EP2820348B1 - Dispositif d'illumination - Google Patents

Dispositif d'illumination Download PDF

Info

Publication number
EP2820348B1
EP2820348B1 EP13704110.9A EP13704110A EP2820348B1 EP 2820348 B1 EP2820348 B1 EP 2820348B1 EP 13704110 A EP13704110 A EP 13704110A EP 2820348 B1 EP2820348 B1 EP 2820348B1
Authority
EP
European Patent Office
Prior art keywords
semiconductor light
light source
source module
lighting device
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP13704110.9A
Other languages
German (de)
English (en)
Other versions
EP2820348A1 (fr
Inventor
Gerhard Behr
Stephan Schwaiger
Philipp Helbig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP2820348A1 publication Critical patent/EP2820348A1/fr
Application granted granted Critical
Publication of EP2820348B1 publication Critical patent/EP2820348B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
    • F21S41/148—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/39—Attachment thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/02—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages with provision for adjustment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0035—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/04—Fastening of light sources or lamp holders with provision for changing light source, e.g. turret
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F21V7/06—Optical design with parabolic curvature
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/30—Semiconductor lasers

Definitions

  • the invention relates to a lighting device according to the preamble of claim 1.
  • An illumination device is for example in the WO 2006/066530 A1 disclosed.
  • This document describes a lighting device with a semiconductor light source module and an optic, which are mounted on the front of a common carrier.
  • the optics has a plurality of dowel pins which extend through holes in the semiconductor light source module and in the carrier that fits through the holes.
  • the in the WO 2006/066530 A1 The disclosed construction does not allow easy replacement of the semiconductor light source module.
  • the illumination device has a semiconductor light source module and an optical system as well as a common carrier for the semiconductor light source module and the optical system, wherein the optical system is mounted on a front side of the carrier by means of at least one dowel pin which extends into a fitting of the semiconductor light source module.
  • the semiconductor light source module abuts against a rear side of the carrier opposite the front side, and the at least one dowel pin protrudes through an aperture in the carrier and extends into the fitting bore of the semiconductor light source module, the at least one dowel pin forming a shoulder adjacent to one the rear side of the carrier abutting bearing surface of the semiconductor light source module abuts.
  • measuring hole means that the diameter of the bore is matched to the diameter of the bore in the bore portion of the at least one dowel pin. That is, the diameter of the fitting hole in the semiconductor light source module corresponds to the diameter of the arranged in the mating bore portion of the at least one dowel pin.
  • the opening in the carrier and the fitting hole in the semiconductor light source module and the arrangement of optics and half light source module on different sides of the carrier can be replaced in the illumination device according to the invention, the semiconductor light source module in a simple manner, without previously the optics or other parts of the Lighting device according to the invention must be dismantled for this purpose.
  • the at least one dowel pin in cooperation with the fitting hole in the semiconductor light source module allows exact alignment or adjustment of the optics with respect to the semiconductor light source module.
  • the dowel pin determines the height of the optics on the support surface of the semiconductor light source module and defined by the fitting bore in the semiconductor light source module, the orientation and position of the optics with respect to the semiconductor light source module in a plane parallel to the support surface.
  • the at least one dowel pin is integrally formed with the optics.
  • the at least one dowel pin can be used not only for adjustment but as a means for attaching the optics to the semiconductor light source module.
  • the production is simplified because the same can be produced with the optics in the same manufacturing step dowel pin.
  • the at least one dowel pin is hollow and has a screw thread for receiving a screw.
  • the at least one dowel pin can additionally be used to attach the optics to the semiconductor light source module.
  • the at least one dowel pin protrudes from the bore in the semiconductor light source module from a side of the semiconductor light source module facing away from the contact surface and the protruding from the bore in the semiconductor light source module portion of the dowel pin is provided with a screw thread for a nut.
  • the lighting device according to the invention has first fastening means which are provided for fixing the support surface of the semiconductor light source module on the rear side of the carrier.
  • the first fastening means may be formed as a screw connection between the semiconductor light source module and optics or as a clamping device which presses the semiconductor light source module with its bearing surface against the rear side of the carrier.
  • the screw connection has over the clamping device the advantage that with their help, a comparatively high contact pressure between the semiconductor light source module and the carrier can be achieved and thus a good thermal coupling between the semiconductor light source module and carrier is made possible.
  • second fastening means are provided which serve to fix the optics on the carrier.
  • These second fastening means allow the optics to be fixed to the carrier independently of the at least one dowel pin and to ensure that the connection between the optics and the carrier remains in the case of a dismantled semiconductor light source module.
  • the second fastening means are designed as a snap or latching connection between the optics and the carrier. The snap or locking connection allows a fixation of the optics on the carrier in an already roughly aligned alignment.
  • the support of the illumination device according to the invention advantageously has a recess for receiving a section of the semiconductor light source module provided with semiconductor light sources. This makes it possible for the section of the semiconductor light source module equipped with the semiconductor light sources to extend to the front side of the carrier so that the light emitted by the semiconductor light sources impinges on the optics arranged on the front side of the carrier.
  • the carrier of the illumination device according to the invention is designed as a heat sink.
  • effective cooling of the semiconductor light source module can be ensured since the heat generated by the semiconductor light source module is dissipated to the environment by means of the heat sink.
  • the semiconductor light source module of the illumination device according to the invention preferably has a heat sink on which the semiconductor light sources are arranged.
  • the bearing surface of the semiconductor light source module is formed as part of the heat sink. This ensures a good thermal coupling of the semiconductor light sources to the heat sink and ensures that the heat generated by the semiconductor light sources is dissipated via the heat sink and the support surface on the carrier, which is preferably designed as a heat sink.
  • the above offer screw connections described between the semiconductor light source module and the carrier by means of at least one dowel the ability to generate a high contact pressure between the support surface of the semiconductor light source module and the back of the carrier, thereby achieving a good thermal coupling between the semiconductor light source module and the carrier.
  • the heat sink is preferably made of metal, such as copper or aluminum, or ceramic, such as aluminum nitride, to ensure good thermal conductivity.
  • the carrier formed as a heat sink is preferably made of metal, for example of aluminum, in order to ensure a good thermal conductivity and is preferably provided with cooling fins in order to achieve a large surface which is in contact with the ambient air for the purpose of cooling.
  • the semiconductor light source module of the illumination device has electrical components of an operating device for the semiconductor light sources.
  • the semiconductor light source module can be connected directly to the mains voltage, for example the vehicle electrical system voltage of a motor vehicle.
  • the electrical components of the operating device are arranged on the heat sink of the semiconductor light source module in order to be able to dissipate the heat generated by the electrical components of the operating device also via the heat sink to the carrier designed as a heat sink.
  • Lighting device shown is an illumination device, which is provided for use in the headlight of a motor vehicle.
  • This lighting device has as essential components a semiconductor light source module 1, an optic 2 and a common carrier 3 for the semiconductor light source module 1 and the optics 2.
  • the carrier 3 is formed by a rectangular aluminum plate which has a flat front side 31 and a rear side 32 and at the rear side 32 of which cooling fins 30 are arranged.
  • the carrier 3 has on a longitudinal edge a recess 33 for receiving the semiconductor light source module 1.
  • the carrier 3 serves as a heat sink for the semiconductor light source module 1 and is therefore sometimes referred to below as a heat sink 3.
  • In the carrier three openings 34 are mounted for each a dowel pin 23 of the optics 2.
  • the three openings 34 in the carrier 3 are arranged in the manner of a triangle on the front side 31 of the carrier 3. That is, the three openings 34 form on the front side 31 of the carrier 3, the vertices of a fictitious triangle.
  • the optical system 2 is designed as a reflector to reflect the light emitted by the semiconductor light source module 1.
  • the optic 2 is cup-shaped, shaped with a substantially parabolic curvature. She has a light Reflective surface 21, which faces the semiconductor light sources of the semiconductor light source module 1.
  • the light-reflecting surface 21 is arranged on the inside of the shell-like optical system 2.
  • three hollow dowel pins 23 are formed, which are each provided in its interior with a screw thread and which serve to adjust the spatial position and orientation of the optical system 2 with respect to the semiconductor light source module 1.
  • the in FIG. 6 only shown very schematically third dowel pin 23 has the same construction as in FIG.
  • the two optics pins 2 are arranged on the front side 31 of the carrier 3 and their three dowel pins 23 each protrude through an opening 34 in the carrier 3.
  • the three dowel pins 23 each have two sections 231, 232 with different outer diameters.
  • the first portion 231 is formed on the outer side 22 of the optical system 2 and the second portion 232 immediately adjoins the first portion 231 and forms the free end of the respective dowel pin 23.
  • At the transition from the first portion 231 to the second portion 232 forms each dowel pin 23 a paragraph 230, which is due to the different outer diameter of the two sections 231, 232, respectively.
  • the outer diameter of the second shoulder 232 is smaller than the outer diameter of its first portion 231 at each dowel pin 23.
  • the first portion 231 of the dowel pins 23 each extend through the corresponding aperture 34 in the carrier 3, so that the second portion 232 of the dowel pins 23 respectively at the back 32 of the carrier 3 stands out.
  • the optic 2 is provided with two spring-formed snap hooks 24, which are integrally formed on the outside 22 of the optic 2 and in each case engage behind in a recess 35 of the support 3 on its rear side 32.
  • the attachment of the optics 2 by means of the snap hook 24 is shown schematically in the Figures 5 and 6 shown.
  • the semiconductor light source module 1 has a heat sink 10 made of aluminum with a first wedge-like section 11, on the surface 110 of which a mounting plate 4 with five light-emitting diode chips 40 arranged in a row is mounted.
  • the LED chips 40 emit white light during their operation.
  • the mounting plate 4 is formed, for example, as a metal core board.
  • electrical components (not shown) of an operating device for the light-emitting diode chips 40 are mounted on a surface of the heat sink 10.
  • the first section 11 of the semiconductor light source module 10 is arranged in the recess 33 of the carrier 3 and projects beyond the front side 31 of the carrier 3, so that the light-emitting diode chips 40 are arranged substantially at the focal point of the parabolic optic 2 and the light emitted by the light-emitting diode chips 40 on the Light reflective inner side 21 of the optical system 2 hits.
  • the heat sink 10 further has a second, plate-like portion 12 which is angled perpendicular to the first portion 11.
  • the second, plate-like portion 12 of the heat sink 10 forms a bearing surface 120, which rests against the back 32 of the carrier 3.
  • the second, plate-like portion 12 of the heat sink 10 are three mating holes 121 arranged for each one of the three dowel pins 23 of the optics 2.
  • the diameter of the holes 121 is in each case matched to the outer diameter of the second portion 232 of the corresponding dowel pin 23, so that the second portion 232 of the dowel pins 23 respectively fits exactly into the corresponding bore 121.
  • the diameter of the holes 121 is thus smaller than the outer diameter of the first portion 231 of the dowel pins 23.
  • the second portion 232 of the three dowel pins 23 each extend into the corresponding bore 121 in the second, plate-like portion 12 of the heat sink 10, so that the paragraph 230 of the respective rests against the support surface 120 of the second, plate-like portion 12 of the heat sink 10.
  • the paragraph 230 of the dowel pins 23 therefore determines the height of the optics 2 on the support surface 120 of the second, plate-like portion 12 of the heat sink 10 and thus the altitude of the optics 2 with respect to the LED chips 40.
  • the spatial position and orientation of the optics 2 with respect to the LED chips 40th in directions parallel to the support surface 120 is determined by the position of the three holes 121. Since the outer diameter of the second portion 232 of the three dowel pins 23 is matched to the diameter of the corresponding bore 121, the dowel pins 23 are each arranged without play in the corresponding bore 121.
  • a bushing 7 is also arranged, which contains the electrical contacts for powering the semiconductor light source module 1 and is provided for receiving a plug.
  • the semiconductor light source module 1 is supplied with the vehicle electrical system voltage of the motor vehicle.
  • the carrier 3 three beyond the side edges of the support 3 protruding fastening devices 8 are further arranged, which serve for mounting the illumination device in a motor vehicle.
  • the screws 5 and 6 are released on the rear side 122 of the second, plate-like section 12 of the heat sink 10 of the semiconductor light source module 1.
  • the semiconductor light source module 1 can be removed from the rear side 32 of the carrier 3 by being pulled off from the second sections 232 of the dowel pins 23 which extend into the bores 121.
  • the optic 2 is after removing the screws 5 and the semiconductor light source module 1 by means of the snap hook 24 and the pins 34 stuck in the apertures 34 on the carrier 3 still sufficiently fixed so that they can not be detached from the carrier 3.
  • the assembly of the new semiconductor light source module 1 is done in the reverse order as the disassembly.
  • the semiconductor light source module 1 can additionally have a primary optics which is arranged directly above the light-emitting diode chips 40 and directs the light emitted by the light-emitting diode chips 40 onto the light-reflecting inner side 21 of the optical system 2.
  • This primary optics may be, for example, an optical lens or an optical concentrator.
  • the semiconductor light sources of the semiconductor light source module 1 may have other light sources such as superluminescent diodes or laser diodes instead of the light emitting diode chips 40.
  • the optics 2 may have other shapes than the shell-like according to the preferred embodiment.
  • the light-reflecting surface 21 of the optics may be partially or completely coated with phosphor.
  • the dowel pins 23 of the optics 2 do not necessarily have to be hollow.
  • the second portions 232 of the dowel pins 23 may be formed so as to protrude through the corresponding bore 121 in the second portion 12 of the heat sink 10 of the semiconductor light source module 1 and the portion of the second portion 232 of the dowel pins projecting from the back surface 122 of the heat sink 10 is a screw thread having, on which a nut can be screwed to screw the semiconductor light source module 1 to the optics 2.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Claims (10)

  1. Dispositif d'éclairage comprenant un module de sources de lumière à semi-conducteurs (1) et une optique (2), ainsi qu'un support commun (3) pour le module de sources de lumière à semi-conducteurs (1) et l'optique (2), ladite optique (2) étant montée sur une face avant (31) du support (3) et présentant au moins une goupille d'ajustage (23) qui s'étend dans un alésage adapté (121) ménagé dans le module de sources de lumière à semi-conducteurs (1),
    - ledit module de sources de lumière à semi-conducteurs (1) étant appliqué contre une face arrière (32) du support (3), opposée à la face avant (31),
    - ladite au moins une goupille d'ajustage (23) passant à travers une ouverture (34) dans le support (3) et s'étendant dans l'alésage adapté (121) du module de sources de lumière à semi-conducteurs (1),
    caractérisé en ce que
    - ladite au moins une goupille d'ajustage (23) forme un épaulement (230) qui est appliqué contre une surface d'appui (120) du module de sources de lumière à semi-conducteurs (1), adjacente à la face arrière (32) du support (3).
  2. Dispositif d'éclairage selon la revendication 1, ladite au moins une goupille d'ajustage (23) étant formée d'un seul tenant avec l'optique (2).
  3. Dispositif d'éclairage selon la revendication 1 ou 2, ladite au moins une goupille d'ajustage (23) étant creuse et munie d'un filetage pour recevoir une vis (5).
  4. Dispositif d'éclairage selon la revendication 1 ou 2, ladite au moins une goupille d'ajustage faisant saillie de l'alésage adapté (121) ménagé dans le module de sources de lumière à semi-conducteurs (1), sur une face (122) du module de sources de lumière à semi-conducteurs (1), opposée à la surface d'appui (120), et la partie de la goupille d'ajustage faisant saillie de l'alésage adapté (121) ménagé dans le module de sources de lumière à semi-conducteurs (1) étant munie d'un filetage pour un écrou.
  5. Dispositif d'éclairage selon l'une des revendications 1 à 4, des premiers moyens de fixation (6) étant prévus pour fixer la surface d'appui (120) du module de sources de lumière à semi-conducteurs (1) à la face arrière (32) du support (3).
  6. Dispositif d'éclairage selon l'une des revendications 1 à 5, des deuxièmes moyens de fixation (24, 35) étant présents pour fixer l'optique (2) au support (3).
  7. Dispositif d'éclairage selon la revendication 6, lesdits deuxièmes moyens de fixation (24, 35) étant réalisés sous forme de liaison par enclenchement ou encliquetage entre l'optique (3) et le support (3).
  8. Dispositif d'éclairage selon l'une des revendications 1 à 7, le support (3) ayant un évidement (33) destiné à recevoir une partie (11) du module de sources de lumière à semi-conducteurs (1), munie de sources de lumières à semi-conducteurs (40).
  9. Dispositif d'éclairage selon l'une des revendications 1 à 8, le support (3) étant réalisé sous forme de corps de refroidissement.
  10. Dispositif d'éclairage selon l'une des revendications 1 à 9, le module de sources de lumière à semi-conducteurs (1) présentant un puits de chaleur (10), et la surface d'appui (120) étant réalisée comme élément constitutif du puits de chaleur (10) et les sources de lumière à semi-conducteurs (40) étant agencées sur le puits de chaleur (10).
EP13704110.9A 2012-02-27 2013-02-13 Dispositif d'illumination Active EP2820348B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012202933A DE102012202933A1 (de) 2012-02-27 2012-02-27 Beleuchtungseinrichtung
PCT/EP2013/052878 WO2013127632A1 (fr) 2012-02-27 2013-02-13 Dispositif d'éclairage

Publications (2)

Publication Number Publication Date
EP2820348A1 EP2820348A1 (fr) 2015-01-07
EP2820348B1 true EP2820348B1 (fr) 2016-04-13

Family

ID=47714109

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13704110.9A Active EP2820348B1 (fr) 2012-02-27 2013-02-13 Dispositif d'illumination

Country Status (7)

Country Link
US (1) US9297522B2 (fr)
EP (1) EP2820348B1 (fr)
CN (1) CN104136835B (fr)
DE (1) DE102012202933A1 (fr)
ES (1) ES2582503T3 (fr)
HU (1) HUE029602T2 (fr)
WO (1) WO2013127632A1 (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9146030B2 (en) * 2012-06-18 2015-09-29 Buddy Stefanoff Light emitting diode (LED) lighting assemblies and methods of use
FR3010488B1 (fr) * 2013-09-06 2015-09-18 Valeo Vision Module lumineux pour dispositif d'eclairage et/ou de signalisation
DE102014109114B4 (de) * 2014-06-30 2024-04-25 HELLA GmbH & Co. KGaA Anordnung eines Kühlkörpers in einem Scheinwerfer
US9772092B2 (en) * 2014-11-14 2017-09-26 Hella Kgaa Hueck & Co. Lamp assembly and method for torque-free assembly of the lamp assembly
DE102015201929A1 (de) 2015-02-04 2016-08-04 Osram Gmbh Beleuchtungseinrichtung und Herstellungsverfahren für eine Beleuchtungseinrichtung
JP6685130B2 (ja) * 2015-12-25 2020-04-22 株式会社小糸製作所 車両用灯具
FR3048487B1 (fr) * 2016-03-02 2019-05-24 Valeo Vision Dispositif d'eclairage pour vehicule automobile comprenant des modules lumineux refroidis au moyen d'un generateur d'un flux d'air
KR102460854B1 (ko) * 2016-05-17 2022-10-31 현대모비스 주식회사 차량의 램프
US10960224B2 (en) 2017-01-12 2021-03-30 Janssen Pharmaceutica Nv Trans-orbital infrared light therapy
DE102017104841A1 (de) * 2017-03-08 2018-09-13 HELLA GmbH & Co. KGaA Beleuchtungsvorrichtung für Fahrzeuge sowie Montageverfahren
DE102017107197A1 (de) * 2017-04-04 2018-10-04 Automotive Lighting Reutlingen Gmbh Verfahren zur Montage einer Laserdiode auf einem Kühlkörper, nach diesem Verfahren montierte Lichtaussendungseinheit und Kraftfahrzeugscheinwerfer mit einer solchen Lichtaussendungseinheit
DE102017125712A1 (de) * 2017-11-03 2019-05-09 Automotive Lighting Reutlingen Gmbh Anordnung mit einem ersten, an einem zweiten Bauteil festzulegenden Bauteil, Leuchte und Verfahren
DE102018105004A1 (de) 2018-03-05 2019-09-05 Vossloh-Schwabe Deutschland Gmbh Leuchte
CN215001387U (zh) * 2018-06-19 2021-12-03 亮锐控股有限公司 照明模块和照明***
EP3667162A1 (fr) * 2018-12-11 2020-06-17 ZKW Group GmbH Dispositif d'éclairage pour un phare de véhicule automobile
US10926102B2 (en) * 2019-04-15 2021-02-23 Janssen Pharmaceutica Nv Transorbital NIR LIGHT THERAPY DEVICES
US10874874B2 (en) 2019-04-15 2020-12-29 Janssen Pharmaceutica Nv Transorbital NIR light therapy device
US11708968B2 (en) * 2021-05-07 2023-07-25 Lumileds Llc Two-part heatsink for LED module

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7008095B2 (en) * 2003-04-10 2006-03-07 Osram Sylvania Inc. LED lamp with insertable axial wireways and method of making the lamp
DE102004062990A1 (de) 2004-12-22 2006-07-06 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Beleuchtungseinrichtung mit mindestens einer Leuchtdiode und Fahrzeugscheinwerfer
US7588359B2 (en) * 2005-09-26 2009-09-15 Osram Sylvania Inc. LED lamp with direct optical coupling in axial arrangement
US7341365B2 (en) 2005-12-16 2008-03-11 Ford Global Technologies, Llc LED unit for a vehicle lamp assembly
DE102007038786B4 (de) * 2007-08-06 2016-02-04 Automotive Lighting Reutlingen Gmbh Vorsatzlinse eines Leuchtmoduls, Leuchtmodul und Herstellungsverfahren
DE102007050893B4 (de) * 2007-10-24 2011-06-01 Continental Automotive Gmbh Verfahren zum Positionieren und Montieren einer LED-Baueinheit sowie Positionierkörper hierfür
US7635206B2 (en) * 2008-01-02 2009-12-22 Yujing Technology Co., Ltd. Light emitting diode lighting device having a lens connected to a hood
JP4582190B2 (ja) * 2008-05-14 2010-11-17 市光工業株式会社 車両用灯具
JP2010182486A (ja) * 2009-02-04 2010-08-19 Koito Mfg Co Ltd 車両用灯具
US8998463B2 (en) * 2009-09-03 2015-04-07 Koito Manufacturing Co., Ltd. Light-emitting apparatus and automotive headlamps
US8602608B2 (en) * 2010-08-27 2013-12-10 Tyco Electronics Nederland B.V. Light module
AT510454B1 (de) * 2010-10-14 2013-04-15 Zizala Lichtsysteme Gmbh Led-fahrzeugscheinwerfer
CN103154605A (zh) * 2010-10-19 2013-06-12 欧司朗股份有限公司 发光组件

Also Published As

Publication number Publication date
DE102012202933A1 (de) 2013-08-29
CN104136835A (zh) 2014-11-05
EP2820348A1 (fr) 2015-01-07
US20140376232A1 (en) 2014-12-25
WO2013127632A1 (fr) 2013-09-06
US9297522B2 (en) 2016-03-29
CN104136835B (zh) 2016-07-06
ES2582503T3 (es) 2016-09-13
HUE029602T2 (en) 2017-02-28

Similar Documents

Publication Publication Date Title
EP2820348B1 (fr) Dispositif d'illumination
EP1828671B1 (fr) Dispositif d'eclairage dote d'au moins une diode electroluminescente et phare de vehicule
EP1828678B1 (fr) Dispositif d'eclairage ayant au moins une diode electroluminescente et phare de vehicule
EP2291594B1 (fr) Unité d éclairage pour phare de véhicule et phare de véhicule
EP2350528B1 (fr) Lampe à led
EP3004724B1 (fr) Dispositif d'éclairage pour phare de véhicule
EP2095016B1 (fr) Unité d'éclairage pour phare de véhicule, et phare de véhicule correspondant
DE102010063713A1 (de) Beleuchtungsvorrichtung
DE102018117378A1 (de) Leistungsversorgung, Lampe, bewegliche Vorrichtung und Verfahren zur Herstellung einer Leistungsversorgung
EP2766657B1 (fr) Module led pourvu d'un corps de refroidissement
DE202011107787U1 (de) Lichtemissionsvorrichtung
EP3671014B1 (fr) Module de phares à del et module lumineux à del destiné à être utilisé dans un tel module de phares à del
EP2873913A1 (fr) Lampe à DEL
EP2885573B1 (fr) Système d'éclairage comprenant un dispositif de refroidissement et un élément optique
DE212019000443U1 (de) Ein Federelement umfassende Beleuchtungsvorrichtung
EP3270043B9 (fr) Réflecteur multicomposant pour module d'éclairage d'un phare de véhicule automobile
DE10116957A1 (de) Fahrzeugleuchte
WO2015040240A1 (fr) Lampe
DE202011100723U1 (de) Lampe
EP2839209B1 (fr) Appareil d'éclairage
DE102021208380A1 (de) Gargerätetür mit einem Modulaufsatz für eine Ambientebeleuchtung und Gargerät
DE102008056171A1 (de) Beleuchtungseinheit mit einer Halbleiterlichtquellenanordnung
EP2910843A1 (fr) Lampe
EP3465328A2 (fr) Dispositif de génération de lumière pour un affichage tête haute d'un véhicule automobile
DE102012216578A1 (de) Beleuchtungseinrichtung

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20140929

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAX Request for extension of the european patent (deleted)
GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

RIC1 Information provided on ipc code assigned before grant

Ipc: F21V 19/00 20060101ALI20150911BHEP

Ipc: F21V 7/06 20060101ALI20150911BHEP

Ipc: F21S 8/10 20060101AFI20150911BHEP

Ipc: F21V 17/16 20060101ALI20150911BHEP

Ipc: F21V 29/70 20150101ALI20150911BHEP

Ipc: F21V 17/12 20060101ALI20150911BHEP

Ipc: F21V 17/06 20060101ALI20150911BHEP

Ipc: F21Y 101/02 20060101ALI20150911BHEP

INTG Intention to grant announced

Effective date: 20151014

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

RIC1 Information provided on ipc code assigned before grant

Ipc: F21V 17/16 20060101ALI20160111BHEP

Ipc: F21V 19/00 20060101ALI20160111BHEP

Ipc: F21V 17/06 20060101ALI20160111BHEP

Ipc: F21V 29/00 20150101ALI20160111BHEP

Ipc: F21S 8/10 20060101AFI20160111BHEP

Ipc: F21V 7/06 20060101ALI20160111BHEP

Ipc: F21V 17/12 20060101ALI20160111BHEP

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 790537

Country of ref document: AT

Kind code of ref document: T

Effective date: 20160415

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: GERMAN

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 502013002570

Country of ref document: DE

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

REG Reference to a national code

Ref country code: ES

Ref legal event code: FG2A

Ref document number: 2582503

Country of ref document: ES

Kind code of ref document: T3

Effective date: 20160913

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20160413

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160413

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160413

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160413

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160713

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160413

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160413

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160413

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160714

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160816

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160413

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160413

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160413

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 502013002570

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160413

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160413

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160413

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160413

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 5

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160413

REG Reference to a national code

Ref country code: HU

Ref legal event code: AG4A

Ref document number: E029602

Country of ref document: HU

26N No opposition filed

Effective date: 20170116

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160413

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170228

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160413

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20170213

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170228

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170228

REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Ref document number: 502013002570

Country of ref document: DE

Free format text: PREVIOUS MAIN CLASS: F21S0008100000

Ipc: F21S0043000000

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170213

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20170228

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 6

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170213

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170213

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160413

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160413

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FI

Payment date: 20190215

Year of fee payment: 7

Ref country code: CZ

Payment date: 20190212

Year of fee payment: 7

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20190220

Year of fee payment: 7

Ref country code: HU

Payment date: 20190213

Year of fee payment: 7

Ref country code: AT

Payment date: 20190219

Year of fee payment: 7

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160413

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160413

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160413

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160413

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160813

REG Reference to a national code

Ref country code: AT

Ref legal event code: MM01

Ref document number: 790537

Country of ref document: AT

Kind code of ref document: T

Effective date: 20200213

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CZ

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200213

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200213

Ref country code: HU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200214

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200229

REG Reference to a national code

Ref country code: ES

Ref legal event code: FD2A

Effective date: 20210705

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200214

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20230821

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20240219

Year of fee payment: 12