EP2881793A4 - Photosensitive resin composition and photosensitive resin printing plate precursor - Google Patents
Photosensitive resin composition and photosensitive resin printing plate precursorInfo
- Publication number
- EP2881793A4 EP2881793A4 EP13825787.8A EP13825787A EP2881793A4 EP 2881793 A4 EP2881793 A4 EP 2881793A4 EP 13825787 A EP13825787 A EP 13825787A EP 2881793 A4 EP2881793 A4 EP 2881793A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- photosensitive resin
- printing plate
- plate precursor
- resin composition
- resin printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002243 precursor Substances 0.000 title 1
- 239000011347 resin Substances 0.000 title 1
- 229920005989 resin Polymers 0.000 title 1
- 239000011342 resin composition Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/322—Aqueous alkaline compositions
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials For Photolithography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012169412 | 2012-07-31 | ||
JP2012169411 | 2012-07-31 | ||
PCT/JP2013/070615 WO2014021322A1 (en) | 2012-07-31 | 2013-07-30 | Photosensitive resin composition and photosensitive resin printing plate precursor |
Publications (3)
Publication Number | Publication Date |
---|---|
EP2881793A1 EP2881793A1 (en) | 2015-06-10 |
EP2881793A4 true EP2881793A4 (en) | 2016-04-20 |
EP2881793B1 EP2881793B1 (en) | 2017-03-15 |
Family
ID=50027995
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP13825787.8A Active EP2881793B1 (en) | 2012-07-31 | 2013-07-30 | Photosensitive resin composition and photosensitive resin printing plate precursor |
Country Status (6)
Country | Link |
---|---|
US (1) | US9678424B2 (en) |
EP (1) | EP2881793B1 (en) |
JP (1) | JP5601425B2 (en) |
KR (1) | KR102054033B1 (en) |
CN (1) | CN104508555B (en) |
WO (1) | WO2014021322A1 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106062632B (en) * | 2014-02-17 | 2019-10-18 | 东丽株式会社 | Laminated resin body and letterpress plate originals |
WO2017038970A1 (en) * | 2015-09-03 | 2017-03-09 | 東レ株式会社 | Photosensitive resin printing plate precursor, and method for manufacturing printing plate |
WO2018123773A1 (en) * | 2016-12-26 | 2018-07-05 | 東レ株式会社 | Photosensitive resin composition and photosensitive resin printing plate precursor containing same |
ES2859298T3 (en) | 2017-01-31 | 2021-10-01 | Flint Group Germany Gmbh | Radiation curable mixture containing partially saponified, poorly functionalized polyvinyl acetate |
JP6372599B1 (en) * | 2017-08-07 | 2018-08-15 | 東洋紡株式会社 | Photosensitive resin composition for letterpress printing original plate and letterpress printing original plate using the same |
PL3667418T3 (en) | 2017-08-07 | 2024-07-01 | Toyobo Mc Corporation | Photosensitive resin composition for relief printing original plate and relief printing original plate using the same |
JP6409106B1 (en) * | 2017-08-30 | 2018-10-17 | 太陽インキ製造株式会社 | Curable resin composition, dry film, cured product and printed wiring board |
EP3928999A4 (en) * | 2019-02-21 | 2022-12-21 | Toyobo Co., Ltd. | Water-developable photosensitive resin printing plate |
CN111856876A (en) * | 2019-04-25 | 2020-10-30 | 田菱智能科技(昆山)有限公司 | Photosensitive resin composition |
NL2027002B1 (en) | 2020-11-27 | 2022-07-04 | Flint Group Germany Gmbh | Photosensitive composition |
WO2023277053A1 (en) * | 2021-06-30 | 2023-01-05 | 富士フイルム株式会社 | Original plate for flexographic printing plate and method for producing flexographic printing plate |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2960066A1 (en) * | 2013-02-20 | 2015-12-30 | Toray Industries, Inc. | Resin printing original plate for laser engraving |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5632138A (en) * | 1979-08-23 | 1981-04-01 | Toray Ind Inc | Photosensitive polyamide composition |
JPS5745535A (en) * | 1980-09-02 | 1982-03-15 | Unitika Ltd | Photosensitive resin composition |
JPS5968734A (en) * | 1982-10-12 | 1984-04-18 | Toray Ind Inc | Photosensitive resin composition |
JP2697235B2 (en) | 1990-03-26 | 1998-01-14 | 東レ株式会社 | Photosensitive resin composition |
JPH03293670A (en) * | 1990-04-12 | 1991-12-25 | Pilot Corp:The | Photopolymerizable composition |
JP2876798B2 (en) | 1991-03-12 | 1999-03-31 | 東レ株式会社 | Photosensitive resin composition |
JP3796914B2 (en) * | 1997-08-26 | 2006-07-12 | 東レ株式会社 | Photosensitive resin composition and printing plate material |
JP2001272776A (en) | 2000-03-27 | 2001-10-05 | Toyobo Co Ltd | Photosensitive resin composition |
JP2004294596A (en) * | 2003-03-26 | 2004-10-21 | Toray Ind Inc | Photosensitive resin relief printing material for making matrix |
JP2005331811A (en) * | 2004-05-21 | 2005-12-02 | Toray Ind Inc | Photosensitive resin composition,original printing plate using the same and the printing plate |
JP4647444B2 (en) * | 2005-09-16 | 2011-03-09 | 東京応化工業株式会社 | Water-soluble photosensitive resin composition for flexographic printing plate and water-soluble photosensitive flexographic printing plate |
-
2013
- 2013-07-30 CN CN201380039883.0A patent/CN104508555B/en active Active
- 2013-07-30 WO PCT/JP2013/070615 patent/WO2014021322A1/en active Application Filing
- 2013-07-30 KR KR1020157003896A patent/KR102054033B1/en active IP Right Grant
- 2013-07-30 JP JP2013555107A patent/JP5601425B2/en active Active
- 2013-07-30 US US14/418,710 patent/US9678424B2/en active Active
- 2013-07-30 EP EP13825787.8A patent/EP2881793B1/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2960066A1 (en) * | 2013-02-20 | 2015-12-30 | Toray Industries, Inc. | Resin printing original plate for laser engraving |
Also Published As
Publication number | Publication date |
---|---|
JPWO2014021322A1 (en) | 2016-07-21 |
KR20150040928A (en) | 2015-04-15 |
US20150205201A1 (en) | 2015-07-23 |
CN104508555B (en) | 2020-02-11 |
EP2881793A1 (en) | 2015-06-10 |
JP5601425B2 (en) | 2014-10-08 |
EP2881793B1 (en) | 2017-03-15 |
KR102054033B1 (en) | 2019-12-09 |
WO2014021322A1 (en) | 2014-02-06 |
US9678424B2 (en) | 2017-06-13 |
CN104508555A (en) | 2015-04-08 |
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