board according to any one of the variants
30 évoquées ci-dessus. 30 mentioned above.
Il faut noter que les figures exposent l'invention de manière détaillée pour mettre en œuvre l'invention, lesdites figures pouvant bien entendu servir à mieux définir l'invention, le cas échéant. It should be noted that the figures expose the invention in detail to implement the invention, said figures can of course be used for better define the invention, if any.
La figure 1 illustre un exemple de réalisation d'un dispositif de refroidissement comprenant une carte de circuit 1 imprimé et conforme à 5 l'invention. Celle-ci est représentée de manière partielle, mais forme une plaque qui s'étend dans un plan. Une telle carte de circuit imprimé est par exemple un composant d'un dispositif de commande d'un dispositif de ventilation chargé de mettre en mouvement un flux d'air à l'intérieur d'une installation de ventilation, chauffage et/ou climatisation. Ce dispositif de commande a pour fonction de piloter î o la vitesse de rotation d'une hélice constitutive du dispositif de ventilation, en contrôlant la tension ou le courant envoyé à un moteur électrique entraînant en rotation l'hélice. FIG. 1 illustrates an exemplary embodiment of a cooling device comprising a circuit board 1 printed and in accordance with the invention. This is partially represented, but forms a plate that extends in a plane. Such a printed circuit board is for example a component of a control device of a ventilation device responsible for setting in motion a flow of air inside a ventilation, heating and / or air conditioning system. This control device has the function of controlling the speed of rotation of a propeller constituting the ventilation device, by controlling the voltage or the current sent to an electric motor driving the propeller in rotation.
La carte de circuit imprimé 1 est formée par un substrat 10 électriquement 15 isolant, sur lequel est ménagé une ou plusieurs pistes électriquement conductrices 2. The printed circuit board 1 is formed by an electrically insulating substrate 10, on which is formed one or more electrically conductive tracks 2.
Cette carte de circuit imprimé 1 comprend une première face 3 et une deuxième face 4 opposée à la première face par rapport au corps de la carte de 20 circuit imprimé. This printed circuit board 1 comprises a first face 3 and a second face 4 opposite to the first face relative to the body of the printed circuit board.
Selon un exemple de réalisation, la carte de circuit imprimé 1 comprend au moins un trou 5, un tel trou étant traversant, c'est-à-dire débouchant dans la première face 3 et dans la deuxième face 4.  According to an exemplary embodiment, the printed circuit board 1 comprises at least one hole 5, such a hole being through, that is to say opening into the first face 3 and the second face 4.
25 La première face 3 de la carte de circuit imprimé 1 peut être porteuse de composants électroniques 1 1 , en particulier de composants de puissance qui dissipent des calories et dont il est nécessaire d'assurer le refroidissement pour leur garantir un niveau de fiabilité compatible avec une application dans le domaine automobile. Ces composants qui dégagent des calories sont, parThe first face 3 of the printed circuit board 1 can carry electronic components 11, in particular power components which dissipate calories and which must be cooled to guarantee a level of reliability compatible with them. an application in the automotive field. These components that give off calories are, by
30 exemple, des transistors, notamment de type MOSFET, mais il peut également s'agir de condensateur ou de shunt. La première face 3 peut bien entendu recevoir d'autres composants électroniques qui participent par exemple à la mise en œuvre du pilotage ou à la protection du moteur électrique. Le ou les trous 5 reçoivent un moyen conducteur de calories 6. Selon le mode réalisation de la figure 1 , ce moyen conducteur de calories est réalisé par des via thermiques, préférentiellement remplis d'un matériau conducteur 5 thermique. En d'autres termes, la paroi interne du substrat 10 qui borde le trou 5 est métallisée, de manière à former un drain thermique qui s'étend de la première face 3 à la deuxième face 4 de la carte de circuit imprimé 1 . Selon une variante, la zone centrale du trou entourée par la partie métallisée 7 peut être libre, formant ainsi un espace. Selon une autre alternative, la zone centrale du trou peut être î o comblée par un matériau, par exemple du cuivre ou le matériau utilisé pour le brasage du composant électronique 1 1 . For example, transistors, in particular of MOSFET type, but it can also be capacitor or shunt. The first face 3 can of course receive other electronic components that participate for example in the implementation of control or protection of the electric motor. The hole or holes 5 receive a calorie-conducting means 6. According to the embodiment of FIG. 1, this calorie-conducting means is produced by thermal via, preferably filled with a thermal conductive material. In other words, the inner wall of the substrate 10 which borders the hole 5 is metallized, so as to form a heat sink which extends from the first face 3 to the second face 4 of the printed circuit board 1. Alternatively, the central zone of the hole surrounded by the metallized portion 7 may be free, thereby forming a gap. According to another alternative, the central zone of the hole may be filled with a material, for example copper or the material used for brazing the electronic component January 1.
Une extrémité des trous métallisés s'étend dans le plan de la deuxième face 4 et peut ainsi être léchée par un flux d'air. Dans les deux cas évoqués ci-dessus, 15 la ou les parties métallisées 7 forment un drain thermique qui conduit les calories générées par le composant électronique vers le flux d'air, de manière à les dissiper directement ou indirectement dans celui-ci. One end of the metallized holes extends in the plane of the second face 4 and can be licked by a flow of air. In both cases mentioned above, the metallized portion or portions 7 form a heat sink which drives the calories generated by the electronic component to the airflow, so as to dissipate them directly or indirectly therein.
Selon la représentation de la figure 1 , le moyen conducteur de calories 6 est 20 un ensemble de via thermiques formés par la partie métallisée 7 des trous 5, préférentiellement remplis d'un matériau conducteur thermique. According to the representation of FIG. 1, the calorie-conducting means 6 is a set of thermal vias formed by the metallized portion 7 of the holes 5, preferably filled with a thermally conductive material.
La partie métallisée 7 du trou 5 est, par exemple, contenue dans l'épaisseur de la carte de circuit imprimé 1 et elle est raccordée du côté de la première face 3The metallized portion 7 of the hole 5 is, for example, contained in the thickness of the printed circuit board 1 and is connected to the side of the first face 3
25 à la piste conductrice 2 qui chemine sur la première face 3. Selon cette variante, le composant électronique 1 1 qui dégage des calories n'est pas installé directement au droit des trous 5. Au contraire, celui-ci est éloigné des trous et la piste électriquement conductrice 2 draine les calories en provenance du composant électronique 1 1 vers la ou les parties métallisées 7 des trous 5. On comprend ici25 to the conductive track 2 which travels on the first side 3. According to this variant, the electronic component 1 1 which releases calories is not installed directly to the right of the holes 5. On the contrary, it is away from the holes and the electrically conductive track 2 drains the calories from the electronic component 1 1 to the metallized part or portions 7 of the holes 5. Here is understood
30 qu'un périmètre externe du composant électronique 1 1 délimite sur la première face 3 une première emprise 12, alors que le trou ou la pluralité de trous 5, qui contient le moyen conducteur de calories 6, délimite une deuxième emprise 8 sur la première face 3, la première emprise 12 et la deuxième emprise 8 étant séparées par une distance non-nulle, référencée 13 sur la figure 1 . La première emprise 12 est une aire de la première face 3 délimitée par une projection du composant électronique 1 1 , perpendiculairement à un plan dans lequel s'inscrit la première face 3 de la carte de circuit imprimé 1 . La deuxième emprise 8 est une 5 aire de la première face 3 occupée par le trou 5. Dans le cas d'une pluralité de trous 5, la deuxième emprise 8 est délimitée par une périphérie entourant la pluralité de trous 18, mesurée dans le plan de la première face 3. 30 that an outer perimeter of the electronic component 1 1 delimits on the first face 3 a first grip 12, while the hole or the plurality of holes 5, which contains the calorie conducting means 6, delimits a second grip 8 on the first face 3, the first right-of-way 12 and the second right-of-way 8 being separated by a non-zero distance, referenced 13 in FIG. The first grip 12 is an area of the first face 3 delimited by a projection of the electronic component 11, perpendicular to a plane in which the first face 3 of the printed circuit board 1 is inscribed. The second grip 8 is an area of the first face 3 occupied by the hole 5. In the case of a plurality of holes 5, the second grip 8 is delimited by a periphery surrounding the plurality of holes 18, measured in the plane of the first face 3.
A l'opposé de la piste électriquement conductrice 2, la partie métallisée 7 des î o trous 5 se termine dans le plan de la deuxième face 4, et un dissipateur thermique 9 est solidarisé sur la carte de circuit imprimé 1 par brasage. In contrast to the electrically conductive track 2, the metallized portion 7 of the 5 holes ends in the plane of the second face 4, and a heat sink 9 is secured to the printed circuit board 1 by brazing.
Le dissipateur thermique 9 est préférentiellement au moins en regard partiellement du moyen conducteur de calories 6. Un tel dissipateur thermique 9 débute à partir de la deuxième face 4 et se termine dans un canal dans lequel 15 circule le flux d'air.  The heat sink 9 is preferably at least partially facing the calorie-conducting means 6. Such a heat sink 9 starts from the second face 4 and ends in a channel in which the air flow circulates.
Selon un exemple de réalisation non illustré, ce dissipateur thermique 9 est formé par un barreau 14 solidarisé par une brasure sur la deuxième face 4, par exemple au moins partiellement en regard du moyen conducteur de calories 6, 20 c'est-à-dire au moins partiellement en regard de la deuxième emprise 8. According to an embodiment not shown, this heat sink 9 is formed by a bar 14 secured by a solder on the second face 4, for example at least partially facing the calorie conducting means 6, that is to say at least partially opposite the second right of way 8.
Selon la figure 1 , le dissipateur thermique 9 peut également comporter une embase 16 sur laquelle le barreau 14 est fixé. L'embase 16 est alors brasée par une brasure 15 contre la deuxième face 4, au niveau de l'extrémité des parties 25 métallisées 7 ménagées dans les trous 5, According to Figure 1, the heat sink 9 may also include a base 16 on which the bar 14 is fixed. The base 16 is then brazed by a solder 15 against the second face 4, at the end of the metallized portions 7 formed in the holes 5,
Pour simplifier les figures 2 à 4, les parties métallisées 7 et les trous 5 ont été représentés de manière symbolique, par des bandes. Il est néanmoins clair que le contenu technique du mode de réalisation décrit ci-dessus et illustré à la figure 1 30 peut être transposé à l'un quelconque des modes de réalisation illustrés aux figures 2 à 4, en particulier à l'égard de la structure du moyen conducteur de calories 6. La figure 2 montre une première variante de l'invention proche de celle représentée à la figure 1 . On détaillera ci-dessous les différences et on se reportera à la description de la figure 1 pour les éléments identiques. To simplify FIGS. 2 to 4, the metallized portions 7 and the holes 5 have been symbolically represented by strips. It is nevertheless clear that the technical content of the embodiment described above and illustrated in FIG. 1 may be transposed to any of the embodiments illustrated in FIGS. 2 to 4, in particular with respect to the structure of the calorie conducting medium 6. FIG. 2 shows a first variant of the invention similar to that represented in FIG. The differences will be detailed below and reference will be made to the description of FIG. 1 for the identical elements.
5 Une différence réside dans le positionnement du composant électronique 1 1 susceptible de dégager des calories. Alors que sur la figure 1 , un tel composant est à distance du ou des trous, le composant électronique 1 1 est ici solidarisé, notamment par un brasage, sur la première face 3 au droit de la pluralité de trous 5, c'est-à-dire au droit du moyen conducteur de calories 6. Autrement dit, un î o périmètre externe du composant électronique 1 1 délimite la première emprise 12 sur la première face 3. Cette première emprise 12 superpose la deuxième emprise 8 délimitant la périphérie entourant la pluralité de trous 5. L'invention couvre le cas montré sur cette figure où la première emprise 12 est totalement superposée sur la deuxième emprise 8, cette dernière couvrant une aire plus importante que l'aireOne difference lies in the positioning of the electronic component 1 1 likely to release calories. While in Figure 1, such a component is at a distance from the hole or holes, the electronic component 1 1 is here secured, in particular by soldering, on the first face 3 to the right of the plurality of holes 5, that is, That is, an outer perimeter of the electronic component 1 1 delimits the first right-of-way 12 on the first face 3. This first right-of-way 12 superimposes the second right-of-way 8 delimiting the periphery surrounding the plurality of holes 5. The invention covers the case shown in this figure where the first right-of-way 12 is totally superimposed on the second right-of-way 8, the latter covering a larger area than the area
15 couverte par la première emprise. 15 covered by the first right of way.
L'invention couvre également le cas où la première emprise 12 se superpose au moins partiellement avec la deuxième emprise 8. En d'autres termes, l'invention couvre la situation où le composant électronique 1 1 est entièrement 20 disposé au dessus de la pluralité de trous 5, mais elle couvre également le cas où le composant électronique 1 1 chevauche seulement partiellement la pluralité de trous 5. La variante de cette figure comporte également un dissipateur thermique 9, par exemple, identique à celui de la figure 1 . The invention also covers the case where the first grip 12 is superimposed at least partially with the second grip 8. In other words, the invention covers the situation where the electronic component 11 is entirely disposed above the plurality. of holes 5, but it also covers the case where the electronic component 1 1 only partially overlaps the plurality of holes 5. The variant of this figure also comprises a heat sink 9, for example, identical to that of Figure 1.
25 La deuxième variante de l'invention est représentée à la figure 3. La carte de circuit imprimé 1 reçoit un moyen conducteur de calories 6 identique à celui des figures 1 ou 2. En revanche, le dissipateur thermique 9 présente une forme différente. En effet, celui-ci traverse de part en part la carte de circuit imprimé 15, au niveau du moyen conducteur de calories 6, par exemple au centre de celui-ci.The second variant of the invention is shown in FIG. 3. The printed circuit board 1 receives a calorie conducting means 6 identical to that of FIGS. 1 or 2. On the other hand, the heat sink 9 has a different shape. Indeed, it passes right through the printed circuit board 15, at the calorie conducting means 6, for example in the center thereof.
30 Le barreau 14 présente alors une première extrémité libre qui débouche dans le flux d'air et une seconde extrémité coiffée par une tête 17 formée de manière unitaire avec le barreau 14. La tête 17 forme un plat qui est solidarisé sur la première face 3 par une brasure 18 au droit du moyen conducteur de calories 6. La variante de la figure 4 est proche de celle la figure 3. On détaillera ci- après la différence et on se reportera à la description de la figure 3 pour les éléments identiques. La différence réside dans le mode de solidarisation du 5 dissipateur thermique 9 sur le moyen conducteur de calories 6. The bar 14 then has a first free end that opens into the air flow and a second end capped by a head 17 formed unitarily with the bar 14. The head 17 forms a flat which is secured to the first face 3 by a solder 18 to the right of the calorie-conducting medium 6. The variant of FIG. 4 is close to that of FIG. 3. The difference will be detailed below and reference will be made to the description of FIG. 3 for the identical elements. The difference lies in the method of securing the heat sink 9 to the calorie conducting means 6.
Le dissipateur thermique 9 comprend le barreau 14 coiffé par la tête 17 identique à la variante de la figure 3. La tête 17 n'est pas brasée sur le moyen conducteur de calories 6 au niveau de la première face 3. Une brasure 15 est î o réalisée entre le barreau 14 et le moyen conducteur de calories 6 au niveau de la deuxième face 4 de la carte de circuit imprimé 1 . Le dissipateur thermique 9 se trouve alors en appui par sa tête 17 sur une première extrémité du moyen conducteur de calories 6, et solidarisé à celui-ci par le biais de la brasure 15 réalisée au niveau de la deuxième face 4. The heat sink 9 comprises the bar 14 capped by the head 17 identical to the variant of FIG. 3. The head 17 is not soldered on the calorie-conducting means 6 at the first face 3. A solder 15 is o performed between the bar 14 and the calorie conducting means 6 at the second face 4 of the printed circuit board 1. The heat sink 9 is then supported by its head 17 on a first end of the calorie-conducting means 6, and secured thereto by means of the solder 15 made at the second face 4.
15  15
La deuxième variante et la troisième variante de l'invention emploient un dissipateur thermique 9 qui présente une tête 17, cette dernière débordant, autrement dit dépassant, du plan de la première face 3 entre les composants électroniques solidarisés sur cette première face 3. La tête contribue à capter les 20 calories générées par les composants électroniques pour les drainer vers le barreau 14 léché par le flux d'air.  The second variant and the third variant of the invention employ a heat sink 9 which has a head 17, the latter protruding, in other words protruding, from the plane of the first face 3 between the electronic components secured to this first face 3. The head helps capture the 20 calories generated by the electronic components to drain to the bar 14 licked by the air flow.
La carte de circuit imprimé 1 décrite dans les variantes ci-dessus peut comprendre une pluralité de trous 5 et/ou une pluralité de moyens conducteurs de 25 calories 6 identiques et une pluralité de dissipateurs thermiques 9 identiques. The printed circuit board 1 described in the above variants may comprise a plurality of holes 5 and / or a plurality of identical calorie conducting means 6 and a plurality of identical heat sinks 9.
Selon une autre variante, la carte de circuit imprimé 1 selon la présente invention peut comprendre une combinaison de moyens conducteurs de calories 6 et de dissipateurs thermiques 9 réalisés selon au moins deux variantes exposées 30 ci-dessus. According to another variant, the printed circuit board 1 according to the present invention may comprise a combination of caloric conducting means 6 and heat sinks 9 made according to at least two variants exposed above.
On notera que le dissipateur thermique 9 selon l'une quelconque des variantes présentées ci-dessus est avantageusement réalisé en un alliage d'aluminium ou préférentiel lement en cuivre. It will be noted that the heat sink 9 according to any one of the variants presented above is advantageously made of an alloy aluminum or preferably copper.
On notera également que, préférentiellement, la carte de circuit imprimé 1 est munie sous la deuxième face 4 et/ou sur la première face 3 d'un plan de cuivre de sorte à permettre le brasage de différents composants, et en particulier It will also be noted that, preferably, the printed circuit board 1 is provided under the second face 4 and / or on the first face 3 of a copper plane so as to allow brazing of various components, and in particular
La figure 5 illustre un exemple d'application de la carte de circuit imprimé 1 selon l'invention dans un dispositif de ventilation 19. Un tel dispositif de ventilation comprend un support 20 à l'intérieur duquel est logé un moteur électrique 21 . FIG. 5 illustrates an example of application of the printed circuit board 1 according to the invention in a ventilation device 19. Such a ventilation device comprises a support 20 inside which an electric motor 21 is housed.
Le moteur électrique 21 entraîne en rotation une hélice 22 constituée d'un bol 23 représenté en pointillé sur cette figure. Ce bol forme un moyen d'entraînement de l'hélice, puisqu'un arbre du moteur est relié à ce bol 23. Un tel bol est par exemple plein, en ce sens que sa paroi est dépourvue d'ouverture. Selon une autre alternative, un tel bol 23 présente une pluralité d'ouvertures. The electric motor 21 rotates a propeller 22 consisting of a bowl 23 shown in dotted line in this figure. This bowl forms a drive means of the propeller, since a motor shaft is connected to the bowl 23. Such a bowl is for example full, in that its wall is devoid of opening. According to another alternative, such a bowl 23 has a plurality of openings.
A la périphérie d'un tel bol 23 s'étend une pluralité de pales 24 selon une direction parallèle à une direction d'extension de l'arbre du moteur. L'extrémité de chaque pale est jointe par un bandeau 25. Une telle hélice 22 forme ainsi une hélice en cage d'écureuil, autrement appelé turbine radiale. At the periphery of such a bowl 23 extends a plurality of blades 24 in a direction parallel to an extension direction of the motor shaft. The end of each blade is joined by a strip 25. Such a helix 22 thus forms a squirrel cage propeller, otherwise called radial turbine.
A l'opposé de l'hélice 22 par rapport au moteur électrique 21 , on trouve le dispositif de commande 26 dont la fonction est de piloter la vitesse de rotation de l'hélice 22 en contrôlant la tension ou le courant envoyé au moteur électrique 21 . Un tel dispositif de commande 26 est installé contre le support 20 de manière à pouvoir être exposé au flux d'air généré par l'hélice 22, le dispositif de commande étant recouvert par un capot 27 de manière limiter l'entrée de corps étranger dans la portion du dispositif de ventilation où est installé le dispositif de commande 26. Le support 20 comprend un évidement 28 dans lequel le flux d'air mis en mouvement par l'hélice 22 peut circuler, un tel flux d'air étant représenté de manière schématique par deux symboles référencés 29 et 30. Un tel évidement 28 est bordé latéralement par au moins une première paroi 31 , et avantageusement par une seconde paroi 32, l'une et/ou l'autre de ces parois pouvant être solidaires de la carte de circuit imprimé 1 . On comprend ainsi que le flux d'air 29, 30 est canalisé par le support 20 et au moins l'une et/ou l'autre des premier et deuxième parois référencées 31 et 32. Opposite the propeller 22 with respect to the electric motor 21, there is the control device 26 whose function is to control the speed of rotation of the propeller 22 by controlling the voltage or the current sent to the electric motor 21 . Such a control device 26 is installed against the support 20 so as to be exposed to the air flow generated by the propeller 22, the control device being covered by a cover 27 so as to limit the entry of foreign body into the portion of the ventilation device in which the control device 26 is installed. The support 20 comprises a recess 28 in which the flow of air set in motion by the propeller 22 can circulate, such a flow of air being represented in a manner schematic by two symbols referenced 29 and 30. Such a recess 28 is laterally bordered by at least a first wall 31, and advantageously by a second wall 32, one and / or the other of these walls being integral with the printed circuit board 1. It is thus understood that the air flow 29, 30 is channeled by the support 20 and at least one and / or the other of the first and second referenced walls 31 and 32.
5  5
Ce canal est également délimité par le dispositif de commande 26. De manière plus précise, ce canal est délimité par la carte de circuit imprimé 1 constitutive du dispositif de commande 26. î o La portion de la carte de circuit imprimé 1 qui ferme le canal de circulation du flux d'air 29, 30, en combinaison avec la première paroi 31 et la deuxième paroi 32, forme une partie de ladite carte dans laquelle sont ménagés le ou les trous 5, le ou les moyens conducteur de calories 6 et le ou les dissipateurs thermiques 9, tels que détaillés en référence aux figures 1 à 4.  This channel is also delimited by the control device 26. More specifically, this channel is delimited by the printed circuit board 1 constituting the control device 26. The portion of the printed circuit board 1 which closes the channel the air flow 29, 30, in combination with the first wall 31 and the second wall 32, forms a part of said card in which are formed the hole or holes 5, the means or means 6 of calories and the or heat sinks 9, as detailed with reference to Figures 1 to 4.
15  15
La deuxième face 4 de la carte de circuit imprimé 1 est partagée d'une part, en une partie 33 de carte de circuit imprimé 1 léchée par le flux d'air 29, 30 mis en circulation par l'hélice 22, et d'autre part, en une zone 34 non exposée au flux d'air généré par l'hélice 22. Le ou les moyens conducteurs de calories 6 et le ou les 20 dissipateurs thermiques 9 sont ménagés dans la partie 33, et sont absents de la zone 34.  The second face 4 of the printed circuit board 1 is shared on the one hand, in a portion 33 of printed circuit board 1 licked by the air flow 29, 30 circulated by the propeller 22, and of on the other hand, in a zone 34 not exposed to the air flow generated by the helix 22. The one or more heat conducting means 6 and the heat dissipator (s) 9 are formed in the portion 33, and are absent from the zone 34.
Le partage entre la partie 33 de la carte de circuit imprimé 1 et la zone 34 de cette même carte est organisé par la première paroi 31 , et avantageusement par 25 la deuxième paroi 32. On comprend donc que la deuxième face 4 qui se trouve au droit de la partie 33 de la carte de circuit imprimé 1 , qui comporte au moins moyen conducteur de calories 6 et un dissipateur thermique 9, est léchée par le flux d'air 29, 31 , de manière à la refroidir et corrélativement, de manière à refroidir les composants électroniques 1 1 qui dégagent des calories. The division between the portion 33 of the printed circuit board 1 and the zone 34 of this same card is organized by the first wall 31, and advantageously by the second wall 32. It is therefore understood that the second face 4 which is at the 1 of the circuit board 1, which comprises at least one calorie-conducting medium 6 and a heat sink 9, is licked by the air flow 29, 31, so as to cool it and correlatively, so as to to cool the electronic components 1 1 which give off calories.
30  30
Une telle partie 33 de la carte de circuit imprimé 1 forme un support pour les pistes électriquement conductrices. En d'autres termes, une pluralité de pistes électriquement conductrices chemine sur la deuxième face 4 léchée par le flux d'air et elles sont arrangées de manière à limiter le risque de court-circuit entre deux pistes électriquement conductrices. Un tel agencement est, par exemple, une distance minimum séparant les pistes électriquement conductrices qui cheminent au niveau de la partie 33 léchée par le flux d'air. Selon un exemple de 5 réalisation, une telle distance est par exemple de 1 .5 mm minimum. Such a portion 33 of the printed circuit board 1 forms a support for the electrically conductive tracks. In other words, a plurality of electrically conductive tracks travel on the second side 4 licked by the flow of air and they are arranged so as to limit the risk of short circuit between two electrically conductive tracks. Such an arrangement is, for example, a minimum distance separating the electrically conductive tracks that run at the portion 33 licked by the air flow. According to an exemplary embodiment, such a distance is for example 1 .5 mm minimum.
Selon un exemple de réalisation, la zone 34 peut comprendre au moins un composant électronique 35 solidarisé sur la deuxième face 4 qui s'étend au niveau de la zone 34. Cette zone comprend encore une pluralité de pistes électriquement î o conductrices ne nécessitant pas d'agencement pour éviter les courts-circuits, puisque cette zone 34 est isolée du flux d'air 29, 30 en circulation, notamment grâce à la présence de la première paroi 31 qui est plaquer contre la deuxième face 4, par exemple, perpendiculairement au plan d'extension de la carte de circuit imprimé 1 . According to an exemplary embodiment, the zone 34 may comprise at least one electronic component 35 secured to the second face 4 which extends at the zone 34. This zone further comprises a plurality of electrically conductive tracks that do not require arrangement to avoid short circuits, since this zone 34 is isolated from the circulating air flow 29, 30, in particular thanks to the presence of the first wall 31 which is pressed against the second face 4, for example, perpendicular to the extension plan of the printed circuit board 1.
15  15

Claims

REVENDICATIONS
1 . Dispositif de refroidissement pour une carte de circuit imprimé, 5 comprenant une carte de circuit imprimé munie d'au moins une face ou première face et au moins un élément dissipateur thermique (9) brasé sur ladite au moins une face du circuit imprimé, ledit au moins un élément dissipateur thermique (9) étant apte à être disposé dans un flux de fluide réfrigérant. î o 2. Dispositif de refroidissement selon la revendication 1 , ladite carte de circuit imprimé comprenant deux faces. 1. A cooling device for a printed circuit board, comprising a printed circuit board provided with at least one face or first face and at least one heat sink element (9) soldered to said at least one face of the printed circuit board, said at least one at least one heat dissipating element (9) being able to be arranged in a refrigerant flow. 2. A cooling device according to claim 1, said printed circuit board having two faces.
3. Dispositif de refroidissement selon la revendication 2, comprenant au moins un trou traversant ladite carte de circuit imprimé depuis l'une des deuxCooling device according to claim 2, comprising at least one hole passing through said printed circuit board from one of the two
15 faces à l'autre des deux faces, ledit un élément dissipateur thermique (9) étant disposé en regard dudit au moins un trou traversant. 15 faces to the other of the two faces, said heat dissipating element (9) being disposed opposite said at least one through hole.
4. Dispositif de refroidissement selon la revendication 3, dans lequel ledit au moins un trou traversant comprend une surface interne recouverte d'uneCooling device according to claim 3, wherein said at least one through hole comprises an inner surface covered with a
20 substance métallique. Metal substance.
5. Dispositif de refroidissement selon l'une des revendications 3 ou 4, comprenant une pluralité de trous traversant ladite carte de circuit imprimé. 5. Cooling device according to one of claims 3 or 4, comprising a plurality of holes through said printed circuit board.
25 6. Dispositif de refroidissement selon l'une des revendications précédentes, dans lequel la carte de circuit imprimé est munie d'un composant électronique (19). The cooling device according to one of the preceding claims, wherein the printed circuit board is provided with an electronic component (19).
7. Dispositif de refroidissement selon la revendication précédente prise dans 30 son rattachement à la revendication 5, dans lequel un périmètre externe du composant électronique (19) délimite une première emprise (30) sur la première face (16), la pluralité de trous (18) délimite une deuxième emprise (26) sur la première face (16), la première emprise (30) et la deuxième emprise (26) étant séparées par une distance non nulle. 7. Cooling device according to the preceding claim taken in its attachment to claim 5, wherein an outer perimeter of the electronic component (19) delimits a first grip (30) on the first face (16), the plurality of holes ( 18) delimits a second right-of-way (26) on the first face (16), the first right-of-way (30) and the second right-of-way (26) being separated by a non-zero distance.
8. Dispositif de refroidissement selon l'une des revendications 5 à 7, dans lequel un périmètre externe du composant électronique (19) délimite une première 5 emprise (30) sur la première face (16), la pluralité de trous (18) délimite une deuxième emprise (26) sur la première face (16), la première emprise (30) et la deuxième emprise (26) se superposant au moins partiellement. 8. Cooling device according to one of claims 5 to 7, wherein an outer perimeter of the electronic component (19) delimits a first grip (30) on the first face (16), the plurality of holes (18) delimits a second grip (26) on the first face (16), the first grip (30) and the second grip (26) overlapping at least partially.
9. Dispositif de refroidissement selon l'une des revendications précédentes, î o dans lequel le au moins un élément dissipateur thermique (9) comprend une tête9. Cooling device according to one of the preceding claims, wherein the at least one heat sink element (9) comprises a head
(31 ) formant butée d'appui contre la carte de circuit imprimé (15). (31) forming abutment against the printed circuit board (15).
10. Dispositif de ventilation (19) d'une installation de ventilation d'un habitacle de véhicule automobile, comprenant une hélice (22) génératrice d'un flux10. Ventilation device (19) of a ventilation installation of a passenger compartment of a motor vehicle, comprising a propeller (22) generating a flow
15 d'air (29, 30) et apte à être entraînée par un moteur électrique (21 ), comprenant une dispositif de refroidissement selon l'une quelconque des revendications précédentes. 15 of air (29, 30) and adapted to be driven by an electric motor (21), comprising a cooling device according to any one of the preceding claims.
EP13805864.9A 2012-12-19 2013-12-13 Cooling device for a printed circuit board Withdrawn EP2936955A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1262300A FR2999864A1 (en) 2012-12-19 2012-12-19 COOLING DEVICE FOR PRINTED CIRCUIT BOARD
PCT/EP2013/076501 WO2014095610A1 (en) 2012-12-19 2013-12-13 Cooling device for a printed circuit board

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EP2936955A1 true EP2936955A1 (en) 2015-10-28

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EP13805864.9A Withdrawn EP2936955A1 (en) 2012-12-19 2013-12-13 Cooling device for a printed circuit board

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US (1) US20160135283A1 (en)
EP (1) EP2936955A1 (en)
JP (1) JP2016502280A (en)
CN (1) CN104956784A (en)
FR (1) FR2999864A1 (en)
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WO (1) WO2014095610A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6354279B2 (en) * 2014-04-18 2018-07-11 ダイキン工業株式会社 Air conditioner
US10237967B2 (en) * 2015-10-02 2019-03-19 Analogic Corporation Cooling assembly for electronics assembly of imaging system
CA3031042C (en) * 2016-07-20 2023-12-19 Stackpole International Engineered Products, Ltd. Pump assembly having integrated controller and motor with internal active cooling
DE102017104386A1 (en) * 2017-03-02 2018-09-06 HELLA GmbH & Co. KGaA Method for producing an electrical assembly
DE102018210256A1 (en) * 2018-06-22 2019-12-24 Robert Bosch Gmbh Control unit with heat sink and circuit board

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58175643U (en) * 1982-05-19 1983-11-24 富士通株式会社 Heat dissipation structure for printed wiring board components
JPS59123298A (en) * 1982-12-28 1984-07-17 富士通株式会社 Semiconductor device
FR2625038B1 (en) * 1987-12-22 1990-08-17 Cit Alcatel METHOD AND DEVICE FOR COOLING AN INTEGRATED CIRCUIT HOUSING
US5043845A (en) * 1989-10-16 1991-08-27 Eastman Kodak Company High-speed CCD sensor mounting system with improved signal to noise operation and thermal contact
JPH03204997A (en) * 1989-12-29 1991-09-06 Hitachi Ltd Multilayer printed board cooling system
US5113315A (en) * 1990-08-07 1992-05-12 Cirqon Technologies Corporation Heat-conductive metal ceramic composite material panel system for improved heat dissipation
US5258887A (en) * 1992-06-15 1993-11-02 Eaton Corporation Electrical device cooling system using a heat sink attached to a circuit board containing heat conductive layers and channels
JPH06169189A (en) * 1992-11-30 1994-06-14 Hitachi Ltd Chip type heat generating component and packaging thereof
WO1994029900A1 (en) * 1993-06-09 1994-12-22 Lykat Corporation Heat dissipative means for integrated circuit chip package
JP3269397B2 (en) * 1995-09-19 2002-03-25 株式会社デンソー Printed wiring board
DE19842590A1 (en) * 1998-09-17 2000-04-13 Daimler Chrysler Ag Process for the production of circuit arrangements
JP3923703B2 (en) * 2000-03-29 2007-06-06 ローム株式会社 Printed wiring board having heat dissipation means
US6477054B1 (en) * 2000-08-10 2002-11-05 Tektronix, Inc. Low temperature co-fired ceramic substrate structure having a capacitor and thermally conductive via
US6605778B2 (en) * 2000-10-02 2003-08-12 Siemens Aktiengesellschaft Circuit carrier, in particular printed circuit board
US7265983B2 (en) * 2003-10-13 2007-09-04 Tyco Electronics Raychem Gmbh Power unit comprising a heat sink, and assembly method
JP2005168268A (en) * 2003-12-05 2005-06-23 Asmo Co Ltd Motor drive circuit device and motor
JP2006024755A (en) * 2004-07-08 2006-01-26 Fujitsu Ltd Circuit board
JP2006100483A (en) * 2004-09-29 2006-04-13 Matsushita Electric Works Ltd Heat dissipation structure of printed wiring board
US7269017B2 (en) * 2004-11-19 2007-09-11 Delphi Technologies, Inc. Thermal management of surface-mount circuit devices on laminate ceramic substrate
JP2007173341A (en) * 2005-12-20 2007-07-05 Nissan Motor Co Ltd Mounting structure of circuit board, and method of the mounting
US7808788B2 (en) * 2007-06-29 2010-10-05 Delphi Technologies, Inc. Multi-layer electrically isolated thermal conduction structure for a circuit board assembly
DE202007009288U1 (en) * 2007-07-03 2007-08-30 Osram Gesellschaft mit beschränkter Haftung Surface-mountable light-emitting diode component with a heat sink
US7911797B2 (en) * 2007-10-25 2011-03-22 Nexxus Lighting Apparatus and methods for thermal management of electronic devices
JP5218657B2 (en) * 2009-06-15 2013-06-26 富士通オプティカルコンポーネンツ株式会社 Optical module
US8767398B2 (en) * 2010-02-05 2014-07-01 Black Tank Llc Thermal management system for electrical components and method of producing same
JP2012231061A (en) * 2011-04-27 2012-11-22 Global Micronics Corp Electronic component module and manufacturing method of the same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2014095610A1 *

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WO2014095610A1 (en) 2014-06-26
CN104956784A (en) 2015-09-30
US20160135283A1 (en) 2016-05-12
JP2016502280A (en) 2016-01-21
FR2999864A1 (en) 2014-06-20
MX2015007953A (en) 2016-02-19

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