EP2851129A1 - Buse de pulvérisation et système de revêtement l'utilisant - Google Patents

Buse de pulvérisation et système de revêtement l'utilisant Download PDF

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Publication number
EP2851129A1
EP2851129A1 EP14162012.0A EP14162012A EP2851129A1 EP 2851129 A1 EP2851129 A1 EP 2851129A1 EP 14162012 A EP14162012 A EP 14162012A EP 2851129 A1 EP2851129 A1 EP 2851129A1
Authority
EP
European Patent Office
Prior art keywords
liquid
spray nozzle
substrate
gas
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14162012.0A
Other languages
German (de)
English (en)
Inventor
Do-Young Byun
Vu Dat Nguyen
Baek Hoon Seong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Enjet Co Ltd
Original Assignee
Enjet Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020130033536A external-priority patent/KR101397384B1/ko
Priority claimed from KR1020130110716A external-priority patent/KR101545049B1/ko
Application filed by Enjet Co Ltd filed Critical Enjet Co Ltd
Publication of EP2851129A1 publication Critical patent/EP2851129A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
    • B05B5/025—Discharge apparatus, e.g. electrostatic spray guns
    • B05B5/03—Discharge apparatus, e.g. electrostatic spray guns characterised by the use of gas, e.g. electrostatically assisted pneumatic spraying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
    • B05B5/025—Discharge apparatus, e.g. electrostatic spray guns
    • B05B5/053—Arrangements for supplying power, e.g. charging power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
    • B05B5/08—Plant for applying liquids or other fluent materials to objects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
    • B05B5/08—Plant for applying liquids or other fluent materials to objects
    • B05B5/082—Plant for applying liquids or other fluent materials to objects characterised by means for supporting, holding or conveying the objects
    • B05B5/084—Plant for applying liquids or other fluent materials to objects characterised by means for supporting, holding or conveying the objects the objects lying on, or being supported above conveying means, e.g. conveyor belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
    • B05B7/0416—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid
    • B05B7/0441—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid with one inner conduit of liquid surrounded by an external conduit of gas upstream the mixing chamber
    • B05B7/0458—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid with one inner conduit of liquid surrounded by an external conduit of gas upstream the mixing chamber the gas and liquid flows being perpendicular just upstream the mixing chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/06—Spray pistols; Apparatus for discharge with at least one outlet orifice surrounding another approximately in the same plane
    • B05B7/062—Spray pistols; Apparatus for discharge with at least one outlet orifice surrounding another approximately in the same plane with only one liquid outlet and at least one gas outlet
    • B05B7/066—Spray pistols; Apparatus for discharge with at least one outlet orifice surrounding another approximately in the same plane with only one liquid outlet and at least one gas outlet with an inner liquid outlet surrounded by at least one annular gas outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/08—Spray pistols; Apparatus for discharge with separate outlet orifices, e.g. to form parallel jets, i.e. the axis of the jets being parallel, to form intersecting jets, i.e. the axis of the jets converging but not necessarily intersecting at a point
    • B05B7/0807—Spray pistols; Apparatus for discharge with separate outlet orifices, e.g. to form parallel jets, i.e. the axis of the jets being parallel, to form intersecting jets, i.e. the axis of the jets converging but not necessarily intersecting at a point to form intersecting jets
    • B05B7/0861—Spray pistols; Apparatus for discharge with separate outlet orifices, e.g. to form parallel jets, i.e. the axis of the jets being parallel, to form intersecting jets, i.e. the axis of the jets converging but not necessarily intersecting at a point to form intersecting jets with one single jet constituted by a liquid or a mixture containing a liquid and several gas jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/12—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to conditions of ambient medium or target, e.g. humidity, temperature position or movement of the target relative to the spray apparatus

Definitions

  • the following description relates to a spray nozzle and a coating system using the same, and more particularly, to a spray nozzle that is capable of atomizing an injection liquid and stably injecting fine droplets of a uniform size, and increasing the amount of injection so that it can be applied to mass production processes, and a coating system thereof.
  • a coating process is essential in not only traditional industrial areas such as automobile and construction, but also in manufacturing areas such as display and solar cell etc. Especially, when manufacturing displays such as organic solar cells and organic light emitting diodes (OLED) etc., there is required a precise coating of a thickness of tens to hundreds nanometers. In addition, since the roughness and uniformity of a coating surface have a significant effect on the performance of a product, it should be possible to use ultrafine droplets, and to coat the product quickly for mass production.
  • anti-fingerprint coating or anti-reflecting coating method for application on the surfaces of touch window surfaces such as smart phones, tablets, notebook computers etc. are being converted into wet coating processes instead of conventional vacuum coating processes.
  • the technology of atomizing liquid for conventional spray coating processes may be broadly classified into methods using pressure energy, gas energy, centrifugal energy, mechanical energy, and electrical energy.
  • the method of using pressure energy is a method of using pressure injection valves, wherein the liquid to be atomized is passed through single hole or porous injection nozzles, or vortex injection valves(simplex, duplex, dual orifice, and reflux types etc.) to form spray.
  • This is a method generally used to spray liquid fuel injected into a gas turbine burner, randomly creating droplets of approximately 20 ⁇ 250 ⁇ m. Therefore, in such a method of using pressure energy, there is a problem that it is difficult to be applied to a complicated coating technology.
  • the method that uses centrifugal energy utilizing a wheel atomizer or rotary cup atomizer is a method of randomly creating droplets of a range of 10 ⁇ 200 ⁇ m. It is a method mainly used in cleaning and agriculture areas. In this method, it is impossible to coat the central portion, and thus there is a problem that it is difficult to be applied to a uniform coating technology.
  • gas bombardment atomizer method which is method of using gas energy, wherein a great quantity of gas in a low speed and low pressure state is injected towards a jet of liquid that is being injected using a two-fluid injection valve to atomize the liquid
  • gas assisted atomizer method wherein a small amount of gas in a high speed state is injected towards a liquid jet.
  • This method is mainly used in thin film wet coating, but in this method, the droplets would be formed to have a random size between 15 ⁇ 200 ⁇ m, thus making it difficult to form a fine thin film coating, and stains may occur on the coating surface, and further, due to the high fluid speed when injecting the gas at a high speed, the fast fluid speed may make the atomized droplets collide with the substrate, causing the droplets to bounce back. In addition, there may be too much coating liquid coming off the substrate, causing a waste of the coating liquid, thereby increasing manufacturing costs, and since the viscosity of the liquid that can be used is limited to less than 50cp, there may be limitations in the coating technology in developing or applying functional materials, causing difficulty in developing various types of coating technologies.
  • the most representative method of using mechanical energy is the ultrasound spray technology wherein liquid is atomized by high frequency signals applied by a piezoelectric actuator.
  • droplets may be further atomized than when using gas energy, but droplets are formed to have a random size between 1 ⁇ 200 ⁇ m, making it difficult to secure uniformity in the size of droplets, and there is also a limitation in the amount of injection of droplets, thereby causing a problem of difficulty in utilizing in mass production processes.
  • the purpose of the present disclosure is to resolve the aforementioned problems of prior art, that is, to provide a spray nozzle that is capable of stably injecting fine droplets having a uniform size, whereby it is possible to increase the amount of injection so that it may be applied to mass production processes, and a coating system thereof.
  • a spray nozzle comprising: a liquid nozzle injecting liquid towards a substrate; a gas nozzle for injecting gas to collide with the liquid on an injection path of the liquid to perform a primary atomization of the liquid; and a voltage supply connected to the liquid nozzle, the voltage supply for applying voltage to the liquid nozzle to generate an electric field between the liquid nozzle and substrate to perform a secondary atomization of the liquid, it is desirable that the support is made of conductive material.
  • the spray nozzle further comprises a case for accommodating the liquid nozzle inside thereof, and the liquid and gas are made to collide with each other outside the case.
  • the spray nozzle further comprises a case for accommodating the liquid nozzle and gas nozzle inside thereof, the case provided with a gas path for guiding a flowing direction of the gas so that the gas being injected from the gas nozzle collides with the liquid on the injection path of the liquid, and the gas is made to collide with the liquid inside the case.
  • the case is provided with a guide part that is dented towards the inside on an end closer to the substrate, a cross-sectional area of the guide increasing as it gets farther from the substrate, in order to guide an injection direction of the liquid so that the liquid is injected towards the substrate.
  • a distance between the guide part and the substrate is 1cm or more so that a secondary atomization of the liquid can be completed between the guide part and the substrate.
  • a flow rate of the liquid supplied to the liquid nozzle is 10 -8 m 3 /s or more.
  • the liquid nozzle consists of a plurality of liquid nozzles each having a different diameter, any one of the plurality of liquid nozzles accommodating another of the plurality of liquid nozzles inside thereof or any one of the plurality of liquid nozzles accommodated inside of another of the plurality of liquid nozzles.
  • the liquid nozzle consists of a plurality of liquid nozzles, any one of the plurality of liquid nozzles being distanced from another of the plurality of liquid nozzles in a parallel direction.
  • the gas path guides the flowing direction of the gas so that the gas being injected from the gas nozzle collides with the liquid on the injection path of the liquid.
  • a coating system using a spray nozzle comprising: a support where a substrate is disposed; a spray nozzle injecting liquid towards a surface of the substrate according to any one of claims 1 to 9; a liquid supply supplying liquid being injected from the liquid nozzle; a gas supply supplying gas flowing inside the gas path; and a transferrer transferring at least one of the support and the spray nozzle.
  • the coating system further comprises a plasma processor configured to plasma process the substrate; and the spray nozzle is provided with a substrate plasma processed through the plasma processor.
  • the plasma processor cleans a surface of the substrate, or processes the surface of the substrate to be hydrophilic or hydrophobic depending on the liquid injected from the spray nozzle.
  • the plasma processor performs at least one of charging and discharging the substrate, and the spray nozzle is spaced by 500mm or less from the plasma processor along a transferring path of the substrate.
  • the transferrer comprises a first transferrer configured to transfer the support; and a second transferrer configured to move the spray nozzle in a direction approaching or distancing from the support.
  • the coating system further comprises a sensor configured to obtain location information of the support; and a controller configured to receive the location information of the support through the sensor and control operations of at least one of the plasma processor, spray nozzle, voltage applier and transferrer.
  • the controller comprises: an electric field control module configured to control an intensity of an electric field formed between the spray nozzle and the support by adjusting a voltage amount applied to the spray nozzle; a pressure control module configured to control a pressure of the gas that collides with the liquid in the spray nozzle; a transfer control module configured to control a movement of the transferrer; and a flow rate control module configured to control a flow rate of the liquid injected form the spray nozzle.
  • the coating system further comprises an amperometer connecting the spray nozzle and the substrate, and measuring current information between the spray nozzle and the substrate; and the controller further comprises a current amount control module receiving current information obtained by the amperometer and controls a current amount between the substrate and the spray nozzle.
  • the coating system further comprises a test substrate to which liquid being injected from the spray nozzle is shot, the test substrate testing a injection state of the spray nozzle through current information of the liquid shot, and the amperometer is connected between the liquid nozzle and the test substrate and measures the current information of the shot liquid.
  • the support is made of conductive material or provided with a coating layer of non-conductive material on an external surface thereof.
  • the support receives voltage or is grounded selectively depending on its location.
  • the coating system further comprises a container accommodating a spray nozzle inside thereof, the container comprising an inlet and outlet for entering/exiting of the substrate.
  • the container is provided with a gas channel for injecting nitrogen or inert gas inside thereof or discharging the nitrogen or inert gas.
  • the coating system it is desirable that at least one of a certain gas concentration, temperature and humidity is maintained inside the container.
  • a spray nozzle that may atomize liquid being injected in a uniform size, and a coating system thereof.
  • FIG. 1 is a schematic cross-sectional view of a spray nozzle according to a first exemplary embodiment of the present disclosure.
  • a spray nozzle according to a first exemplary embodiment of the present disclosure 100 may make the liquid being injected to collide with gas, thereby performing a primary atomization of the liquid, and then apply an electric field to the atomized liquid, thereby performing a secondary atomization, so as to inject the liquid in a fine droplet state having a uniform size.
  • This spray nozzle 100 comprises a liquid nozzle 110, gas nozzle 120, voltage supply 130, and case 140.
  • the liquid nozzle 110 is a path for liquid to flow, whereby liquid is injected towards a substrate.
  • the gas nozzle 120 is a path for gas, whereby gas is injected towards an injection path of liquid so that the gas collides with the liquid and thus a primary atomization of the liquid can be performed.
  • the gas nozzle 120 may preferably inject gas such that the gas vertically collides with the injection path of the liquid.
  • collision of the gas and liquid is a very important factor to the primary atomization of the liquid, and thus in order to atomize the liquid stably, the gas and the injection path of the liquid must collide vertically to each other.
  • the gas may have an effect in the injection direction of the liquid or in the opposite direction of the injection direction, and in the case where force is applied in the injection direction of the liquid by collision, atomized droplets would collide with the substrate S at a too fast speed, thereby possibly causing rebounding of the droplets, whereas in the case where force is applied in the opposite direction of the injection direction of the liquid by collision, the injection of the liquid would be interrupted by the gas, thereby possibly having a negative effect on the injection speed or injection flow rate.
  • gas nozzle 120 may be provided such that gas may be injected along a tangent direction of an outer circumference of the liquid injection path, but there is no limitation thereto.
  • gas nozzles 120 there is a plurality of gas nozzles 120, each of which is spaced by a same distance from one another on an outer circumference of the liquid injection path, such that gas may be injected along a tangent direction of the outer circumference of the liquid injection path, but there is no limitation thereto.
  • the voltage supply 130 is electrically connected to the liquid nozzle 110, and generates an electric field between the liquid nozzle 110 and substrate S, more particularly between the spray nozzle 100 and substrate S so as to perform a primary atomization of the liquid by collision with the gas.
  • the substrate S is at a ground state, and thus when voltage is applied from the voltage supply 130 to the liquid nozzle 110, a voltage difference would occur between the substrate S and the liquid nozzle 110, thereby creating an electric field.
  • the case 140 is for accommodating the liquid nozzle 110 inside thereof.
  • the gas nozzle 120 is provided outside the case 140 unlike the liquid nozzle 110, and thus the collision with the gas occurs outside the case 140.
  • liquid supplied from outside more preferably liquid supplied from a separate liquid supply is supplied to the liquid nozzle 110, flows inside the liquid nozzle 110, and is then injected towards the substrate S.
  • the liquid injected towards the substrate S collides with the gas injected from the gas nozzle 120 between the substrate S and the case 140, and a primary atomization occurs by the collision with the gas.
  • the surface of the liquid becomes unstable, and due to this instability of the liquid surface, a secondary atomization by the electric field would occur actively even when the liquid has non-polarity or has an extremely low electrical conductivity, and more detailed explanation thereof will be mentioned hereinafter.
  • the gas vertically collides with the injection path of the liquid, but there is no limitation thereto.
  • the liquid would go through a primary atomization by collision with the gas, and then this unstabilized liquid surface goes through a secondary atomization by the electric field created between the nozzle 100 and the substrate S. Since the liquid has already been atomized by collision with the gas, the flow rate of the liquid that can be atomized increases significantly, which directly leads to the increase of process speed.
  • liquid having non-polarity or having a low electrical conductivity may also be easily atomized by a spray nozzle according to a first exemplary embodiment of the present disclosure, and more detailed explanation thereon will be mentioned hereinafter.
  • ⁇ e indicates free electron on liquid surface
  • ⁇ 0 indicates dielectric constant in vacuum
  • E indicates electric field
  • a secondary atomization may occur in spite of a weak dielectrophoretic force.
  • FIG. 2 is a schematic cross-sectional view of a spray nozzle according to a second exemplary embodiment of the present disclosure.
  • a spray nozzle according to a second exemplary embodiment of the present disclosure 200 may make the liquid being injected to collide with gas, thereby performing a primary atomization of the liquid, and then applying an electric field to the atomized liquid, thereby performing a secondary atomization, so as to inject the liquid in a fine droplet state having a uniform size.
  • This spray nozzle 200 comprises a liquid nozzle 110, gas nozzle 120, voltage supply 130, and case 240.
  • liquid nozzle 110 gas nozzle 120 and voltage supply 130 are the same those according to the first exemplary embodiment of the present disclosure, and thus further explanation is omitted.
  • FIG. 3 is a schematic plane view of a spray nozzle according to an second exemplary embodiment of the present disclosure.
  • the case 240 is for accommodating the liquid nozzle 110 and the gas nozzle 120 inside, and making the liquid and gas collide inside thereof.
  • the second exemplary embodiment is different from the first exemplary embodiment in that when liquid is injected outside the case 240, the liquid will be in a state that had already gone through a primary atomization, and then outside of the case 240, a secondary atomization will be performed by an electric field.
  • the gas injected from the gas nozzle 120 flows, and there is also formed a gas flow path 241 that guides gas to vertically collide with the injection path of the liquid.
  • case 240 may be provided with a guide 242 that guides liquid to be injected towards a substrate S, but there is no limitation thereto.
  • the guide 242 is provided on a surface near the substrate S in the case 240, but the cross-section area of the guide 242 increases as it gets farther from the substrate S, but there is no limitation thereto.
  • FIG. 4 is a schematic cross-sectional view of a spray nozzle according to a third exemplary embodiment of the present disclosure.
  • a spray nozzle according to a third exemplary embodiment of the present disclosure 300 comprises a liquid nozzle 310, gas nozzle 120, voltage supply 130, and case 240.
  • the gas nozzle 120 and voltage supply 130 are the same as those in the first exemplary embodiment of the present disclosure, and the case 240 is the same as that in the second exemplary embodiment of the present disclosure, and thus detailed explanation is omitted.
  • the liquid nozzle 310 is where liquid flows inside and injects the liquid towards the substrate S.
  • a plurality of liquid nozzles 310 having different diameters, one of the plurality of liquid nozzles accommodating another liquid nozzle or one of the plurality of liquid nozzles accommodated inside another liquid nozzle.
  • the plurality of liquid nozzles 110 may have a same central axis, the liquid nozzle 110 with the smallest diameter disposed sequentially starting from the middle and the liquid nozzle 110 with the largest diameter disposed outermost, but there is no limitation thereto.
  • the liquid flowing inside the plurality of liquid nozzles 310 may consist of numerous different liquids.
  • numerous different liquids may be supplied to the different liquid nozzles 310, and then as they flow along the injection path of the liquid, and then collide with gas, they may be mixed together, and thus when they are injected outside the case 240, they may be injected as a mixed liquid, but there is no limitation thereto.
  • FIG. 5 is a schematic cross-sectional view of a spray nozzle according to a fourth exemplary embodiment of the present disclosure.
  • a spray nozzle according to a fourth exemplary embodiment of the present disclosure 400 comprises a liquid nozzle 410, gas nozzle 120, voltage supply 130, and case 240.
  • the gas nozzle 120 and voltage supply 130 are the same as those in the first exemplary embodiment of the present disclosure, and the case 240 is the same as that in the second exemplary embodiment of the present disclosure, and thus further detailed explanation in omitted.
  • the liquid nozzle 410 is where liquid flows inside, and injects the liquid towards the substrate S.
  • a plurality of liquid nozzles 410 one of the plurality of liquid nozzles distanced in a parallel direction from another liquid nozzle.
  • the liquid flowing inside the plurality of liquid nozzles 410 may consist of numerous different liquids, and it is desirable that the plurality of liquid nozzles 410 are disposed closely to one another such that the different liquids are sufficiently mixed inside the case 240 and then be injected.
  • FIG. 6 is a photograph showing different states of injection of liquid in different voltages from a spray nozzle according to FIGs. 1 to 5
  • FIG. 7 is a photograph showing a PET film coated with PEDOT conducting polymer through a spray nozzle according to FIGs. 1 to 5
  • FIG. 8 is a photograph showing surface roughness of a film coated according to FIG. 7 .
  • a high polymer conductive PEDOT that has a high viscosity and that is not easily atomized by the mutual connectivity of the high polymer material was used, supplied at a speed of 80 ⁇ l/min, and as gas, air was pressurized by 1bar and used.
  • the size of atomized liquid was in the range of approximately 10 ⁇ 150 ⁇ m.
  • a voltage was applied through the voltage supply 130, voltages of 2, 3, 4 kV were applied between the spray nozzle and substrate S, and there was a tendency that as the voltage increased the jet length of the liquid got shorter.
  • the length of the liquid jet getting shorter means that the atomizing process of the liquid is active.
  • the flow rate against the pressure applied is approximately 20 ⁇ 120cm 3 /sec, which is 1 ⁇ 10m/sec in velocity.
  • the minimum distance needed from after a primary atomization is completed until a secondary atomization is completed is 1cm, and as in one of the second exemplary embodiment to fourth exemplary embodiment of the present disclosure, in the case where liquid goes through a primary atomization inside the case 240 of the spray and goes through a secondary atomization outside the case 240, the distance between the spray nozzle and substrate S needed for the liquid to go through a secondary atomization sufficiently between the spray nozzle and the substrate S is 1cm.
  • the flow rate of the liquid may be increased to 10 -8 m 3 /sec or more, and according to the present experimental example, it can be seen that the flow rate of the liquid injected from the spray nozzle is 10 -7 m 3 /sec, which is above the injection flow rate of approximately 10 -10 to 10 -9 m 3 /sec when using electric energy.
  • FIG. 9 is a schematic view of a coating system using a spray nozzle according to a fifth exemplary embodiment of the present disclosure
  • FIG. 10 is a schematic view of a controller in a coating system using a spray nozzle according to FIG. 9 .
  • a coating system that uses a spray nozzle according to a fifth exemplary embodiment of the present disclosure 500 performs coating using a spray nozzle according to first to fourth exemplary embodiments of the present disclosure.
  • the coating system 500 also monitors whether or not the atomized liquid is being stably injected and coated on a substrate.
  • the coating system 500 comprises a spray nozzle 100, 200, 300, 400 according to first to fourth exemplary embodiments, support 510, amperometer 520, liquid supply 530, gas supply 540, nozzle transferrer 550, and controller 560.
  • the spray nozzle 200 is the same as those in the aforementioned first to fourth exemplary embodiments, and thus detailed explanation thereof is omitted, and for convenience of explanation, it is assumed that a spray nozzle according to a second exemplary embodiment 200 is used.
  • the support 510 is on which a substrate S is disposed, and the support 510 is provided as a flat panel member.
  • the substrate S is disposed on an upper part of the support 510, and a first transferrer 551 is provided on a lower part of the support 510, so that the substrate S that has been coated can perform the next process.
  • the amperometer 520 is electrically connected between the substrate S and the spray nozzle 200. And the amperometer 520 measures the current between the substrate S and the spray nozzle 200.
  • the liquid supply 530 supplies the liquid that flows inside the liquid nozzle 110 of the spray nozzle 200, which is a well known technology and thus detailed explanation thereof is omitted.
  • the gas supply 540 supplies the gas that flows inside the gas nozzle 110 of the spray nozzle 200, which is a well known technology and thus detailed explanation thereof is omitted.
  • the transferrer 550 transfers at least one of the aforementioned spray nozzle 200 and support 510.
  • the transferrer 550 comprises a first transferrer 551 configured to transfer the support 510 and a second transferrer 555 configured to transfer the spray nozzle 200.
  • the second transferrer 555 is connected to the spray nozzle 200 to transfer the spray nozzle 200 in a direction either approaching or distancing from the support 510 or in a direction parallel to the support 510.
  • the second transferrer 555 transfers the spray nozzle 200 in at least one direction of x, y, and z axis directions.
  • the controller 560 receives the current information between the substrate S and the spray nozzle 200 from the amperometer 520 and controls the injection conditions of the liquid being injected towards the substrate S or the movement of the spray nozzle 200.
  • the controller 560 comprises an electric field control module 561, pressure control module 562, current amount control module 563, transfer control module 564, and injection speed control module 565.
  • the electric field control module 561 adjusts the voltage applied to the liquid nozzle 110 through the voltage supply 130 and controls the electric field that occurs between the substrate S and the spray nozzle 200.
  • the size of the electric field relates to a secondary atomization of the liquid, and thus it is possible control the speed of the second atomization by adjusting the size of the electric field by the electric field control module 561.
  • the pressure control module 562 adjusts the pressure of the gas that is supplied from the gas supply 540.
  • the primary atomization of the liquid occurs as the gas collides with the liquid being injected, and thus it is possible to control the primary atomization by adjusting the pressure of the gas flowing inside the gas nozzle 120.
  • the current amount control module 563 receives the current information obtained by the amperometer 520 and controls the current amount between the substrate S and spray nozzle 200.
  • the current amount control module 563 acknowledges the flow tendency of the current amount between the substrate S and spray nozzle 200 and monitors whether or not the liquid is being injected and atomized stably.
  • the liquid is not being injected or atomized stably, and thus it is possible to control at least one of the electric field control module 561 and pressure control module 562 to redetermine the initial injection conditions of the liquid such as the size of the electric field and pressure of the gas so that the liquid can be injected and atomized stably, but there is no limitation thereto.
  • the transfer control module 564 controls the movement of the nozzle transferrer 550 to control the location and transferring speed of the spray nozzle 200 or the support 510.
  • the first transferrer 551 to change the location of the substrate S or move the second transferrer 555 to change the initial injection position of the spray nozzle 200 or receive the current information obtained through the amperometer 520 and change the location of the spray nozzle 200 to a location where the liquid can be injected stably, but there is no limitation thereto.
  • the injection speed control module 565 controls the injection speed of the liquid being injected from the spray nozzle 200 by adjusting the flow rate of the liquid supplied to the liquid nozzle 110.
  • the injection speed of the liquid is proportional to the mass flow rate or volumetric flow rate of the liquid, and thus it is possible to control the injection speed of the liquid by adjusting the mass flow rate or volumetric flow rate of the liquid.
  • the injection speed of the liquid affects the time it takes for the liquid to arrive at the substrate S, and if this time is significantly short, the liquid may arrive at the substrate S without having gone through a secondary atomization sufficiently, resulting in increased and nonuniform surface roughness of the coating surface of the substrate S.
  • the injection speed control module 565 controls the injection speed of the liquid.
  • an additional test substrate may be provided to examine the injection state of the spray nozzle 200, but there is no limitation thereto.
  • an amperometer 520 may be additionally provided between the spray nozzle 200 and the test substrate to measure the current amount between the spray nozzle 200 and the test substrate, but there is no limitation thereto, and the amperometer 520 provided between the spray nozzle 200 and the susbtrate S may be used instead.
  • a cleaner for cleaning the spray nozzle 200 there is no limitation thereto.
  • initial injection conditions are determined through the aforementioned electric field control module 561 and pressure control module 562.
  • the voltage supplied from the voltage supply 130 is determined to 1, 2, 3, 4kV through the electric field control module 561, and the pressure of the gas supplied from the gas supply 540 is determined to 1, 2, 3bar through the pressure control module 562.
  • the current amount between the substrate S and spray nozzle 200 is measured through the amperometer 520 by adjusting at least one of the voltage and pressure.
  • FIG. 11 is a schematic graph of a result of monitoring a stable initial spraying state through an amperometry in a coating system using a spray nozzle according to FIG. 9 .
  • FIG. 11 it is shown that when the pressure is 2bar, the flow of the current amount does not change significantly even by change of voltage.
  • this experimental example is a result derived in the case of using a coating system using a spray nozzle according to a fifth exemplary embodiment of the present disclosure 500, and thus if the size of the spray nozzle 200 and the distance between the spray nozzle 200 and the substrate are changed, the initial injection conditions would be different from the present experimental example, and thus there is no limitation thereto.
  • FIG. 12 is a schematic skewed view of a coating system using a spray nozzle according to a sixth exemplary embodiment of the present disclosure
  • FIG. 13 is a schematic skewed view of inside a container in a coating system using a spray nozzle according to FIG. 12
  • FIG. 14 is a schematic plane view of inside the container in a coating system using a spray nozzle according to FIG. 12 .
  • a coating system using a spray nozzle is capable of coating a substrate with uniformly atomized droplets and improving a substrate shooting rate of atomized droplets by plasma processing a surface of the substrate prior to coating the substrate.
  • the coating system using a spray nozzle comprises a support 610, plasma processor 620, liquid supply 530, gas supply 540, transferrer 650, container 660, sensor 670, and controller 680.
  • the support 610 is where a substrate S is disposed, the support 610 being provided by a flat panel type material, and since it is similar to that explained in the aforementioned fifth exemplary embodiment, and thus detailed explanation is omitted.
  • the support according to a sixth exemplary embodiment of the present disclosure 610 receives voltage or is grounded according to each process of processing the substrate, and for this purpose, the support 610 is provided by a conductive material.
  • the outer surface of the substrate S is provided with a coating layer of a non-conductive material so as to prevent direct effect on the substrate S.
  • the plasma may move towards the substrate S when a surface of the substrate S is plasma processed as it passes the plasma processor 620.
  • the support 610 is grounded so that plasma is stably formed when a surface of the substrate S is plasma processed as it passes the plasma processor 620.
  • a potential difference may be generated between the spray nozzle 200 and a support 610 so as to form a strong electric field between the spray nozzle 200 and the support 610 when the substrate S is coated as it passes the spray nozzle 200.
  • the plasma processor 620 is configured to plasma process an outer surface of the substrate S being transferred through a first transferrer 651 that will be explained hereinafter.
  • the plasma processor 620 may clean a coated surface of the substrate S, or process the surface of the substrate S to be coated to be hydrophilic or hydrophobic.
  • hydrophilic or hydrophobic features are determined in consideration of the liquid used in a spray nozzle 200 that will be explained hereinafter.
  • the liquid used in the spray nozzle 200 is hydrophilic, an outer surface of the substrate S is plasma processed to be hydrophilic so that the liquid can be effectively shot to the outer surface of the substrate S.
  • the liquid used in the spray nozzle 130 is hydrophobic, the outer surface of the substrate S is plasma processed to be hydrophobic.
  • a portion of the substrate S may be processed to be hydrophilic while the remaining portion of the substrate S is processed to be hydrophobic. That is, in a case of coating an outer surface of the substrate S to have a certain pattern, a certain area of an outer surface of the substrate S may be plasma processed to have same features as the liquid, while the remaining area besides the certain area of the outer surface of the substrate S is plasma processed to have different features from the liquid, thereby coating the substrate such that the liquid is concentrated on the certain area.
  • the plasma processor 620 may perform a process of charging or discharging the substrate S.
  • a discharging of the substrate S is performed when charges on the substrate S are distributed non-uniformly, whereas a charging of the substrate S is performed when charges on the substrate S are distributed uniformly.
  • the substrate S is processed to be hydrophilic or hydrophobic or discharged or charged through the plasma processor 620, but without limitation.
  • the plasma processor 620 may be an atmospheric-pressure plasma, but without limitation.
  • the transferrer 650 transfers at least one of the aforementioned support 610 and spray nozzle 200.
  • the transferrer 650 comprises a first transferrer 651 configured to transfer the support 610 and a second transferrer 655 configured to transfer the spray nozzle 200.
  • the first transferrer 651 transfers the support 610, and in a sixth exemplary embodiment of the present disclosure, the first transferrer 651 comprises a rail 652 and an electrode 653.
  • the rail 652 consists of a pair of rail members facing each other.
  • the support 610 is mounted onto an upper side of the rail members so that the support 610 can slide along the rail 652.
  • the first transferrer 651 may be provided, but without limitation, such that it rotates the support 610 on the upper side of the rail 652 or transfer the support 610 on a virtual plane that is parallel to the support 610.
  • the electrode 653 is provided between the pair of rail 652. In response to the support 610 reaching a certain position, the electrode 653 contacts the support 610 and applies voltage to the support or grounds the support 610.
  • the electrode 653 has a shape of a roll, a portion of the roll being provided with voltage while the remaining portion being grounded. By rotation, the electrode 653 selectively applies voltage to the support 610 or grounds the support 610.
  • the electrode 653 may have a shape of a spring, which applies voltage to the support 610 or grounds the support 610 as it contacts or is distanced from the support 610 by elasticity.
  • the second transferrer 655 is the same as the second transferrer 555 explained in the fifth exemplary embodiment, and thus detailed explanation is omitted.
  • the container 660 accommodates the plasma processor 620 and spray nozzle 200 inside thereof, and isolates the substrate S from outside during processing so as to maintain certain processing conditions.
  • inlet 661 and the outlet 662 are provided such that they may be open/closed to close the inside of the container 660 during plasma processing and coating processing.
  • the container 660 may be provided with a gas channel 663 through which nitrogen or inert gas may be injected inside the container 660.
  • a certain gas concentration, humidity and temperature may be maintained, without limitation, inside the container 660.
  • the sensor 670 measures location information of the support 610.
  • the senor 670 is provided in plural number, each spaced from one another along the rail 652.
  • the sensor 670 divides the location of the support 610 into an inlet section, a section being affected by the plasma processor 620, a section being affected by the spray nozzle 200, and an outlet section, and measures where the support 610 is located.
  • the controller 680 receives location information of the support 610 from the aforementioned sensor 670, and controls operations of at least one of the plasma processor 620, spray nozzle 200, and transferrer 650. More specific operations are the same as those explained in the fifth exemplary embodiment and thus detailed explanation is omitted.
  • the substrate S is fixated to the support 610 disposed outside the container 660, and then the support 610 is moved inside the container 660 through the first transferrer 651.
  • the inlet 661 closes, and the support 610 moves to a processing area of the plasma processor 620.
  • the controller 680 when the support 610 arrives at a lower side of the plasma processor 620, the controller 680, having acknowledged the location of the support 610 through the sensor 670, controls operations of the plasma processor 620 to output plasma towards the support, more particularly towards the substrate S.
  • the substrate S is processed to be hydrophilic or hydrophobic, or charged or discharged.
  • the support 610 is provided with voltage or is grounded by the electrode 653.
  • FIG. 15 is a schematic view of a substrate plasma processed by a plasma processor in a coating system using a spray nozzle according to FIG. 12 .
  • the letter part of 'ENJET' is processed to be hydrophobic while the background part is processed to be hydrophilic through the plasma processor 620.
  • the plasma processed substrate S moves to the lower side of the spray nozzle 200 by the first transferrer 651, and the sensor acknowledges the location of the support 610, and the controller 680 controls the operations of the spray nozzle 200.
  • coating of the atomized liquid may be concentrated on letters 'ENJET', or on the background part of 'ENJET'.
  • FIG. 16 is a schematic skewed view of coating a plasma processed substrate through a spray nozzle in a coating system using a spray nozzle according to FIG. 12 .
  • the substrate S is coated and a pattern is formed such that the coating of the atomized liquid is concentrated on the letters 'ENJET'.
  • the sensor 670 measures the location the substrate S and opens the outlet 662, and transfers the substrate S outside the container 660.

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  • Nozzles (AREA)
  • Electrostatic Spraying Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
EP14162012.0A 2013-03-28 2014-03-27 Buse de pulvérisation et système de revêtement l'utilisant Withdrawn EP2851129A1 (fr)

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KR1020130033536A KR101397384B1 (ko) 2013-03-28 2013-03-28 스프레이 노즐 및 이를 이용한 코팅 시스템
KR1020130110716A KR101545049B1 (ko) 2013-09-13 2013-09-13 스프레이 노즐을 이용하는 코팅 시스템

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JP6657505B2 (ja) * 2015-11-09 2020-03-04 アネスト岩田株式会社 静電噴霧装置及び静電噴霧方法
TWI634951B (zh) * 2016-07-21 2018-09-11 報知機股份有限公司 Electrostatic spray generating device and charged water particle dispersing device
KR101976458B1 (ko) * 2017-06-28 2019-05-10 참엔지니어링(주) 토출장치 및 노즐 교체방법
EP3714926A1 (fr) * 2019-03-28 2020-09-30 Erbe Elektromedizin GmbH Instrument, tête d'instrument, système d'application et procédé
TWI736949B (zh) * 2019-04-16 2021-08-21 南韓商恩傑特股份有限公司 感應電流體動力學噴射打印裝置
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TW201436874A (zh) 2014-10-01

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