EP2893303A1 - Transducteur ultrasonore et procédé de fabrication d'un transducteur ultrasonore - Google Patents

Transducteur ultrasonore et procédé de fabrication d'un transducteur ultrasonore

Info

Publication number
EP2893303A1
EP2893303A1 EP13759168.1A EP13759168A EP2893303A1 EP 2893303 A1 EP2893303 A1 EP 2893303A1 EP 13759168 A EP13759168 A EP 13759168A EP 2893303 A1 EP2893303 A1 EP 2893303A1
Authority
EP
European Patent Office
Prior art keywords
ultrasonic transducer
covering means
housing
cavity
covering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13759168.1A
Other languages
German (de)
English (en)
Inventor
Oliver Betz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
systec Controls Mess- und Regeltechnik GmbH
systec Controls Mess und Regeltechnik GmbH
Original Assignee
systec Controls Mess- und Regeltechnik GmbH
systec Controls Mess und Regeltechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by systec Controls Mess- und Regeltechnik GmbH, systec Controls Mess und Regeltechnik GmbH filed Critical systec Controls Mess- und Regeltechnik GmbH
Publication of EP2893303A1 publication Critical patent/EP2893303A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0207—Driving circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0076—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised in that the layers are not bonded on the totality of their surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/142—Laminating of sheets, panels or inserts, e.g. stiffeners, by wrapping in at least one outer layer, or inserting into a preformed pocket
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2437—Piezoelectric probes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/886—Additional mechanical prestressing means, e.g. springs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/028—Treatment by energy or chemical effects using vibration, e.g. sonic or ultrasonic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Definitions

  • the invention relates to an ultrasonic transducer, wherein the ultrasonic transducer comprises a housing and a piezo-element, which is inserted in a cavity of the housing. The cavity is covered by a covering means arranged in the housing. Between the cover and the piezo-element, a spring is arranged, which acts on the piezo-element with a spring force. Furthermore, the invention relates to a method for assembling an ultrasonic transducer and an assembly for installation in the housing of an ultrasonic transducer.
  • ultrasonic transducers are used for a variety of measurements.
  • the ultrasound used for the measurement is generated by exciting a piezoelectric element to vibrate by changing the voltage.
  • the ultrasound thus generated is picked up by a receiver directly or after reflection at an interface.
  • the receiver converts the applied ultrasonic signals back into a voltage change.
  • the ultrasonic transducer of the type mentioned is also suitable as a receiver, so that it can be used both as a generator as well as a receiver of ultrasonic signals.
  • Such ultrasonic transducers are used, for example, as pressure or level sensors. They have proven particularly useful as sensors for flowmeters.
  • the flow rate of a flowing through the conduit medium can be determined easily.
  • Various methods can be used for the measurement; a frequently used method is the propagation time difference measurement of the ultrasonic signals emitted by the ultrasound transducer. From the results obtained, the mass or volume flow in the pipe can be calculated with high precision.
  • ultrasonic flowmeters do not necessarily have to be installed in the pipe to be dimensioned, but also as so-called clamp-on measuring devices can be used. In many cases it is completely sufficient for the measurement to fasten the ultrasonic transducers on the outside of the line.
  • the non-invasive measurement offers the advantage that it is possible to dispense with opening the line required for inserting the sensor. Leakage problems do not even occur here.
  • clamp-on measuring devices do not generate a disturbance in the pipe cross-section and thus there is no danger of falsifying the measurement result by means of a local flow change caused by the sensor
  • the clamp-on flowmeters which are easy to install, are suitable for mobile use at changing measuring locations beyond stationary use. For this, it only needs to be calibrated to the respective pipe cross-section and the material used for the wall of the pipe.
  • An ultrasonic transducer essentially consists of a piezo element that is inserted in a cavity which is formed in the housing of the ultrasonic transducer.
  • the inserted into the cavity piezo element is pressed by spring force from the inside against this outer wall of the housing.
  • To the rest of the housing cavity is closed with a covering, usually it is covered by a simple disc.
  • Such a covering means is required because the interior of the ultrasonic transducer is provided with a potting enclosure after the assembly of the piezoelectric element in the vast majority of cases for safety reasons.
  • the disc covering the cavity is intended to prevent the liquid potting compound from penetrating into the cavity during the casting of the ultrasonic transducer and overriding the effect of the spring element.
  • the disc can be used as an abutment for the spring pressing the piezo element to the housing inner wall.
  • the assembly of these parts is relatively complex.
  • the piezo element Before the housing can be cast, the piezo element must first go outside be contacted. This is done via guided in the housing cable, which connect the piezoelectric element with the provided at the back of the housing terminals of the ultrasonic transducer.
  • an opening or a cable channel In the cavity-covering disc, an opening or a cable channel is provided, through which the cables must be threaded to guide them out of the cavity.
  • the piezoelectric element opposite end of the cable connection is soldered to the housing with the external interface of the ultrasonic transducer, so its connection.
  • impedance matching is almost always required. It is achieved by the interposition of an inductance.
  • the cavity After cabling, the cavity must be sealed off from the rest of the housing. A disk lying only on the cavity would not completely close it, penetration of the potting compound into the cavity would not be safe in this way.
  • the disc In order to ensure the tightness of the cavity as simple as possible, the disc is glued to the housing. For this purpose, the disc is positioned in the desired position over the cavity and fixed there, for example with a split pin. Subsequently, it is provided along the housing with an adhesive which, after curing, connects the disc to the housing and seals the cavity. Also glued and thus sealed is the existing in the disc opening with the guided through them wiring.
  • the object of the present application is to provide an ultrasonic transducer whose production is simpler in comparison with the ultrasonic transducers of the type mentioned above. Furthermore, a prefabricated assembly is proposed with which an ultrasonic transducer can be assembled in a quick and easy way. In addition, a simplifying the assembly of an ultrasonic transducer method is proposed.
  • the ultrasound transducer has a plurality of conductor tracks, respectively electrical conductors, which pass through the covering means.
  • one of the conductor tracks connects a contact surface, which is arranged on the side facing the piezoelectric element of the cover, with a contact surface on the opposite side of the cover.
  • the covering is thus formed as a kind of printed circuit board or board.
  • the electrical conductors are therefore integrated into the covering means, that is, embodied in one piece with the covering means.
  • the piezoelectric element is connected to the covering means on the side facing the cavity, and the external interface of the ultrasonic transducer arranged on the housing is connected to the side opposite the cavity.
  • the cables connecting the piezoelectric element with the external interface thus no longer have to be passed through an opening, instead two separate cables are each contacted with the contact points provided for this purpose on one side of the covering means.
  • a first cable connects the piezo element to the covering means
  • the second cable connects the covering means to the external interface of the ultrasonic transducer.
  • the first and second cables are in turn interconnected by the cover means.
  • the interconnects integrated in the covering means are thus part of an electrical connection which contacts the piezoelement with the external interfaces of the ultrasound transducer arranged on the housing.
  • a very particular advantage of this solution is that it makes it possible to pre-assemble elements of the ultrasonic transducer according to the invention prior to installation in the converter housing as an assembly.
  • the proposed prefabricated assembly has a covering means for closing a cavity provided for receiving a piezoelectric element of the ultrasonic transducer, wherein the Covering means according to the invention comprises electrical conductors which through-contact the covering means and wherein the assembly comprises a piezoelectric element which is connected to the electrical conductors and wherein between the piezo-element and the covering means a spring element is arranged.
  • This assembly is preferably already assembled outside of the ultrasonic transducer, since such an access from all sides is easily possible.
  • the piezoelectric element and the covering means are easily accessible in this way and can be connected to one another without hindrance.
  • the prefabricated module must then only be connected to the external interface of the ultrasonic transducer.
  • the designated contact points of the covering are still easily accessible even after the positioning of the assembly.
  • the assembly of the ultrasonic transducer is thereby significantly simplified.
  • contact points of the conductor tracks are formed as solder surfaces.
  • solder pads additionally facilitates the contacting of the cables and thus accelerate the assembly of the ultrasonic transducer even more.
  • the covering means comprises at least one electrical or electronic component. This makes it possible to provide such a component in the connection of the piezoelectric element and the external interface of the ultrasonic transducer, without it having to be intermediately interposed in the connection.
  • the component can be connected in advance of the assembly with the conductor of the cover, during assembly of the ultrasonic transducer so no additional connections are required except the contacts of the first and second cable.
  • the covering means comprises at least one inductance for impedance matching of the piezoelectric element.
  • An impedance matching is regularly required as described. If the board is already equipped with the inductance inserted in the strip conductor, it is possible to dispense with the freehand wiring of the coil otherwise to be performed during the contacting. It is particularly advantageous if the covering means comprises an active electronic component, for example a sensor detection, which reads out the piezoelectric element used in the ultrasonic transducer.
  • the ultrasonic transducer has a covering means, which is held in the transducer housing by means of a bayonet closure.
  • An essential basic idea of this aspect of the invention is to make the connection between cover and converter housing self-holding.
  • the proposed plug-in rotary connection allows a known manner, a positive connection of the two parts.
  • the cover means is fixed with the closing of the bayonet closure in the desired cavity covering position.
  • the spring element arranged between the covering means and the piezo element additionally assists the sealing of the cavity.
  • the spring force exerted by the spring element on the piezoelectric element presses in the opposite direction the covering means against the housing-side part of the bayonet closure and seals the cavity.
  • the positive connection achieved in this way makes it possible to dispense with the hitherto required additional step of bonding the covering means to the housing.
  • the cover must therefore no longer be held in position, as it was previously required for bonding.
  • the assembly of the ultrasonic transducer is much easier.
  • the specific embodiment of the bayonet principle ie how the covering is inserted into the housing and is moved by means of a rotation between covering and converter housing in a position in which it is held positively on the housing, can without particular difficulties to the respective circumstances be adjusted.
  • the bayonet closure comprises a thread.
  • the thread allows by twisting a Jacobson2020 the housing-side part and the cover center side part of the bayonet lock to the complete system.
  • the two closure parts are thus twisting pressed against each other along the thread, whereby the sealing of the cavity is further improved.
  • the piezo element and the covering means are connected to each other.
  • the piezo element is biased by the spring element, so to speak.
  • the assembly is then secured by means of the bayonet lock on the housing of the ultrasonic transducer, wherein the piezo element is pressed by the spring element against the inside of the housing. After closing the bayonet closure, the piezo element is in the intended position, at the same time the cavity is sealed.
  • the contacts on the side facing away from the cavity of the board must be connected to the electrical or electronic interfaces of the ultrasonic transducer.
  • Dannt is the piezoelectric element via the covering means through-contacting conductor tracks connected to the housing arranged connections of the ultrasonic transducer.
  • the covering means is welded to the housing, in particular by ultrasonic welding.
  • the method of attachment of the covering means can also be considered detached from the formation of the covering means with through-contacting conductor tracks.
  • the described advantages of the fastening types bayonet closure or ultrasonic welding can also be realized independently of the formation of the covering means as a circuit board.
  • the features of the characterizing part of claims 1 and 1 1 are therefore not mandatory for this purpose.
  • Figure 1 A schematic representation of a composite ultrasonic transducer with a cover plate in the form of a board
  • Figure 2 A schematic representation of an ultrasonic transducer with a cover plate in the form of a circuit board, which is held by means of a bayonet closure in the housing.
  • the ultrasonic transducer 1 shown in FIG. 1 has a housing 2 and a connection 3 fastened to the housing 2 for a cable connection, not shown here, for connecting the ultrasonic transducer 1 to a control unit.
  • a piezo element 5 is arranged in a cavity 4.
  • the piezoelectric element 5 is acted upon by a spring 6, which presses it against a wall 7 of the cavity 4.
  • the piezo-element 5 opposite end of the spring 6 abuts a cover 4 covering the cavity 4.
  • the covering means is fastened to the housing 2 by retaining means, not shown here, and seals the cavity against the penetration of potting compound.
  • the covering means 8 has through-contacting printed conductors and is thus formed like a platinum. On the side facing the cavity 4 of the cover 8 conductor tracks are connected via cable 9 to the piezoelectric element 5.
  • the cable 9 run through the spring 6 formed in the form of a helical spring.
  • the covering means 8, the spring 6 and the piezo element 5 connected via the cables 9 to the covering means 8 form an assembly. The assembly may be prefabricated outside the housing 2 and inserted into the converter housing 2 after assembly.
  • the cover means 8 requires no opening for the piezoelectric element 5 outwardly contacting cable. It is self-contained. His the cavity 4 facing away from surface 10 thus has no openings, could penetrate through the potting compound in the cavity 4. On the surface 10 solder pads are provided, are connected via the cable 1 1 with the piezoelectric element 5 through-contacting conductor tracks. The cables 1 1 extend through the housing 2 to the terminal 3, via which the piezo element 5 can be connected to a control unit.
  • FIG. 2 shows a further partially opened ultrasonic transducer 1, in which the holding means of the covering means 8 is a bayonet closure 12.
  • the circularly shaped covering means 8 has on its circumference two projecting pins, which are inserted into slots 13 which are mutually offset by 180 degrees at a likewise circular opening of the housing 2 are arranged above the cavity 4.
  • Adjoining the slots 13 is a lateral slot designed to be transverse, in which the pins are pushed in by twisting the cover means 8.
  • the taken in the transverse slot, shown here in phantom pin 14 undercut the longitudinal slot 13 and thus secure the cover 8 in its position over the cavity 4 so that it can seal the cavity against entered into the housing potting compound.
  • the cables 1 1 are equipped with sufficient clearance, so that they do not hinder the rotation of the cover 8.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Signal Processing (AREA)
  • Acoustics & Sound (AREA)
  • Transducers For Ultrasonic Waves (AREA)

Abstract

Transducteur ultrasonore (1) qui comporte un boîtier (2) et un élément piézo-électrique (5) monté dans une cavité (4) du boîtier. Un moyen de couverture (8) est situé dans le boîtier (2) et couvre la cavité (4). Un élément ressort (6) est situé entre le moyen de couverture (8) et l'élément piézo-électrique (5) et soumet ledit élément piézo-électrique (5) à l'action d'une force de ressort. Selon l'invention, le moyen de couverture (8) comporte plusieurs tracés conducteurs établissant une connexion transversale à travers ledit moyen de couverture (8).
EP13759168.1A 2012-09-05 2013-09-03 Transducteur ultrasonore et procédé de fabrication d'un transducteur ultrasonore Withdrawn EP2893303A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012108254.5A DE102012108254A1 (de) 2012-09-05 2012-09-05 Ultraschall-Wandler und Verfahren zur Herstellung eines Ultraschall-Wandlers
PCT/EP2013/068203 WO2014037354A1 (fr) 2012-09-05 2013-09-03 Transducteur ultrasonore et procédé de fabrication d'un transducteur ultrasonore

Publications (1)

Publication Number Publication Date
EP2893303A1 true EP2893303A1 (fr) 2015-07-15

Family

ID=49118508

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13759168.1A Withdrawn EP2893303A1 (fr) 2012-09-05 2013-09-03 Transducteur ultrasonore et procédé de fabrication d'un transducteur ultrasonore

Country Status (5)

Country Link
US (1) US10569303B2 (fr)
EP (1) EP2893303A1 (fr)
CN (1) CN104641202A (fr)
DE (1) DE102012108254A1 (fr)
WO (1) WO2014037354A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014010375B4 (de) 2014-07-12 2021-06-17 Diehl Metering Gmbh Ultraschallwandleranordnung sowie Ultraschallwasserzähler
WO2017086949A1 (fr) 2015-11-18 2017-05-26 Halliburton Energy Services, Inc. Traitement de données optiques d'outil à deux capteurs via une standardisation par capteur maître
WO2017119864A1 (fr) 2016-01-04 2017-07-13 Halliburton Energy Services, Inc. Connexion d'un transducteur à un câble sans endommagement physique du câble
DE102016101154B4 (de) * 2016-01-22 2024-03-14 Krohne Ag Ultraschallwandler
CN106321043A (zh) * 2016-10-17 2017-01-11 广汉市思科信达科技有限公司 一种旋转式超声换能器
CN108802424A (zh) * 2018-08-21 2018-11-13 苏州源源机械设备有限公司 一种明渠流速传感器装置
EP4063818A1 (fr) * 2021-03-22 2022-09-28 Kistler Holding AG Capteur piézoélectrique
DE102022210971A1 (de) 2022-10-18 2024-04-18 Mib Gmbh Messtechnik Und Industrieberatung Ultraschallmessanordnung

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4705981A (en) * 1986-01-29 1987-11-10 Murata Manufacturing Co., Ltd. Ultrasonic transducer
US4746831A (en) * 1985-03-27 1988-05-24 Kaijo Denki Co., Ltd. Ultrasonic transreceiver
WO1997008761A1 (fr) * 1995-08-28 1997-03-06 Accuweb, Inc. Unites de transducteurs a ultrasons pour detection du bord d'un ruban
JPH11325992A (ja) * 1998-05-08 1999-11-26 Matsushita Electric Ind Co Ltd 超音波振動子とその支持構成およびこれを用いた超音波流量計測装置
EP1237148A2 (fr) * 2001-02-28 2002-09-04 Matsushita Electric Industrial Co., Ltd. Transducteur à ultrasons, procédé de fabrication, et son utilisation dans un débitmètre à ultrasons
US20020190608A1 (en) * 2001-04-23 2002-12-19 Product Systems Incorporated Indium or tin bonded megasonic transducer systems
EP1840530A2 (fr) * 2006-03-30 2007-10-03 Krohne AG Débitmètre à ultrasons
EP2076062A1 (fr) * 2006-10-20 2009-07-01 Murata Manufacturing Co. Ltd. Capteur ultrasonore
JP2011015265A (ja) * 2009-07-03 2011-01-20 Panasonic Corp 超音波送受波器およびこれを用いた超音波流量計
WO2011141167A2 (fr) * 2010-05-12 2011-11-17 Hydrometer Gmbh Dispositif transducteur à ultrasons et débit-mètre à ultrasons

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9120580D0 (en) * 1991-09-27 1991-11-06 Federal Ind Ind Group Inc Acoustic transducer
WO1997006761A1 (fr) 1995-08-16 1997-02-27 Cornell Research Foundation, Inc. Pansement axillaire
DK172871B1 (da) * 1997-08-22 1999-08-23 Danfoss As Ultralydstransducer
AT6059U1 (de) * 2002-06-18 2003-03-25 Avl List Gmbh Messzelle zur durchführung von messungen an flüssigen oder gasförmigen proben
US7307373B2 (en) * 2005-08-12 2007-12-11 Daniel Measurement And Control, Inc. Transducer assembly for an ultrasonic fluid meter
US7607347B2 (en) 2006-03-07 2009-10-27 Gems Sensors, Inc. Fluid level detector
BR112013018520A2 (pt) 2011-02-23 2016-10-18 Miitors Aps método ultrassônico de vazão

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4746831A (en) * 1985-03-27 1988-05-24 Kaijo Denki Co., Ltd. Ultrasonic transreceiver
US4705981A (en) * 1986-01-29 1987-11-10 Murata Manufacturing Co., Ltd. Ultrasonic transducer
WO1997008761A1 (fr) * 1995-08-28 1997-03-06 Accuweb, Inc. Unites de transducteurs a ultrasons pour detection du bord d'un ruban
JPH11325992A (ja) * 1998-05-08 1999-11-26 Matsushita Electric Ind Co Ltd 超音波振動子とその支持構成およびこれを用いた超音波流量計測装置
EP1237148A2 (fr) * 2001-02-28 2002-09-04 Matsushita Electric Industrial Co., Ltd. Transducteur à ultrasons, procédé de fabrication, et son utilisation dans un débitmètre à ultrasons
US20020190608A1 (en) * 2001-04-23 2002-12-19 Product Systems Incorporated Indium or tin bonded megasonic transducer systems
EP1840530A2 (fr) * 2006-03-30 2007-10-03 Krohne AG Débitmètre à ultrasons
EP2076062A1 (fr) * 2006-10-20 2009-07-01 Murata Manufacturing Co. Ltd. Capteur ultrasonore
JP2011015265A (ja) * 2009-07-03 2011-01-20 Panasonic Corp 超音波送受波器およびこれを用いた超音波流量計
WO2011141167A2 (fr) * 2010-05-12 2011-11-17 Hydrometer Gmbh Dispositif transducteur à ultrasons et débit-mètre à ultrasons

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2014037354A1 *

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US10569303B2 (en) 2020-02-25
US20150209828A1 (en) 2015-07-30
CN104641202A (zh) 2015-05-20
WO2014037354A1 (fr) 2014-03-13
DE102012108254A1 (de) 2014-03-06

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