EP2896670A4 - Composition adhésive photodurcissable - Google Patents

Composition adhésive photodurcissable

Info

Publication number: EP2896670A4
Authority: EP; European Patent Office
Prior art keywords: adhesive composition; photocurable adhesive; photocurable; composition; adhesive
Prior art date: 2012-09-13
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP13837731.2A

Other languages

German (de)

English (en)

Other versions

EP2896670A1 (fr

EP2896670B1 (fr

Inventor

Sang Hwan Kim

Yong Hoon Lee

Dai Hyun Kim

Won Gu Choi

Jang Soon Kim

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

LG Chem Ltd

Original Assignee

LG Hausys Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2012-09-13

Filing date

2013-09-04

Publication date

2015-09-30

2013-09-04 Application filed by LG Hausys Ltd filed Critical LG Hausys Ltd

2015-07-22 Publication of EP2896670A1 publication Critical patent/EP2896670A1/fr

2015-09-30 Publication of EP2896670A4 publication Critical patent/EP2896670A4/fr

2020-11-04 Application granted granted Critical

2020-11-04 Publication of EP2896670B1 publication Critical patent/EP2896670B1/fr

Status Active legal-status Critical Current

2033-09-04 Anticipated expiration legal-status Critical

Links

239000000853 adhesive Substances 0.000 title 1
230000001070 adhesive effect Effects 0.000 title 1

Classifications

- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/04—Epoxynovolacs
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Epoxy Resins (AREA)
Adhesives Or Adhesive Processes (AREA)

EP13837731.2A 2012-09-13 2013-09-04 Composition adhésive photodurcissable Active EP2896670B1 (fr)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
KR1020120101328A KR101464407B1 (ko)	2012-09-13	2012-09-13	광경화형 접착제 조성물
PCT/KR2013/007966 WO2014042385A1 (fr)	2012-09-13	2013-09-04	Composition adhésive photodurcissable

Publications (3)

Publication Number	Publication Date
EP2896670A1 EP2896670A1 (fr)	2015-07-22
EP2896670A4 true EP2896670A4 (fr)	2015-09-30
EP2896670B1 EP2896670B1 (fr)	2020-11-04

Family

ID=50278439

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP13837731.2A Active EP2896670B1 (fr)	2012-09-13	2013-09-04	Composition adhésive photodurcissable

Country Status (5)

Country	Link
US (1)	US9315699B2 (fr)
EP (1)	EP2896670B1 (fr)
KR (1)	KR101464407B1 (fr)
CN (1)	CN104619804B (fr)
WO (1)	WO2014042385A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR101832522B1 (ko) *	2013-11-29	2018-04-04	주식회사 엘지화학	접착 필름 형성용 조성물, 광경화전 가공용 점착 필름, 접착 필름 및 전자종이 표시장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6312801B1 (en) *	2000-06-20	2001-11-06	Saehan Industries Incorporation	Adhesive tape for electronic parts
US20100133703A1 (en) *	2008-11-28	2010-06-03	Lintec Corporation	Semiconductor Chip Laminate and Adhesive Composition for Semiconductor Chip Lamination
DE102010028586A1 (de) *	2010-05-05	2011-11-10	Henkel Ag & Co. Kgaa	1K-Epoxidharzzusammensetzung mit verringerter Toxizität

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JPS6072918A (ja) *	1983-09-30	1985-04-25	Toshiba Corp	光重合性エポキシ樹脂組成物
JPH05315742A (ja) *	1992-05-08	1993-11-26	Furukawa Electric Co Ltd:The	耐熱性接着剤
JPH08100163A (ja)	1994-09-29	1996-04-16	Nippon Zeon Co Ltd	エポキシ樹脂系接着剤組成物
JPH09279117A (ja) *	1996-04-10	1997-10-28	Kansai Paint Co Ltd	熱硬化型接着剤
KR100302212B1 (ko)	1999-01-22	2001-09-22	한형수	전자부품용 접착테이프의 제조방법
EP1026217B1 (fr) *	1999-02-08	2003-04-23	Toray Saehan Inc.	Procédé pour la préparation de rubans adhésifs pour composants électroniques
JP5655446B2 (ja) *	2010-09-09	2015-01-21	Dic株式会社	熱硬化性樹脂組成物およびプリント配線板用層間接着フィルム
JP5610307B2 (ja) *	2010-09-20	2014-10-22	エルジー・ケム・リミテッド	偏光板用接着剤組成物、これを含む偏光板及び光学素子
KR101072371B1 (ko) *	2010-09-20	2011-10-11	주식회사 엘지화학	편광판용 접착제 및 이를 포함하는 편광판
KR101043609B1 (ko)	2010-09-29	2011-06-22	대아플랜트(주)	점검창이 구비된 보일러의 맨홀
KR102002280B1 (ko) *	2011-09-07	2019-10-01	마이크로켐 코포레이션	저 표면 에너지 기재 상에 릴리프 패턴을 제작하기 위한 에폭시 제형 및 방법

2012
- 2012-09-13 KR KR1020120101328A patent/KR101464407B1/ko active IP Right Grant
2013
- 2013-09-04 WO PCT/KR2013/007966 patent/WO2014042385A1/fr active Application Filing
- 2013-09-04 US US14/424,715 patent/US9315699B2/en active Active
- 2013-09-04 EP EP13837731.2A patent/EP2896670B1/fr active Active
- 2013-09-04 CN CN201380047949.0A patent/CN104619804B/zh active Active

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6312801B1 (en) *	2000-06-20	2001-11-06	Saehan Industries Incorporation	Adhesive tape for electronic parts
US20100133703A1 (en) *	2008-11-28	2010-06-03	Lintec Corporation	Semiconductor Chip Laminate and Adhesive Composition for Semiconductor Chip Lamination
DE102010028586A1 (de) *	2010-05-05	2011-11-10	Henkel Ag & Co. Kgaa	1K-Epoxidharzzusammensetzung mit verringerter Toxizität

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2014042385A1 *

Also Published As

Publication number	Publication date
EP2896670A1 (fr)	2015-07-22
KR20140035042A (ko)	2014-03-21
WO2014042385A1 (fr)	2014-03-20
CN104619804A (zh)	2015-05-13
EP2896670B1 (fr)	2020-11-04
US9315699B2 (en)	2016-04-19
CN104619804B (zh)	2017-04-12
KR101464407B1 (ko)	2014-12-04
US20150203726A1 (en)	2015-07-23

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2015-09-30	RIC1	Information provided on ipc code assigned before grant	Ipc: C09J 11/00 20060101ALI20150824BHEP Ipc: C09J 163/00 20060101AFI20150824BHEP Ipc: C09J 163/04 20060101ALI20150824BHEP
2015-12-23	DAX	Request for extension of the european patent (deleted)
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