EP2810310A4 - Thermoelectric devices using sintered bonding - Google Patents
Thermoelectric devices using sintered bondingInfo
- Publication number
- EP2810310A4 EP2810310A4 EP13743614.3A EP13743614A EP2810310A4 EP 2810310 A4 EP2810310 A4 EP 2810310A4 EP 13743614 A EP13743614 A EP 13743614A EP 2810310 A4 EP2810310 A4 EP 2810310A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- thermoelectric devices
- sintered bonding
- sintered
- bonding
- thermoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
- B22F7/064—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0466—Alloys based on noble metals
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3732—Diamonds
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/363,997 US20120291454A1 (en) | 2011-05-20 | 2012-02-01 | Thermoelectric Devices Using Sintered Bonding |
PCT/US2013/023203 WO2013116107A1 (en) | 2012-02-01 | 2013-01-25 | Thermoelectric devices using sintered bonding |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2810310A1 EP2810310A1 (en) | 2014-12-10 |
EP2810310A4 true EP2810310A4 (en) | 2016-01-20 |
Family
ID=48905721
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP13743614.3A Withdrawn EP2810310A4 (en) | 2012-02-01 | 2013-01-25 | Thermoelectric devices using sintered bonding |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP2810310A4 (en) |
WO (1) | WO2013116107A1 (en) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0898310A2 (en) * | 1997-08-19 | 1999-02-24 | Sumitomo Electric Industries, Ltd. | Heat sink for semiconductors and manufacturing process thereof |
US6270848B1 (en) * | 1997-02-06 | 2001-08-07 | Sumitomo Electric Industries, Ltd. | Heat sink material for use with semiconductor component and method for fabricating the same, and semiconductor package using the same |
US20070183920A1 (en) * | 2005-02-14 | 2007-08-09 | Guo-Quan Lu | Nanoscale metal paste for interconnect and method of use |
JP2009081252A (en) * | 2007-09-26 | 2009-04-16 | Aruze Corp | Thermoelectric conversion element and method for forming electrode thereof |
JP2009117792A (en) * | 2007-10-19 | 2009-05-28 | Ube Ind Ltd | Thermoelectric conversion module and process for producing the same |
WO2009150908A1 (en) * | 2008-06-13 | 2009-12-17 | アルゼ株式会社 | Thermoelectric converter element and conductive member for thermoelectric converter element |
CN102311714A (en) * | 2011-08-24 | 2012-01-11 | 浙江科创新材料科技有限公司 | High thermal and electric conducting adhesive filled with nanometer silver and preparation method thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5824561A (en) * | 1994-05-23 | 1998-10-20 | Seiko Instruments Inc. | Thermoelectric device and a method of manufacturing thereof |
US20100193001A1 (en) * | 2007-07-09 | 2010-08-05 | Kabushiki Kaisha Toshiba | Thermoelectric conversion module, and heat exchanger, thermoelectric temperature control device and thermoelectric generator employing the same |
JP4912991B2 (en) * | 2007-09-07 | 2012-04-11 | 住友化学株式会社 | Method for manufacturing thermoelectric conversion element |
JP5499317B2 (en) * | 2009-03-03 | 2014-05-21 | 学校法人東京理科大学 | Thermoelectric conversion element and thermoelectric conversion module |
-
2013
- 2013-01-25 WO PCT/US2013/023203 patent/WO2013116107A1/en active Application Filing
- 2013-01-25 EP EP13743614.3A patent/EP2810310A4/en not_active Withdrawn
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6270848B1 (en) * | 1997-02-06 | 2001-08-07 | Sumitomo Electric Industries, Ltd. | Heat sink material for use with semiconductor component and method for fabricating the same, and semiconductor package using the same |
EP0898310A2 (en) * | 1997-08-19 | 1999-02-24 | Sumitomo Electric Industries, Ltd. | Heat sink for semiconductors and manufacturing process thereof |
US20070183920A1 (en) * | 2005-02-14 | 2007-08-09 | Guo-Quan Lu | Nanoscale metal paste for interconnect and method of use |
JP2009081252A (en) * | 2007-09-26 | 2009-04-16 | Aruze Corp | Thermoelectric conversion element and method for forming electrode thereof |
JP2009117792A (en) * | 2007-10-19 | 2009-05-28 | Ube Ind Ltd | Thermoelectric conversion module and process for producing the same |
WO2009150908A1 (en) * | 2008-06-13 | 2009-12-17 | アルゼ株式会社 | Thermoelectric converter element and conductive member for thermoelectric converter element |
CN102311714A (en) * | 2011-08-24 | 2012-01-11 | 浙江科创新材料科技有限公司 | High thermal and electric conducting adhesive filled with nanometer silver and preparation method thereof |
Non-Patent Citations (1)
Title |
---|
See also references of WO2013116107A1 * |
Also Published As
Publication number | Publication date |
---|---|
EP2810310A1 (en) | 2014-12-10 |
WO2013116107A1 (en) | 2013-08-08 |
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Legal Events
Date | Code | Title | Description |
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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17P | Request for examination filed |
Effective date: 20140721 |
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AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
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AX | Request for extension of the european patent |
Extension state: BA ME |
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RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: PEINER, ERWIN Inventor name: KRUSPE, THOMAS Inventor name: WAAG, ANDREAS Inventor name: KAEHLER, JULIAN Inventor name: STRANZ, ANDREJ Inventor name: JUNG, SEBASTIAN |
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DAX | Request for extension of the european patent (deleted) | ||
RA4 | Supplementary search report drawn up and despatched (corrected) |
Effective date: 20151217 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: C22C 1/04 20060101ALI20151211BHEP Ipc: B23K 35/30 20060101ALI20151211BHEP Ipc: B23K 35/02 20060101ALI20151211BHEP Ipc: C01B 31/06 20060101ALN20151211BHEP Ipc: H01L 35/02 20060101AFI20151211BHEP Ipc: C22C 5/06 20060101ALI20151211BHEP Ipc: H01L 35/08 20060101ALI20151211BHEP Ipc: H01L 35/34 20060101ALI20151211BHEP Ipc: H01L 23/38 20060101ALI20151211BHEP Ipc: B22F 7/06 20060101ALI20151211BHEP Ipc: H01L 23/373 20060101ALN20151211BHEP Ipc: B32B 15/01 20060101ALI20151211BHEP Ipc: H05K 1/09 20060101ALN20151211BHEP |
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17Q | First examination report despatched |
Effective date: 20170320 |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20180217 |