EP2783153A1 - Cooling body for semiconductor lighting device with plastics parts - Google Patents
Cooling body for semiconductor lighting device with plastics partsInfo
- Publication number
- EP2783153A1 EP2783153A1 EP12784475.1A EP12784475A EP2783153A1 EP 2783153 A1 EP2783153 A1 EP 2783153A1 EP 12784475 A EP12784475 A EP 12784475A EP 2783153 A1 EP2783153 A1 EP 2783153A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- plastic part
- heat sink
- insert
- cup
- plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004033 plastic Substances 0.000 title claims abstract description 152
- 229920003023 plastic Polymers 0.000 title claims abstract description 152
- 239000004065 semiconductor Substances 0.000 title claims abstract description 47
- 238000001816 cooling Methods 0.000 title abstract description 9
- 238000001746 injection moulding Methods 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 description 15
- 239000000463 material Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 210000002414 leg Anatomy 0.000 description 6
- 239000002918 waste heat Substances 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- QXAITBQSYVNQDR-UHFFFAOYSA-N amitraz Chemical compound C=1C=C(C)C=C(C)C=1N=CN(C)C=NC1=CC=C(C)C=C1C QXAITBQSYVNQDR-UHFFFAOYSA-N 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000012549 training Methods 0.000 description 1
- 210000000689 upper leg Anatomy 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the invention relates to a heat sink for a
- the invention Semiconductor light source is provided, wherein the first plastic part has a lower thermal conductivity than the second plastic part.
- the invention is particular
- Heat sink material exist.
- the lighting device which may be configured in particular as a retrofit lamp, is equipped with at least one such heat sink.
- At least one light source may be attached to at least a first heat sink portion of a first heat sink material, and at least one second heat sink portion of a second heat sink material may not have a light source attached thereto.
- the second heat sink material may have a lower thermal conductivity than the first
- the heat sink comprises: a first plastic part, which has a rear-side receiving space, and a second plastic part, which is connected to the first plastic part at the front side and for the arrangement of at least one
- Plastic part has a lower thermal conductivity than the second plastic part and in the heat sink at least one insert is present, which has a higher
- Thermal conductivity has as the second plastic part.
- This heat sink has the advantage that due to the lower thermal conductivity of the first plastic part, an object located in the receiving space is thermally insulated from the at least one semiconductor light source. This can be particularly advantageous when the at least one semiconductor light source generates waste heat to a considerable extent and the article is sensitive to heat, in particular if the article itself is electrically
- plastic heat sink is operable and generates waste heat.
- an at least largely made of plastic heat sink can be particularly easy and inexpensive and easy to manufacture.
- the insert can heat dissipation in and heat dissipation from the plastic of one of the plastic parts or both
- Plastic parts are improved, in particular in or out of the thermally less conductive first plastic part. This improves in particular a heat dissipation from the
- the at least one insert may comprise (exactly) one or more inserts.
- the first plastic part may in particular a
- Plastic part may in particular have a thermal conductivity of up to about 5 W / (m-K), in particular of up to about 10 W / (m-K) (in particular for an electrically non-conductive
- Plastic part and in particular up to about 20 W / (m-K)
- the at least one insert may in particular have an insert whose
- Thermal conductivity is more than 10 W / (m-K), in particular more than 20 W / (m-K), especially more than 50 W / (m-K) and in particular more than 100 W / (m-K).
- the insert may be partially surrounded by plastic (thus also partially exposed) or completely surrounded by plastic (core insert).
- At least one insert may consist in particular of metal or ceramic.
- the metal may in particular comprise aluminum, copper, magnesium, steel or a mixture or alloy thereof.
- the metal insert may in particular be a deep-drawn sheet metal, a section of a metal tube and / or a die-cast part.
- the recording room is in particular only by the first
- the second plastic part has in particular at least one bearing surface for fastening at least one
- the bearing surface can be made of any material.
- the at least one semiconductor light source can be applied directly to a support surface, for example a housed one Semiconductor light source.
- the at least one semiconductor light source can be applied directly to a support surface, for example a housed one Semiconductor light source.
- Semiconductor light source may alternatively via a carrier
- connection of the two plastic parts is in particular a thermal, mechanical and possibly also electrical
- thermoplastic in particular thermoplastic can be used, for example PMMA, PC, ABS, PA, PP, PBT, PPS, PEEK, silicone or a mixture thereof.
- the first plastic part is preferably made of PC or PBT. It is a development that the two plastic parts have the same plastic as the base material, but one of them has a heat conductivity increasing filler. Alternatively, both plastic parts a
- graphite or carbon fibers are used.
- boron nitride particles can be used as filling material for an electrically non-conductive second plastic part.
- Receiving space for a driver by means of which the at least one semiconductor light source is operable.
- the object may thus be a driver, and the receiving space may be at least part of a driver cavity.
- At least one insert is at least partially inserted between the first plastic part and the second plastic part.
- at least one insert may also at least partially adhere to (including in) the first plastic part or to (including in) the second
- the receiving space has a cup-shaped basic shape. This allows an effective and circumferentially sealed recording of an object, in particular driver, in the receiving space, and also a simple production.
- a cup shape may in particular be a circumferentially closed mold.
- the recording room can in particular a basic form without
- the receiving space may in particular a cylindrical, cuboid or
- the receiving space can be connected in particular by means of a passage through both plastic parts channel ("cable channel”) with an outside, in particular for
- Insert ring is arranged circumferentially around the receiving space. This supports a heat dissipation from the
- Forming surface for the at least one semiconductor light source forms. This enables a beam direction of the light emitted from the front in the cup-shaped region semiconductor light source (s), in particular if an inside of the cup-shaped region (diffuse or specular) is designed reflective, for example by means of a reflective layer.
- the floor is in particular of a front side
- the front cup-shaped portion has the further advantage that a translucent cover (piston or cover plate, etc.), e.g. made of glass or plastic, easily attachable to it. This can be the
- front cup-shaped area in particular at its front free edge of the side wall at least one
- Recess for receiving the cover, in particular from a lower edge of a piston, have, for. a circumferential annular groove. It is also an embodiment that the heat sink has an insert, which has a front-opening cup-shaped basic shape. This deposit can
- Plastic part can be kept low.
- the heat sink has an insert, which has a rear-opening cup-shaped basic shape and the side wall is arranged annularly around the receiving space circumferentially.
- At least one insert is exposed at least at the bottom of the cup-shaped region and forms at least part of the support surface. This further reduces a heat transfer resistance between at least one semiconductor light source arranged there and the second plastic part.
- the first plastic part laterally at least substantially completely surrounds.
- a particularly large heat dissipation surface formed by a lateral, outside surface of the second plastic part is provided.
- This heat dissipation surface may have a heat dissipation structure, e.g. Cooling fins, cooling pins, etc.
- Plastic part, the first plastic part for example, completely or up to a small support edge surrounded.
- the heat sink can be for easy manufacture
- the first plastic part may have a reverse "U” -shaped basic shape in longitudinal section and the second plastic part has a longitudinal shape "H” -shaped basic shape. Due to the "H" -shaped basic shape of the second plastic part, this has a front-side (opening to the front)
- Plastic part and the second plastic part are integrally connected. This allows for a special firm connection of the plastic parts.
- the plastic parts are in particular (large) surface to each other.
- first plastic part and the second plastic part have been produced together by means of a two-component injection molding process. This gives the advantage of a simple and accurate production.
- Plastic part is electrically insulating. As a result, the advantage is achieved that the receiving space compared to a
- Creepage distances) and also with respect to the second plastic part is electrically isolated, which saves parts, assembly costs and consequently costs.
- Plastic part is electrically conductive. So will one
- Plastic part also allows a particularly high thermal conductivity of up to 20 W / (m-K) or even more.
- Plastic part can be achieved in particular by adding an electrically conductive filler to the plastic base material, e.g. of carbon,
- Plastic part is electrically insulating. So will one
- Retrofit lamp is.
- the invention is for a lamp
- Retrofitlampe particularly advantageous use, since this is a particularly compact design with a
- the retrofit lamp may be, for example, an incandescent retrofit lamp or a halogen lamp retrofit lamp.
- the semiconductor light-emitting device may have a rear-side socket for electrical supply, e.g. an Edison socket or a bipin socket, by means of which the rear opening of the receiving space can be closed.
- a rear-side socket for electrical supply e.g. an Edison socket or a bipin socket
- the base can in particular the
- Driver are supplied with electrical signals which the driver to operate the at least one
- the semiconductor light-emitting device may have a front-side transparent cover (e.g., a bulb or a cover plate) through which light emitted from the at least one semiconductor light source passes.
- the cover may in particular be attached to the second plastic part, e.g. through an essay.
- the semiconductor luminescent device is in particular with
- Semiconductor light source at least one light emitting diode.
- a color can be monochrome (eg red, green, blue, etc.) or multichromic (eg be white).
- the light emitted by the at least one light-emitting diode can also be an infrared light (IR LED) or an ultraviolet light (UV LED).
- Light emitting diodes can produce a mixed light; e.g. a white mixed light.
- the at least one light-emitting diode may contain at least one wavelength-converting phosphor
- the phosphor may alternatively or additionally be arranged away from the light-emitting diode
- the at least one light-emitting diode can be in the form of at least one individually housed light-emitting diode or in the form of at least one LED chip. Several LED chips can be mounted on a common substrate (“submount").
- the at least one light emitting diode may be equipped with at least one own and / or common optics for beam guidance, e.g. at least one Fresnel lens,
- organic LEDs can generally also be used.
- the at least one semiconductor light source may be e.g. have at least one diode laser.
- Fig.l shows a sectional view in side view a
- Heatsink of a semiconductor light emitting device with two plastic parts and a liner
- FIG. 2 shows a view analogous to FIG
- FIG. 3 shows a view analogous to FIG
- Fig.l shows a heat sink 11 for a
- Semiconductor lighting device H in the form of a light bulb retrofit lamp.
- the heat sink 11 has a first plastic part 12 which has a receiving space 13 which is open on the rear side, and a second plastic part 14 which is connected to the first plastic part 12 on its front side 15.
- the first plastic part 12 has a smaller one
- the first plastic part 12 may consist of PC or PBT and have a thermal conductivity of less than 0.6 W / (m-K) and the second plastic part 14 a
- the first plastic part 12 has a longitudinal section
- the second plastic part 14 has a "H" -shaped basic shape in longitudinal section, the second plastic part 14 completely surrounding the first plastic part 12 laterally except for a rear, laterally projecting support edge 16.
- the second plastic part 14 forms a front side
- the insert 18 has a "U" -shaped in the longitudinal section,
- cup-like basic shape which thus at least approximately the shape of the first plastic part 12 and des
- cup-shaped portion 17b of the second plastic part 14 follows.
- the insert 18 lies with its transverse section 19 of the "U" (which is circular-disk-shaped or circular disk-shaped in space) on a floor 20 of the cup-shaped region 17a, essentially free on the outside,
- the transverse section 19 and thus also the bottom 20 form a support surface for at least one
- the first plastic part 12 and the second plastic part 14 are integrally connected to each other, namely, they have been manufactured together by means of a two-component injection molding process, wherein the insert 18 as shown
- the insert 18 is thus firmly anchored in the plastic parts 12 and 14.
- the insert 18 may have holes or other recesses for the passage of plastic in order to facilitate in particular a production of the heat sink 11.
- Plastic part 14 is provided an annular groove 26 for use of a translucent piston B.
- the piston B is provided an annular groove 26 for use of a translucent piston B.
- the receiving space 13 can be closed by a base part S, which here has an Edison socket E as a supply connection.
- a base part S which here has an Edison socket E as a supply connection.
- Driver cavity K is accommodated a driver T, which is the input side to the Edison socket E and the output side connected to the light emitting diodes 22 electrically.
- the driver T is connected to the LEDs 22 in particular by electrical
- Lines M are connected, which are guided by a concentric to the longitudinal axis through the plastic parts 12 and 14 and through the insert 18 leading (cable) channel 27 and contact the carrier 21, which in turn electrically connects the light emitting diodes 22 together.
- Light emitting diodes 22 operated via the driver T and thereby waste heat.
- the driver T also generates waste heat, albeit to a much lesser degree.
- LEDs 22 is mostly with a small
- the outer side 28 corresponds here essentially to the outside, lateral
- the heat generated in the receiving space 13 or in the driver cavity K can (with a correspondingly higher Thermal resistance) are delivered to the insert 18.
- A likewise through the light emitting diodes 22 warming piston chamber R, which is arched by the piston B, can be discharged through the piston B and through the good heat conducting side wall 25 of the cup-shaped portion 17 a therethrough.
- FIG. 2 shows a view analogous to FIG
- Heat sink 31 according to a second embodiment with two plastic parts 32 and 34 and now two inserts 38a and 38b.
- the heat sink 31 is constructed similarly to the heat sink 11 and, in particular, can be used in a similar manner in a semiconductor light fixture H.
- the two inserts 38a and 38b namely a first insert 38a and a second insert 38b of, for example, aluminum, are spaced from each other and thus thermally more decoupled from one another than a one-piece insert.
- the first insert 38 a is arranged in a ring around the receiving space 13 and can in particular serve to transfer heat in the receiving space 13 from the first plastic part 32 to the second plastic part 34. Due to the separation from the second insert 38b, advantageously, a heat flow from the light emitting diodes 22 to a region of the heat sink 31 is reduced laterally of the receiving space 13, without a
- the second insert 38b also covers the bottom 20 of the cup-shaped region 17a here, but is only in contact with the second plastic part 34.
- the second insert 38b points , _.
- Heat output is available and overall increased heat dissipation is achieved.
- the first plastic part 32 now has no side
- FIG. 3 shows a view analogous to FIG.
- the plastic parts 42 and 44 are formed similarly to the plastic parts 12 and 14.
- the second, better heat-conducting plastic part 44 surrounds the first, poorer heat-conducting plastic part 42 laterally substantially (except for the rear support edge (16)).
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011086789A DE102011086789A1 (en) | 2011-11-22 | 2011-11-22 | Heatsink for semiconductor luminescent device with plastic parts |
PCT/EP2012/070023 WO2013075880A1 (en) | 2011-11-22 | 2012-10-10 | Cooling body for semiconductor lighting device with plastics parts |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2783153A1 true EP2783153A1 (en) | 2014-10-01 |
EP2783153B1 EP2783153B1 (en) | 2016-08-24 |
Family
ID=47177903
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP12784475.1A Active EP2783153B1 (en) | 2011-11-22 | 2012-10-10 | Cooling body for semiconductor lighting device with plastics parts |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2783153B1 (en) |
DE (1) | DE102011086789A1 (en) |
WO (1) | WO2013075880A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3273160A4 (en) * | 2015-11-05 | 2018-06-27 | Leedarson Lighting Co., Ltd. | Heat-dissipation lamp cup |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014192280A1 (en) * | 2013-05-29 | 2014-12-04 | パナソニックIpマネジメント株式会社 | Led unit |
CN104235748B (en) * | 2013-06-19 | 2018-08-31 | 欧司朗有限公司 | Lamp housing and its manufacturing method and lighting device including the lamp housing |
DE102013219335A1 (en) * | 2013-09-25 | 2015-03-26 | Osram Gmbh | Lighting device with substrate body |
GB2523844B (en) * | 2014-03-08 | 2016-04-27 | Lighttherm Ltd | LED lamp with embedded circuitry |
DE102014209774A1 (en) * | 2014-05-22 | 2015-11-26 | Osram Gmbh | Heatsink for light-emitting diodes (LED), method for producing a heat sink and luminaire with a heat sink |
WO2016108138A1 (en) * | 2014-12-30 | 2016-07-07 | Sabic Global Technologies B.V. | A polymeric heat dissipation device, methods of making and of using the same |
DE102015201152A1 (en) * | 2015-01-23 | 2016-07-28 | Osram Gmbh | Heat sink for a lighting device |
US11134618B2 (en) | 2016-08-30 | 2021-10-05 | Current Lighting Solutions, Llc | Luminaire including a heat dissipation structure |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7153004B2 (en) * | 2002-12-10 | 2006-12-26 | Galli Robert D | Flashlight housing |
DE102009022071A1 (en) | 2009-05-20 | 2010-11-25 | Osram Gesellschaft mit beschränkter Haftung | Heat sink for a lighting device |
DE102009024904A1 (en) * | 2009-06-15 | 2010-12-16 | Osram Gesellschaft mit beschränkter Haftung | Heat sink for semiconductor light elements |
US8827508B2 (en) * | 2009-10-22 | 2014-09-09 | Thermal Solution Resources, Llc | Overmolded LED light assembly and method of manufacture |
DE102010030702A1 (en) * | 2010-04-07 | 2011-10-13 | Osram Gesellschaft mit beschränkter Haftung | Semiconductor lamp |
-
2011
- 2011-11-22 DE DE102011086789A patent/DE102011086789A1/en not_active Ceased
-
2012
- 2012-10-10 WO PCT/EP2012/070023 patent/WO2013075880A1/en active Application Filing
- 2012-10-10 EP EP12784475.1A patent/EP2783153B1/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3273160A4 (en) * | 2015-11-05 | 2018-06-27 | Leedarson Lighting Co., Ltd. | Heat-dissipation lamp cup |
Also Published As
Publication number | Publication date |
---|---|
EP2783153B1 (en) | 2016-08-24 |
WO2013075880A1 (en) | 2013-05-30 |
DE102011086789A1 (en) | 2013-05-23 |
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Legal Events
Date | Code | Title | Description |
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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17P | Request for examination filed |
Effective date: 20140623 |
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AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
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RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: ENGL, MORITZ Inventor name: TEGETHOFF, STEFFEN Inventor name: LIPOWSKY, PETER Inventor name: MUEHLBAUER, CAROLIN |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: MUEHLBAUER, CAROLIN Inventor name: LIPOWSKY, PETER Inventor name: TEGETHOFF, STEFFEN Inventor name: ENGL, MORITZ |
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DAX | Request for extension of the european patent (deleted) | ||
17Q | First examination report despatched |
Effective date: 20150803 |
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